DA14680 [DIALOG]
The most integrated and flexible Bluetooth® low energy SoC;型号: | DA14680 |
厂家: | Dialog Semiconductor |
描述: | The most integrated and flexible Bluetooth® low energy SoC |
文件: | 总5页 (文件大小:576K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SmartBond™ DA14680
The most integrated and flexible Bluetooth® low energy SoC
Create next-generation Bluetooth low energy solutions without compromising on
functionality or battery lifetime, thanks to Dialog’s SmartBond DA14680.
It’s the world’s first single-chip solution for wearables, smart home and other rechargeable devices.
This highly integrated solution supports the full Bluetooth 4.2 features. As a SmartBond device,
it offers the highest performance, lowest power consumption and smallest footprint. Delivering
processing capacity when you need it and saving power when you don’t, it can manage multi-sensor
arrays and enable always-on sensing. Plus our SmartSnippets™ tooling helps you optimize your
software for power consumption.
The DA14680 includes Flash memory, offers unlimited execution space and enables over-the-air
updates. With an integrated Power Management Unit comprising system power rails, a battery
charger and a fuel gauge, it supports rechargeable batteries natively and can power a complete
sensor-based system. Meanwhile, a dedicated hardware crypto engine delivers banking-level
security (including Apple HomeKit support) with end-to-end encryption to keep personal data safe.
Applications
DA14680
■ (Multi-sensor) wearable devices:
XTAL16M
ARM M0™ CPU
16 kB Cache
-
-
-
Fitness / activity trackers
Sport watches
Smartwatches
XTAL32K
8-CH DMA
AES256
SHA-2
USB 1.1
Charger
■ Smart home
OTP 64 kB
UARTx2
SPIx2
ECC
■ Consumer appliances
■ Home automation
■ Voice-controlled remote controls
■ Rechargeable keyboards
■ Toys
TRNG
I2Cx2
TEMP
ADC
FLASH 8Mbit
IR
KEYB
QDEC
TIMERS
PCM/I2S
PDM
RAM 128 kB
■ Industrial automation
ROM 128 kB
GPIO matrix
QuadSPI CTRL
Power Management Unit
www.dialog-semiconductor.com/bluetoothlowenergy
SoC Features
•
•
Complies to Bluetooth 4.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47
Part 15 (US) and ARIB STD-T66 (Japan)
Flexible processing power
-
-
32 kHz up to 96 MHz 32-bit ARM Cortex-M0 with 16 kBytes, 4-way associative cache
Three optimised power modes (Extended sleep, Deep sleep and Hibernation) reducing
current down to 840 nA
•
•
Memories
-
-
-
-
-
8 Mb FLASH
64 kB One-Time-Programmable (OTP) memory
128 kB Data SRAM with retention capabilities
16 kB Cache SRAM with retention capabilities
128 kB ROM (including boot ROM and Bluetooth low energy stack)
Power management
-
-
-
-
-
-
Integrated Buck DC-DC converter (1.7 V - 4.75 V)
Three power supply pins for external devices
Supports Li-Polymer, Li-Ion, coin cells, NiMH and alkaline batteries
Charger (up to 5.0 V) with programmable curves
High accuracy state-of-charge fuel gauge
Programmable threshold for brownout detection
•
Clocks
-
-
-
-
16 MHz crystal and RC oscillators
32 kHz crystal and RC oscillators
10.5 kHz RCX oscillator as a 32 kHz crystal replacement
Low power PLL up to 96 MHz
•
•
•
Three general purpose timer/counters with PWM, one of them 16-bit up/down timer/counter with
PWM available in extended sleep mode
Application cryptographic engine with ECC, AES-256, SHA-1, SHA-256, SHA-512 and a FIPS
140-2-compliant True Random Number Generator
Digital interfaces
-
-
-
-
-
-
-
-
-
-
31 general purpose I/Os with programmable voltage levels
Two UARTs, one with hardware flow control
Two SPI+™ interfaces
Two I²C bus interfaces at 100 kHz, 400 kHz
Three-axis capable Quadrature Decoder
PDM interface with HW sample rate converter (2 mics or 2 speakers)
I²S/PCM master/slave interface up to 8 channels
Keyboard scanner with de-bouncing
Infrared (IR) interface (PWM)
USB Full Speed (FS) device interface
www.dialog-semiconductor.com/bluetoothlowenergy
•
•
Analog interfaces
-
-
-
8-channel 10-bit ADC with averaging capability achieving 11.5 ENOB
Three matched white LED drivers
Temperature sensor
Radio transceiver
-
-
-
-
2.4 GHz CMOS transceiver with integrated balun
50 Ω matched single wire antenna interface
0 dBm transmit output power and -94 dBm receiver sensitivity
Supply current at VBAT1 (3 V): 3.4 mA (TX), 3.1 mA (RX)
•
Packages
AQFN with 60 pins, 6 mm x 6 mm x 0.9 mm
-
Power Management
There are 3 power rails that can
be used to supply external devices
namely Vsys, Vflash and Vext. There
are also internal rails used for the
core and the radio (Vcore , Vradio). All
of the rails are supplied by a normal
LDO, a Retention LDO or one of the
outputs of the Single Inductance
Multiple Output (SIMO) DCDC
converter. When the SoC is active,
the DCDC is enabled. When the SoC
is in sleep mode, then the Retention
LDOs are supplying the rails.
VBUS
CC/CV
LDO_USB_RET
LDO_USB
4.2V – 5.75V
1.7V – 4.75V
V33
Vsys 110mA/3mA
VBAT1
LDO_VBAT_RET
LDO_VBAT
-
+
4.7μF
SIMO
DCDC
VDD1V8
V12
V14
Vflash
Vcore
75mA/3mA
VDD1V8P
Vradio
Vext
10μF
4.7μF
75mA/3mA
The normal LDOs are used while
powering up the system or during
transitions from active to sleep and
vice-versa.
10μF
10μF
0.47μH
The driving capability of the various rails is depicted in the figure: light blue for active, dark blue
for sleep. LDOs as well as DCDC outputs can be switched on/off depending on the application’s
requirements. A flexible Constant Current / Constant Voltage (CC/CV) charger supplying currents
from 200 uA to 400 mA allows for native re-chargeable batteries support. Finally, a State-of-Charge
engine, monitors the remaining capacitance of the battery when the system is active. The Power
Management Unit reduces Bill of Material and enables full control of the power budget of the final
product.
www.dialog-semiconductor.com/bluetoothlowenergy
Application CPU
The ARM M0™ CPU is equipped with a configurable 16 kB cache which can operate in direct,
two-way or four-way associative mode. Moreover, the cache line size can be programed to be 8,
16 or 32 bytes. The SoC allows execution directly from the integrated FLASH (8 Mb) or the OTP.
There are 2 separate buses, one serving the code execution path (CPU, FLASH) and another which
serves data storage (DMA, Peripherals) hence eliminating latencies in application execution. The
CPU can be clocked by the XTAL16 crystal oscillator (16 MHz), or by a low-power internal PLL
which boosts the frequency to 96 MHz, enabling complex applications or algorithms without the use
of an external or dedicated MCU.
System Booting
The DA14680 supports booting from a serial interface or from a non-volatile memory (FLASH or
OTP). It also comes with a pre-defined header residing in OTP which contains configuration flags
but also trim values and preferred settings programmed during silicon manufacturing and/or final
product testing by the customer. Booting latency might vary from 15 ms (NVM booting path) to
some hundreds of ms (serial path) depending on the serial interface used and the speed/size of the
booting transaction.
Sleep Modes
The DA14680 comprises multiple power domains which are powered by the Vcore rail and can be
switched on or off by software. This flexibility combined with manipulating clocks and retainable
RAM cells, leads to the three different sleep modes of the system: Extended Sleep, Deep Sleep and
Hibernation. The first mode is used between Bluetooth low energy activities, the second is a clock-
less mode with RAM retained (used to store pairing parameters) while the third is a clock-less mode
with all RAM off, achieving the minimum current dissipation.
Software and Tools
The DA14680 is supported by Dialog SmartSnippets Studio, a royalty-free software development
platform for all SmartBond devices, which contains:
■ SmartSnippets Toolbox: A tool suite covering all software developer needs, including power
profiling, FLASH or OTP programming and testing
■ SmartSnippets IDE: An Eclipse CDT based IDE pre-configured plugins allowing easy out of
the box set-up of the build/debug environment
■ SmartSnippets DA1468x Software Development Kit and Documentation
www.dialog-semiconductor.com/bluetoothlowenergy
Specification Parameters
Parameter
Description
Conditions
Min
Typ
Max
Unit
Supply voltage
Supply current
Supply current
Supply current
Supply current
Supply current
Supply current
Radio sensitivity level
Recommended operating condition
1.7
0.4
1.2
5.7
1.7
1.5
0.6
4.75
1
V
VBAT
CPU is idle (WFI), DCDC on, VBAT=3V
0.6
1.4
6.2
2.6
2.4
0.7
-94
-31
0
mA
mA
mA
μA
IBAT_IDLE
CPU executes code from RAM, DCDC on,
peripherals on, VBAT=3V
1.9
6.9
14.7
13.8
5.8
IBAT_RUN_16MHz
IBAT_RUN_96MHz
IBAT_EXT_SLP
IBAT_DP_SLP
IBAT_HIBERN
PSENSE
CPU executes code from RAM, DCDC on,
peripherals on, VBAT=3V
Cache (16kB) and Data (32kB) retained.
XTAL32k used. FLASH in power down.
All clocks off. FLASH off. 24kB RAM retained.
All clocks off. FLASH off. No RAM retained.
μA
μA
Normal operating conditions; PER=30.8%;
DCDC disabled
dBm
dBm
dBm
LSB
Radio Intermod.
distortion interferer
Worst case interferer level
Maximum gain
-35
-1
PINT_IMD
Radio output
power level
1
2
PO
ADC integral/differential
non-linearity
INL/DNL
-2
Ordering Information
Part number
Package
Size (mm)
Shipment
Pack Quantity
DA14680-01F08A92
AQFN60
6 x 6 x 0.9
Reel
100/1000/4000
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