APR34330MPTR-G1 [DIODES]

Switching Regulator;
APR34330MPTR-G1
型号: APR34330MPTR-G1
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Switching Regulator

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A Product Line of  
Diodes Incorporated  
APR34330  
SECONDARY SIDE SYNCHRONOUS RECTIFICATION SWITCHER  
Description  
Pin Assignments  
APR34330 is a secondary side Combo IC, which combines an N-  
Channel MOSFET and a driver circuit designed for synchronous  
rectification (SR) in DCM operation. It also integrates output voltage  
detect function for primary side control system.  
(Top View)  
DRISR  
GND  
GND  
8
1
2
3
4
The N-Channel MOSFET has been optimized for low gate charge,  
low RDS(ON), fast switching speed and body diode reverse recovery  
performance.  
VDET  
AREF  
VCC  
7
6
5
GND  
The synchronous rectification can effectively reduce the secondary  
side rectifier power dissipation and provide high performance solution.  
By sensing MOSFET drain-to-source voltage, APR34330 can output  
ideal drive signal with less external components. It can provide high  
performance solution for 5V output voltage application.  
DRAIN  
Note: The DRAIN pin of internal MOSFET is exposed PAD, which is at the bottom  
of IC (the dashed box). The secondary current should flow from GND(pin 6,7,8) to  
this exposed PAD.  
Same as AP4341, APR34330 detects the output voltage and provides  
a periodical signal when the output voltage is lower than a certain  
threshold. By fast response to secondary side voltage, APR34330  
can effectively improve the transient performance of primary side  
control system.  
SO-8EP  
The APR34330 is available in SO-8EP package.  
Applications  
Adapters/Chargers for Cell/Cordless Phones, ADSL Modems, MP3  
and Other Portable Apparatus  
Standby and Auxiliary Power Supplies  
Features  
Synchronous Rectification for DCM Operation Flyback  
Eliminate Resonant Ring Interference  
Fast Detector of Supply Voltages  
Fewest External Components  
Totally Lead-free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. GreenDevice (Note 3)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Typical Applications Circuit  
C21 C22  
+
+
C23  
R21  
APR34330  
DRAIN  
GND  
GND  
DRAIN  
R23  
R24  
DRISR  
VDET  
GND  
VCC  
C24  
AREF  
CAREF  
RAREF  
1 of 13  
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June 2015  
© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Pin Descriptions  
Pin Number  
Pin Name  
Function  
1
DRISR  
Synchronous rectification MOSFET drive  
Synchronous rectification sense input and dynamic function output, connected to DRAIN  
through a resistor  
2
3
VDET  
AREF  
Program a voltage reference with a resistor from AREF to GND, to enable synchronous  
rectification MOSFET drive signal  
4
VCC  
DRAIN  
GND  
Power supply, connected with system output  
5
Drain pin of internal MOSFET. The Drain voltage signal can obtain from this pin.  
Source pin of internal MOSFET, connected to Ground  
6,7,8  
Drain pin of internal MOSFET. The secondary current should flow from GND (pin 6.7.8)  
to this DRAIN pad.  
Exposed PAD  
DRAIN  
Functional Block Diagram  
VCC  
4
VREF  
IOVP  
Dynamic  
Integrator  
(VDET-VCC)*tONP  
OVP  
IAREF  
Counter  
tONPDET  
3
AREF  
OSC  
1
SRDRIVER  
DRISR  
6,7,8  
GND  
5, EP  
DRAIN  
2
VDET  
2 of 13  
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June 2015  
© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Absolute Maximum Ratings (Note 4)  
Symbol  
Parameter  
Value  
-0.3 to 7.5  
-2 to 50  
-0.3 to 6  
15  
Unit  
V
VCC  
Supply Voltage  
VDET, VDRAIN  
Voltage at VDET, DRAIN Pin  
Voltage at AREF, DRISR Pin  
Continuous Drain Current  
Pulsed Drain Current  
V
VAREF, VDRISR  
V
ID  
A
IDM  
PD  
θJA  
60  
A
Power Dissipation at TA=+25ºC  
2
W
Thermal Resistance (Junction to Ambient)  
56  
ºC /W  
(Note 5)  
Thermal Resistance (Junction to Case)  
(Note 5)  
θJC  
TJ  
14  
+150  
ºC /W  
ºC  
Operating Junction Temperature  
Storage Temperature  
TSTG  
TLEAD  
-65 to +150  
+300  
ºC  
Lead Temperature (Soldering, 10 sec)  
ºC  
Notes: 4. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied.  
Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.  
5. FR-4 substrate PC board, 2oz copper, with 1 inch2 pad layout.  
Recommended Operating Conditions  
Symbol  
VCC  
Parameter  
Min  
3.3  
-40  
Max  
6
Unit  
V
Supply Voltage  
Ambient Temperature  
TA  
+85  
ºC  
3 of 13  
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June 2015  
© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Electrical Characteristics (@TA = +25°C, VCC=5V, unless otherwise specified.)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Supply Voltage ( VCC Pin )  
ISTARTUP  
IOP  
Startup Current  
Operating Current  
VCC=VSTARTUP-0.1V  
90  
150  
150  
μA  
μA  
VDET pin floating  
VCC=VTRIGGER+20mV  
40  
100  
VSTARTUP  
Startup Voltage  
UVLO  
2.6  
2.3  
3.1  
2.8  
3.4  
3.1  
V
V
Dynamic Output Section/Oscillator Section  
VTRIGGER  
Internal Trigger Voltage  
Duty Cycle  
5.25  
4
5.3  
15  
30  
5.35  
18  
V
%
μs  
tOSC  
Oscillation Period  
VCC=5V  
18  
37.5  
VCC=VTRIGGER, VCC/VDET pin is  
separately connected to a 20Ω  
resistor  
Output Maximum Current  
30  
60  
80  
mA  
tDIS  
VDIS  
Minimum Period  
18  
5.28  
1.5  
30  
30  
5.44  
3
37.5  
5.52  
4.5  
ms  
V
Discharge Voltage  
IDIS  
Discharge Current  
VCC=VDIS+0.1V  
mA  
mV  
V
VDIS-VTRIGGER  
VOVP  
Trigger Discharger Gap  
Overshoot Voltage for Discharge  
110  
5.9  
5.8  
6.0  
VCC=VOVP+0.1V, VCC pin is  
connected to a 20Ω resistor  
IOVP  
Overshoot Current for Discharge  
40  
100  
mA  
Synchronous Voltage Detect  
VTHON  
VTHOFF  
tDON  
Gate Turn On Threshold  
0
-25  
-15  
70  
100  
50  
50  
1.8  
1
V
mV  
ns  
ns  
ns  
ns  
Gate Turn Off Threshold  
Turn-on Delay Time  
-5  
From VTHON to VDRISR=1V  
From VTHOFF to VDRISR=3V  
From 1V to 3V, CL=4.7nF  
From 3V to 1V, CL=4.7nF  
(VDET-VCC)*tONP = 25Vµs  
(VDET-VCC)*tONP = 50Vµs  
VCC=5V  
130  
150  
100  
100  
2.0  
5
tDOFF  
Turn-off Propagation Delay Time  
Gate Turn-on Rising Time  
Gate Turn-off Falling Time  
tRG  
tFG  
tLEB_S  
tLEB_L  
VDRISR_HIGH  
0.9  
Minimum On Time  
μs  
Drive Output Voltage  
3.7  
V
V
SR Minimum Operating Voltage  
(Note 6)  
VS_MIN  
4.5  
tOVP_LAST  
Kqs  
Added OVP Discharge Time  
(Note 7)  
2.0  
ms  
0.325  
0.515  
mA*μs  
(VDET-VCC)*tONP = 25Vµs  
Notes 6: This item specifies the minimum SR operating voltage of VIN_DC, VIN_DC≥NPS*VS_MIN.  
7: This item is used to specify the value of RAREF  
.
4 of 13  
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June 2015  
© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Electrical Characteristics (@TA =+25°C, unless otherwise specified. Cont.)  
MOSFET Static Characteristics  
Parameters  
Symbol  
VDSS(BR)  
VGS(TH)  
IDSS  
Conditions  
VGS=0V, ID=0.25mA  
VDS=VGS, ID=0.25mA  
VDS=50V, VGS=0V  
VGS=10V, VDS=0V  
VGS=4.5V, ID=3A  
Min  
50  
Typ  
56  
0.85  
6
Max  
Unit  
V
Drain to Source Breakdown  
Voltage  
2
Gate Threshold Voltage  
V
Zero Gate Voltage Drain  
Current  
1000  
±10  
36  
nA  
μA  
Gate to Source Leakage  
Current  
IGSS  
1
32  
36  
Drain to Source On-state  
Resistance  
RDS(ON)  
mΩ  
VGS=4.5V, ID=15A  
42  
MOSFET Dynamic Characteristics  
Parameters  
Input Capacitance  
Symbol  
Conditions  
Min  
Typ  
661  
52  
Max  
Unit  
Ciss  
Coss  
Crss  
Qgs  
Qgd  
Qg  
Output Capacitance  
VGS=0V, VDS=25V, f=1MHz  
pF  
Reverse Transfer Capacitance  
Gate to Source Charge  
45  
1.4  
2.9  
7.5  
2.15  
VGS=0V to 10V, VDD=25V,  
ID=15A  
Gate to Drain Charge (Miller  
Charger)  
nC  
Total Gate Charge  
Gate Resistance  
VGS=4.5V  
Ω
Rg  
5 of 13  
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June 2015  
© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Performance Characteristics  
Startup Voltage vs. Temperature  
UVLO vs. Temperature  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
3.4  
3.2  
3.0  
2.8  
2.6  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature (oC)  
Temperature (oC)  
Internal Trigger Voltage vs. Temperature  
Internal Trigger Current vs. Temperature  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
5.4  
5.3  
5.2  
5.1  
5.0  
4.9  
4.8  
4.7  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature (oC)  
Temperature (oC)  
Overshoot Voltage for Discharge vs. Temperature  
Overshoot Current for Discharge vs. Temperature  
160  
140  
120  
100  
80  
6.0  
5.8  
5.6  
5.4  
5.2  
5.0  
60  
40  
20  
0
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature (oC)  
Temperature (oC)  
6 of 13  
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June 2015  
© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Performance Characteristics (Cont.)  
Gate Turn Off Threshold vs. Temperature  
Kqs (See Note 7) vs. Temperature  
0
-5  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature (oC)  
Temperature (oC)  
Operating Current vs. Temperature  
Drain to Source On-state Resistance vs. Temperature  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
140  
120  
100  
80  
60  
40  
20  
0
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature (oC)  
Temperature (oC)  
7 of 13  
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© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Output Voltage Detect Function Description  
tOSC  
tOSC  
tDIS  
tDIS  
tDIS  
tDIS  
tDIS  
tDIS  
VDET  
VCC  
VOVP  
VDIS  
VDIS  
VTRIGGER  
VTRIGGER  
VOFF  
VON  
UVLO  
tOVP_LAST  
IOVP  
IDIS  
IVCC  
Figure 1. Typical Waveforms of APR34330  
When VCC is beyond power-on voltage (VON), the APR34330 starts up. The VDET pin asserts a periodical pulse and the oscillation period is tOSC  
.
When VCC is beyond the trigger voltage (VTRIGGER), the periodical pulse at VDET pin is discontinued. When VCC is beyond the discharge voltage  
(VDIS), the discharge circuit will be enabled, and a 3mA current (IDIS) will flow into VCC pin. When VCC is higher than the overshoot voltage (VOVP),  
the APR34330 will enable a discharge circuit, the discharge current (IOVP) will last tOVP_LAST time. After the tOVP_LAST time, APR34330 will stop the  
discharge current and detect VCC voltage again. If VCC is still higher than VOVP, the tOVP_LAST time discharge current will be enabled again. Once the  
OVP discharge current is asserted, the periodical pulse at VDET pin will be disabled.  
When the VCC falls below the power-off voltage (VOFF), the APR34330 will shut down.  
Operation Description  
MOSFET Driver  
The operation of the SR is described with timing diagram shown in Figure 2. APR34330 monitors the MOSFET drain-source voltage. When the  
drain voltage is lower than the turn-on threshold voltage VTHON, the IC outputs a positive drive voltage after a turn-on delay time (tDON). The  
MOSFET will turn on and the current will transfer from the body diode into the MOSFET’s channel.  
In the process of drain current decreasing linearly toward zero, the drain-source voltage rises synchronically. When it rises over the turn-off  
threshold voltage VTHOFF, APR34330 pulls the drive signal down after a turn-off delay (tDOFF).  
I,V  
VDET  
IS  
VTHON  
0
t
VTHOFF  
VDRISR  
0.9VDRISR  
0.9VDRISR  
0.1VDRISR  
tRG  
0.1VDRISR  
0
t
tFG  
tDON  
tDOFF  
Figure 2. Typical Waveforms of APR34330  
8 of 13  
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© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Operation Description (Cont.)  
Minimum On Time  
When the controlled MOSFET gate is turned on, some ringing noise is generated. The minimum on-time timer blanks the VTHOFF comparator,  
keeping the controlled MOSFET on for at least the minimum on time. If VTHOFF falls below the threshold before minimum on time expires, the  
MOSFET will keep on until the end of the minimum on time.  
The minimum on time is in direct proportion to the (VDET-VCC)*tONP. When (VDET-VCC)*tONP=5V*5μs, the minimum on time is about 1.8μs.  
The Value and Meaning of AREF Resistor  
As to DCM operation Flyback converter, after secondary rectifier stops conduction the primary MOSFET Drain-to-source ringing waveform is  
resulted from the resonant of primary inductance and equivalent switch device output capacitance. This ringing waveform probably leads to  
Synchronous Rectifier error conduction. To avoid this fault happening, APR34330 has a special function design by means of volt-second product  
detecting. From the sensed voltage of VDET pin to see, the volt-second product of voltage above VCC at primary switch on time is much higher  
than the volt-second product of each cycle ringing voltage above VCC. Therefore, before every time Synchronous Rectifier turning on, APR34330  
judges if the detected volt-second product of VDET voltage above VCC is higher than a threshold and then turn on synchronous Rectifier. The  
purpose of AREF resistor is to determine the volt-second product threshold. APR34330 has a parameter, Kqs, which converts RAREF value to volt-  
second product,  
Area2 RAREF *Kqs  
In general, Area1 and Area3, the value of which should be test on system, depend on system design and are always fixed after system design  
frozen. As to BCD PSR design, the Area1 value changes with primary peak current value and Area3 value generally keeps constant at all of  
conditions. So the AREF resistor design should consider the worst case, the minimum primary peak current condition. Since of system design  
parameter distribution, Areas1 and Area3 have moderate tolerance. So Area2 should be designed between the middle of Area1 and Area3 to keep  
enough design margin.  
Area3RAREF *Kqs Area1  
Area1=(VDET-VCC)*tONP  
Area3  
VDET  
VCC  
Area2=Kqs*RAREF  
Figure 3. AREF Function  
SR Minimum Operating Voltage  
APR34330 sets a minimum SR operating voltage by comparing the difference between VDET and output voltage (VCC). The value of VDETVCC must  
be higher than its internal reference, then APR34330 will begin to integrate the area of (VDETVCC)*tONP. If not, the area integrating will not begin  
and the SR driver will be disabled.  
SR Turning off Timing Impact on PSR CV Sampling  
As to synchronous rectification on Flyback power system, SR MOSFET need to turn off in advance of secondary side current decreasing to zero to  
avoid current flowing reversely. When SR turns off in advance, the secondary current will flow through the body diode. The SR turning off time is  
determined by the VTHOFF at a fixed system. When VTHOFF is more close to zero, the SR turning on time gets longer and body diode conduction time  
gets shorter. Since of the different voltage drop between SR MOSFET and body diode, the PSR feedback signal VFB appears a voltage jump at the  
time of SR MOSFET turning off. If the PSR CV sampling time tSAMPLE is close to even behind this voltage jump time, there will be system unstable  
operation issue or the lower output voltage issue.  
9 of 13  
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© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Operation Description (Cont.)  
To ensure stable operating of system, it must be met:  
tBODYDIODE<tONS*(1- tSAMPLE  
)
tSAMPLE  
SR Turnoff,  
Bodydiode operating  
SR Operating  
tBODYDIODE  
VFB  
tONS  
Figure 4. SR Turning off Timing Impact on PSR CV Sampling  
Recommended Application Circuit Parameters  
The two resistors R23 and R24 are used to pass ESD test. The value of R23 and R24 should be over 20and below 47respectively because of  
the undershoot performance. The package of R23 and R24 should be at least 0805 and there isn’t any trace under these two resistors.  
CAREF is suggested to parallel with AREF resistor to keep the volt-second product threshold stable. And the recommended value of CAREF is 100nF.  
The recommended value of C24 is 100nF.  
Ordering Information  
APR34330 XX XX - XX  
Product Name  
RoHS/Green  
G1 : Green  
Package  
Packing  
MP: SO-8EP  
TR : Tape & Reel  
Package  
Temperature Range  
-40 to +85C  
Part Number  
Marking ID  
34330MP-G1  
Packing  
SO-8EP  
APR34330MPTR-G1  
4000/Tape & Reel  
10 of 13  
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© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Marking Information  
(Top View)  
First and Second Lines: Logo and Marking ID  
Third Line: Date Code  
Y: Year  
WW: Work Week of Molding  
A: Assembly House Code  
XX: 7th and 8th Digits of Batch No.  
34330  
MP-G1  
YWWAXX  
-
Package Outline Dimensions (All dimensions in mm(inch).)  
(1) Package Type: SO-8EP  
3.800(0.150)  
4.000(0.157)  
2.110(0.083)  
2.710(0.107)  
4.700(0.185)  
1.270(0.050)  
TYP  
5.100(0.201)  
0.300(0.012)  
0.510(0.020)  
0.050(0.002)  
0.150(0.006)  
5.800(0.228)  
6.200(0.244)  
1.350(0.053)  
1.550(0.061)  
0.400(0.016)  
1.270(0.050)  
0.150(0.006)  
0.250(0.010)  
Note: Eject hole, oriented hole and mold mark is optional.  
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APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
Suggested Pad Layout  
(1) Package Type: SO-8EP  
Y1  
G
Z
X1  
Y
E
X
Z
G
X
Y
X1  
Y1  
E
Dimensions  
(mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch)  
(mm)/(inch)  
(mm)/(inch)  
(mm)/(inch)  
Value  
6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059  
3.600/0.142  
2.700/0.106  
1.270/0.050  
12 of 13  
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© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  
A Product Line of  
Diodes Incorporated  
APR34330  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2015, Diodes Incorporated  
www.diodes.com  
13 of 13  
www.diodes.com  
June 2015  
© Diodes Incorporated  
APR34330  
Document number: DS37452 Rev. 3 - 2  

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