CY7C1329H-133AXI [CYPRESS]
2-Mbit (64K x 32) Pipelined Sync SRAM; 2兆位（ 64K ×32）流水线同步SRAM
| 型号： | CY7C1329H-133AXI |
| 厂家： | 
CYPRESS |
| 描述： | 2-Mbit (64K x 32) Pipelined Sync SRAM |
| 文件： | 总16页 (文件大小：709K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY7C1329H
2-Mbit (64K x 32) Pipelined Sync SRAM
Features
Functional Description[1]
• Registered inputs and outputs for pipelined operation
• 64K × 32 common I/O architecture
• 3.3V core power supply
The CY7C1329H SRAM integrates 64K x 32 SRAM cells with
advanced synchronous peripheral circuitry and a two-bit
counter for internal burst operation. All synchronous inputs are
gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE1), depth-expansion Chip Enables (CE2 and CE3), Burst
• 2.5V/3.3V I/O operation
• Fast clock-to-output times
— 3.5 ns (for 166-MHz device)
Control inputs (ADSC, ADSP,
(BW[A:D] and BWE), and Global Write (GW). Asynchronous
inputs include the Output Enable (OE) and the ZZ pin.
ADV), Write Enables
and
— 4.0 ns (for 133-MHz device)
• Provide high-performance 3-1-1-1 access rate
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
• User-selectable burst counter supporting Intel®
Pentium® interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed write
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle. This part supports Byte
Write operations (see Pin Descriptions and Truth Table for
further details). Write cycles can be one to four bytes wide as
controlled by the Byte Write control inputs. GW when active
• Asynchronous output enable
• Offered in JEDEC-standard lead-free 100-pin TQFP
package
• “ZZ” Sleep Mode Option
causes all bytes to be written.
LOW
The CY7C1329H operates from a +3.3V core power supply
while all outputs operate with either a +2.5V or +3.3V supply.
All
inputs
and
outputs
are
JEDEC-standard
JESD8-5-compatible.
Logic Block Diagram
A0, A1, A
ADDRESS
REGISTER
2
A[1:0]
MODE
Q1
ADV
CLK
BURST
COUNTER
AND
CLR
Q0
LOGIC
ADSC
ADSP
DQ
BYTE
WRITE REGISTER
D
DQ
BYTE
WRITE DRIVER
D
BW
D
DQ
BYTE
C
DQ
BYTE
C
BW
C
OUTPUT
BUFFERS
WRITE DRIVER
OUTPUT
REGISTERS
WRITE REGISTER
MEMORY
ARRAY
SENSE
AMPS
DQ s
DQ
B
E
DQ
B
BYTE
WRITE DRIVER
BYTE
WRITE REGISTER
BW
BW
B
A
DQ
A
DQ
A
BYTE
WRITE DRIVER
BYTE
WRITE REGISTER
BWE
INPUT
REGISTERS
GW
ENABLE
REGISTER
PIPELINED
ENABLE
CE
CE
CE
1
2
3
OE
SLEEP
CONTROL
ZZ
Note:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05673 Rev. *B
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 22, 2006
[+] Feedback
CY7C1329H
Selection Guide
166 MHz
3.5
133 MHz
Unit
ns
Maximum Access Time
4.0
225
40
Maximum Operating Current
Maximum CMOS Standby Current
240
mA
mA
40
Pin Configuration
100-pin TQFP Pinout
NC
DQC
DQC
VDDQ
VSSQ
DQC
DQC
DQC
DQC
VSSQ
VDDQ
DQC
DQC
NC
NC
1
2
3
4
5
6
7
8
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DQB
DQB
VDDQ
VSSQ
DQB
DQB
DQB
DQB
VSSQ
VDDQ
DQB
DQB
VSS
BYTE C
BYTE B
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
CY7C1329H
VDD
NC
VSS
NC
VDD
ZZ
DQD
DQD
VDDQ
VSSQ
DQD
DQD
DQD
DQD
VSSQ
VDDQ
DQD
DQD
NC
DQA
DQA
VDDQ
VSSQ
DQA
DQA
DQA
DQA
VSSQ
VDDQ
DQA
DQA
NC
BYTE D
BYTE A
Document #: 38-05673 Rev. *B
Page 2 of 16
[+] Feedback
CY7C1329H
Pin Definitions
Name
I/O
Description
Address Inputs used to select one of the 64K address locations. Sampled at the rising edge
A0, A1, A
Input-
Synchronous of the CLK if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 are sampled active. A1, A0
feed the 2-bit counter.
BWA,BWB,
BWC, BWD
Input-
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct Byte Writes to the SRAM.
Synchronous Sampled on the rising edge of CLK.
GW
Input-
Global Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a global
Synchronous Write is conducted (ALL bytes are written, regardless of the values on BW[A:D] and BWE).
BWE
CLK
CE1
Input-
Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must be
Synchronous asserted LOW to conduct a Byte Write.
Input-
Clock
Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the
burst counter when ADV is asserted LOW, during a burst operation.
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE
2 and CE to select/deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is sampled only
when a new3external address is loaded.
CE2
CE3
Input-
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
Synchronous CE1 and CE3 to select/deselect the device. CE
2 is sampled only when a new external address is
loaded
Input-
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
Synchronous CE1 and CE2 to select/deselect the device. Not connected for BGA. Where referenced, CE3 is
assumed active throughout this document for BGA. CE3 is sampled only when a new external
address is loaded.
OE
Input-
Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When
Asynchronous LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as
input data pins. OE is masked during the first clock of a Read cycle when emerging from a
deselected state.
ADV
Input-
Advance Input signal, sampled on the rising edge of CLK, active LOW. When asserted, it
Synchronous automatically increments the address in a burst cycle.
ADSP
Input- Address Strobe from Processor, sampled on the rising edge of CLK, active LOW. When
Synchronous asserted LOW, A is captured in the address registers. A1, A0 are also loaded into the burst counter.
When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE1
is deasserted HIGH.
ADSC
ZZ
Input-
Address Strobe from Controller, sampled on the rising edge of CLK, active LOW. When
Synchronous asserted LOW, A is captured in the address registers. A1, A0 are also loaded into the burst counter.
When ADSP and ADSC are both asserted, only ADSP is recognized.
Input-
ZZ “sleep” Input, active HIGH. This input, when HIGH places the device in a non-time-critical
Asynchronous “sleep” condition with data integrity preserved. For normal operation, this pin has to be LOW or
left floating. ZZ pin has an internal pull-down.
DQA, DQB
DQC, DQD
I/O-
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered
Synchronous by the rising edge of CLK. As outputs, they deliver the data contained in the memory location
specified by “A” during the previous clock rise of the Read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQ are
placed in a tri-state condition.
VDD
Power Supply Power supply inputs to the core of the device.
VSS
Ground
Ground for the core of the device.
VDDQ
VSSQ
MODE
I/O Power Supply Power supply for the I/O circuitry.
I/O Ground
Ground for the I/O circuitry.
Input-
Static
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDD or left
floating selects interleaved burst sequence. This is a strap pin and should remain static during
device operation. Mode Pin has an internal pull-up.
NC
No Connects. Not internally connected to the die. 4M, 9M, 18M, 72M, 144M, 288M, 576M and
1G are address expansion pins and are not internally connected to the die.
Document #: 38-05673 Rev. *B
Page 3 of 16
[+] Feedback
CY7C1329H
then the Write operation is controlled by BWE and BW[A:D]
signals. The CY7C1329H provides Byte Write capability that
is described in the Write Cycle Descriptions table. Asserting
the Byte Write Enable input (BWE) with the selected Byte
Write (BW[A:D]) input, will selectively write to only the desired
bytes. Bytes not selected during a Byte Write operation will
remain unaltered. A synchronous self-timed Write mechanism
has been provided to simplify the Write operations.
Functional Overview
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock.
The CY7C1329H supports secondary cache in systems
utilizing either a linear or interleaved burst sequence. The
interleaved burst order supports Pentium and i486™
processors. The linear burst sequence is suited for processors
that utilize a linear burst sequence. The burst order is user
selectable, and is determined by sampling the MODE input.
Accesses can be initiated with either the Processor Address
Strobe (ADSP) or the Controller Address Strobe (ADSC).
Address advancement through the burst sequence is
controlled by the ADV input. A two-bit on-chip wraparound
burst counter captures the first address in a burst sequence
and automatically increments the address for the rest of the
burst access.
Because the CY7C1329H is a common I/O device, the Output
Enable (OE) must be deasserted HIGH before presenting data
to the DQ inputs. Doing so will tri-state the output drivers. As
a safety precaution, DQs are automatically tri-stated whenever
a Write cycle is detected, regardless of the state of OE.
Single Write Accesses Initiated by ADSC
ADSC Write accesses are initiated when the following condi-
tions are satisfied: (1) ADSC is asserted LOW, (2) ADSP is
deasserted HIGH, (3) CE1, CE2, CE3 are all asserted active,
and (4) the appropriate combination of the Write inputs (GW,
BWE, and BW[A:D]) are asserted active to conduct a Write to
the desired byte(s). ADSC-triggered Write accesses require a
single clock cycle to complete. The address presented to A is
loaded into the address register and the address
advancement logic while being delivered to the memory array.
The ADV input is ignored during this cycle. If a global Write is
conducted, the data presented to DQ is written into the corre-
sponding address location in the memory core. If a Byte Write
is conducted, only the selected bytes are written. Bytes not
selected during a Byte Write operation will remain unaltered.
A synchronous self-timed Write mechanism has been
provided to simplify the Write operations.
Byte Write operations are qualified with the Byte Write Enable
(BWE) and Byte Write Select (BW[A:D]) inputs. A Global Write
Enable (GW) overrides all Byte Write inputs and writes data to
all four bytes. All Writes are simplified with on-chip
synchronous self-timed Write circuitry.
Three synchronous Chip Selects (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. ADSP is ignored if CE1
is HIGH.
Single Read Accesses
This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW,
(2) CE1, CE2, CE3 are all asserted active, and (3) the Write
signals (GW, BWE) are all deasserted HIGH. ADSP is ignored
if CE1 is HIGH. The address presented to the address inputs
(A) is stored into the address advancement logic and the
address register while being presented to the memory array.
The corresponding data is allowed to propagate to the input of
the output registers. At the rising edge of the next clock the
data is allowed to propagate through the output register and
onto the data bus within tCO if OE is active LOW. The only
exception occurs when the SRAM is emerging from a
deselected state to a selected state, its outputs are always
tri-stated during the first cycle of the access. After the first cycle
of the access, the outputs are controlled by the OE signal.
Consecutive single Read cycles are supported. Once the
SRAM is deselected at clock rise by the chip select and either
ADSP or ADSC signals, its output will tri-state immediately.
Because the CY7C1329H is a common I/O device, the Output
Enable (OE) must be deasserted HIGH before presenting data
to the DQ inputs. Doing so will tri-state the output drivers. As
a safety precaution, DQs are automatically tri-stated whenever
a Write cycle is detected, regardless of the state of OE.
Burst Sequences
The CY7C1329H provides a two-bit wraparound counter, fed
by A1, A0, that implements either an interleaved or linear burst
sequence. The interleaved burst sequence is designed specif-
ically to support Intel Pentium applications. The linear burst
sequence is designed to support processors that follow a
linear burst sequence. The burst sequence is user selectable
through the MODE input.Asserting ADV LOW at clock rise will
automatically increment the burst counter to the next address
in the burst sequence. Both Read and Write burst operations
are supported.
Single Write Accesses Initiated by ADSP
This access is initiated when both of the following conditions
are satisfied at clock rise: (1) ADSP is asserted LOW, and
(2) CE1, CE2, CE3 are all asserted active. The address
presented to A is loaded into the address register and the
address advancement logic while being delivered to the RAM
array. The Write signals (GW, BWE, and BW[A:D]) and ADV
inputs are ignored during this first cycle.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation “sleep” mode. Two
clock cycles are required to enter into or exit from this “sleep”
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the “sleep” mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the “sleep” mode. CE1, CE2, CE3, ADSP, and ADSC must
remain inactive for the duration of tZZREC after the ZZ input
returns LOW.
ADSP-triggered Write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQ inputs is written into the corre-
sponding address location in the memory array. If GW is HIGH,
Document #: 38-05673 Rev. *B
Page 4 of 16
[+] Feedback
CY7C1329H
Interleaved Burst Address Table
(MODE = Floating or VDD
Linear Burst Address Table (MODE = GND)
)
First
Address
A1, A0
Second
Address
A1, A0
Third
Address
A1, A0
Fourth
Address
A1, A0
First
Address
A1, A0
Second
Address
A1, A0
Third
Address
A1, A0
Fourth
Address
A1, A0
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
ZZ Mode Electrical Characteristics
Parameter
IDDZZ
Description
Sleep mode standby current
Device operation to ZZ
ZZ recovery time
Test Conditions
ZZ > VDD – 0.2V
Min.
Max.
Unit
mA
ns
40
tZZS
ZZ > VDD – 0.2V
2tCYC
tZZREC
tZZI
ZZ < 0.2V
2tCYC
0
ns
ZZ Active to sleep current
This parameter is sampled
This parameter is sampled
2tCYC
ns
tRZZI
ZZ Inactive to exit sleep current
ns
Document #: 38-05673 Rev. *B
Page 5 of 16
[+] Feedback
CY7C1329H
Truth Table[2, 3, 4, 5, 6, 7]
Next Cycle
Unselected
Add. Used
Add. Used
CE1 CE2 CE3 ZZ
ADSP
ADSC
ADV
WRITE OE
None
None
H
L
L
L
L
X
L
L
L
L
L
X
X
L
X
X
H
X
H
X
L
L
L
L
L
L
H
L
L
L
L
L
L
X
L
X
X
X
X
X
X
X
X
X
X
X
L
X
X
X
X
X
X
X
X
L
X
X
X
X
X
X
L
Unselected
Unselected
Unselected
Unselected
Begin Read
Begin Read
None
None
None
L
L
X
X
L
None
X
L
None
None
H
H
X
L
None
None
X
X
H
H
H
H
H
X
L
External
External
None
X
X
X
L
External
External
External
External
External
Next
Continue Read Next
Continue Read Next
Continue Read Next
Continue Read Next
L
L
H
X
L
L
H
H
H
H
L
L
H
H
H
L
L
H
L
Suspend Read
Suspend Read
Suspend Read
Suspend Read
Begin Write
Current
X
H
Current
Current
Current
Current
Current
External
Next
Next
Next
X
H
H
X
H
X
X
H
H
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
L
L
L
L
L
L
L
L
L
L
H
X
X
H
X
H
H
X
X
H
H
H
H
H
H
H
H
H
H
H
L
L
H
H
H
L
H
L
Next
L
H
X
X
L
Begin Write
Next
L
Begin Write
Next
L
L
Continue Write
Continue Write
Suspend Write
Suspend Write
ZZ “Sleep”
Current
Current
Current
Current
Current
H
H
H
H
H
H
H
H
H
L
Next
H
L
Current
Current
None
H
X
Truth Table for Read/Write [2, 3]
Function
GW
BWE
BWD
BWC
BWB
BWA
Read
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
L
X
H
H
H
H
H
H
H
H
L
X
X
X
Read
H
H
H
H
L
H
H
L
H
L
Write Byte A – DQA
Write Byte B – DQB
Write Bytes B, A
Write Byte C – DQC
Write Bytes C, A
Write Bytes C, B
Write Bytes C, B, A
H
L
L
H
H
L
H
L
L
L
H
L
L
L
Write Byte D – DQD
H
H
H
Notes:
2. X = “Don't Care.” H =Logic HIGH, L = Logic LOW.
3. WRITE = L when any one or more Byte Write Enable signals (BW ,BW ,BW ,BW and BWE = L or GW = L. WRITE = H when all Byte Write Enable signals
)
D
A
B
C
(BW ,BW ,BW ,BW BWE, GW = H.
),
A
B
C
D
4. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.
5. CE , CE , and CE are available only in the TQFP package.
1
2
3
6. The SRAM always initiates a read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BW
. Writes may occur only on subsequent clocks
[A:D]
after the ADSP or with the assertion of ADSC. As a result,
don't care for the remainder of the Write cycle.
must be driven HIGH prior to the start of the Write cycle to allow the outputs to Tri-State. OE is a
OE
7. OE is asynchronous and is not sampled with the clock rise. It is masked internally during Write cycles. During a Read cycle all data bits are Tri-State when OE
is inactive or when the device is deselected, and all data bits behave as output when OE is active (LOW).
Document #: 38-05673 Rev. *B
Page 6 of 16
[+] Feedback
CY7C1329H
Truth Table for Read/Write (continued)[2, 3]
Function
GW
BWE
BWD
BWC
BWB
BWA
Write Bytes D, A
H
L
L
H
H
L
Write Bytes D, B
Write Bytes D, B, A
Write Bytes D, C
Write Bytes D, C, A
Write Bytes D, C, B
Write All Bytes
H
H
H
H
H
H
L
L
L
L
L
L
L
X
L
L
L
L
L
L
X
H
H
L
L
L
H
L
H
H
L
H
L
L
L
H
L
L
L
Write All Bytes
X
X
X
Document #: 38-05673 Rev. *B
Page 7 of 16
[+] Feedback
CY7C1329H
DC Input Voltage ................................... –0.5V to VDD + 0.5V
Current into Outputs (LOW) ........................................ 20 mA
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Static Discharge Voltage ......................................... > 2001V
(per MIL-STD-883, Method 3015)
Storage Temperature ................................. –65°C to +150°C
Latch-up Current ................................................... > 200 mA
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Operating Range
Supply Voltage on VDD Relative to GND ....... –0.5V to +4.6V
Supply Voltage on VDDQ Relative to GND...... –0.5V to +VDD
Ambient
Range
Commercial
Industrial
Temperature
0°C to +70°C
–40°C to +85°C
VDD
VDDQ
3.3V
–5%/+10%
2.5V –5%
to VDD
DC Voltage Applied to Outputs
in Tri-State............................................–0.5V to VDDQ + 0.5V
Electrical Characteristics Over the Operating Range[8, 9]
Parameter
VDD
Description
Power Supply Voltage
I/O Supply Voltage
Test Conditions
Min.
3.135
3.135
2.375
2.4
Max.
3.6
Unit
V
VDDQ
for 3.3V I/O
for 2.5V I/O
VDD
V
2.625
V
V
VOH
VOL
VIH
VIL
IX
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage[8]
Input LOW Voltage[8]
for 3.3V I/O, IOH = –4.0 mA
for 2.5V I/O, IOH = –1.0 mA
for 3.3V I/O, IOL = 8.0 mA
for 2.5V I/O, IOL = 1.0 mA
for 3.3V I/O
V
2.0
V
V
0.4
V
0.4
V
2.0
1.7
VDD + 0.3V
V
for 2.5V I/O
V
DD + 0.3V
V
for 3.3V I/O
–0.3
–0.3
–5
0.8
0.7
5
V
for 2.5V I/O
V
Input Leakage Current GND ≤ VI ≤ VDDQ
except ZZ and MODE
µA
Input Current of MODE Input = VSS
Input = VDD
–30
–5
µA
µA
5
Input Current of ZZ
Input = VSS
Input = VDD
µA
30
5
µA
IOZ
IDD
Output Leakage Current GND ≤ VI ≤ VDDQ, Output Disabled
VDD Operating Supply VDD = Max., IOUT = 0 mA, 6-ns cycle,166 MHz
–5
µA
240
225
100
90
mA
mA
mA
mA
Current
f = fMAX = 1/tCYC
7.5-ns cycle,133 MHz
6-ns cycle, 166 MHz
7.5-ns cycle,133 MHz
ISB1
ISB2
ISB3
Automatic CS
Power-down
Current—TTL Inputs
VDD = Max, Device
Deselected, VIN ≥ VIH or
VIN ≤ VIL, f = fMAX = 1/tCYC
Automatic CS
Power-down
Current—CMOS Inputs VIN > VDDQ – 0.3V, f = 0
VDD = Max, Device
Deselected,VIN ≤0.3Vor
All speeds
40
mA
Automatic CS
Power-down
Current—CMOS Inputs or VIN > VDDQ – 0.3V,
VDD = Max, Device
Deselected, or VIN ≤ 0.3V
6-ns cycle, 166 MHz
7.5-ns cycle,133MHz
85
75
mA
mA
f = fMAX = 1/tCYC
ISB4
Automatic CS
Power-down
Current—TTL Inputs
VDD = Max, Device
Deselected, VIN ≥ VIH or
VIN ≤ VIL, f = 0
All speeds
45
mA
Notes:
8. Overshoot: V (AC) < V +1.5V (Pulse width less than t
/2), undershoot: V (AC) > –2V (Pulse width less than t
/2).
IH
DD
CYC
IL
CYC
9. T
: Assumes a linear ramp from 0v to V (min.) within 200 ms. During this time V < V and V
< V
.
Power-up
DD
IH
DD
DDQ
DD
10. Tested initially and after any design or process change that may affect these parameters.
Document #: 38-05673 Rev. *B
Page 8 of 16
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CY7C1329H
Capacitance[10]
100 TQFP
Parameter
Description
Input Capacitance
Test Conditions
Max.
Unit
pF
CIN
TA = 25°C, f = 1 MHz,
5
5
5
VDD = 3.3V
CCLK
CI/O
Clock Input Capacitance
Input/Output Capacitance
pF
VDDQ = 2.5V
pF
Thermal Resistance[10]
100 TQFP
Package
Parameter
Description
Thermal Resistance
(Junction to Ambient)
Test Conditions
Unit
ΘJA
Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51
30.32
°C/W
ΘJC
Thermal Resistance
(Junction to Case)
6.85
°C/W
AC Test Loads and Waveforms
3.3V I/O Test Load
OUTPUT
R = 317Ω
3.3V
ALL INPUT PULSES
90%
VDDQ
OUTPUT
90%
10%
Z = 50Ω
0
R = 50Ω
10%
L
GND
5 pF
INCLUDING
R = 351Ω
≤ 1 ns
≤ 1 ns
V = 1.5V
T
(a)
JIG AND
SCOPE
(b)
(c)
2.5V I/O Test Load
R = 1667Ω
2.5V
OUTPUT
R = 50Ω
OUTPUT
ALL INPUT PULSES
90%
VDDQ
90%
10%
Z = 50Ω
0
10%
L
GND
5 pF
R =1538Ω
≤ 1 ns
≤ 1 ns
INCLUDING
V = 1.25V
T
JIG AND
SCOPE
(a)
(b)
(c)
Document #: 38-05673 Rev. *B
Page 9 of 16
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CY7C1329H
Switching Characteristics Over the Operating Range [11, 12]
166 MHz
133 MHz
Parameter
tPOWER
Clock
tCYC
Description
VDD(Typical) to the First Access[13]
Min.
Max
Min.
Max
Unit
1
1
ms
Clock Cycle Time
Clock HIGH
6.0
2.5
2.5
7.5
3.0
3.0
ns
ns
ns
tCH
tCL
Clock LOW
Output Times
tCO
Data Output Valid after CLK Rise
Data Output Hold after CLK Rise
Clock to Low-Z[14, 15, 16]
3.5
4.0
ns
ns
ns
ns
ns
ns
ns
tDOH
1.5
0
1.5
0
tCLZ
tCHZ
Clock to High-Z[[14, 15, 16]
3.5
3.5
4.0
4.5
tOEV
OE LOW to Output Valid
tOELZ
tOEHZ
Set-up Times
tAS
OE LOW to Output Low-Z[14, 15, 16]
OE HIGH to Output High-Z[14, 15, 16]
0
0
3.5
4.0
Address Set-up before CLK Rise
ADSC, ADSP Set-up before CLK Rise
ADV Set-up before CLK Rise
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
ns
ns
ns
ns
ns
ns
tADS
tADVS
tWES
GW, BWE, BW[A:D] Set-up before CLK Rise
Data Input Set-up before CLK Rise
Chip Enable Set-Up before CLK Rise
tDS
tCES
Hold Times
tAH
Address Hold after CLK Rise
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
ns
ns
ns
ns
ns
ns
tADH
ADSP, ADSC Hold after CLK Rise
ADV Hold after CLK Rise
tADVH
tWEH
GW, BWE, BW[A:D] Hold after CLK Rise
Data Input Hold after CLK Rise
Chip Enable Hold after CLK Rise
tDH
tCEH
Notes:
11. Timing reference level is 1.5V when V
= 3.3V and is 1.25V when V
= 2.5V.
DDQ
DDQ
12. Test conditions shown in (a) of AC Test Loads unless otherwise noted.
13. This part has a voltage regulator internally; t
is the time that the power needs to be supplied above V (minimum) initially before a Read or Write operation
POWER
DD
can be initiated.
14. t
, t
,t
, and t
are specified with AC test conditions shown in part (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.
CHZ CLZ OELZ
OEHZ
15. At any given voltage and temperature, t
is less than t
and t
is less than t
to eliminate bus contention between SRAMs when sharing the same
CLZ
OEHZ
OELZ
CHZ
data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed
to achieve High-Z prior to Low-Z under the same system conditions.
16. This parameter is sampled and not 100% tested.
Document #: 38-05673 Rev. *B
Page 10 of 16
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CY7C1329H
Switching Waveforms
Read Cycle Timing[17]
t
CYC
CLK
t
t
CL
CH
t
t
ADH
ADS
ADSP
ADSC
t
t
ADH
ADS
t
t
AH
AS
A1
A2
A3
ADDRESS
Burst continued with
new base address
t
t
WEH
WES
GW, BWE,
BW[A:D]
Deselect
cycle
t
t
CEH
CES
CE
t
t
ADVH
ADVS
ADV
OE
ADV
suspends
burst.
t
t
OEV
CO
t
t
OEHZ
t
OELZ
t
CHZ
DOH
t
CLZ
t
Q(A2)
Q(A2 + 1)
Q(A2 + 2)
Q(A2 + 3)
Q(A2)
Q(A2 + 1)
Q(A1)
Data Out (Q)
High-Z
CO
Burst wraps around
to its initial state
Single READ
BURST READ
DON’T CARE
UNDEFINED
Note:
17. On this diagram, when CE is LOW, CE is LOW, CE is HIGH and CE is LOW. When CE is HIGH, CE is HIGH or CE is LOW or CE is HIGH.
1
2
3
1
2
3
Document #: 38-05673 Rev. *B
Page 11 of 16
[+] Feedback
CY7C1329H
Switching Waveforms (continued)
Write Cycle Timing[17, 18]
t
CYC
CLK
t
t
CL
CH
t
t
ADH
ADS
ADSP
ADSC extends burst
t
t
ADH
ADS
t
t
ADH
ADS
ADSC
t
t
AH
AS
A1
A2
A3
ADDRESS
Byte write signals are
ignored for first cycle when
ADSP initiates burst
t
t
WEH
WES
BWE,
BW[A :D]
t
t
WEH
WES
GW
CE
t
t
CEH
CES
t
t
ADVH
ADVS
ADV
OE
ADV suspends burst
t
t
DH
DS
Data In (D)
D(A2)
D(A2 + 1)
D(A2 + 1)
D(A2 + 2)
D(A2 + 3)
D(A3)
D(A3 + 1)
D(A3 + 2)
D(A1)
High-Z
t
OEHZ
Data Out (Q)
BURST READ
Single WRITE
BURST WRITE
Extended BURST WRITE
DON’T CARE
UNDEFINED
Note:
18.
Full width Write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BW
LOW.
[A : D]
Document #: 38-05673 Rev. *B
Page 12 of 16
[+] Feedback
CY7C1329H
Switching Waveforms (continued)
Read/Write Cycle Timing[17, 19, 20]
t
CYC
CLK
t
t
CL
CH
t
t
ADH
ADS
ADSP
ADSC
t
t
AH
AS
A1
A2
A3
A4
A5
A6
ADDRESS
t
t
WEH
WES
BWE,
BW[A:D]
t
t
CEH
CES
CE
ADV
OE
t
t
DH
t
CO
DS
t
OELZ
Data In (D)
High-Z
High-Z
D(A3)
D(A5)
D(A6)
t
t
OEHZ
CLZ
Data Out (Q)
Q(A1)
Q(A2)
Q(A4)
Q(A4+1)
Q(A4+2)
Q(A4+3)
Back-to-Back READs
Single WRITE
BURST READ
Back-to-Back
WRITEs
DON’T CARE
UNDEFINED
Notes:
19. The data bus (Q) remains in High-Z following a Write cycle unless an ADSP, ADSC, or ADV cycle is performed.
20. GW is HIGH.
Document #: 38-05673 Rev. *B
Page 13 of 16
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CY7C1329H
Switching Waveforms (continued)
ZZ Mode Timing[21, 22]
CLK
t
t
ZZ
ZZREC
ZZ
t
ZZI
I
SUPPLY
I
DDZZ
t
RZZI
ALL INPUTS
(except ZZ)
DESELECT or READ Only
Outputs (Q)
High-Z
DON’T CARE
Notes:
21. Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device.
22. DQs are in High-Z when exiting ZZ sleep mode.
Document #: 38-05673 Rev. *B
Page 14 of 16
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CY7C1329H
Ordering Information
“Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit www.cypress.com for actual products offered”.
Speed
(MHz)
Package
Diagram
Operating
Range
Ordering Code
CY7C1329H-166AXC
CY7C1329H-166AXI
CY7C1329H-133AXC
CY7C1329H-133AXI
Package Type
166
51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free
100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free
100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free
100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free
Commercial
Industrial
133
Commercial
Industrial
Package Diagram
100-pin TQFP (14 x 20 x 1.4 mm) (51-85050)
16.00 0.20
1.40 0.05
14.00 0.10
100
81
80
1
0.30 0.08
0.65
TYP.
12° 1°
(8X)
SEE DETAIL
A
30
51
31
50
0.20 MAX.
1.60 MAX.
R 0.08 MIN.
0.20 MAX.
0° MIN.
SEATING PLANE
STAND-OFF
0.05 MIN.
0.15 MAX.
NOTE:
1. JEDEC STD REF MS-026
0.25
GAUGE PLANE
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE
BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH
R 0.08 MIN.
0.20 MAX.
0°-7°
3. DIMENSIONS IN MILLIMETERS
0.60 0.15
0.20 MIN.
51-85050-*B
1.00 REF.
DETAIL
A
i486 is a trademark, and Intel and Pentium are registered trademarks, of Intel Corporation. PowerPC is a registered trademark
of IBM Corporation. All product and company names mentioned in this document may be trademarks of their respective holders.
Document #: 38-05673 Rev. *B
Page 15 of 16
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY7C1329H
Document History Page
Document Title: CY7C1329H 2-Mbit (64K x 32) Pipelined Sync SRAM
Document Number: 38-05673
Orig. of
REV.
**
ECN NO. Issue Date Change
Description of Change
347357
424820
See ECN
See ECN
PCI
New Data Sheet
Converted from Preliminary to Final.
*A
RXU
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Changed Three-State to Tri-State.
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the
Electrical Characteristics Table.
Modified test condition from VIH < VDD to VIH < VDD
Replaced Package Name column with Package Diagram in the Ordering
Information table.
Updated the Ordering Information Table.
Replaced Package Diagram of 51-85050 from *A to *B
*B
433014
See ECN
NXR
Included 3.3V I/O option
Updated the Ordering Information table.
Document #: 38-05673 Rev. *B
Page 16 of 16
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