CMBD2004 [CYSTEKEC]
High voltage switching (double) diodes; 高电压开关（双）二极管
| 型号： | CMBD2004 |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | High voltage switching (double) diodes |
| 文件： | 总4页 (文件大小：181K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
CYStech Electronics Corp.
Page No. : 1/4
High voltage switching (double) diodes
CMBD2004/A/C/SN3
Description
High voltage switching diodes encapsulated in a SOT-23 small plastic SMD package.
Single diodes and double diodes with different pinning are available.
Features
•Fast switching speed
•Low forward voltage drop
•Small plastic SMD package
Mechanical Data
•Case : SOT-23, molded plastic
•Terminals : Solderable per MIL-STD-202 Method 208
•Weight : 0.008 grams(approx.)
Pinning
Outline
Pin
Description
SOT-23
CMBD2004 CMBD2004A CMBD2004C CMBD2004S
A
NC
K
K1
K2
A1
A2
A1
K2
K1,A1
1
2
3
3
A1,A2
K1,K2
2
1
Marking:
(1) CMBD2004
(3)CMBD2004C
(2)CMBD2004A
(4)CMBD2004S
Type
Marking Code
D53
CMBD2004 N3
CMBD2004AN3
CMBD2004CN3
CMBD2004SN3
DB8
DB7
DB6
Diode configuration and symbol
CMBD2004/A/C/SN3
CYStek Product Specification
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
CYStech Electronics Corp.
Page No. : 2/4
Absolute Maximum Ratings(Ta=25℃, unless otherwise specified)
• Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -65~+150 °C
Junction Temperature Tj ............................................................................................................. +150 °C
• Maximum Power Dissipation
Total Power Dissipation Ptot (Note)........................................................................................... 350 mW
• Maximum Voltages and Currents
Repetitive Peak Reverse Voltage VRRM ............................................................................................ 300 V
DC Blocking Voltage VR………………………………………………………………………….. 240V
RMS Reverse Voltage VR(RMS)…………………………………………………………………….. 170V
Continuous Forward Current IF (Note)…………………………………………………………… 225 mA
Peak Repetitive Forward Current IFRM (Note)………..………………………………………….625 mA.
Surge Non-repetitive Forward Current IFSM @ tp=1µs........................................................................ 4A
@ tp=1s…….…………………………………………. 1A
• Thermal Resistance, Junction to Ambient Air RθJA……………………………………….……357℃/W
Note : Parts mounted on FR-4 board. For double diodes, Ptot is the total power dissipation of both diodes.
Characteristics (Ta=25°C)
Characteristic
Reverse Breakdown Voltage
Symbol
Condition
IR=100µA
IF=20mA
Min.
300
-
-
-
Max.
Unit
V
mV
mV
nA
µA
pF
VBR
VF(1)
VF(2)
IR(1)
IR(2)
CD
-
870
1000
100
100
5
Forward Voltage (Note)
IF=100mA
VR=240V,Tj=25℃
VR=240V,Tj=150℃
VR=0V, f=1MHz
Reverse Leakage Current (Note)
Diode Capacitance
-
-
IF=IR=30mA RL=100Ω
Reverse Recovery Time
trr
50
ns
measured at IR=3mA
Notes: Pulse test, tp=380µs, duty cycle<2%.
CMBD2004/A/C/SN3
CYStek Product Specification
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
CYStech Electronics Corp.
Page No. : 3/4
Characteristic Curves
Forward Characteristics
Reverse Leakage Current vs Junction Temperature
1000
100
10
100
10
1
1
0.1
0.01
0.1
0.01
0
100
Junction Temperature---Tj(℃)
200
0
1
2
Instantaneous Forward Voltage---VF(V)
Power Derating Curve
400
350
300
250
200
150
100
50
0
0
50
100
150
200
Ambient Temperature---TA(℃)
CMBD2004/A/C/SN3
CYStek Product Specification
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
CYStech Electronics Corp.
Page No. : 4/4
SOT-23 Dimension
Diagram:
Marking:
A
L
3
DXX
S
B
1
2
V
G
C
3-Lead SOT-23 Plastic Surface Mounted
Package. CYStek Package Code: N3
D
K
H
J
• CMBD2004 N3 : Single Diode
(Marking Code D53)
• CMBD2004AN3 : Common Anode. (Marking Code DB8)
• CMBD2004CN3 : Common Cathode. (Marking Code DB7)
• CMBD2004SN3 : Series Connected. (Marking Code DB6)
*: Typical
Inches
Min. Max.
Millimeters
Inches
Min. Max.
Millimeters
DIM
DIM
Min.
Max.
3.04
1.60
1.30
0.50
2.30
0.10
Min.
Max.
0.177
0.67
1.15
2.75
0.65
A
B
C
D
G
H
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
2.80
1.20
0.89
0.30
1.70
0.013
J
K
L
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
0.85
0.32
0.85
2.10
0.25
S
V
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CMBD2004/A/C/SN3
CYStek Product Specification
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