CMBD7000N3 [CYSTEKEC]

High -speed double diode; 高倍速双二极管
CMBD7000N3
型号: CMBD7000N3
厂家: CYSTECH ELECTONICS CORP.    CYSTECH ELECTONICS CORP.
描述:

High -speed double diode
高倍速双二极管

二极管
文件: 总5页 (文件大小:263K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Spec. No. : C329N3  
Issued Date : 2006.12.05  
Revised Date  
CYStech Electronics Corp.  
Page No. : 1/5  
High –speed double diode  
CMBD7000N3  
Description  
The CMBD7000N3 consists of two high-speed switching diodes connected in series, fabricated in planar  
technology, and encapsulated in the small SOT-23 plastic SMD package.  
Equivalent Circuit  
Outline  
CMBD7000N3  
SOT-23  
Cathode/Anode  
1Anode  
Cathode  
2Cathode  
Anode  
3Cathode/Anode  
Absolute Maximum Ratings @TA=25  
Parameters  
Reverse voltage  
Forward current  
Symbol  
VR  
IF  
IFRM  
Min  
-
-
Max  
100  
200  
500  
225  
1.8  
300  
2.4  
150  
+150  
Unit  
V
mA  
Peak forward surge current  
mA  
mW  
mW/°C  
mW  
mW/°C  
°C  
Power dissipation (Note 1)  
PD  
Derate above 25℃  
Power dissipation (Note 2)  
PD  
Derate above 25℃  
Junction Temperature  
Storage Temperature  
Tj  
Tstg  
-55  
-55  
°C  
×
×
Note 1: Device mounted on an FR-5 PCB with area 1.0 0.75 0.062 in.  
2 : Device mounted on an Alumina board with area 0.4×0.3×0.024 in .  
CMBD7000N3  
CYStek Product Specification  
Spec. No. : C329N3  
Issued Date : 2006.12.05  
Revised Date  
CYStech Electronics Corp.  
Page No. : 2/5  
Electrical Characteristics @ Tj=25unless otherwise specified  
Parameters  
Symbol  
Conditions  
Min Typ. Max Unit  
Reverse breakdown voltage  
V(BR)  
I(BR)=100μA  
100  
-
-
V
IF=1mA  
IF=10mA  
IF=100mA  
0.55  
0.67  
0.75  
0.7  
0.82  
1.1  
V
V
V
Forward voltage  
VF  
-
VR=50V  
VR=100V  
VR=50V, Tj=125℃  
1.0  
3.0  
100  
μA  
μA  
μA  
Reverse current  
IR  
Cd  
trr  
-
-
-
-
-
-
Diode capacitance  
Reverse recovery time  
VR=0V, f=1MHz  
1.5  
pF  
when switched from IF=10mA to  
IR=10mA, RL=100, measured  
at IR=1mA  
4
ns  
Thermal Characteristics  
Symbol  
Parameter  
Conditions  
Note 1  
Value  
Unit  
Rth,j-a  
Rth, j-a  
thermal resistance from junction to ambient  
thermal resistance from junction to ambient  
556  
417  
/W  
/W  
Note 2  
Note 1: Device mounted on an FR-5 PCB with area 1.0×0.75×0.062 in .  
2 : Device mounted on an Alumina board with area 0.4×0.3×0.024 in .  
Ordering Information  
Device  
Package  
SOT-23  
(Pb-free)  
Shipping  
Marking  
M5C  
CMBD7000N3  
3000 pcs / Tape & Reel  
CMBD7000N3  
CYStek Product Specification  
Spec. No. : C329N3  
Issued Date : 2006.12.05  
Revised Date  
CYStech Electronics Corp.  
Page No. : 3/5  
Characteristic Curves(applicable to each diode)  
Forward Current vs Forward Voltage  
Diode Capacitance vs Reverse Voltage  
275  
250  
225  
200  
175  
150  
125  
100  
75  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
50  
25  
0
0
2
4
6
8
10 12 14 16  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4  
Reverse Voltage---VR(V)  
Forward Voltage---VF(V)  
CMBD7000N3  
CYStek Product Specification  
Spec. No. : C329N3  
Issued Date : 2006.12.05  
Revised Date  
CYStech Electronics Corp.  
Page No. : 4/5  
Reel Dimension  
Carrier Tape Dimension  
CMBD7000N3  
CYStek Product Specification  
Spec. No. : C329N3  
Issued Date : 2006.12.05  
Revised Date  
CYStech Electronics Corp.  
Page No. : 5/5  
SOT-23 Dimension  
Marking:  
A
L
3
M5C  
S
B
1
2
V
G
3-Lead SOT-23 Plastic  
Surface Mounted Package  
CYStek Package Code: N3  
C
Style: Pin 1.Anode 2.Cathode  
3.Cathode/Anode  
D
K
H
J
*: Typical  
Inches  
Millimeters  
Inches  
Min. Max.  
Millimeters  
DIM  
DIM  
Min.  
Max.  
Min.  
Max.  
3.04  
1.60  
1.30  
0.50  
2.30  
0.10  
Min.  
0.085  
0.32  
0.85  
2.10  
0.25  
Max.  
0.177  
0.67  
1.15  
2.75  
0.65  
A
B
C
D
G
H
0.1102 0.1204  
0.0472 0.0630  
0.0335 0.0512  
0.0118 0.0197  
0.0669 0.0910  
0.0005 0.0040  
2.80  
1.20  
0.89  
0.30  
1.70  
0.013  
J
K
L
S
V
0.0034 0.0070  
0.0128 0.0266  
0.0335 0.0453  
0.0830 0.1083  
0.0098 0.0256  
Notes: 1.Controlling dimension: millimeters.  
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.  
Material:  
Lead: 42 Alloy ; solder plating  
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.  
CYStek reserves the right to make changes to its products without notice.  
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
CMBD7000N3  
CYStek Product Specification  

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