APR34330MPTR-G1 [DIODES]
Switching Regulator;型号: | APR34330MPTR-G1 |
厂家: | DIODES INCORPORATED |
描述: | Switching Regulator 开关 |
文件: | 总13页 (文件大小:506K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
A Product Line of
Diodes Incorporated
APR34330
SECONDARY SIDE SYNCHRONOUS RECTIFICATION SWITCHER
Description
Pin Assignments
APR34330 is a secondary side Combo IC, which combines an N-
Channel MOSFET and a driver circuit designed for synchronous
rectification (SR) in DCM operation. It also integrates output voltage
detect function for primary side control system.
(Top View)
DRISR
GND
GND
8
1
2
3
4
The N-Channel MOSFET has been optimized for low gate charge,
low RDS(ON), fast switching speed and body diode reverse recovery
performance.
VDET
AREF
VCC
7
6
5
GND
The synchronous rectification can effectively reduce the secondary
side rectifier power dissipation and provide high performance solution.
By sensing MOSFET drain-to-source voltage, APR34330 can output
ideal drive signal with less external components. It can provide high
performance solution for 5V output voltage application.
DRAIN
Note: The DRAIN pin of internal MOSFET is exposed PAD, which is at the bottom
of IC (the dashed box). The secondary current should flow from GND(pin 6,7,8) to
this exposed PAD.
Same as AP4341, APR34330 detects the output voltage and provides
a periodical signal when the output voltage is lower than a certain
threshold. By fast response to secondary side voltage, APR34330
can effectively improve the transient performance of primary side
control system.
SO-8EP
The APR34330 is available in SO-8EP package.
Applications
•
•
Adapters/Chargers for Cell/Cordless Phones, ADSL Modems, MP3
and Other Portable Apparatus
Standby and Auxiliary Power Supplies
Features
•
•
•
•
Synchronous Rectification for DCM Operation Flyback
Eliminate Resonant Ring Interference
Fast Detector of Supply Voltages
Fewest External Components
Totally Lead-free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
C21 C22
+
+
C23
R21
APR34330
DRAIN
GND
GND
DRAIN
R23
R24
DRISR
VDET
GND
VCC
C24
AREF
CAREF
RAREF
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© Diodes Incorporated
APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Pin Descriptions
Pin Number
Pin Name
Function
1
DRISR
Synchronous rectification MOSFET drive
Synchronous rectification sense input and dynamic function output, connected to DRAIN
through a resistor
2
3
VDET
AREF
Program a voltage reference with a resistor from AREF to GND, to enable synchronous
rectification MOSFET drive signal
4
VCC
DRAIN
GND
Power supply, connected with system output
5
Drain pin of internal MOSFET. The Drain voltage signal can obtain from this pin.
Source pin of internal MOSFET, connected to Ground
6,7,8
Drain pin of internal MOSFET. The secondary current should flow from GND (pin 6.7.8)
to this DRAIN pad.
Exposed PAD
DRAIN
Functional Block Diagram
VCC
4
VREF
IOVP
Dynamic
Integrator
(VDET-VCC)*tONP
OVP
IAREF
Counter
tONPDET
3
AREF
OSC
1
SRDRIVER
DRISR
6,7,8
GND
5, EP
DRAIN
2
VDET
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© Diodes Incorporated
APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Absolute Maximum Ratings (Note 4)
Symbol
Parameter
Value
-0.3 to 7.5
-2 to 50
-0.3 to 6
15
Unit
V
VCC
Supply Voltage
VDET, VDRAIN
Voltage at VDET, DRAIN Pin
Voltage at AREF, DRISR Pin
Continuous Drain Current
Pulsed Drain Current
V
VAREF, VDRISR
V
ID
A
IDM
PD
θJA
60
A
Power Dissipation at TA=+25ºC
2
W
Thermal Resistance (Junction to Ambient)
56
ºC /W
(Note 5)
Thermal Resistance (Junction to Case)
(Note 5)
θJC
TJ
14
+150
ºC /W
ºC
Operating Junction Temperature
Storage Temperature
TSTG
TLEAD
-65 to +150
+300
ºC
Lead Temperature (Soldering, 10 sec)
ºC
Notes: 4. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied.
Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.
5. FR-4 substrate PC board, 2oz copper, with 1 inch2 pad layout.
Recommended Operating Conditions
Symbol
VCC
Parameter
Min
3.3
-40
Max
6
Unit
V
Supply Voltage
Ambient Temperature
TA
+85
ºC
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© Diodes Incorporated
APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Electrical Characteristics (@TA = +25°C, VCC=5V, unless otherwise specified.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply Voltage ( VCC Pin )
ISTARTUP
IOP
Startup Current
Operating Current
VCC=VSTARTUP-0.1V
–
90
150
150
μA
μA
VDET pin floating
VCC=VTRIGGER+20mV
40
100
VSTARTUP
Startup Voltage
UVLO
–
–
2.6
2.3
3.1
2.8
3.4
3.1
V
V
–
Dynamic Output Section/Oscillator Section
VTRIGGER
–
Internal Trigger Voltage
Duty Cycle
–
5.25
4
5.3
15
30
5.35
18
V
%
μs
–
tOSC
Oscillation Period
VCC=5V
18
37.5
VCC=VTRIGGER, VCC/VDET pin is
separately connected to a 20Ω
resistor
–
Output Maximum Current
30
60
80
mA
tDIS
VDIS
Minimum Period
–
18
5.28
1.5
30
30
5.44
3
37.5
5.52
4.5
–
ms
V
Discharge Voltage
–
IDIS
Discharge Current
VCC=VDIS+0.1V
mA
mV
V
VDIS-VTRIGGER
VOVP
Trigger Discharger Gap
Overshoot Voltage for Discharge
–
–
110
5.9
5.8
6.0
VCC=VOVP+0.1V, VCC pin is
connected to a 20Ω resistor
IOVP
Overshoot Current for Discharge
40
–
100
mA
Synchronous Voltage Detect
VTHON
VTHOFF
tDON
Gate Turn On Threshold
–
0
-25
–
–
-15
70
100
50
50
1.8
–
1
V
mV
ns
ns
ns
ns
Gate Turn Off Threshold
Turn-on Delay Time
–
-5
From VTHON to VDRISR=1V
From VTHOFF to VDRISR=3V
From 1V to 3V, CL=4.7nF
From 3V to 1V, CL=4.7nF
(VDET-VCC)*tONP = 25Vµs
(VDET-VCC)*tONP = 50Vµs
VCC=5V
130
150
100
100
2.0
5
tDOFF
Turn-off Propagation Delay Time
Gate Turn-on Rising Time
Gate Turn-off Falling Time
–
tRG
–
tFG
–
tLEB_S
tLEB_L
VDRISR_HIGH
0.9
–
Minimum On Time
μs
Drive Output Voltage
3.7
–
–
V
V
SR Minimum Operating Voltage
(Note 6)
VS_MIN
–
–
–
4.5
tOVP_LAST
Kqs
Added OVP Discharge Time
(Note 7)
–
–
2.0
–
ms
0.325
–
0.515
mA*μs
(VDET-VCC)*tONP = 25Vµs
Notes 6: This item specifies the minimum SR operating voltage of VIN_DC, VIN_DC≥NPS*VS_MIN.
7: This item is used to specify the value of RAREF
.
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© Diodes Incorporated
APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Electrical Characteristics (@TA =+25°C, unless otherwise specified. Cont.)
MOSFET Static Characteristics
Parameters
Symbol
VDSS(BR)
VGS(TH)
IDSS
Conditions
VGS=0V, ID=0.25mA
VDS=VGS, ID=0.25mA
VDS=50V, VGS=0V
VGS=10V, VDS=0V
VGS=4.5V, ID=3A
Min
50
–
Typ
56
0.85
6
Max
Unit
V
Drain to Source Breakdown
Voltage
–
2
Gate Threshold Voltage
V
Zero Gate Voltage Drain
Current
–
1000
±10
36
nA
μA
Gate to Source Leakage
Current
IGSS
–
1
–
32
36
Drain to Source On-state
Resistance
RDS(ON)
mΩ
VGS=4.5V, ID=15A
–
42
MOSFET Dynamic Characteristics
Parameters
Input Capacitance
Symbol
Conditions
Min
–
Typ
661
52
Max
–
Unit
Ciss
Coss
Crss
Qgs
Qgd
Qg
Output Capacitance
VGS=0V, VDS=25V, f=1MHz
–
–
pF
Reverse Transfer Capacitance
Gate to Source Charge
–
45
–
–
1.4
2.9
7.5
2.15
–
VGS=0V to 10V, VDD=25V,
ID=15A
Gate to Drain Charge (Miller
Charger)
–
–
nC
Total Gate Charge
Gate Resistance
VGS=4.5V
–
–
–
–
–
Ω
Rg
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© Diodes Incorporated
APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Performance Characteristics
Startup Voltage vs. Temperature
UVLO vs. Temperature
3.5
3.0
2.5
2.0
1.5
1.0
3.4
3.2
3.0
2.8
2.6
-40
-20
0
20
40
60
80
100
120
140
-40
-20
0
20
40
60
80
100
120
140
Temperature (oC)
Temperature (oC)
Internal Trigger Voltage vs. Temperature
Internal Trigger Current vs. Temperature
100
90
80
70
60
50
40
30
20
10
0
5.4
5.3
5.2
5.1
5.0
4.9
4.8
4.7
-40
-20
0
20
40
60
80
100
120
140
-40
-20
0
20
40
60
80
100
120
140
Temperature (oC)
Temperature (oC)
Overshoot Voltage for Discharge vs. Temperature
Overshoot Current for Discharge vs. Temperature
160
140
120
100
80
6.0
5.8
5.6
5.4
5.2
5.0
60
40
20
0
-40
-20
0
20
40
60
80
100
120
140
-40
-20
0
20
40
60
80
100
120
140
Temperature (oC)
Temperature (oC)
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APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Performance Characteristics (Cont.)
Gate Turn Off Threshold vs. Temperature
Kqs (See Note 7) vs. Temperature
0
-5
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-10
-15
-20
-25
-30
-35
-40
-40
-20
0
20
40
60
80
100
120
140
-40
-20
0
20
40
60
80
100
120
140
Temperature (oC)
Temperature (oC)
Operating Current vs. Temperature
Drain to Source On-state Resistance vs. Temperature
100
90
80
70
60
50
40
30
20
10
0
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
100
120
140
-40
-20
0
20
40
60
80
100
120
140
Temperature (oC)
Temperature (oC)
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© Diodes Incorporated
APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Output Voltage Detect Function Description
tOSC
tOSC
tDIS
tDIS
tDIS
tDIS
tDIS
tDIS
VDET
VCC
VOVP
VDIS
VDIS
VTRIGGER
VTRIGGER
VOFF
VON
UVLO
tOVP_LAST
IOVP
IDIS
IVCC
Figure 1. Typical Waveforms of APR34330
When VCC is beyond power-on voltage (VON), the APR34330 starts up. The VDET pin asserts a periodical pulse and the oscillation period is tOSC
.
When VCC is beyond the trigger voltage (VTRIGGER), the periodical pulse at VDET pin is discontinued. When VCC is beyond the discharge voltage
(VDIS), the discharge circuit will be enabled, and a 3mA current (IDIS) will flow into VCC pin. When VCC is higher than the overshoot voltage (VOVP),
the APR34330 will enable a discharge circuit, the discharge current (IOVP) will last tOVP_LAST time. After the tOVP_LAST time, APR34330 will stop the
discharge current and detect VCC voltage again. If VCC is still higher than VOVP, the tOVP_LAST time discharge current will be enabled again. Once the
OVP discharge current is asserted, the periodical pulse at VDET pin will be disabled.
When the VCC falls below the power-off voltage (VOFF), the APR34330 will shut down.
Operation Description
MOSFET Driver
The operation of the SR is described with timing diagram shown in Figure 2. APR34330 monitors the MOSFET drain-source voltage. When the
drain voltage is lower than the turn-on threshold voltage VTHON, the IC outputs a positive drive voltage after a turn-on delay time (tDON). The
MOSFET will turn on and the current will transfer from the body diode into the MOSFET’s channel.
In the process of drain current decreasing linearly toward zero, the drain-source voltage rises synchronically. When it rises over the turn-off
threshold voltage VTHOFF, APR34330 pulls the drive signal down after a turn-off delay (tDOFF).
I,V
VDET
IS
VTHON
0
t
VTHOFF
VDRISR
0.9VDRISR
0.9VDRISR
0.1VDRISR
tRG
0.1VDRISR
0
t
tFG
tDON
tDOFF
Figure 2. Typical Waveforms of APR34330
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APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Operation Description (Cont.)
Minimum On Time
When the controlled MOSFET gate is turned on, some ringing noise is generated. The minimum on-time timer blanks the VTHOFF comparator,
keeping the controlled MOSFET on for at least the minimum on time. If VTHOFF falls below the threshold before minimum on time expires, the
MOSFET will keep on until the end of the minimum on time.
The minimum on time is in direct proportion to the (VDET-VCC)*tONP. When (VDET-VCC)*tONP=5V*5μs, the minimum on time is about 1.8μs.
The Value and Meaning of AREF Resistor
As to DCM operation Flyback converter, after secondary rectifier stops conduction the primary MOSFET Drain-to-source ringing waveform is
resulted from the resonant of primary inductance and equivalent switch device output capacitance. This ringing waveform probably leads to
Synchronous Rectifier error conduction. To avoid this fault happening, APR34330 has a special function design by means of volt-second product
detecting. From the sensed voltage of VDET pin to see, the volt-second product of voltage above VCC at primary switch on time is much higher
than the volt-second product of each cycle ringing voltage above VCC. Therefore, before every time Synchronous Rectifier turning on, APR34330
judges if the detected volt-second product of VDET voltage above VCC is higher than a threshold and then turn on synchronous Rectifier. The
purpose of AREF resistor is to determine the volt-second product threshold. APR34330 has a parameter, Kqs, which converts RAREF value to volt-
second product,
Area2 RAREF *Kqs
In general, Area1 and Area3, the value of which should be test on system, depend on system design and are always fixed after system design
frozen. As to BCD PSR design, the Area1 value changes with primary peak current value and Area3 value generally keeps constant at all of
conditions. So the AREF resistor design should consider the worst case, the minimum primary peak current condition. Since of system design
parameter distribution, Areas1 and Area3 have moderate tolerance. So Area2 should be designed between the middle of Area1 and Area3 to keep
enough design margin.
Area3 RAREF *Kqs Area1
Area1=(VDET-VCC)*tONP
Area3
VDET
VCC
Area2=Kqs*RAREF
Figure 3. AREF Function
SR Minimum Operating Voltage
APR34330 sets a minimum SR operating voltage by comparing the difference between VDET and output voltage (VCC). The value of VDET–VCC must
be higher than its internal reference, then APR34330 will begin to integrate the area of (VDET–VCC)*tONP. If not, the area integrating will not begin
and the SR driver will be disabled.
SR Turning off Timing Impact on PSR CV Sampling
As to synchronous rectification on Flyback power system, SR MOSFET need to turn off in advance of secondary side current decreasing to zero to
avoid current flowing reversely. When SR turns off in advance, the secondary current will flow through the body diode. The SR turning off time is
determined by the VTHOFF at a fixed system. When VTHOFF is more close to zero, the SR turning on time gets longer and body diode conduction time
gets shorter. Since of the different voltage drop between SR MOSFET and body diode, the PSR feedback signal VFB appears a voltage jump at the
time of SR MOSFET turning off. If the PSR CV sampling time tSAMPLE is close to even behind this voltage jump time, there will be system unstable
operation issue or the lower output voltage issue.
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© Diodes Incorporated
APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Operation Description (Cont.)
To ensure stable operating of system, it must be met:
tBODYDIODE<tONS*(1- tSAMPLE
)
tSAMPLE
SR Turnoff,
Bodydiode operating
SR Operating
tBODYDIODE
VFB
tONS
Figure 4. SR Turning off Timing Impact on PSR CV Sampling
Recommended Application Circuit Parameters
The two resistors R23 and R24 are used to pass ESD test. The value of R23 and R24 should be over 20Ω and below 47Ω respectively because of
the undershoot performance. The package of R23 and R24 should be at least 0805 and there isn’t any trace under these two resistors.
CAREF is suggested to parallel with AREF resistor to keep the volt-second product threshold stable. And the recommended value of CAREF is 100nF.
The recommended value of C24 is 100nF.
Ordering Information
APR34330 XX XX - XX
Product Name
RoHS/Green
G1 : Green
Package
Packing
MP: SO-8EP
TR : Tape & Reel
Package
Temperature Range
-40 to +85C
Part Number
Marking ID
34330MP-G1
Packing
SO-8EP
APR34330MPTR-G1
4000/Tape & Reel
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APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Marking Information
(Top View)
First and Second Lines: Logo and Marking ID
Third Line: Date Code
Y: Year
WW: Work Week of Molding
A: Assembly House Code
XX: 7th and 8th Digits of Batch No.
34330
MP-G1
YWWAXX
Package Outline Dimensions (All dimensions in mm(inch).)
(1) Package Type: SO-8EP
3.800(0.150)
4.000(0.157)
2.110(0.083)
2.710(0.107)
4.700(0.185)
1.270(0.050)
TYP
5.100(0.201)
0.300(0.012)
0.510(0.020)
0.050(0.002)
0.150(0.006)
5.800(0.228)
6.200(0.244)
1.350(0.053)
1.550(0.061)
0.400(0.016)
1.270(0.050)
0.150(0.006)
0.250(0.010)
Note: Eject hole, oriented hole and mold mark is optional.
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© Diodes Incorporated
APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
Suggested Pad Layout
(1) Package Type: SO-8EP
Y1
G
Z
X1
Y
E
X
Z
G
X
Y
X1
Y1
E
Dimensions
(mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
Value
6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059
3.600/0.142
2.700/0.106
1.270/0.050
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© Diodes Incorporated
APR34330
Document number: DS37452 Rev. 3 - 2
A Product Line of
Diodes Incorporated
APR34330
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final and determinative format released by Diodes Incorporated.
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Copyright © 2015, Diodes Incorporated
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Document number: DS37452 Rev. 3 - 2
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