APR34509MPTR-G1 [DIODES]
Analog Circuit,;
| 型号： | APR34509MPTR-G1 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | Analog Circuit, 光电二极管 |
| 文件： | 总12页 (文件大小：365K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
APR34509
SECONDARY SIDE SYNCHRONOUS RECTIFICATION SWITCHER
Description
Pin Assignments
The APR34509 is a secondary side Combo IC, which combines an N-
Channel MOSFET and a driver circuit designed for synchronous
rectification (SR), supports CCM, DCM and Quasi-Resonant Flyback
Topologies.
(Top View)
DRISR
GND
GND
8
1
2
3
4
The N-Channel MOSFET has been optimized for low gate charge,
low RDS(ON), fast switching speed and body diode reverse recovery
performance.
VCC
CCM
7
6
5
AREF
DRAIN
The synchronous rectification can effectively reduce the secondary
side rectifier power dissipation and provide high performance solution.
By sensing MOSFET drain-to-source voltage, the APR34509 can
output ideal drive signal with less external components.
VDET
Note: The DRAIN pin of internal MOSFET is exposed PAD, which is at the bottom
of IC (the dashed box). The secondary current should flow from GND(pin 7,8) toth
is exposed PAD.
It can provide high performance solution for 5V to 12V output voltage
application.
SO-8EP
The APR34509 is available in SO-8EP package.
Applications
Features
•
•
•
•
Synchronous Rectification for DCM Operation Flyback
Eliminate Resonant Ring Interference
Fast Detector of Supply Voltages
Fewest External Components
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
•
•
Adapters/Chargers for Cell/Cordless Phones, ADSL Modems, MP3
and Other Portable Apparatus
Standby and Auxiliary Power Supplies
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
C21 C22
+
+
C23
R21
D1
Primary
Control
IC
Q1
CY
APR34509
R1
DRAIN
GND
GND
DRAIN
R23
R24
DRISR
VDET
VCC
C24
AREF
CCM
CCCM
R2
ZD2
ZD1
CAREF
RAREF
R3
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Pin Descriptions
Pin Number
Pin Name
Function
1
DRISR
Synchronous rectification MOSFET drive.
2
3
VCC
CCM
Power supply, connected with system output.
Primary trigger signal sense input.
Synchronous rectification sense input and dynamic function output, connected to DRAIN
through a resistor.
4
VDET
DRAIN
AREF
GND
5
Drain pin of internal MOSFET. The Drain voltage signal can obtain from this pin.
Program a voltage reference with a resistor from AREF to GND, to enable synchronous
rectification MOSFET drive signal.
6
7, 8
Source pin of internal MOSFET, connected to Ground.
Drain pin of internal MOSFET. The secondary current should flow from GND (pin 7, 8)
to this DRAIN pad.
Exposed PAD
DRAIN
Functional Block Diagram
VCC
DRAIN
2
5, EP
VDD
Test
Mode
Fault
Mode
Power
OK
Regulator
VREF
IAREF
AREF
6
VCC
Integrator
∫(VDET-
VCC)dt
S
R
Q
1
S
R
Q
DRISR
Drive
VTHON
Gate
Monitor
LEB
Time
VDET
4
VTHOFF
VTHCCM
7,8
GND
3
CCM
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Absolute Maximum Ratings (Note 4)
Symbol
Parameter
Value
-0.3 to 16
-2 to 60
-0.3 to 16
20
Unit
V
Supply Voltage
VCC
Voltage at VDET, DRAIN Pin
Voltage at AREF, DRISR Pin
Continuous Drain Current
Pulsed Drain Current
V
VDET, VDRAIN
V
VAREF, VDRISR
A
ID
80
A
IDM
PD
2.2
W
Power Dissipation at TA = +25°C
Thermal Resistance (Junction to Ambient)
(Note 5)
56
12
°C /W
°C /W
θJA
θJC
Thermal Resistance (Junction to Case)
(Note 5)
Operating Junction Temperature
Storage Temperature
+150
-65 to +150
+300
°C
°C
°C
TJ
TSTG
TLEAD
Lead Temperature (Soldering, 10 sec)
Notes: 4. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied.
Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.
5. FR-4 substrate PC board, 2oz copper, with 1 inch2 pad layout.
Recommended Operating Conditions
Symbol
VCC
Parameter
Min
3.3
-40
Max
13
Unit
V
Supply Voltage
Ambient Temperature
+85
°C
TA
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Electrical Characteristics (@TA = +25°C, VCC = 5V, unless otherwise specified.)
Symbol
Parameter
Condition
Min
Typ
Max
Unit
Supply Voltage ( VCC Pin )
ISTARTUP
IOP
Startup Current
Operating Current
VCC = VSTARTUP-0.1V
–
–
100
100
150
150
µA
µA
VDET Pin Floating
VCC = 5V
VSTARTUP
Startup Voltage
UVLO
–
–
–
–
3.1
2.8
–
–
V
V
–
Gate Driver
VTHON
VTHOFF
tDON
Gate Turn On Threshold
Gate Turn Off Threshold
Turn On Delay Time
–
0
-20
–
–
-11.5
70
100
50
20
1.6
–
1
V
mV
ns
ns
ns
ns
µs
V
–
-3
From VTHON to VDRISR = 1V
From VTHOFF to VDRISR = 4V
From 1V to 4V, VCC = 5V, CL = 4.7nF
From 4V to 1V, VCC = 5V, CL = 4.7nF
130
150
100
35
tDOFF
tRG
Turn Off Propagation Delay Time
Turn On Rising Time
–
–
tFG
Turn Off Falling Time
–
tON_MIN
Minimum On Time
–
1.2
2
–
VCC
VCC
–
VDRI_HIGH
Drive Maximum Voltage
–
–
–
VDRISR
VCC < 5V
VCC >= 5V
–
VDRI_HOLD
SR Drive Hold Voltage
V
5
mA*
Kqs
VS_MIN
(Note 6)
–
–
0.32
0.42
0.52
4.5
μs
Synchronous Rectification (SR)
–
–
V
Minimum Operating Voltage (Note 7)
Synchronous Rectification Detection
VTH_CCM VDRISR Rising Threshold
tDCCM
CCM Propagation Delay
VDRISR Output Transitions From
High to Low
0.43
0.53
20
0.63
35
V
From CCM Rising to VDRISR Falling
10%
–
ns
Notes: 6. This item is used to specify the value of RAREF
.
7. This item specifies the minimum SR operating voltage of VIN_DC, VIN_DC≥NPS*VS_MIN.
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Electrical Characteristics (@TA =+25°C, unless otherwise specified. Cont.)
MOSFET Static Characteristics
Symbol
VDSS(BR)
VGS(TH)
IDSS
Parameter
Condition
VGS = 0V, ID = 0.25mA
VDS = VGS, ID = 0.25mA
VDS = 50V, VGS = 0V
Min
60
0.7
–
Typ
–
Max
Unit
V
Drain to Source Breakdown
Voltage
–
2
1
Gate Threshold Voltage
1.3
–
V
Zero Gate Voltage Drain
Current
µA
Gate to Source Leakage
Current
IGSS
VGS = 4.5V, VDS = 0V
VGS = 4.5V, ID = 3A
–
–
–
±50
µA
Drain to Source On-state
Resistance
RDS(ON)
8
–
mΩ
MOSFET Dynamic Characteristics
Symbol
Ciss
Parameter
Condition
Min
–
Typ
1872
506
Max
–
Unit
Input Capacitance
Output Capacitance
Coss
–
–
VGS = 0V, VDS = 25V, f =1MHz
pF
Reverse Transfer
Capacitance
Crss
Qgs
Qgd
–
–
–
43
3.1
4.8
–
–
–
Gate to Source Charge
VGS = 0V to 10V, VDD = 25V,
ID=15A
Gate to Drain Charge (Miller
Charger)
nC
Qg
Rg
Total Gate Charge
Gate Resistance
VGS = 4.5V
–
–
15
–
–
–
1.8
Ω
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Synchronous Rectification Principle Description
SR MOSFET Turn On
The APR34509 determines the synchronous rectification MOSFET turning on time by monitoring the MOSFET drain-to-source voltage. For both of
DCM and CCM operation, the turning on principle is same. When the drain voltage is lower than the turn-on threshold voltage VTHON, the IC
outputs a positive drive voltage after a turn-on delay time (tDON). The MOSFET will turn on and the current will transfer from the body diode into
the MOSFET’s channel. Since of parasitic parameter, the voltage on MOSFET drain pin has moderate voltage ringing at this moment, which
maybe impact on SR controller VDET voltage sense and bring about turning off fault. To avoid fault situation happening, a Minimum On Time
(tONMIN) blanking period is used that will maintain the power MOSFET on for a minimum amount of time.
In Figure 1, the turn on blanking time tONMIN is to prevent the MOSFET drain-to-source voltage ringing affect. During this time, the VDRISR is pulled
up to VCC; after tONMIN, the drive voltage stops being pulled up by the driver, and begins to drop; when VDRISR drops to VDRI_HOLD, it will be held at
this voltage until being pulled down.
DCM Turn Off Operation
The DCM operation of the SR is described with timing diagram shown in Figure 1.
In the process of drain current decreasing linearly toward zero, the drain-source voltage rises synchronically. When it rises over the turn off
threshold voltage VTHOFF, the APR34509 pulls the drive signal down after a turn-off delay (tDOFF).
I,V
VDET
IS
VTHON
0
VTHOFF
t
VDRI_HIGH
VDRI_HOLD
0.9VGATE
1V
0
t
tONMIN
tDON
tDOFF
Figure 1. Typical Waveforms of APR34509 in DCM
CCM Turn Off Operation
The CCM pin is used to sense trigger signal for turning off the SR MOSFET before primary switch turning on in Continuous Conduction Mode
(CCM) system. After tONMIN, if the CCM pin voltage rises over the threshold voltage VTHCCM, the drive voltage will be pulled down after a short
delay time tDCCM to turn off SR MOSFET. The CCM pin senses trigger signal coming from primary switch turn on signal through a RC networks
circuit, a Y–type isolating capacitor CCCM, two resistors R2 and R3. Note variations of these resistors, of CCCM, and of the dV/dt across CCCM
require that worst-case tolerances be taken into account when determining the minimum value of CCCM. For example, the value of this resistor will
impact the rise time of CCM voltage. The bigger resistor, the slower the CCM voltage rises.
The zener diode ZD1 is used for ESD test.
The value of CY should be much higher than that of CCCM. If necessary, increase the value of CY to ensure that CY >> CCCM; do not decrease
CCCM
.
CY is the main common-mode capacitance between the primary and the secondary sides of the system. This is usually a discrete component,
whose value ranges from 47pF to 2200pF. Aside from any EMI-control purposes, it also serves as the return path for the CCM signal charging and
discharging current pulses.
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Synchronous Rectification Principle Description (Cont.)
VGATE_PRIMARY
0
t
VCCM
VTH_CCM
0
t
VDRISR
VDRI_HIGH
VDRI_HOLD
0.9VGATE
0
t
tDCCM
Figure 2. Typical Turn Off Waveforms of APR34509 in CCM
Minimum On Time
When the controlled MOSFET gate is turned on, some ringing noise is generated. The minimum on-time timer blanks the VTHOFF comparator and
CCM comparator, keeping the controlled MOSFET on for at least the minimum on time. During the minimum on time, the turn off threshold (DCM
and CCM) is totally blanked.
The Value and Meaning of AREF Resistor
As to DCM operation Flyback converter, after secondary rectifier stops conduction, the primary MOSFET Drain-to-source ringing waveform is
resulted from the resonant of primary inductance and equivalent switch device output capacitance. This ringing waveform probably leads to
Synchronous Rectifier error conduction. To avoid this fault happening, the APR34509 has a special function design by means of volt-second
product detecting. From the sensed voltage of VDET pin to see, the volt-second product of voltage above VCC at primary switch on time is much
higher than the volt-second product of each cycle ringing voltage above VCC. Therefore, before every time Synchronous Rectifier turning on, the
APR34509 judges if the detected volt-second product of VDET voltage above VCC is higher than a threshold and then turns on synchronous
Rectifier. The purpose of AREF resistor is to determine the volt-second product threshold. The APR34509 has a parameter, Kqs, which converts
RAREF value to volt-second product,
Area2 RAREF *Kqs
In general, Area1 and Area3 values depend on system design and are always fixed after system design frozen. As to Diodes PSR design, the
Area1 value changes with primary peak current value and Area3 value generally keeps constant at all conditions. So the AREF resistor design
should consider the worst case, the minimum primary peak current condition. Since of system design parameter distribution, Area1 and Area3
have moderate tolerance. So Area2 should be designed between the middle of Area1 and Area3 to keep enough design margin.
Note: To keep the volt-second product threshold stable, a capacitor is suggested to parallel with AREF resistor. And the recommended value of
this capacitor is 10nF.
Area3 RAREF *Kqs Area1
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Synchronous Rectification Principle Description (Cont.)
Area1=(VDET-VCC)*tONP
Area3
VDET
VCC
Area2=Kqs*RAREF
Figure 3. AREF Function
SR Minimum Operating Voltage
The APR34509 sets a minimum SR operating voltage by comparing the difference between VDET and output voltage (VCC). The value of VDET
–
VCC must be higher than its internal reference, then the APR34509 will begin to integrate the area of (VDET–VCC)*tONP. If not, the area integrating
will not begin and the SR driver will be disabled.
SR Turning Off Timing Impact on PSR CV Sampling
As to synchronous rectification on Flyback power system, SR MOSFET needs to turn off in advance of secondary side current decreasing to zero
to avoid current flowing reversely. When SR turns off in advance, the secondary current will flow through the body diode. The SR turning off time is
determined by the VTHOFF at a fixed system. When VTHOFF is more close to zero, the SR turning on time gets longer and body diode conduction
time gets shorter. Since of the different voltage drop between SR MOSFET and body diode, the PSR feedback signal VFB appears a voltage jump
at the time of SR MOSFET turning off. If the PSR CV sampling time tSAMPLE is close to even behind this voltage jump time, there will be system
unstable operation issue or the lower output voltage issue.
To ensure stable operating of system, it must be met:
tBODYDIODE<tONS- tSAMPLE
tSAMPLE
SR Turnoff,
Bodydiode operating
SR Operating
tBODYDIODE
VFB
tONS
Figure 4. SR Turning Off Timing Impact on PSR CV Sampling
Recommended Application Circuit Parameters
The two resistors R23 and R24 are used to pass ESD test. The value of R23 and R24 should be over 20Ω and below 47Ω respectively because of
the undershoot performance. The package of R23 and R24 should be at least 0805 and there isn’t any trace under these two resistors.
CAREF is suggested to parallel with AREF resistor to keep the volt-second product threshold stable. And the recommended value of CAREF is 20nF.
The recommended value of C24 is 100nF.
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Ordering Information
APR34509 X X - X
Product Name
RoHS/Green
G1 : Green
Package
MP: SO-8EP
Packing
TR : Tape & Reel
Package
Temperature Range
-40 to +85C
Part Number
Marking ID
Packing
SO-8EP
APR34509MPTR-G1
34509MP-G1
4000/Tape & Reel
Marking Information
(Top View)
First and Second Lines: Logo and Marking ID
Third Line: Date Code
Y: Year
WW: Work Week of Molding
A: Assembly House Code
XX: 7th and 8th Digits of Batch No.
34509
MP-G1
YWWAXX
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Package Outline Dimensions (All dimensions in mm(inch).)
(1) Package Type: SO-8EP
3.800(0.150)
4.000(0.157)
2.110(0.083)
2.710(0.107)
4.700(0.185)
1.270(0.050)
TYP
5.100(0.201)
0.300(0.012)
0.510(0.020)
0.050(0.002)
0.150(0.006)
5.800(0.228)
6.200(0.244)
1.350(0.053)
1.550(0.061)
0.400(0.016)
1.270(0.050)
0.150(0.006)
0.250(0.010)
Note: Eject hole, oriented hole and mold mark is optional.
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APR34509
Document number: DS38510 Rev. 2 - 2
APR34509
Suggested Pad Layout
(1) Package Type: SO-8EP
Y1
G
Z
X1
Y
E
X
Z
G
X
Y
X1
Y1
E
Dimensions
(mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
Value
6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059
3.600/0.142
2.700/0.106
1.270/0.050
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APR34509
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APR34509
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
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