DMP2003UPS-13 [DIODES]

Power Field-Effect Transistor,;
DMP2003UPS-13
型号: DMP2003UPS-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Power Field-Effect Transistor,

开关 脉冲 光电二极管 晶体管
文件: 总7页 (文件大小:523K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DMP2003UPS  
Green  
20V P-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI5060-8  
Product Summary  
Features  
Thermally Efficient Package-Cooler Running Applications  
High Conversion Efficiency  
ID  
BVDSS  
RDS(ON)  
TC = +25°C  
Low RDS(ON) Minimizes On State Losses  
-150A  
-120A  
-90A  
2.2mΩ @ VGS = -10V  
2.55mΩ @ VGS = -4.5V  
4.0mΩ @ VGS = -2.5V  
<1.1mm Package Profile Ideal for Thin Applications  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
-20V  
Description  
Mechanical Data  
This new generation MOSFET is designed to minimize RDS(ON) and  
yet maintain superior switching performance. This device is ideal for  
use in notebook battery power management and load switch.  
®
Case: PowerDI 5060-8  
Case Material: Molded Plastic, ―Green‖ Molding Compound;  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Finish - Matte Tin Annealed over Copper Leadframe;  
Solderable per MIL-STD-202, Method 208  
Weight: 0.097 grams (Approximate)  
Applications  
Switch  
PowerDI5060-8  
D
S
S
D
D
D
D
Pin1  
G
S
G
S
Top View  
Pin Configuration  
Bottom View  
Internal Schematic  
Top View  
Ordering Information (Note 4)  
Part Number  
DMP2003UPS-13  
Case  
PowerDI5060-8  
Packaging  
2,500 / Tape & Reel  
Notes:  
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.  
Marking Information  
PowerDI5060-8  
D D  
D
D
=Manufacturers Marking  
P2003US = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 17 = 2017)  
WW = Week Code (01 to 53)  
P2003US  
YY WW  
S
S
S
G
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
www.diodes.com  
October 2017  
© Diodes Incorporated  
DMP2003UPS  
Document number: DS39597 Rev. 2 - 2  
DMP2003UPS  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-20  
Unit  
V
Gate-Source Voltage  
±12  
V
VGSS  
TC = +25°C  
TC = +70°C  
-150  
-120  
A
ID  
Continuous Drain Current, VGS = -10V (Note 7)  
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)  
Maximum Continuous Body Diode Forward Current (Note 7)  
Pulsed Body Diode Forward Current (10μs Pulse, Duty Cycle = 1%)  
Avalanche Current, L = 0.1mH (Note 8)  
-350  
-120  
-350  
-32  
A
A
IDM  
IS  
A
ISM  
IAS  
EAS  
A
Avalanche Energy, L = 0.1mH (Note 8)  
67  
mJ  
Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
PD  
R  
Value  
1.4  
Unit  
W
Steady State  
Steady State  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
90  
°C/W  
W
JA  
2.7  
PD  
R  
Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 7)  
46  
80  
°C/W  
W
JA  
PD  
R  
Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
1.5  
°C/W  
°C  
JC  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 9)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-20  
-1  
V
BVDSS  
IDSS  
VGS = 0V, ID = -250µA  
VDS = -16V, VGS = 0V  
VGS = 12V, VDS = 0V  
µA  
nA  
±100  
IGSS  
ON CHARACTERISTICS (Note 9)  
Gate Threshold Voltage  
-0.5  
1.7  
1.9  
2.5  
-0.6  
-1.4  
2.2  
V
mΩ  
V
VGS(TH)  
RDS(ON)  
VSD  
VDS = VGS, ID = -250µA  
VGS = -10V, ID = -25A  
VGS = -4.5V, ID = -20A  
VGS = -2.5V, ID = -15A  
VGS = 0V, IS = -5A  
Static Drain-Source On-Resistance  
2.55  
4.0  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 10)  
Input Capacitance  
-1.1  
8352  
1406  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
Rg  
VDS = -10V, VGS = 0V  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
599  
13.2  
VDS = 0V, VGS = 0V, f = 1MHz  
79  
177  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Total Gate Charge (VGS = -4.5V)  
Total Gate Charge (VGS = -10V)  
Gate-Source Charge  
Qg  
Qg  
VDS = -10V, ID = -20A  
14.3  
19.8  
Qgs  
Qgd  
tD(ON)  
tR  
Gate-Drain Charge  
Turn-On Delay Time  
7.8  
4.9  
Turn-On Rise Time  
VDD = -10V, VGEN = -4.5V,  
RGEN = 1Ω, ID = -10A  
Turn-Off Delay Time  
377  
189  
tD(OFF)  
tF  
Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
49  
39  
tRR  
IF = -10A, di/dt = 100A/µs  
QRR  
Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. Thermal resistance from junction to soldering point (on the exposed drain pad).  
8. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.  
9. Short duration pulse test used to minimize self-heating effect.  
10. Guaranteed by design. Not subject to product testing.  
2 of 7  
www.diodes.com  
October 2017  
© Diodes Incorporated  
DMP2003UPS  
Document number: DS39597 Rev. 2 - 2  
DMP2003UPS  
30  
25  
20  
15  
10  
5
50.0  
40.0  
30.0  
20.0  
10.0  
0.0  
VGS = -10V  
VDS= -5V  
VGS = -4.5V  
VGS = -4.0V  
VGS = -3.5V  
VGS = -3.0V  
VGS = -2.5V  
VGS = -2.0V  
TJ= 85  
TJ= 25℃  
VGS = -1.8V  
VGS = -1.5V  
TJ= 150℃  
TJ= 125℃  
VGS = -1.3V  
TJ=-55℃  
0
0
0.5  
1
1.5  
2
2.5  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1.Typical Output Characteristic  
0.01  
0.009  
0.008  
0.007  
0.006  
0.005  
0.004  
0.003  
0.002  
0.001  
0
0.004  
0.0035  
0.003  
0.0025  
0.002  
0.0015  
0.001  
0.0005  
0
ID = -15A  
ID = -20A  
ID = -25A  
VGS = -2.5V  
VGS = -4.5V  
VGS = -10V  
0
2
4
6
8
10  
12  
0
5
10 15 20 25 30 35 40 45 50  
ID, DRAIN-SOURCE CURRENT (A)  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
1.9  
1.7  
1.5  
1.3  
1.1  
0.9  
0.7  
0.5  
0.004  
VGS= -10V  
VGS = -10V, ID = -25A  
VGS = -4.5V, ID = -20A  
0.003  
0.002  
0.001  
0
TJ= 150℃  
TJ= 125℃  
TJ= 85℃  
TJ= 25℃  
VGS = -2.5V, ID = -15A  
TJ= -55℃  
-50 -25  
0
25  
50  
75 100 125 150  
0
5
10  
15  
20  
25  
30  
TJ, JUNCTION TEMPERATURE ()  
ID, DRAIN CURRENT (A)  
Figure 6. On-Resistance Variation with Junction  
Temperature  
Figure 5. Typical On-Resistance vs. Drain Current  
and Junction Temperature  
3 of 7  
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October 2017  
© Diodes Incorporated  
DMP2003UPS  
Document number: DS39597 Rev. 2 - 2  
DMP2003UPS  
0.005  
0.004  
0.003  
0.002  
0.001  
0
1.2  
1
0.8  
0.6  
0.4  
0.2  
0
VGS = -2.5V, ID = -15A  
ID = -1mA  
ID = -250μA  
VGS = -10V, ID = -25A  
VGS = -4.5V, ID = -20A  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
TJ, JUNCTION TEMPERATURE ()  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
TJ, JUNCTION TEMPERATURE ()  
Figure 7. On-Resistance Variation with Junction  
Temperature  
30  
25  
20  
15  
10  
5
100000  
10000  
1000  
f=1MHz  
VGS = 0V  
Ciss  
Coss  
Crss  
TJ= 85℃  
TJ= 150℃  
TJ= 25℃  
TJ= 125℃  
TJ= -55℃  
100  
0
0
2
4
6
8
10 12 14 16 18 20  
0
0.3  
0.6  
0.9  
1.2  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
1000  
100  
10  
10  
9
8
7
6
5
4
3
2
1
0
RDS(ON) LIMITED  
PW=1µs  
PW=10µs  
PW=100µs  
VDS = -10V, ID = -20A  
PW=1ms  
TJ(MAX)=150℃  
TC=25℃  
Single Pulse  
DUT on infinite  
heatsink  
PW=10ms  
PW=100ms  
PW=1s  
VGS= -10V  
1
0.1  
1
10  
100  
0
20 40 60 80 100 120 140 160 180 200  
Qg (nC)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Figure 11. Gate Charge  
4 of 7  
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October 2017  
© Diodes Incorporated  
DMP2003UPS  
Document number: DS39597 Rev. 2 - 2  
DMP2003UPS  
1
D=0.9  
D=0.7  
D=0.5  
D=0.3  
0.1  
D=0.1  
D=0.05  
D=0.02  
0.01  
0.001  
D=0.01  
D=0.005  
RθJC(t) = r(t) * RθJC  
RθJC= 1.5/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
1E-06  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
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October 2017  
© Diodes Incorporated  
DMP2003UPS  
Document number: DS39597 Rev. 2 - 2  
DMP2003UPS  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI5060-8  
D
Detail A  
D1  
PowerDI5060-8  
Dim Min Max Typ  
0.90 1.10 1.00  
0.00 0.05  
0.33 0.51 0.41  
O (4X)  
A
A1  
b
c
A1  
b2 0.200 0.350 0.273  
b3  
c
D
0.40 0.80 0.60  
0.230 0.330 0.277  
5.15 BSC  
E1 E  
e
D1  
D2  
D3  
E
4.70 5.10 4.90  
3.70 4.10 3.90  
3.90 4.30 4.10  
6.15 BSC  
O (4X)  
1
E1  
E2  
E3  
e
G
K
5.60 6.00 5.80  
3.28 3.68 3.48  
3.99 4.39 4.19  
1.27 BSC  
b (8X)  
L
e/2  
1
b2 (4X)  
0.51 0.71 0.61  
D3  
K
0.51  
0.51 0.71 0.61  
  
L
L1 0.100 0.200 0.175  
A
D2  
b3 (4X)  
M
M1  
Θ
3.235 4.035 3.635  
1.00 1.40 1.21  
E3  
E2  
M
10°  
6°  
12°  
8°  
11°  
7°  
M1  
Θ1  
Detail A  
All Dimensions in mm  
G
L1  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
PowerDI5060-8  
X4  
X3  
Y2  
Y1  
Dimensions  
Value (in mm)  
1.270  
0.660  
0.820  
0.610  
4.100  
0.755  
4.420  
5.610  
1.270  
0.600  
1.020  
0.295  
1.825  
3.810  
0.180  
6.610  
C
G
G1  
X
Y3  
X1  
X2  
X3  
X4  
Y
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
X2  
Y5  
Y4  
X1  
Y7  
G1  
C
Y6  
Y( 4x)  
X
G
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October 2017  
© Diodes Incorporated  
DMP2003UPS  
Document number: DS39597 Rev. 2 - 2  
DMP2003UPS  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2017, Diodes Incorporated  
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© Diodes Incorporated  
DMP2003UPS  
Document number: DS39597 Rev. 2 - 2  

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