DA14586 [DIALOG]
Smallest, lowest power and most integrated Bluetooth 5 SoC with integrated Flash;
| 型号： | DA14586 |
| 厂家： | 
Dialog Semiconductor |
| 描述： | Smallest, lowest power and most integrated Bluetooth 5 SoC with integrated Flash |
| 文件： | 总4页 (文件大小：566K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SmartBond™ DA14586
Smallest, lowest power and most integrated
Bluetooth 5 SoC with integrated Flash
Connected devices are constantly evolving. New generations appear that are smarter, more full
featured and have longer battery lifetimes. To enable this, SmartBond has evolved too. The
DA14586 offers designers all the benefits of the industry-leading DA14580 but with even greater
flexibility to create more advanced applications from the smallest footprints and power budgets.
As part of the Dialog SmartBond family, the DA14586 is the smallest, lowest power and most
integrated Bluetooth® solution available. This versatile SoC is ideal for adding Bluetooth low
energy to products like remote controls, proximity tags, beacons, connected medical devices and
smart home nodes. It supports all Bluetooth developments up to and including Bluetooth 5 and
Bluetooth low energy Mesh. Plus, with 2 Mb of Flash memory and 96 kB of RAM, the DA14586 has
double the memory for user applications of its predecessor to take full advantage of the standard’s
features. It also includes an integrated microphone interface for voice support at low additional cost.
Like all SmartBond solutions, the DA14586 is easy to design-in and supports standalone as well
as hosted applications. It is supported by a complete development environment and Dialog’s
SmartSnippets™ software that helps you optimize your software for power consumption.
Applications
DA14586
■ Remote controls
ARM Mꢀꢂ CPꢁ
■ Proximity tags and trackers
■ Beacons
■ Connected medical devices
■ Smart home
■ Human Interface Devices
■ VR controllers
■ Connected sensors
■ Wireless charging
SWD
ꢃTP 64 kB
FLASH 2Mb
RAM ꢅ2 kB
RAM 16 kB
RAM 16 kB
RAM ꢅ2 kB
RCꢅ2ꢆHz
RC16MHz
RCꢇ
ꢁARTꢄ2
SPI
12C
ADC
ꢆꢉꢈBꢃARD
WAꢆꢉꢁP
4ꢊCH DMA
ꢋDꢉC
TIMꢉRS
PCMꢌ12S
PDM
DCDC BꢁCꢆ
DCDC BꢃꢃST
LDꢃs
RꢃM
128 kB
GPIꢃ matriꢄ
www.dialog-semiconductor.com/bluetoothlowenergy
SoC Features
•
Complies with Bluetooth 5.0, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47
Part 15 (US) and ARIB STD-T66 (Japan)
•
•
•
Supports up to 8 Bluetooth LE connections
Fast cold boot in less than 50 ms
Processing units
-
-
-
16 MHz 32 bit ARM Cortex-M0 with SWD interface
Dedicated Link Layer Processor
AES-128 bit encryption Processor
•
•
Memories
-
-
-
-
2 Mb FLASH memory
64 kB One-Time-Programmable (OTP) memory
96 kB Data/Retention SRAM
128 kB ROM Operating System and protocol stack
Power management
-
-
-
-
-
-
Integrated Buck DCDC converter
P0, P1, P2 and P3 ports with 3.3 V tolerance
Easy decoupling of only 4 supply pins
Supports coin and alkaline battery cells
1.8 V cold boot support-buck mode
10-bit ADC for battery voltage measurement
•
Digital controlled oscillators
-
-
-
16 MHz crystal (±20 ppm max) and RC oscillator
32 kHz crystal (±50 ppm)
RCX oscillator(±500 ppm max)
•
Flexible Reset Circuitry
System & Power On Reset in a single pin
General purpose, Capture and Sleep timers
-
•
-
-
-
-
-
-
Digital interfaces
Gen. purpose I/Os: 24 (QFN40)
2 UARTs with hardware flow control maximum data rate 1.0 Mbps
SPI+™ interface
I²C bus at 100 kHz, 400 kHz
3-axes capable Quadrature Decoder
•
Analog interfaces
4-channel 10-bit ADC
-
www.dialog-semiconductor.com/bluetoothlowenergy
•
Radio transceiver
-
-
-
Fully integrated 2.4 GHz CMOS transceiver
Single wire antenna: no RF matching or RX/TX switching required
Current consumption with supply voltage equal 3 V:
▪ TX: 3.4 mA, RX: 3.7 mA (with ideal DC-DC)
+0 dBm transmit output power
-
-
-
-20 dBm output power in ‘Near Field Mode’
-93 dBm receiver sensitivity
•
Packages:
QFN 40 pins, 5 mm x 5 mm x 0.9 mm
-
Bluetooth 5.0
Supporting the Bluetooth 5.0 core specification, DA14586 enables new enhanced Bluetooth low
energy functionality ideal for applications such as remote controls, beacons, connected sensors
and innovative medical devices. Among the new features, DA14586 supports Data Packet Length
Extension, Link Layer Privacy v1.2, Secure Connections, Bluetooth low energy Mesh and Efficient
connectable Advertising.
Audio Processing Unit
The integrated Audio Unit (AU) is equipped with a Pulse-Density Modulation (PDM) interface that
can be connected to up to 2 input devices (e.g. MEMS microphones) or output devices, a Pulse-
Code modulation (PCM) controller which provides an up to 192 kHz synchronous interface to
external audio devices, ISDN circuits and serial data interfaces (I2S) and a 24-bit Sample Rate
Converting unit (SRC) used to convert the sampling rate of audio samples between the various
interfaces. PDM and PCM functionality can be mapped to any GPIO through the user programmable
pin logic. An integrated DMA controller handles all data transfers between the AU and the RAM
providing the CPU with the freedom to cope with other tasks.
Enhanced Memory
The DA14586 has a large memory capacity for user applications: 2 Mb of FLASH memory, 96 kB of
Data RAM with retention capability, 128 kB of ROM and 64 kB of One-Time-Programmable (OTP)
memory. The granularity of the RAM cells (32 kB/16 kB/16 kB/32 kB) allows retaining only the RAM
needed and achieves the minimum power consumption during the sleep state.
Compatibility
www.dialog-semiconductor.com/bluetoothlowenergy
As part of the SmartBond family and successor of the DA1458x product family, DA14586 is fully
pin-compatible with DA14580, DA14581 and DA14583 existing designs may be quickly upgraded.
DA14586 is suitable for fully hosted applications without an external MCU.
Software and Tools
The DA14586 is also supported by Dialog SmartSnippets Studio, a royalty-free software
development platform for all SmartBond devices, which contains:
ꢀ
■ SmartSnippets Toolbox: A tool suite covering all software developer needs, including power
profiling, FLASH or OTP programming and testing
ꢀ
■ SmartSnippets DA1458x Software Development Kit and documentation
Ordering Information
Part number
Package
Pitch(mm)
Size (mm)
Shipment
Pack Quantity
DA14586-00F02AT2
QFN40
0.4
5 x 5 x 0.9
Reel
100/1000/5000
Dialog Semiconductor Worldwide Sales Offices - www.dialog-semiconductor.com email: info@diasemi.com
United Kingdom
The Netherlands
Japan
Singapore
Korea
Phone: +44 1793 757700
Phone: +31 73 640 88 22
Phone: +81 3 5425 4567
Phone: +65 648 499 29
Phone: +82 2 3469 8200
China (Shenzhen)
Germany
North America
Taiwan
Hong Kong
Phone: +86 755 2981 3669
Phone: +49 7021 805-0
Phone: +1 408 845 8500
Phone: +886 281 786 222
Phone: +852 3769 5200
China (Shanghai)
Phone: +86 21 5424 9058
This publication is issued to provide outline information only, which unless agreed by Dialog Semiconductor may not be used,
applied, or reproduced for any purpose or be regarded as a representation relating to products. All use of Dialog Semiconductor
products, software and applications referred to in this document are subject to Dialog Semiconductor’s Standard Terms and
Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated.
Dialog and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names
are the property of their respective owners.
© Copyright 2016 Dialog Semiconductor. All rights reserved. 1216CREA
相关型号：
DA14586-00F02AT2
Smallest, lowest power and most integrated Bluetooth 5 SoC with integrated Flash
DIALOG
©2020 ICPDF网 联系我们和版权申明