BC817-xx-7-F [DIODES]

NPN SURFACE MOUNT SMALL SIGNAL TRANSISTOR; NPN表面贴装小信号晶体管
BC817-xx-7-F
型号: BC817-xx-7-F
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

NPN SURFACE MOUNT SMALL SIGNAL TRANSISTOR
NPN表面贴装小信号晶体管

晶体 晶体管
文件: 总4页 (文件大小:113K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BC817-16 / -25 / -40  
NPN SURFACE MOUNT SMALL SIGNAL TRANSISTOR  
Please click here to visit our online spice models database.  
Features  
Mechanical Data  
Ideally Suited for Automated Insertion  
Epitaxial Planar Die Construction  
For Switching, AF Driver and Amplifier Applications  
Complementary PNP Types Available (BC807)  
Lead, Halogen and Antimony Free, RoHS Compliant  
"Green" Device (Notes 3 and 4)  
Case: SOT-23  
Case Material: Molded Plastic, “Green” Molding Compound,  
Note 4. UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe  
(Lead Free Plating) Solderable per MIL-STD-202, Method 208  
Pin Connections: See Diagram  
Marking Information: See Page 3  
Ordering Information: See Page 3  
Weight: 0.008 grams (approximate)  
Qualified to AEC-Q101 Standards for High Reliability  
C
E
B
Top View  
Device Schematic  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Symbol  
VCEO  
VEBO  
IC  
Value  
45  
5.0  
Unit  
V
V
Collector Current  
800  
mA  
mA  
mA  
Peak Collector Current  
Peak Emitter Current  
1000  
1000  
ICM  
IEM  
Thermal Characteristics  
Characteristic  
Power Dissipation at TSB = 50°C (Note 1)  
Symbol  
PD  
Value  
310  
Unit  
mW  
Thermal Resistance, Junction to Substrate Backside (Note 1)  
Thermal Resistance, Junction to Ambient Air (Note 1)  
Operating and Storage Temperature Range  
320  
°C/W  
Rθ  
SB  
403  
°C/W  
°C  
Rθ  
TJ, TSTG  
JA  
-65 to +150  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Characteristic (Note 2)  
Current Gain Group -16  
Symbol  
Min  
100  
160  
250  
60  
Max  
Unit  
Test Condition  
250  
400  
600  
-25  
-40  
VCE = 1.0V, IC = 100mA  
DC Current Gain  
hFE  
Current Gain Group -16  
-25  
-40  
100  
170  
VCE = 1.0V, IC = 300mA  
Collector-Emitter Saturation Voltage  
Base-Emitter Voltage  
0.7  
1.2  
V
V
VCE(SAT)  
VBE  
IC = 500mA, IB = 50mA  
VCE = 1.0V, IC = 300mA  
VCE = 45V  
VCE = 25V, Tj = 150°C  
VEB = 4.0V  
100  
5.0  
nA  
µA  
Collector-Emitter Cutoff Current  
Emitter-Base Cutoff Current  
Gain Bandwidth Product  
ICES  
IEBO  
fT  
100  
nA  
MHz  
pF  
VCE = 5.0V, IC = 10mA,  
f = 50MHz  
100  
Collector-Base Capacitance  
12  
CCBO  
VCB = 10V, f = 1.0MHz  
Notes:  
1. Device mounted on Ceramic Substrate 0.7mm; 2.5cm2 area.  
2. Short duration pulse test used to minimize self-heating effect.  
3. No purposefully added lead. Halogen and Antimony Free.  
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code  
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
1 of 4  
www.diodes.com  
April 2009  
© Diodes Incorporated  
BC817-16 / -25 / -40  
Document number: DS11107 Rev. 18 - 2  
BC817-16 / -25 / -40  
400  
300  
200  
100  
0
500  
400  
300  
200  
100  
0
R
= 320°C/W  
SB  
θ
0
100  
TSB, SUBSTRATE TEMPERATURE (  
200  
0
1
2
°
C)  
VCE, COLLECTOR-EMITTER VOLTAGE (V)  
Fig. 1 Power Dissipation vs. Substrate Temperature (Note 1)  
Fig. 2 Typical Collector Current  
vs. Collector-Emitter Voltage  
100  
1,000  
VCE = 1V  
80  
150°C  
TA = 25°C  
60  
40  
-50°C  
100  
20  
0
10  
0.1  
1
10  
IC, COLLECTOR CURRENT (mA)  
Fig. 4 Typical DC Current Gain vs. Collector Current  
100  
0
10  
20  
1,000  
VCE, COLLECTOR-EMITTER VOLTAGE (V)  
Fig. 3 Typical Collector Current  
vs. Collector-Emitter Voltage  
0.5  
1,000  
typical  
limits  
at TA = 25°C  
0.4  
0.3  
IC / IB = 10  
100  
0.2  
25°C  
0.1  
0
-50°C  
150°C  
10  
0.1  
100  
IC, COLLECTOR CURRENT (mA)  
1,000  
1
10  
IC, COLLECTOR CURRENT (mA)  
Fig. 6 Gain-Bandwidth Product vs. Collector Current  
100  
1,000  
1
10  
Fig. 5 Typical Collector-Emitter Saturation Voltage  
vs. Collector Current  
2 of 4  
www.diodes.com  
April 2009  
© Diodes Incorporated  
BC817-16 / -25 / -40  
Document number: DS11107 Rev. 18 - 2  
BC817-16 / -25 / -40  
Ordering Information (Note 5)  
Part Number  
Case  
Packaging  
BC817-xx-7-F  
SOT-23  
3000/Tape & Reel  
*xx = gain group, e.g. BC817-16-7-F.  
Notes:  
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.  
Marking Information  
K6x = Product Type Marking Code:  
K6A = BC817-16  
K6B = BC817-25  
K6x  
K6C = BC817-40  
YM = Date Code Marking  
Y = Year (ex: T = 2006)  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015  
Code  
J
K
L
M
N
P
R
S
T
U
V
W
X
Y
Z
A
B
C
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
Package Outline Dimensions  
SOT-23  
A
Dim  
A
B
C
D
F
G
H
J
K
Min  
0.37  
1.20  
2.30  
0.89  
0.45  
1.78  
2.80  
Max  
0.51  
1.40  
2.50  
1.03 0.915  
0.60 0.535  
Typ  
0.40  
1.30  
2.40  
C
B
2.05  
3.00  
1.83  
2.90  
0.05  
1.00  
0.400  
0.55  
0.11  
-
H
0.013 0.10  
0.903 1.10  
M
K
K1  
K1  
L
M
-
-
D
0.45  
0.61  
F
J
L
0.085 0.18  
0° 8°  
G
α
All Dimensions in mm  
Suggested Pad Layout  
Y
Dimensions Value (in mm)  
Z
Z
X
Y
C
E
2.9  
0.8  
0.9  
2.0  
C
1.35  
E
X
3 of 4  
www.diodes.com  
April 2009  
© Diodes Incorporated  
BC817-16 / -25 / -40  
Document number: DS11107 Rev. 18 - 2  
BC817-16 / -25 / -40  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2009, Diodes Incorporated  
www.diodes.com  
4 of 4  
www.diodes.com  
April 2009  
© Diodes Incorporated  
BC817-16 / -25 / -40  
Document number: DS11107 Rev. 18 - 2  

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