B1100-FDITR [DIODES]
1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER; 1.0A高压肖特基整流器
| 型号： | B1100-FDITR |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER |
| 文件： | 总4页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
B170/B - B1100/B
Green
1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
Features
Mechanical Data
•
•
•
•
•
Guard Ring Die Construction for Transient Protection
•
•
Case: SMA / SMB
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
Ideally Suited for Automated Assembly
Low Power Loss, High Efficiency
Surge Overload Rating to 30A Peak
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Application
•
•
•
•
Polarity: Cathode Band or Cathode Notch
Weight: SMA 0.064 grams (approximate)
SMB 0.093 grams (approximate)
•
•
•
High Temperature Soldering: 260°C/10 Second at Terminal
Lead Free Finish/RoHS Compliant (Note 1)
Green Molding Compound (No Halogen and Antimony)
(Note 2)
Top View
Bottom View
Ordering Information (Note 3)
Part Number
B1x-13-F
B1xB-13-F
Case
SMA
SMB
Packaging
5000/Tape & Reel
3000/Tape & Reel
*x = Device type, e.g. B180-13-F (SMA package); B1100B-13-F (SMB package).
Notes:
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
XXX = Product type marking code, ex: B170 (SMA package)
XXXX = Product type marking code, ex: B190B (SMB package)
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year (ex: 2 for 2002)
YWW
xxx(x)
WW = Week code 01 to 52
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September 2010
© Diodes Incorporated
B170/B - B1100/B
Document number: DS30018 Rev. 10 - 2
B170/B - B1100/B
Maximum Ratings @T = 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
B170/B
70
B180/B
80
B190/B
90
B1100/B
100
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RMS Reverse Voltage
49
56
63
70
V
A
VR(RMS)
IO
1.0
30
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
@ TT = 125°C
A
A
IFSM
IRRM
Repetitive Peak Reverse Current
1.0
Thermal Characteristics
Characteristic
Typical Thermal Resistance Junction to Terminal (Note 4)
Operating and Storage Temperature Range
Symbol
B170/B
B180/B
B190/B
B1100/B
Unit
°C/W
°C
25
Rθ
JT
-65 to +150
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
IF = 1.0A, TA = 25°C
IF = 1.0A, TA = 100°C
@ Rated VR, TA = 25°C
@ Rated VR, TA = 100°C
VR = 4V, f = 1MHz
0.79
0.69
Forward Voltage Drop
-
-
V
VF
-
-
-
-
0.5
5.0
Leakage Current (Note 5)
Total Capacitance
mA
pF
IR
-
-
80
CT
Notes:
4. Valid provided that terminals are kept at ambient temperature.
5. Short duration pulse test used to minimize self-heating effect.
1,000
10
1.0
100
0.1
T
I
= 25°C
J
Pulse Width = 300µs
F
0.01
10
0
0.2
0.4
0.6
0.8
1.0
0.1
1
VR, DC REVERSE VOLTAGE (V)
Fig. 2 Total Capacitance vs. Reverse Voltage
10
100
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Typical Forward Characteristics
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www.diodes.com
September 2010
© Diodes Incorporated
B170/B - B1100/B
Document number: DS30018 Rev. 10 - 2
B170/B - B1100/B
1.0
40
30
Single Half Sine-Wave
0.5
20
10
0
T
= 150°C
J
0
1
10
NUMBER OF CYCLES AT 60 Hz
Fig. 4 Max Non-Repetitive Peak Forward Surge Current
100
25
50
TT, TERMINAL TEMPERATURE (
Fig. 3 Forward Current Derating Curve
75
100
125
150
°C)
Package Outline Dimensions
B
SMA
SMB
Min
Dim
A
B
C
D
E
G
H
Min
2.29
4.00
1.27
0.15
4.80
0.05
0.76
2.01
Max
2.92
4.60
1.63
0.31
5.59
0.20
1.52
2.30
Dim
A
B
C
D
E
G
H
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.50
3.30
4.06
1.96
0.15
5.00
0.05
0.76
2.00
A
J
C
D
J
J
All Dimensions in mm
All Dimensions in mm
G
E
H
Suggested Pad Layout
SMB
Dimensions
SMA
Dimensions
Value (in mm)
Value (in mm)
Z
G
X
Y
C
6.7
1.8
2.3
2.5
4.3
Z
G
X
Y
C
6.5
1.5
1.7
2.5
4.0
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September 2010
© Diodes Incorporated
B170/B - B1100/B
Document number: DS30018 Rev. 10 - 2
B170/B - B1100/B
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
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www.diodes.com
September 2010
© Diodes Incorporated
B170/B - B1100/B
Document number: DS30018 Rev. 10 - 2
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