AP2162SG-13 [DIODES]
Buffer/Inverter Based Peripheral Driver, 2 Driver, 1A, PDSO8, GREEN, SOP-8;
| 型号： | AP2162SG-13 |
| 厂家： | 
DIODES INCORPORATED |
| 描述： | Buffer/Inverter Based Peripheral Driver, 2 Driver, 1A, PDSO8, GREEN, SOP-8 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总17页 (文件大小：2816K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AP2162/ AP2172
1A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
The AP2162 and AP2172 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
( Top View )
1
2
3
4
8
7
6
5
GND
FLG1
OUT1
OUT2
FLG2
IN
EN1
EN2
All devices are available in SO-8 and MSOP-8EP packages.
SO-8
Features
( Top View )
•
•
•
•
•
•
•
•
•
•
•
•
•
Dual USB Port Power Switches
Over-Current and Thermal Protection
1.5A Accurate Current Limiting
1
2
8
FLG1
GND
7
6
IN
OUT1
OUT2
FLG2
Reverse Current Blocking
3
4
EN1
EN2
115mΩ On-Resistance
5
Input Voltage Range: 2.7V - 5.5V
0.6ms Typical Rise Time
MSOP-8EP
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4.5KV HBM, 350V MM
Active High (AP2172) or Active Low (AP2162) Enable
Ambient Temperature Range -40°C to +85°C
SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
Molding Compound (No Br, Sb)
Applications
•
•
•
Consumer Electronics – LCD TV & Monitor, Game Machines
Communications – Set-Top-Box, GPS, Smartphone
Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
•
•
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
AP2172 Enable Active High
Power Supply
2.7V to 5.5V
Load
Load
IN
OUT1
OUT2
0.1uF
0.1uF
68uF
68uF
0.1uF
10k
10uF
ON
10k
FLG1
FLG2
EN1
EN2
GND
OFF
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May 2014
© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Available Options
Enable Pin
(EN)
Current Limit
(Typical)
Recommended Maximum
Continuous Load Current
Part Number
Channel
AP2162
AP2172
2
2
Active Low
Active High
1.5A
1.5A
1.0A
1.0A
Pin Descriptions
Pin Number
Pin
Name
Function
SO-8
MSOP-8EP
GND
IN
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
Ground
Voltage input pin
EN1
Switch 1 enable input, active low (AP2162) or active high (AP2172)
Switch 2 enable input, active low (AP2162) or active high (AP2172)
EN2
FLG2
OUT2
OUT1
FLG1
Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered
Switch 2 voltage output pin
Switch 1 voltage output pin
Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered
Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Exposed Tab
—
Exposed Tab
Functional Block Diagram
FLG 1
Therm al
Sense
AP2162, AP2172
D eglitch
C urrent
EN 1
D river
Lim it
G N D
U VLO
C urrent
Sense
O U T1
IN
C urrent
Sense
O U T2
U VLO
FLG 2
C urrent
D river
Lim it
EN2
D eglitch
Therm al
Sense
G N D
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
VIN
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage
Rating
3
Unit
kV
V
300
6.5
V
Output Voltage
V
VOUT
VEN , VFLG
ILOAD
VIN +0.3
6.5
Enable Voltage
V
A
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Internal Limited
150
°C
°C
TJ(MAX)
TST
-65 to +150
Caution:
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at conditions between maximum recommended operating conditions and absolute maximum ratings is not implied.
Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices.
Note:
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
VIN
Parameter
Min
2.7
0
Max
5.5
Units
V
Input voltage
Output Current
1.0
A
IOUT
VIL
EN Input Logic Low Voltage
0
0.8
V
EN Input Logic High Voltage
2
V
VIH
VIN
+85
Operating Ambient Temperature
-40
TA
°C
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)
Symbol
VUVLO
ISHDN
IQ
Parameter
Test Conditions
Min
Typ
1.9
Max
2.5
1
Unit
V
Input UVLO
1.6
RLOAD = 1kΩ
Input Shutdown Current
Input Quiescent Current, Dual
Input Leakage Current
0.5
µA
µA
µA
µA
mΩ
mΩ
mΩ
A
Disabled, IOUT = 0
Enabled, IOUT = 0
100
160
1
Disabled, OUT grounded
ILEAK
IREV
Reverse Leakage Current
1
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
MSOP-8EP
SO-8
115
120
140
1.4
1.5
2.4
150
160
180
VIN = 5V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C
Switch on-resistance
RDS(ON)
VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA ≤ 85°C
Short-Circuit Current Limit
Over-Load Current Limit
ISHORT
ILIMIT
ITrig
Enabled into short circuit, CL = 68µF
1.1
2
1.9
0.8
1
A
VIN = 5V, VOUT = 4.6V, CL = 68µF, -40°C ≤ TA ≤ +85°C
Current Limiting Trigger Threshold
EN Input Logic Low Voltage
EN Input Logic High Voltage
EN Input Leakage
A
VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF
V
VIL
VIN = 2.7V to 5.5V
VIN = 2.7V to 5.5V
VEN = 5V
V
VIH
µA
ms
ms
ms
ms
Ω
ISINK
TD(ON)
TR
Output Turn-On Delay Time
Output Turn-On rise time
Output Turn-Off Delay Time
Output Turn-Off Fall Time
FLG Output FET On-Resistance
FLG Blanking Time
0.05
0.6
0.01
0.05
30
CL=1µF, RLOAD = 10Ω
CL=1µF, RLOAD = 10Ω
CL=1µF, RLOAD = 10Ω
CL=1µF, RLOAD = 10Ω
1.5
TD(OFF)
TF
0.1
50
15
RFLG
TBlank
TSHDN
THYS
IFLG =10mA
4
7
ms
CIN =10µF, CL = 68µF
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
140
25
Enabled, RLOAD = 1kΩ
°C
°C
oC/W
oC/W
SO-8 (Note 5)
110
60
Thermal Resistance Junction-to-
Ambient
θJA
MSOP-8EP (Note 6)
Notes:
5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Typical Performance Characteristics
VEN
VEN
50%
50%
50%
50%
TD(OFF)
TD(OFF)
TR
TR
TF
TF
TD(ON)
TD(ON)
90%
90%
90%
90%
10%
VOUT
VOUT
10%
10%
10%
Figure 1 Voltage Waveforms: AP2162 (left), AP2172 (right)
All Enable Plots are for AP2172 Active High
Channel 1 Turn-On Delay and Rise Time
Channel 1 Turn-Off Delay and Fall Time
Ven 1
5V/div
Ven 1
5V/div
C
L
= 1µF
T
= +25°C
= 10ꢀ
A
Vout 1
2V/div
Vout 1
2V/div
R
L
C
L
= 1µF
T
= +25°C
= 10ꢀ
A
R
L
500µs/div
500µs/div
Channel 2 Turn-On Delay and Rise Time
Channel 2 Turn-Off Delay and Fall Time
Ven 2
5V/div
Ven 2
5V/div
C
L
= 1µF
T
= +25°C
= 10ꢀ
A
Vout 2
2V/div
Vout 2
2V/div
R
L
C
L
= 1µF
T
= +25°C
= 10ꢀ
A
R
L
500µs/div
500µs/div
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Typical Performance Characteristics (cont.)
Channel 1 Turn-On Delay and Rise Time
Channel 1 Turn-Off Delay and Fall Time
Ven 1
5V/div
Ven 1
5V/div
C =100uF
L
T
=25°C
A
Vout 1
2V/div
Vout 1
2V/div
R =10ꢀ
L
C =100uF
L
T
=25°C
A
R =10ꢀ
L
500µs/div
500µs/div
Channel 2 Turn-On Delay and Rise Time
Channel 2 Turn-Off Delay and Fall Time
Ven 2
5V/div
Ven 2
5V/div
C
= 100µF
= +25°C
= 10ꢀ
L
T
A
Vout 2
2V/div
Vout 2
2V/div
R
L
C
= 100µF
= +25°C
= 10ꢀ
L
T
A
R
L
500µs/div
500µs/div
Channel 1 Short Circuit Current,
Device Enabled Into Short
Channel 2 Short Circuit Current,
Device Enabled Into Short
Ven 1
5V/div
Ven 2
5V/div
Iout 1
Iout 2
500mA/div
500mA/div
V
= 5V
V
= 5V
IN
IN
T
= +25°C
= 68µF
T
= +25°C
A
A
C
C
= 68µF
L
L
500µs/div
500µs/div
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Typical Performance Characteristics (cont.)
Channel 1 Inrush Current
Channel 2 Inrush Current
Ven 1
5V/div
Ven 2
5V/div
CL = 100µF
CL = 100µF
VIN = 5V
A = +25°C
RL = 5ꢀ
VIN = 5V
A = +25°C
RL = 5ꢀ
T
T
Iout 1
Iout 2
200mA/div
200mA/div
CL = 470µF
CL = 470µF
CL = 220µF
CL = 220µF
1ms/div
1ms/div
Channel 1
Channel 1
1 Ω Load Connected to Enabled Device
2Ω Load Connected to Enabled Device
V
= 5V
V
= 5V
IN
IN
T
= +25°C
= 68µF
T
= +25°C
= 68µF
A
A
Vflag 1
2V/div
Vflag 1
2V/div
C
C
L
L
Iout 1
1A/div
Iout 1
1A/div
2ms/div
2ms/div
Channel 2
Channel 2
1 Ω Load Connected to Enabled Device
2Ω Load Connected to Enabled Device
V
= 5V
V
= 5V
IN
IN
T
= +25°C
= 68µF
T
= +25°C
C = 68µF
L
A
A
Vflag 2
2V/div
Vflag 2
2V/div
C
L
Iout 2
1A/div
Iout 2
1A/div
2ms/div
2ms/div
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Typical Performance Characteristics (cont.)
Channel 1
Channel 2
Short Circuit with Blanking Time and Recovery
Short Circuit with Blanking Time and Recovery
Vout
5V/div
Vout
5V/div
V
= 5V
IN
V
= 5V
IN
T
= +25°C
= 68µF
A
T
= +25°C
= 68µF
A
C
L
C
L
Iout
Vflag
500mA/div
5V/div
Iout
Iout
1A/div
1A/div
20ms/div
20ms/div
Channel 1 Power On
Channel 2 Power On
Vflag
5V/div
Vflag
5V/div
Iout
500mA/div
Iout
500mA/div
T
= +25°C
T
= +25°C
A
A
C
= 68µF
C
= 68µF
L
L
L
R
= 5ꢀ
R
L
= 5ꢀ
Ven
Ven
5V/div
5V/div
Vin
5V/div
Vin
5V/div
1ms/div
1ms/div
Channel 1 UVLO Increasing
Channel 1 UVLO Decreasing
T
= +25°C
= 68µF
= 5ꢀ
A
C
L
L
Vin
Vin
R
2V/div
2V/div
T
= +25°C
= 68µF
= 5ꢀ
A
C
L
L
R
Iout
Iout
500mA/div
500mA/div
10ms/div
1ms/div
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Typical Performance Characteristics (cont.)
Channel 2 UVLO Increasing
Channel 2 UVLO Decreasing
T
= +25°C
= 68µF
= 5ꢀ
A
C
L
L
Vin
Vin
R
2V/div
2V/div
T
= +25°C
= 68µF
= 5ꢀ
A
C
L
L
R
Iout
Iout
500mA/div
500mA/div
10ms/div
1ms/div
Channel 1 Enabled and Shorted with Channel 2 Disabled
Channel 1 Disabled and Channel 2 Enabled
Vout 1
5V/div
Ven1
5V/div
Vout 2
5V/div
Vout 1
5V/div
Vflag 1
5V/div
T
= +25°C
= 68µF
A
Ven2
5V/div
T
= +25°C
A
C
L
C
L
= 68µF
Iout 2
500mA/div
Vout 2
5V/div
100ms/div
50ms/div
Turn-On Time vs Input Voltage
Turn-Off Time vs Input Voltage
750
700
650
600
550
500
450
400
350
300
30
29
29
28
28
27
27
26
26
C
R
T
= 1µF
L
= 10ꢀ
L
= +25°C
A
C
R
T
= 1µF
L
= 10ꢀ
L
= +25°C
A
250
1.5
25
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Typical Performance Characteristics (cont.)
Rise Time vs Input Voltage
Fall Time vs Input Voltage
650
600
550
500
450
400
22
22
21
21
20
20
19
C
R
T
= 1µF
C
R
T
= 1µF
L
L
350
300
250
= 10ꢀ
= +25°C
= 10ꢀ
= +25°C
L
L
A
2
2.5
3
3.5
4
4.5
5
5.5
6
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
Supply Current, Output Enabled vs Ambient Temperature
Supply Current, Output Disabled vs Ambient Temperature
68
63
58
53
48
43
38
33
28
Vin=5.5V
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Vin=5.0V
Vin=5.5V
Vin=3.3V
Vin=5.0V
Vin=3.3V
40
Vin=2.7V
60
Vin=2.7V
-20
-60
-40
0
20
40
60
80
100
-60
-40
-20
0
20
80
100
Ambient Temperature (°C)
Ambient Temperature (°C)
Static Drain-Source On-State Resistance vs Ambient
Temperature
Short-Circuit Output Current vs Ambient Temperature
1.56
1.55
1.54
1.53
1.52
1.51
1.50
1.49
1.48
1.47
1.46
1.45
170
160
150
140
130
120
110
100
90
C
L
= 100µF
Vin=2.7V
Vin=3.3V
Vin=2.7V
Vin=5.0V
Vin=3.3V
Vin=5V
Vin=5.5V
80
80
-60
-40
-20
0
20
40
60
80
100
-60
-40
-20
0
20
40
60
100
Ambient Temperature (°C)
Ambient Temperature (°C)
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AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Typical Performance Characteristics (cont.)
Undervoltage Lockout vs Ambient Temperature
Threshold Trip Current vs Input Voltage
2.20
1.99
1.98
1.97
1.96
1.95
1.94
1.93
1.92
1.91
1.90
1.89
1.88
2.10
2.00
UVLO Rising
1.90
T
= +25°C
= 68µF
A
1.80
C
L
UVLO Falling
1.70
1.60
2.8
3.3
3.8
4.3
4.8
5.3
-60
-40
-20
0
20
40
60
80
100
Input Voltage (V)
Ambient Temperature (°C)
Current Limit Response vs Peak Current
120
100
80
60
40
20
0
VIN = 5V
TA = +25°C
CL = 68µF
0
2
4
6
8
10
12
Peak Current (A)
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AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Application Information
Power Supply Considerations
A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity
of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2162/AP2172 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT
.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT
.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2162/AP2172 is capable of delivering current up
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at ILIMIT
.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2162/AP2172 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA = Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2162/AP2172 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
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AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Application Information (cont.)
Under-voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.
Figure 2. Typical Two-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2162/AP2172, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2162/AP2172 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2162/AP2172 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Ordering Information
13” Tape and Reel
Part Number
Package Code
Packaging
Quantity
Part Number Suffix
AP21X2SG-13
S
SO-8
2500/Tape & Reel
2500/Tape & Reel
-13
-13
AP21X2MPG-13
MP
MSOP-8EP
Marking Information
(1) SO-8
( Top view )
8
7
6
5
4
Logo
2 : 2 Channel
G : Green
Part Number
4 : Active Low
5 : Active High
AP21X X
YY WW X X
YY : Year : 08, 09,10~
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
2
3
1
(2) MSOP-8EP
( Top view )
8
1
7
6
5
A~Z : Green
MSOP-8EP
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
Logo
Y W X E
Part Number
AP21X X
4 : Active Low
5 : Active High
2 : 2 Channel
2
3
4
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package type: SO-8
SO-8
Min
-
0.10
1.30
0.15
0.3
Dim
A
A1
A2
A3
b
Max
1.75
0.20
1.50
0.25
0.5
E1
E
Gauge Plane
Seating Plane
A1
L
D
E
E1
e
h
L
θ
4.85
5.90
3.85
1.27 Typ
-
0.62
0°
4.95
6.10
3.95
Detail ‘A’
7°~9°
h
°
45
0.35
0.82
8°
Detail ‘A’
A2
A3
A
b
All Dimensions in mm
e
D
(2) Package type: MSOP-8EP
MSOP-8EP
D
Dim Min Max Typ
A
A1
A2
A3
b
-
1.10
-
0.05 0.15 0.10
0.75 0.95 0.86
0.29 0.49 0.39
0.22 0.38 0.30
0.08 0.23 0.15
2.90 3.10 3.00
1.60 2.00 1.80
4.70 5.10 4.90
2.90 3.10 3.00
1.30 1.70 1.50
2.85 3.05 2.95
D1
x
E
E2
Gauge Plane
Seating Plane
c
D
y
D1
E
E1
E2
E3
e
L
a
x
y
L
1
8Xb
e
Detail C
E3
E1
A1
A3
c
-
-
0.65
A2
A
0.40 0.80 0.60
0°
-
8°
-
-
4°
0.750
0.750
D
-
See Detail C
All Dimensions in mm
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SO-8
X
Dimensions Value (in mm)
X
Y
C1
C2
0.60
1.55
5.4
C1
1.27
C2
Y
(2) Package Type: MSOP-8EP
X
C
Y
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
G
Dimensions
C
G
X
X1
Y
Y1
Y2
Y2
Y1
X1
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© Diodes Incorporated
AP2162/ AP2172
Document number: DS31570 Rev. 6 - 2
AP2162/ AP2172
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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© Diodes Incorporated
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Document number: DS31570 Rev. 6 - 2
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