DS1216F [DALLAS]

SmartWatch RAM DS1216B/C/D/H SmartWatch ROM DS1216E/F; 的SmartWatch RAM DS1216B / C / D / H的SmartWatch ROM DS1216E /女
DS1216F
型号: DS1216F
厂家: DALLAS SEMICONDUCTOR    DALLAS SEMICONDUCTOR
描述:

SmartWatch RAM DS1216B/C/D/H SmartWatch ROM DS1216E/F
的SmartWatch RAM DS1216B / C / D / H的SmartWatch ROM DS1216E /女

计时器或实时时钟 微控制器和处理器 外围集成电路 光电二极管
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DS1216  
SmartWatch RAM DS1216B/C/D/H  
SmartWatch ROM DS1216E/F  
www.maxim-ic.com  
FEATURES  
C Keeps track of hundredths of seconds,  
seconds, minutes, hours, days, date of the  
month, months, and years  
C Lithium energy source is electrically  
disconnected to retain freshness until power is  
applied for the first time  
C Converts standard 2k x 8 up to 512k x 8  
CMOS static RAMs into nonvolatile memory  
C Embedded lithium energy cell maintains  
watch information and retains RAM data  
C Watch function is transparent to RAM  
operation  
C Proven gas-tight socket contacts  
C Full M10% operating range  
C Operating temperature range: 0LC to +70LC  
C Accuracy is better than M1 minute/month @  
+25LC  
C Month and year determine the number of days  
in each month; leap-year compensation valid  
up to 2100  
ORDERING INFORMATION  
DS1216B, DS1216C, DS1216D, DS1216E,  
RST 1  
28 VCC  
27 WE  
DS1216F, DS1216H (See Figure 2 for letter suffix  
2
3
marking identification.)  
26 V
CC  
B
4
25  
PIN DESCRIPTION  
5
6
24  
23  
RST  
- RESET  
7
8
9
22 OE  
21  
20 CE  
DQ0 - Data Input/Output 0 [RAM]  
[A2]  
A2  
A0  
- Address Bit 2 (Read/Write [ROM])  
- Address Bit 0 (Data Input [ROM])  
[A0] 10  
DQ0 11  
19  
GND - Ground  
18  
CE  
- Conditioned Chip Enable  
12  
13  
17  
16  
OE  
- Output Enable  
WE  
Vcc  
- Write Enable  
GND 14  
15  
- Switched VCC for 28-/32-Pin RAM  
DS1216B/C/D/E  
VCCB - Switched VCC for 24-Pin RAM  
VCCD - Switched VCC for 28-Ppin RAM  
28-Pin Intelligent Socket  
PCB MODIFICATION REQUIRED  
PART  
RAM/ROM  
RAM DENSITY  
FOR DENSITY UPGRADE?  
DS1216B  
DS1216C  
DS1216D  
DS1216E  
DS1216F  
DS1216H  
RAM  
RAM  
RAM  
ROM  
ROM  
RAM  
16k/64k  
64k/256k  
256k/1M  
64k/256k  
64k/256k/1M  
1M/4M  
No/Yes  
No  
No/Yes  
No  
No  
No  
1 of 13  
111901  
DS1216  
TYPICAL OPERATING CIRCUIT  
RST  
1
2
3
4
5
6
7
8
9
32 VCC  
31  
30  
29  
28  
27  
WE  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
OE  
CE  
[A2] 10  
11  
[A0] 12  
DQ0  
13  
14  
15  
GND 16  
DS1216D/E/F/H  
32-Pin Intelligent Socket  
DESCRIPTION  
The DS1216 SmartWatch RAM and SmartWatch ROM Sockets are 600mil-wide DIP sockets with a  
built-in CMOS watch function, an NV RAM controller circuit, and an embedded lithium energy source.  
The sockets provide an NV RAM solution for memory sized from 2k x 8 to 512k x 8 with package sizes  
from 26 pins to 32 pins. When a socket is mated with a CMOS SRAM, it provides a complete solution to  
problems associated with memory volatility and uses a common energy source to maintain time and date.  
The SmartWatch ROM sockets use the embedded lithium source to maintain the time and date only. A  
key feature of the SmartWatch is that the watch function remains transparent to the RAM. The  
SmartWatch monitors VCC for an out-of-tolerance condition. When such a condition occurs, an internal  
lithium energy source is automatically switched on and write protection is unconditionally enabled to  
prevent loss of watch and RAM data.  
Using the SmartWatch saves PC board space since the combination of SmartWatch and the mated RAM  
take up no more area than the memory alone. The SmartWatch uses the VCC, data I/O 0, CE , OE , and WE  
for RAM and watch control. All other pins are passed straight through to the socket receptacle.  
The SmartWatch provides timekeeping information including hundredths of seconds, seconds, minutes,  
hours, days, date, months, and years. The date at the end of the month is automatically adjusted for  
months with fewer than 31 days, including correction for leap years. The SmartWatch operates in either  
24-hour or 12-hour format with an AM/PM indicator.  
OPERATION  
Communication with the SmartWatch RAM is established by pattern recognition on a serial bit stream of  
64 bits that must be matched by executing 64 consecutive write cycles containing the proper data on  
DQ0. On the SmartWatch ROM, communication with the clock is established using A2 and A0, and  
either OE or CE. All accesses that occur prior to recognition of the 64-bit pattern are directed to memory.  
2 of 13  
DS1216  
After the pattern match, the next 64 reads and/or writes are directed to the clock, and the RAM is  
disabled. Once the pattern is established, the next 64 read/write cycles will be directed to the RTC  
registers. When power is cycled, 64 reads should be executed prior to any writes to ensure that the RTC  
registers are not written. A pattern match is ignored if the RST bit is zero and the RST pin goes low  
during the match sequence. A pattern match is also terminated if a read occurs during the 64-bit match  
sequence.  
PATTERN MATCH—RAM  
Data transfer to and from the timekeeping registers is accomplished with a serial bit stream under control  
of chip enable (CE ), output enable (OE ), and write enable ( WE). Initially, a read cycle to any memory  
location using the CE and OE control of the SmartWatch starts the pattern recognition sequence by  
moving a pointer to the first bit of the 64-bit comparison register. Next, 64 consecutive write cycles are  
executed using the CE and WE control of the SmartWatch. These 64 write cycles are used only to gain  
access to the SmartWatch. Therefore, any address to the memory in the socket is acceptable. However,  
the write cycles generated to gain access to the SmartWatch are also writing data to a location in the  
mated RAM. The preferred way to manage this requirement is to set aside just one address location in  
RAM as a SmartWatch scratch pad. When the first write cycle is executed, it is compared to bit 0 of the  
64-bit comparison register. If a match is found, the pointer increments to the next location of the  
comparison register and awaits the next write cycle. If a match is not found, the pointer does not advance  
and all subsequent write cycles are ignored. If a read cycle occurs at any time during pattern recognition,  
the present sequence is aborted and the comparison register pointer is reset. Pattern recognition continues  
for 64 write cycles as described above until all the bits in the comparison register have been matched (this  
bit pattern is shown in Figure 1). With a correct match for 64 bits, the SmartWatch is enabled and data  
transfer to or from the timekeeping registers can proceed. The next 64 cycles will cause the SmartWatch  
to either receive or transmit data on DQ0, depending on the level of the OE pin or the WE pin. Cycles to  
other locations outside the memory block can be interleaved with CE cycles without interrupting the  
pattern recognition sequence or data transfer sequence to the SmartWatch.  
PATTERN MATCH—ROM  
Communication with the SmartWatch is established by pattern recognition of a serial bit stream of 64 bits  
that must be matched by executing 64 consecutive write cycles, placing address bit A2 low with the  
proper data on address bit A0. The 64 write cycles are used only to gain access to the SmartWatch. Prior  
to executing the first of 64 write cycles, a read cycle should be executed by holding A2 high. The read  
cycle will reset the comparison register pointer within the SmartWatch, ensuring the pattern recognition  
starts with the first bit of the sequence. When the first write cycle is executed, it is compared to bit 0 of  
the 64-bit comparison register. If a match is found, the pointer increments to the next location of the  
comparison register and awaits the next write cycle. If a match is not found, the pointer does not advance  
and all subsequent write cycles are ignored. If a read cycle occurs at any time during pattern recognition,  
the present sequence is aborted and the comparison register pointer is reset. Pattern recognition continues  
for a total of 64 write cycles as described above, until all the bits in the comparison register have been  
matched (this bit pattern is shown in Figure 1). With a correct match for 64 bits, the SmartWatch is  
enabled and data transfer to or from the timekeeping registers can proceed. The next 64 cycles will cause  
the SmartWatch to either receive data on data in (A0) or transmit data on data out (DQ0), depending on  
the level of /WRITE READ (A2).  
3 of 13  
DS1216  
SMARTWATCH COMPARISON REGISTER DEFINITION Figure 1  
HEX  
VALUE  
7
1
0
1
C5  
1
0
0
1
1
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
0
1
0
1
0
1
0
1
0
0
1
1
0
0
0
1
1
0
0
1
1
BYTE 0  
BYTE 1  
3A  
0
1
0
1
0
1
0
1
0
1
0
1
A3  
BYTE 2  
5C  
C5  
BYTE 3  
BYTE 4  
3A  
A3  
5C  
BYTE 5  
BYTE 6  
BYTE 7  
0
1
0
1
1
1
0
0
Note: The pattern recognition in Hex is C5, 3A, 5C, C5, 3A, A3, 5C. The odds of this pattern  
accidentally duplicating and causing inadvertent entry to the SmartWatch are less than 1 in 1019. This  
pattern is sent to the SmartWatch LSB to MSB.  
After power-up, the controller could be in the 64-bit clock register read/write sequence (from an  
incomplete access prior to power-down). Therefore, it is recommended that a 64-bit read be performed  
upon power-up to prevent accidental writes to the clock, and to prevent reading clock data when access to  
the RAM would otherwise be expected.  
NONVOLATILE CONTROLLER OPERATION  
The DS1216 SmartWatch performs circuit functions required to make a CMOS RAM nonvolatile. First, a  
switch is provided to direct power from the battery or VCC supply, depending on which voltage is greater.  
This switch has a voltage drop of less than 0.2V. The second function that the SmartWatch provides is  
power-fail detection, which occurs at VTP. The DS1216 constantly monitors the VCC supply. When VCC  
goes out of tolerance, a comparator outputs a power-fail signal to the chip-enable logic. The third function  
accomplishes write protection by holding the chip-enable signal to the memory within 0.2V of VCC or  
battery. During nominal power-supply conditions, the memory chip-enable signal will track the chip-  
enable signal sent to the socket with a maximum propagation delay of 7ns for the 5V and 12ns for the  
3.3V version.  
FRESHNESS SEAL  
Each DS1216 is shipped from Dallas Semiconductor with its lithium energy source disconnected,  
ensuring full energy capacity. When VCC is first applied at a level greater than the lithium energy source  
is enabled for battery-backup operation.  
4 of 13  
DS1216  
SMARTWATCH REGISTER INFORMATION  
The SmartWatch information is contained in eight registers of 8 bits, each of which is sequentially  
accessed one bit at a time after the 64-bit pattern recognition sequence has been completed. When  
updating the SmartWatch registers, each must be handled in groups of 8 bits. Writing and reading  
individual bits within a register could produce erroneous results. These read/write registers are defined in  
Figure 3.  
Data contained in the SmartWatch registers is in binary-coded decimal format (BCD). Reading and  
writing the registers is always accomplished by stepping through all eight registers, starting with bit 0 of  
register 0 and ending with bit 7 of register 7.  
AM–PM/12/24 MODE  
Bit 7 of the hours register is defined as the 12-hour or 24-hour mode-select bit. When high, the 12-hour  
mode is selected. In the 12-hour mode, bit 5 is the AM/PM bit with logic high being PM. In the 24-hour  
mode, bit 5 is the second 10-hour bit (20–23 hours).  
OSCILLATOR AND RESET BITS  
Bits 4 and 5 of the day register are used to control the RESET and oscillator functions. Bit 4 controls the  
RESET (pin 1). When the RESET bit is set to logic 1, the RESET input pin is ignored. When the RESET bit  
is set to logic 0, a low input on the RESET pin will cause the SmartWatch to abort data transfer without  
changing data in the watch registers. Bit 5 controls the oscillator. When set to logic 1, the oscillator is off.  
When set to logic 0, the oscillator turns on and the watch becomes operational. These bits are shipped  
from the factory set to logic 1.  
ZERO BITS  
Registers 1, 2, 3, 4, 5, and 6 contain one or more bits that will always read logic 0. When writing these  
locations, either a logic 1 or 0 is acceptable.  
ADDITIONAL INFORMATION  
Refer to Application Note 52 for information about using regarding optional modifications and the  
phantom clock contained within the SmartWatch.  
5 of 13  
DS1216  
RESET AND MEMORY DENSITY OPTIONS Figure 2  
The letter suffix of the SmartWatch is located on the PCB as shown above.  
The RESET pin on the controller has an internal pullup resistor. To disable the RESET function, the trace  
between pin 1 on the socket and pin 13 on the controller can be cut. In this case, the socket will ignore the  
RESET input, preventing address transitions from resetting the pattern match, even if the RST bit is  
enabled.  
On the DS1216B and DS1216D, the two VCC pins are connected together on the PCB. The switched VCC  
from the controller is connected to the two VCC pins that connect to the inserted RAM. No modifications  
are required if the lower density RAM is used. To use the higher density RAM, the trace by the lower  
density RAM VCC pin, identified by a hash mark labeled “U,” must be cut. The two square-metal pads,  
labeled “G,” must be shorted together. This disconnects switched VCC from the pin going to the inserted  
RAM, and connects it to the corresponding address input pin for the higher density RAM.  
6 of 13  
DS1216  
SMARTWATCH REGISTER DEFINITION Figure 3  
REGISTER  
RANGE (BCD)  
00-99  
7
0
0.1 SEC  
0.01 SEC  
0
1
2
7
7
0
0
0
0
10 SEC  
10 MIN  
SECONDS  
MINUTES  
00-59  
00-59  
7
7
0
0
12/24  
0
10  
A/P  
HR  
HOUR  
01-12  
3
01-07  
00-23  
0
0
0
0
OSC  
RST  
0
DAY  
4
7
7
7
0
0
0
0
0
10  
0
DATE  
DATE  
MONTH  
YEAR  
01-31  
01-12  
00-99  
5
6
7
10 MONTH  
10 YEAR  
7 of 13  
DS1216  
ABSOLUTE MAXIMUM RATINGS*  
Voltage Range on any Pin Relative to Ground  
Operating Temperature Range  
-0.3V to +7.0V for 5V  
0°C to +70°C  
Storage Temperature Range  
-40°C to +70°C  
Soldering Temperature Range  
See J-STD-020A Specification (Note 6)  
* This is a stress rating only and functional operation of the device at these or any other conditions  
beyond those indicated in the operation sections of this specification is not implied. Exposure to  
absolute maximum rating conditions for extended periods of time can affect reliability.  
RECOMMENDED DC OPERATING CONDITIONS  
(0LC to +70LC)  
PARAMETER  
VCC Pin 5V Supply  
SYMBOL  
VCC  
MIN  
4.5  
TYP  
MAX  
5.5  
UNITS NOTES  
5.0  
V
V
V
1
8
8
Logic 1  
Logic 0  
VIH  
2.2  
VCC + 0.3  
+0.8  
VIL  
-0.3  
DC ELECTRICAL CHARACTERISTICS  
(0LC to +70LC; VCC = 5.0 M 10%)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS NOTES  
VCC Supply  
VCC Supply Voltage  
(ICCO = 80mA)  
ICCI  
5
mA  
V
1, 2,3  
1, 6  
VCCO1(U)  
VCC - 0.2  
Input Leakage  
IIL  
-1.0  
2.4  
+1.0  
2,8,13  
A  
Output Logic 1 Voltage  
(IOUT = -1.0mA)  
VOH  
V
Output Logic 1 Voltage  
VOL  
VTP  
0.4  
4.5  
V
V
(IOUT = -1.0mA)  
Write Protection Voltage  
4.25  
BACKUP POWER CHARACTERISTICS  
(0LC to +70LC; VCC < VTP)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS NOTES  
VOH(L)  
VBAT - 0.2  
V
1
CE Output  
VCC Supply Voltage  
(ICCO = 10µA)  
RAM VCC (Battery) Voltage  
Recovery at Power-Up  
VCC Slew Rate fall  
VCCO2(U)  
VBAT - 0.2  
2
V
1, 6,14  
1,15  
VBAT  
tREC  
tF  
3
3.6  
2
V
ms  
s  
0
tCE  
1.5  
5
s  
CE Pulse Width  
8 of 13  
DS1216  
(TA = +25LC)  
CAPACITANCE  
PARAMETER  
SYMBOL  
CIN  
MIN  
MIN  
TYP  
TYP  
MAX  
UNITS NOTES  
Input Capacitance  
Output Capacitance  
5
7
pF  
pF  
COUT  
(TA = +25LC)  
UNITS NOTES  
PARAMETER  
SYMBOL  
MAX  
Expected Data Retention  
tDR  
10  
Years  
14  
AC ELECTRICAL CHARACTERISTICS  
(0LC to 70LC; VCC = 4.5 to 5.5V)  
PARAMETER  
Read Cycle Time  
SYMBOL  
MIN  
TYPE  
MAX  
UNITS NOTES  
tRC  
tCO  
75  
ns  
ns  
65  
65  
CE Access Time  
tOE  
tCOE  
tOEE  
tOD  
ns  
ns  
ns  
ns  
ns  
OE Access Time  
6
6
CE to Output Low-Z  
OE to Output Low-Z  
CE to Output High-Z  
30  
30  
tODO  
OE to Output High-Z  
Address Setup Time (ROM)  
Address Hold Time (ROM)  
Read Recovery  
tAS  
tAH  
tRR  
tWC  
tWP  
tWR  
tDS  
20  
11  
10  
12  
15  
75  
75  
15  
35  
0
ns  
ns  
ns  
Write Cycle Time  
Write Pulse Width  
Write Recovery  
ns  
ns  
ns  
ns  
9
Data Setup Time  
10  
10  
Data Hold Time  
tDH  
tCW  
65  
CE Pulse Width  
tRST  
tPD  
tPF  
75  
ns  
ns  
ns  
RESET Pulse Width  
CE Propagation Delay  
CE High to Power-Fail  
6
0
7
9 of 13  
DS1216  
TIMING DIAGRAM: READ CYCLE TO SMARTWATCH  
TIMING DIAGRAM: WRITE CYCLE TO SMARTWATCH  
TIMING DIAGRAM: RESET FOR SMARTWATCH  
10 of 13  
DS1216  
TIMING DIAGRAM: POWER-DOWN  
TIMING DIAGRAM: POWER-UP  
Warning: Under no circumstances should negative undershoots of any amplitude be allowed when the  
device is in battery-backup mode. Water washing for flux removal will discharge internal lithium source  
because exposed voltage pins are present.  
11 of 13  
DS1216  
NOTES:  
1) Pin locations are designated “U” when a parameter definition refers to the socket receptacle and “L”  
when a parameter definition refers to the socket pin.  
2) No memory inserted in the socket.  
3) Pin 26L can be connected to VCC or left disconnected at the PC board.  
4) SmartWatch sockets can be successfully processed through some conventional wave-soldering  
techniques as long as temperature exposure to the lithium energy source contained within does not  
exceed +85LC. However, post-solder cleaning with water washing techniques is not permissible.  
Discharge to the lithium energy source can result, even if deionized water is utilized. It is equally  
imperative that ultrasonic vibration is not used in order to avert damage to the quartz crystal resonator  
employed by the oscillator circuit.  
5) tCE max must be met to ensure data integrity on power loss.  
6) VCCO1 is the maximum voltage drop from Vcc(L) to Vcc(U) while power is being supplied by  
Vcc(L). VCCO2 is the maximum voltage drop from VBAT to VCC(U) while the part is in battery backup.  
7) Input pulse rise and fall times equal 10ns.  
8) Applies to pins RST L, A2 L, A0 L, CE L, OE L, and WE L.  
9) tWR is a functions of the latter occurring edge of WE or CE .  
10) tDH and tDS are a function of the first occurring edge of WE or CE .  
11) Tas is a function of the first occurring edge of OE or CE.  
12) Tah is a function of the latter occurring edge of OE or CE  
13) RST (Pin 1) has an internal pullup resistor.  
14) Expected data retention is based on using an external SRAM with a data retention current of less than  
0.5µA at +25°C. Expected data retention time (time while on battery) for a given RAM battery  
current can be calculated using the following formula:  
0.045 / (current in amps) = data retention time in hours  
15) The DS1216 products are shipped with the battery-backup power off. First power-up switches backup  
battery on to clock and RAM VCC pin upon power down.  
12 of 13  
DS1216  
DS1216 28 SMARTWATCH  
PKG  
28-PIN  
32-PIN  
DIM MIN MAX MIN MAX  
1.390 1.420 1.580 1.620  
35.31 36.07 40.13 41.14  
0.690 0.720 0.690 0.720  
17.53 18.29 17.53 18.29  
0.420 0.470 0.400 0.470  
10.67 11.94 10.16 11.94  
0.035 0.065 0.035 0.065  
0.89 1.65 0.89 1.65  
0.055 0.075 0.055 0.075  
1.39 1.90 1.39 1.90  
0.120 0.160 0.120 0.160  
3.04 4.06 3.04 4.06  
0.090 0.110 0.090 0.110  
2.29 2.79 2.29 2.79  
0.590 0.630 0.590 0.630  
14.99 16.00 14.99 16.00  
0.008 0.012 0.008 0.012  
0.20 0.30 0.20 0.30  
0.015 0.021 0.015 0.021  
0.38 0.53 0.38 0.53  
0.380 0.420 0.380 0.420  
9.65 10.67 9.65 10.67  
A IN.  
MM  
B IN.  
MM  
C IN.  
MM  
D IN.  
MM  
E IN.  
MM  
F IN.  
MM  
G IN.  
MM  
H IN.  
MM  
J IN.  
MM  
K IN.  
MM  
L IN.  
MM  
13 of 13  

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