DA14680 [DIALOG]

The most integrated and flexible Bluetooth® low energy SoC;
DA14680
型号: DA14680
厂家: Dialog Semiconductor    Dialog Semiconductor
描述:

The most integrated and flexible Bluetooth® low energy SoC

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SmartBondDA14680  
The most integrated and flexible Bluetooth® low energy SoC  
Create next-generation Bluetooth low energy solutions without compromising on  
functionality or battery lifetime, thanks to Dialog’s SmartBond DA14680.  
It’s the world’s first single-chip solution for wearables, smart home and other rechargeable devices.  
This highly integrated solution supports the full Bluetooth 4.2 features. As a SmartBond device,  
it offers the highest performance, lowest power consumption and smallest footprint. Delivering  
processing capacity when you need it and saving power when you don’t, it can manage multi-sensor  
arrays and enable always-on sensing. Plus our SmartSnippetstooling helps you optimize your  
software for power consumption.  
The DA14680 includes Flash memory, offers unlimited execution space and enables over-the-air  
updates. With an integrated Power Management Unit comprising system power rails, a battery  
charger and a fuel gauge, it supports rechargeable batteries natively and can power a complete  
sensor-based system. Meanwhile, a dedicated hardware crypto engine delivers banking-level  
security (including Apple HomeKit support) with end-to-end encryption to keep personal data safe.  
Applications  
DA14680  
(Multi-sensor) wearable devices:  
XTAL16M  
ARM M0CPU  
16 kB Cache  
-
-
-
Fitness / activity trackers  
Sport watches  
Smartwatches  
XTAL32K  
8-CH DMA  
AES256  
SHA-2  
USB 1.1  
Charger  
Smart home  
OTP 64 kB  
UARTx2  
SPIx2  
ECC  
Consumer appliances  
Home automation  
Voice-controlled remote controls  
Rechargeable keyboards  
Toys  
TRNG  
I2Cx2  
TEMP  
ADC  
FLASH 8Mbit  
IR  
KEYB  
QDEC  
TIMERS  
PCM/I2S  
PDM  
RAM 128 kB  
Industrial automation  
ROM 128 kB  
GPIO matrix  
QuadSPI CTRL  
Power Management Unit  
www.dialog-semiconductor.com/bluetoothlowenergy  
SoC Features  
Complies to Bluetooth 4.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47  
Part 15 (US) and ARIB STD-T66 (Japan)  
Flexible processing power  
-
-
32 kHz up to 96 MHz 32-bit ARM Cortex-M0 with 16 kBytes, 4-way associative cache  
Three optimised power modes (Extended sleep, Deep sleep and Hibernation) reducing  
current down to 840 nA  
Memories  
-
-
-
-
-
8 Mb FLASH  
64 kB One-Time-Programmable (OTP) memory  
128 kB Data SRAM with retention capabilities  
16 kB Cache SRAM with retention capabilities  
128 kB ROM (including boot ROM and Bluetooth low energy stack)  
Power management  
-
-
-
-
-
-
Integrated Buck DC-DC converter (1.7 V - 4.75 V)  
Three power supply pins for external devices  
Supports Li-Polymer, Li-Ion, coin cells, NiMH and alkaline batteries  
Charger (up to 5.0 V) with programmable curves  
High accuracy state-of-charge fuel gauge  
Programmable threshold for brownout detection  
Clocks  
-
-
-
-
16 MHz crystal and RC oscillators  
32 kHz crystal and RC oscillators  
10.5 kHz RCX oscillator as a 32 kHz crystal replacement  
Low power PLL up to 96 MHz  
Three general purpose timer/counters with PWM, one of them 16-bit up/down timer/counter with  
PWM available in extended sleep mode  
Application cryptographic engine with ECC, AES-256, SHA-1, SHA-256, SHA-512 and a FIPS  
140-2-compliant True Random Number Generator  
Digital interfaces  
-
-
-
-
-
-
-
-
-
-
31 general purpose I/Os with programmable voltage levels  
Two UARTs, one with hardware flow control  
Two SPI+™ interfaces  
Two I²C bus interfaces at 100 kHz, 400 kHz  
Three-axis capable Quadrature Decoder  
PDM interface with HW sample rate converter (2 mics or 2 speakers)  
I²S/PCM master/slave interface up to 8 channels  
Keyboard scanner with de-bouncing  
Infrared (IR) interface (PWM)  
USB Full Speed (FS) device interface  
www.dialog-semiconductor.com/bluetoothlowenergy  
Analog interfaces  
-
-
-
8-channel 10-bit ADC with averaging capability achieving 11.5 ENOB  
Three matched white LED drivers  
Temperature sensor  
Radio transceiver  
-
-
-
-
2.4 GHz CMOS transceiver with integrated balun  
50 Ω matched single wire antenna interface  
0 dBm transmit output power and -94 dBm receiver sensitivity  
Supply current at VBAT1 (3 V): 3.4 mA (TX), 3.1 mA (RX)  
Packages  
AQFN with 60 pins, 6 mm x 6 mm x 0.9 mm  
-
Power Management  
There are 3 power rails that can  
be used to supply external devices  
namely Vsys, Vflash and Vext. There  
are also internal rails used for the  
core and the radio (Vcore , Vradio). All  
of the rails are supplied by a normal  
LDO, a Retention LDO or one of the  
outputs of the Single Inductance  
Multiple Output (SIMO) DCDC  
converter. When the SoC is active,  
the DCDC is enabled. When the SoC  
is in sleep mode, then the Retention  
LDOs are supplying the rails.  
VBUS  
CC/CV  
LDO_USB_RET  
LDO_USB  
4.2V – 5.75V  
1.7V – 4.75V  
V33  
Vsys 110mA/3mA  
VBAT1  
LDO_VBAT_RET  
LDO_VBAT  
-
+
4.7μF  
SIMO  
DCDC  
VDD1V8  
V12  
V14  
Vflash  
Vcore  
75mA/3mA  
VDD1V8P  
Vradio  
Vext  
10μF  
4.7μF  
75mA/3mA  
The normal LDOs are used while  
powering up the system or during  
transitions from active to sleep and  
vice-versa.  
10μF  
10μF  
0.47μH  
The driving capability of the various rails is depicted in the figure: light blue for active, dark blue  
for sleep. LDOs as well as DCDC outputs can be switched on/off depending on the application’s  
requirements. A flexible Constant Current / Constant Voltage (CC/CV) charger supplying currents  
from 200 uA to 400 mA allows for native re-chargeable batteries support. Finally, a State-of-Charge  
engine, monitors the remaining capacitance of the battery when the system is active. The Power  
Management Unit reduces Bill of Material and enables full control of the power budget of the final  
product.  
www.dialog-semiconductor.com/bluetoothlowenergy  
Application CPU  
The ARM M0™ CPU is equipped with a configurable 16 kB cache which can operate in direct,  
two-way or four-way associative mode. Moreover, the cache line size can be programed to be 8,  
16 or 32 bytes. The SoC allows execution directly from the integrated FLASH (8 Mb) or the OTP.  
There are 2 separate buses, one serving the code execution path (CPU, FLASH) and another which  
serves data storage (DMA, Peripherals) hence eliminating latencies in application execution. The  
CPU can be clocked by the XTAL16 crystal oscillator (16 MHz), or by a low-power internal PLL  
which boosts the frequency to 96 MHz, enabling complex applications or algorithms without the use  
of an external or dedicated MCU.  
System Booting  
The DA14680 supports booting from a serial interface or from a non-volatile memory (FLASH or  
OTP). It also comes with a pre-defined header residing in OTP which contains configuration flags  
but also trim values and preferred settings programmed during silicon manufacturing and/or final  
product testing by the customer. Booting latency might vary from 15 ms (NVM booting path) to  
some hundreds of ms (serial path) depending on the serial interface used and the speed/size of the  
booting transaction.  
Sleep Modes  
The DA14680 comprises multiple power domains which are powered by the Vcore rail and can be  
switched on or off by software. This flexibility combined with manipulating clocks and retainable  
RAM cells, leads to the three different sleep modes of the system: Extended Sleep, Deep Sleep and  
Hibernation. The first mode is used between Bluetooth low energy activities, the second is a clock-  
less mode with RAM retained (used to store pairing parameters) while the third is a clock-less mode  
with all RAM off, achieving the minimum current dissipation.  
Software and Tools  
The DA14680 is supported by Dialog SmartSnippets Studio, a royalty-free software development  
platform for all SmartBond devices, which contains:  
SmartSnippets Toolbox: A tool suite covering all software developer needs, including power  
profiling, FLASH or OTP programming and testing  
SmartSnippets IDE: An Eclipse CDT based IDE pre-configured plugins allowing easy out of  
the box set-up of the build/debug environment  
SmartSnippets DA1468x Software Development Kit and Documentation  
www.dialog-semiconductor.com/bluetoothlowenergy  
Specification Parameters  
Parameter  
Description  
Conditions  
Min  
Typ  
Max  
Unit  
Supply voltage  
Supply current  
Supply current  
Supply current  
Supply current  
Supply current  
Supply current  
Radio sensitivity level  
Recommended operating condition  
1.7  
0.4  
1.2  
5.7  
1.7  
1.5  
0.6  
4.75  
1
V
VBAT  
CPU is idle (WFI), DCDC on, VBAT=3V  
0.6  
1.4  
6.2  
2.6  
2.4  
0.7  
-94  
-31  
0
mA  
mA  
mA  
μA  
IBAT_IDLE  
CPU executes code from RAM, DCDC on,  
peripherals on, VBAT=3V  
1.9  
6.9  
14.7  
13.8  
5.8  
IBAT_RUN_16MHz  
IBAT_RUN_96MHz  
IBAT_EXT_SLP  
IBAT_DP_SLP  
IBAT_HIBERN  
PSENSE  
CPU executes code from RAM, DCDC on,  
peripherals on, VBAT=3V  
Cache (16kB) and Data (32kB) retained.  
XTAL32k used. FLASH in power down.  
All clocks off. FLASH off. 24kB RAM retained.  
All clocks off. FLASH off. No RAM retained.  
μA  
μA  
Normal operating conditions; PER=30.8%;  
DCDC disabled  
dBm  
dBm  
dBm  
LSB  
Radio Intermod.  
distortion interferer  
Worst case interferer level  
Maximum gain  
-35  
-1  
PINT_IMD  
Radio output  
power level  
1
2
PO  
ADC integral/differential  
non-linearity  
INL/DNL  
-2  
Ordering Information  
Part number  
Package  
Size (mm)  
Shipment  
Pack Quantity  
DA14680-01F08A92  
AQFN60  
6 x 6 x 0.9  
Reel  
100/1000/4000  
Dialog Semiconductor Worldwide Sales Offices - www.dialog-semiconductor.com email: info@diasemi.com  
United Kingdom  
The Netherlands  
Japan  
Singapore  
Korea  
Phone: +44 1793 757700  
Phone: +31 73 640 88 22  
Phone: +81 3 5425 4567  
Phone: +65 648 499 29  
Phone: +82 2 3469 8200  
China (Shenzhen)  
Germany  
North America  
Taiwan  
Hong Kong  
Phone: +86 755 2981 3669  
Phone: +49 7021 805-0  
Phone: +1 408 845 8500  
Phone: +886 281 786 222  
Phone: +852 3769 5200  
China (Shanghai)  
Phone: +86 21 5424 9058  
This publication is issued to provide outline information only, which unless agreed by Dialog Semiconductor may not be used,  
applied, or reproduced for any purpose or be regarded as a representation relating to products. All use of Dialog Semiconductor  
products, software and applications referred to in this document are subject to Dialog Semiconductor’s Standard Terms and  
Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated.  
Dialog and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names  
are the property of their respective owners.  
© Copyright 2016 Dialog Semiconductor. All rights reserved. 0916CREA  

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