CY2309CZXI-1T [CYPRESS]

3.3V Zero Delay Clock Buffer; 3.3V零延迟时钟缓冲器
CY2309CZXI-1T
型号: CY2309CZXI-1T
厂家: CYPRESS    CYPRESS
描述:

3.3V Zero Delay Clock Buffer
3.3V零延迟时钟缓冲器

时钟驱动器 逻辑集成电路 光电二极管
文件: 总14页 (文件大小:309K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CY2305C  
CY2309C  
PRELIMINARY  
3.3V Zero Delay Clock Buffer  
CY2309C. It accepts one reference input and drives out five low  
skew clocks. The -1H versions of each device operate up to  
100-133 MHz frequencies and have higher drive than the -1  
devices. All parts have on-chip PLLs which lock to an input clock  
on the REF pin. The PLL feedback is on-chip and is obtained  
from the CLKOUT pad.  
Features  
10 MHz to 100-133 MHz operating range, compatiblewith CPU  
and PCI bus frequencies  
Zero input and output propagation delay  
Multiple low skew outputs  
The CY2309C has two banks of four outputs each that are  
controlled by the select inputs as shown in the “Select Input  
Decoding for CY2309C” on page 3. If all output clocks are not  
required, BankB is three-stated. The input clock is directly  
applied to the outputs by the select inputs for chip and system  
testing purposes.  
One input drives five outputs (CY2305C)  
One input drives nine outputs, grouped as 4 + 4 + 1 (CY2309C)  
50 ps typical cycle-cycle jitter (15 pF, 66 MHz)  
Test Mode to bypass phase locked loop (PLL) (CY2309C) only,  
see “Select Input Decoding for CY2309C” on page 3  
The CY2305C and CY2309C PLLs enter a power down mode  
when there are no rising edges on the REF input. In this state,  
the outputs are three-stated and the PLL is turned off. This  
results in less than 12.0 μA of current draw for commercial  
temperature devices and 25.0 μA for industrial temperature  
parts. The CY2309C PLL shuts down in one additional case as  
shown in the “Select Input Decoding for CY2309C” on page 3.  
Available in space saving 16-pin 150 Mil SOIC or 4.4 mm  
TSSOP packages (CY2309C), and 8-pin, 150 Mil SOIC  
package (CY2305C)  
3.3V operation  
In the special case when S2:S1 is 1:0, the PLL is bypassed and  
REF is output from DC to the maximum allowable frequency. The  
part behaves like a non-zero delay buffer in this mode and the  
outputs are not three-stated.  
Industrial temperature available  
Functional Description  
The CY2305C and CY2309C are die replacement parts for  
CY2305 and CY2309.  
The CY2305C or CY2309C is available in two or three different  
configurations as shown in the “Ordering Information” on  
page 11. The CY2305C-1 or CY2309C-1 is the base part. The  
CY2305-1H or CY2309-1H is the high drive version of the -1. Its  
rise and fall times are much faster than the -1s.  
The CY2309C is a low cost 3.3V zero delay buffer designed to  
distribute high speed clocks and is available in a 16-pin SOIC or  
TSSOP package. The CY2305C is an 8-pin version of the  
Logic Block Diagram for CY2309C  
CLKOUT  
MUX  
PLL  
REF  
CLKA1  
CLKA2  
CLKA3  
CLKA4  
CLKB1  
CLKB2  
CLKB3  
CLKB4  
S2  
Select Input  
Decoding  
S1  
Cypress Semiconductor Corporation  
Document Number: 38-07672 Rev. *F  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised July 5, 2007  
[+] Feedback  
CY2305C  
CY2309C  
PRELIMINARY  
Logic Block Diagram for CY2305C  
PLL  
CLKOUT  
CLK1  
REF  
CLK2  
CLK3  
CLK4  
Document Number: 38-07672 Rev. *F  
Page 2 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Pinouts  
CY2309C  
Figure 1. Pin Diagram - 16 Pin SOIC/TSSOP  
SOIC/TSSOP  
Top View  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
REF  
CLKOUT  
CLKA1  
CLKA4  
CLKA3  
VDD  
CY2309C  
CLKA2  
VDD  
GND  
GND  
CLKB4  
CLKB3  
S1  
CLKB1  
CLKB2  
S2  
Table 1. Pin Definition - 16 Pin SOIC/TSSOP  
Pin  
Signal  
Description  
1
REF[1]  
CLKA1[2]  
CLKA2[2]  
VDD  
Input reference frequency  
Buffered clock output, Bank A  
Buffered clock output, Bank A  
3.3V supply  
2
3
4
5
GND  
Ground  
6
CLKB1[2]  
CLKB2[2]  
S2[3]  
Buffered clock output, Bank B  
Buffered clock output, Bank B  
Select input, bit 2  
7
8
9
S1[3]  
Select input, bit 1  
10  
11  
12  
13  
14  
15  
16  
CLKB3[2]  
CLKB4[2]  
GND  
Buffered clock output, Bank B  
Buffered clock output, Bank B  
Ground  
VDD  
CLKA3[2]  
CLKA4[2]  
CLKOUT[2]  
3.3V supply  
Buffered clock output, Bank A  
Buffered clock output, Bank A  
Buffered output, internal feedback on this pin  
Table 2. Select Input Decoding for CY2309C  
S2  
0
S1  
0
CLOCK A1–A4  
Three state  
Driven  
CLOCK B1–B4  
Three state  
Three state  
Driven  
CLKOUT[4]  
Driven  
Output Source  
PLL  
PLL Shutdown  
N
N
Y
N
0
1
Driven  
PLL  
1
0
Driven  
Driven  
Reference  
PLL  
1
1
Driven  
Driven  
Driven  
Notes  
1. Weak pull down.  
2. Weak pull down on all outputs.  
3. Weak pull ups on these inputs.  
4. This output is driven and has an internal feedback for the PLL. The load on this output is adjusted to change the skew between the reference and output.  
Document Number: 38-07672 Rev. *F  
Page 3 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
CY2305C  
Figure 2. Pin Diagram - 8 Pin SOIC  
SOIC  
Top View  
1
8
CLKOUT  
CLK4  
V
DD  
REF  
CLK2  
CLK1  
GND  
CY2305C  
2
3
4
7
6
5
CLK3  
Table 3. Pin Description - 8 Pin SOIC  
Pin  
1
Signal  
Description  
REF[1]  
CLK2[2]  
CLK1[2]  
GND  
Input reference frequency  
Buffered clock output  
Buffered clock output  
Ground  
2
3
4
5
CLK3[2]  
Buffered clock output  
3.3V supply  
6
VDD  
7
CLK4[2]  
Buffered clock output  
8
CLKOUT[2]  
Buffered clock output, internal feedback on this pin  
Zero Delay and Skew Control  
All outputs should be uniformly loaded to achieve Zero Delay between the input and output. Since the CLKOUT pin is the internal  
feedback to the PLL, its relative loading can adjust the input or output delay.  
For applications requiring zero input or output delay, all outputs including CLKOUT are equally loaded. Even if CLKOUT is not used,  
it must have a capacitive load equal to that on other outputs for obtaining zero input or output delay.  
For zero output or output skew, all outputs are loaded equally. For further information refer to the application note entitled “CY2305  
and CY2309 as PCI and SDRAM Buffers”.  
Document Number: 38-07672 Rev. *F  
Page 4 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Absolute Maximum Conditions  
Supply Voltage to Ground Potential................–0.5V to +4.6V  
DC Input Voltage (Except REF) ............0.5V to VDD + 0.5V  
DC Input Voltage REF ...........................0.5V to VDD + 0.5V  
Storage Temperature ................................. –65°C to +150°C  
Junction Temperature................................................. 150°C  
Static Discharge Voltage  
(per MIL-STD-883, Method 3015) ...........................> 2,000V  
Operating Conditions for CY2305CSXC-XX and CY2309CSXC-XX  
Operating Conditions table for CY2305CSXC-XX and CY2309CSXC-XX Commercial Temperature Devices.  
Parameter  
VDD  
Description  
Min  
3.0  
0
Max  
3.6  
70  
30  
10  
7
Unit  
V
Supply Voltage  
TA  
Operating Temperature (Ambient Temperature)  
Load Capacitance, below 100 MHz  
Load Capacitance, from 100 MHz to 133 MHz  
Input Capacitance  
°C  
pF  
pF  
pF  
ms  
CL  
CL  
CIN  
tPU  
Power up time for all VDDs to reach minimum specified voltage  
(power ramps are monotonic)  
0.05  
50  
Electrical Characteristics for CY2305CSXC-XX and CY2309CSXC-XX  
Electrical Characteristics table for CY2305CSXC-XX and CY2309CSXC-XX Commercial Temperature Devices.  
Parameter  
Description  
Input LOW Voltage[5]  
Input HIGH Voltage[5]  
Input LOW Current  
Input HIGH Current  
Output LOW Voltage[6]  
Test Conditions  
Min  
–0.3  
2.0  
Max  
0.8  
Unit  
V
VIL  
VIH  
IIL  
VDD + 0.3  
50  
V
VIN = 0V  
μA  
μA  
V
IIH  
VIN = VDD  
100  
VOL  
IOL = 8 mA (–1)  
0.4  
I
OH = 12 mA (–1H)  
VOH  
Output HIGH Voltage[6]  
IOH = –8 mA (–1)  
IOL = –12 mA (–1H)  
2.4  
V
I
DD (PD mode)  
Power Down Supply Current REF = 0 MHz  
Supply Current Unloaded outputs at 66.67 MHz,  
SEL inputs at VDD  
12.0  
32  
μA  
IDD  
mA  
Notes  
5. .REF input has a threshold voltage of V /2.  
DD  
6. Parameter is guaranteed by design and characterization. Not 100% tested in production.  
Document Number: 38-07672 Rev. *F  
Page 5 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Switching Characteristics for CY2305CSXC-XX and CY2309CSXC-XX  
Switching characteristics table for CY2305CSXC-1 and CY2309CSXC-1 Commercial Temperature Devices. All parameters are  
specified with loaded outputs.  
Parameter  
Name  
Test Conditions  
Min  
Typ  
Max  
Unit  
t1  
Output Frequency  
30 pF load  
10 pF load  
10  
10  
100  
133.33  
MHz  
MHz  
Duty Cycle[6] = t2 ÷ t1  
Rise Time[6]  
Fall Time[6]  
Measured at 1.4V, Fout = 66.67 MHz  
Measured between 0.8V and 2.0V  
Measured between 0.8V and 2.0V  
All outputs equally loaded  
40.0  
50.0  
60.0  
2.25  
2.25  
200  
%
ns  
ns  
ps  
ps  
t3  
0
t4  
t5  
Output to Output Skew[6]  
t6A  
Delay, REF Rising Edge to Measured at VDD/2  
CLKOUT Rising Edge[6]  
±350  
t6B  
t7  
Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL  
1
5
0
8.7  
ns  
ps  
CLKOUT Rising Edge[6]  
Bypass Mode, CY2309C device only.  
Device to Device Skew[6] Measured at VDD/2 on the CLKOUT pins  
of devices  
700  
tJ  
Cycle to Cycle Jitter, peak[6] Measured at 66.67 MHz, loaded outputs  
50  
175  
1.0  
ps  
tLOCK  
PLL Lock Time[6]  
Stable power supply, valid clock  
presented on REF pin  
ms  
Switching characteristics table for CY2305CSXC-1H and CY2309CSXC-1H Commercial Temperature Devices. All parameters are  
specified with loaded outputs.  
Parameter  
t1  
Name  
Description  
Min  
Typ  
Max  
Unit  
Output Frequency  
30-pF load  
10-pF load  
10  
10  
100  
133.33  
MHz  
MHz  
Duty Cycle[6] = t2 ÷ t1  
Duty Cycle[6] = t2 ÷ t1  
Rise Time[6]  
Fall Time[6]  
Output to Output Skew[6]  
Measured at 1.4V, Fout = 66.67 MHz  
Measured at 1.4V, Fout < 50.0 MHz  
Measured between 0.8V and 2.0V  
Measured between 0.8V and 2.0V  
All outputs equally loaded  
40.0  
45.0  
50.0  
50.0  
60.0  
55.0  
1.5  
%
%
t3  
ns  
ns  
ps  
ps  
t4  
1.5  
t5  
200  
±350  
t6A  
Delay, REF Rising Edge to Measured at VDD/2  
CLKOUT Rising Edge[6]  
0
t6B  
t7  
Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL  
1
1
5
0
8.7  
700  
ns  
ps  
CLKOUT Rising Edge[6]  
Bypass Mode, CY2309C device only.  
Device to Device Skew[6] Measured at VDD/2 on the CLKOUT pins  
of devices  
t8  
Output Slew Rate[6]  
Measured between 0.8V and 2.0V using  
Test Circuit #2  
V/ns  
tJ  
Cycle to Cycle Jitter, peak[6] Measured at 66.67 MHz, loaded outputs  
175  
1.0  
ps  
tLOCK  
PLL Lock Time[6]  
Stable power supply, valid clock  
presented on REF pin  
ms  
Document Number: 38-07672 Rev. *F  
Page 6 of 14  
[+] Feedback  
CY2305C  
CY2309C  
PRELIMINARY  
Operating Conditions for CY2305CSXI-XX and CY2309CSXI-XX  
Operating conditions table for CY2305CSXI-XX and CY2309CSXI-XX Industrial Temperature Devices.  
Parameter  
Description  
Min  
3.0  
–40  
Max  
3.6  
85  
30  
10  
7
Unit  
V
VDD  
TA  
Supply Voltage  
Operating Temperature (Ambient Temperature)  
Load Capacitance, below 100 MHz  
Load Capacitance, from 100 MHz to 133 MHz  
Input Capacitance  
°C  
pF  
pF  
pF  
CL  
CL  
CIN  
Electrical Characteristics for CY2305CSXI-XX and CY2309CSXI-XX  
Electrical characteristics table for CY2305CSXI-XX and CY2309CSXI-XX Industrial Temperature Devices.  
Parameter  
VIL  
Description  
Input LOW Voltage[5]  
Input HIGH Voltage[5]  
Input LOW Current  
Test Conditions  
Min  
–0.3  
2.0  
Max  
0.8  
Unit  
V
VIH  
IIL  
VDD + 0.3  
50.0  
V
VIN = 0V  
μA  
μA  
V
IIH  
Input HIGH Current  
Output LOW Voltage[6]  
VIN = VDD  
100.0  
0.4  
VOL  
IOL = 8 mA (–1)  
I
OH =12 mA (–1H)  
IOH = –8 mA (–1)  
OL = –12 mA (–1H)  
VOH  
Output HIGH Voltage[6]  
2.4  
V
I
IDD (PD mode) Power down Supply Current  
IDD Supply Current  
REF = 0 MHz  
25.0  
35  
μA  
Unloaded outputs at 66.67 MHz,  
SEL inputs at VDD  
mA  
Document Number: 38-07672 Rev. *F  
Page 7 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Switching Characteristics for CY2305CSXI-XX and CY2309CSXI-XX  
Switching characteristics table for CY2305CSXI-1and CY2309CSXI-1 Industrial Temperature Devices. All parameters are specified  
with loaded outputs.  
Parameter  
t1  
Name  
Test Conditions  
30 pF load  
10 pF load  
Min  
Typ  
Max  
Unit  
Output Frequency  
10  
10  
100  
133.33  
MHz  
MHz  
Duty Cycle[6] = t2 ÷ t1  
Rise Time[6]  
Fall Time[6]  
Measured at 1.4V, Fout = 66.67 MHz  
Measured between 0.8V and 2.0V  
Measured between 0.8V and 2.0V  
All outputs equally loaded  
40.0  
50.0  
60.0  
2.25  
2.25  
200  
%
ns  
ns  
ps  
ps  
t3  
0
t4  
t5  
Output to Output Skew[6]  
t6A  
Delay, REF Rising Edge to Measured at VDD/2  
CLKOUT Rising Edge[6]  
±350  
t6B  
Delay, REF Rising Edge to Measured at VDD/2. Measured in  
1
5
8.7  
ns  
CLKOUT Rising Edge[6]  
Device to Device Skew[6]  
PLL Bypass Mode, CY2309C device  
only.  
t7  
Measured at VDD/2 on the CLKOUT  
pins of devices  
Cycle to Cycle Jitter, peak[6] Measured at 66.67 MHz, loaded  
outputs  
0
50  
700  
175  
1.0  
ps  
ps  
tJ  
tLOCK  
PLL Lock Time[6]  
Stable power supply, valid clock  
presented on REF pin  
ms  
Switching characteristics table for CY2305CSXI-1H and CY2309CSXI-1H Industrial Temperature Device. All parameters are specified  
with loaded outputs.  
Parameter  
t1  
Name  
Description  
Min  
Typ  
Max  
Unit  
Output Frequency  
30 pF load  
10 pF load  
10  
10  
100  
133.33  
MHz  
MHz  
Duty Cycle[6] = t2 ÷ t1  
Duty Cycle[6] = t2 ÷ t1  
Rise Time[6]  
Fall Time[6]  
Output to Output Skew[6]  
Measured at 1.4V, Fout = 66.67 MHz  
Measured at 1.4V, Fout < 50.0 MHz  
Measured between 0.8V and 2.0V  
Measured between 0.8V and 2.0V  
All outputs equally loaded  
40.0  
45.0  
50.0  
50.0  
60.0  
55.0  
1.5  
%
%
t3  
ns  
ns  
ps  
ps  
t4  
1.5  
t5  
200  
±350  
t6A  
Delay, REF Rising Edge to Measured at VDD/2  
CLKOUT Rising Edge[6]  
0
t6B  
Delay, REF Rising Edge to Measured at VDD/2. Measured in  
1
5
8.7  
ns  
CLKOUT Rising Edge[6]  
Device to Device Skew[6]  
Output Slew Rate[6]  
PLL Bypass Mode, CY2309C device  
only.  
t7  
Measured at VDD/2 on the CLKOUT  
pins of devices  
1
0
700  
ps  
V/ns  
ps  
t8  
Measured between 0.8V and 2.0V  
using Test Circuit #2  
Cycle to Cycle Jitter, peak[6] Measured at 66.67 MHz, loaded  
outputs  
tJ  
175  
1.0  
tLOCK  
PLL Lock Time[6]  
Stable power supply, valid clock  
presented on REF pin  
ms  
Document Number: 38-07672 Rev. *F  
Page 8 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Switching Waveforms  
Figure 3. Duty Cycle Timing  
t
1
t
2
1.4V  
1.4V  
1.4V  
Figure 4. All Outputs Rise/Fall Time  
3.3V  
0V  
2.0V  
0.8V  
2.0V  
0.8V  
OUTPUT  
t
3
t
4
Figure 5. Output-Output Skew  
1.4V  
OUTPUT  
1.4V  
OUTPUT  
t
5
Figure 6. Input-Output Propagation Delay  
V
DD/2  
INPUT  
VDD/2  
OUTPUT  
t
6
Figure 7. Device-Device Skew  
VDD/2  
CLKOUT, Device 1  
CLKOUT, Device 2  
VDD/2  
t7  
Document Number: 38-07672 Rev. *F  
Page 9 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Test Circuits  
Test Circuit # 2  
Test Circuit # 1  
V
DD  
V
1 kΩ  
1 kΩ  
DD  
0.1 μ F  
CLK out  
0.1 μ F  
OUTPUTS  
GND  
OUTPUTS  
10 pF  
C
LOAD  
V
DD  
V
DD  
0.1 μ F  
GND  
0.1 μ F  
GND  
GND  
For parameter t8 (output slew rate) on -1H devices  
Document Number: 38-07672 Rev. *F  
Page 10 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Ordering Information  
Ordering Code  
Pb-Free - CY2305C  
CY2305CSXC-1  
CY2305CSXC-1T  
CY2305CSXC-1H  
CY2305CSXC-1HT  
CY2305CSXI-1  
Package Type  
Operating Range  
Commercial  
8-pin 150 Mil SOIC  
8-pin 150 Mil SOIC – Tape and Reel  
8-pin 150 Mil SOIC  
Commercial  
Commercial  
Commercial  
Industrial  
8-pin 150 Mil SOIC – Tape and Reel  
8-pin 150 Mil SOIC  
CY2305CSXI-1T  
CY2305CSXI-1H  
CY2305CSXI-1HT  
Pb-Free- CY2309C  
CY2309CSXC-1  
CY2309CSXC-1T  
CY2309CSXC-1H  
CY2309CSXC-1HT  
CY2309CSXI-1  
8-pin 150 Mil SOIC – Tape and Reel  
8-pin 150 Mil SOIC  
Industrial  
Industrial  
8-pin 150 Mil SOIC – Tape and Reel  
Industrial  
16-pin 150 Mil SOIC  
Commercial  
Commercial  
Commercial  
Commercial  
Industrial  
16-pin 150 Mil SOIC – Tape and Reel  
16-pin 150 Mil SOIC  
16-pin 150 Mil SOIC – Tape and Reel  
16-pin 150 Mil SOIC  
CY2309CSXI-1T  
CY2309CSXI-1H  
CY2309CSXI-1HT  
CY2309CZXC-1  
CY2309CZXC-1T  
CY2309CZXC-1H  
CY2309CZXC-1HT  
CY2309CZXI-1  
16-pin 150 Mil SOIC – Tape and Reel  
16-pin 150 Mil SOIC  
Industrial  
Industrial  
16-pin 150 Mil SOIC – Tape and Reel  
16-pin 4.4 mm TSSOP  
Industrial  
Commercial  
Commercial  
Commercial  
Commercial  
Industrial  
16-pin 4.4 mm TSSOP – Tape and Reel  
16-pin 4.4 mm TSSOP  
16-pin 4.4 mm TSSOP – Tape and Reel  
16-pin 4.4 mm TSSOP  
CY2309CZXI-1T  
CY2309CZXI-1H  
CY2309CZXI-1HT  
16-pin 4.4 mm TSSOP – Tape and Reel  
16-pin 4.4 mm TSSOP  
Industrial  
Industrial  
16-pin 4.4 mm TSSOP – Tape and Reel  
Industrial  
Document Number: 38-07672 Rev. *F  
Page 11 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Package Drawing and Dimensions  
Figure 8. 8-Pin (150 Mil) SOIC S8  
PIN 1 ID  
4
1
1. DIMENSIONS IN INCHES[MM] MIN.  
MAX.  
2. PIN 1 ID IS OPTIONAL,  
ROUND ON SINGLE LEADFRAME  
RECTANGULAR ON MATRIX LEADFRAME  
0.150[3.810]  
0.157[3.987]  
3. REFERENCE JEDEC MS-012  
4. PACKAGE WEIGHT 0.07gms  
0.230[5.842]  
0.244[6.197]  
PART #  
S08.15 STANDARD PKG.  
SZ08.15 LEAD FREE PKG.  
5
8
0.189[4.800]  
0.196[4.978]  
0.010[0.254]  
0.016[0.406]  
X 45°  
SEATING PLANE  
0.061[1.549]  
0.068[1.727]  
0.004[0.102]  
0.050[1.270]  
BSC  
0.0075[0.190]  
0.0098[0.249]  
0.004[0.102]  
0.0098[0.249]  
0°~8°  
0.016[0.406]  
0.035[0.889]  
0.0138[0.350]  
0.0192[0.487]  
Figure 9. 16-Pin (150 Mil) SOIC S16  
PIN 1 ID  
8
1
DIMENSIONS IN INCHES[MM] MIN.  
MAX.  
REFERENCE JEDEC MS-012  
PACKAGE WEIGHT 0.15gms  
0.150[3.810]  
0.157[3.987]  
0.230[5.842]  
0.244[6.197]  
PART #  
S16.15 STANDARD PKG.  
SZ16.15 LEAD FREE PKG.  
9
16  
0.010[0.254]  
0.016[0.406]  
X 45°  
0.386[9.804]  
0.393[9.982]  
SEATING PLANE  
0.061[1.549]  
0.068[1.727]  
0.004[0.102]  
0.050[1.270]  
BSC  
0.0075[0.190]  
0.0098[0.249]  
0.016[0.406]  
0.035[0.889]  
0°~8°  
0.0138[0.350]  
0.0192[0.487]  
0.004[0.102]  
0.0098[0.249]  
Document Number: 38-07672 Rev. *F  
Page 12 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Figure 10. 16-Pin TSSOP 4.40 MM Body Z16.173  
PIN 1 ID  
DIMENSIONS IN MM[INCHES] MIN.  
1
MAX.  
REFERENCE JEDEC MO-153  
PACKAGE WEIGHT 0.05gms  
6.25[0.246]  
6.50[0.256]  
4.30[0.169]  
4.50[0.177]  
16  
0.65[0.025]  
BSC.  
0.25[0.010]  
BSC  
0.19[0.007]  
0.30[0.012]  
1.10[0.043] MAX.  
GAUGE  
PLANE  
0°-8°  
0.076[0.003]  
0.50[0.020]  
0.70[0.027]  
0.05[0.002]  
0.15[0.006]  
0.85[0.033]  
0.95[0.037]  
0.09[[0.003]  
0.20[0.008]  
SEATING  
PLANE  
4.90[0.193]  
5.10[0.200]  
Document Number: 38-07672 Rev. *F  
Page 13 of 14  
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CY2305C  
CY2309C  
PRELIMINARY  
Document History Page  
Document Title: CY2305C CY2309C 3.3V Zero Delay Clock Buffer  
Document Number: 38-07672  
Orig. of  
Change  
REV.  
ECN NO. Issue Date  
Description of Change  
**  
224421  
268571  
276453  
See ECN  
See ECN  
See ECN  
RGL  
New datasheet  
Added bullet for 5V tolerant inputs in the features  
*A  
*B  
RGL  
RGL  
Minor Change: Moved one sentence from the features to the Functional  
Description  
*C  
*D  
*E  
303063  
318315  
344815  
See ECN  
See ECN  
See ECN  
RGL  
RGL  
RGL  
Updated datasheet as per characterization data  
Datasheet rewrite  
Minor Error: Corrected the header of all the AC/DC tables with the right part  
numbers.  
*F  
1279889  
See ECN  
KVM  
Changed title from “Low Cost 3.3V Zero Delay Buffer” to “3.3V Zero Delay  
Clock Buffer”  
Specified the VIL minimum value to -0.3V  
Specified the VIH maximum value to VDD + 0.3V  
Changed DC Input Voltage (REF) maximum value in Absolute Maximum  
section  
Removed references to 5V tolerant inputs (pages 1 and 2)  
Removed Pentium compatibility reference  
Added CY2305C block diagram  
Added “peak” to the jitter specifications  
Changed typical jitter from 75 ps to 50 ps for standard drive devices  
For standard drive devices, tightened rise/fall times from 2.5 ns to 2.25 ns  
Tightened cycle-to-cycle jitter from 200 ps to 175 ps  
Tightened output-to-output skew from 250 ps to 200 ps  
© Cypress Semiconductor Corporation, 2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any  
circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical,  
life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical  
components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems  
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),  
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,  
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress  
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without  
the express written permission of Cypress.  
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES  
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document Number: 38-07672 Rev. *F  
Revised July 5, 2007  
Page 14 of 14  
PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered  
2
trademarks referenced herein are property of the respective corporations. Purchase of I C components from Cypress or one of its sublicensed Associated Companies conveys a license under the  
2
2
2
Philips I C Patent Rights to use these components in an I C system, provided that the system conforms to the I C Standard Specification as defined by Philips. All products and company names  
mentioned in this document may be the trademarks of their respective holders.  
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