CY2037B-11WAF-IL [CYPRESS]

High-Accuracy EPROM Programmable PLL Die for Crystal Oscillators; 高精度EPROM可编程PLL模晶体振荡器
CY2037B-11WAF-IL
型号: CY2037B-11WAF-IL
厂家: CYPRESS    CYPRESS
描述:

High-Accuracy EPROM Programmable PLL Die for Crystal Oscillators
高精度EPROM可编程PLL模晶体振荡器

振荡器 晶体振荡器 时钟发生器 微控制器和处理器 外围集成电路 可编程只读存储器 电动程控只读存储器
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CY2037  
High-Accuracy EPROM Programmable  
PLL Die for Crystal Oscillators  
Features  
Benefits  
EPROM-programmable die for in-package programming of  
Enables quick turnaround of custom oscillators  
crystal oscillators  
Lowers inventory costs through stocking of blank parts  
High resolution PLL with 12-bit multiplier and 10-bit divider  
Enables synthesis of highly accurate and stable output clock  
EPROM-programmable capacitor tuning array with shadow  
frequencies with zero or low PPM  
register  
Enables fine-tuning of output clock frequency by adjusting  
CLoad of the crystal  
Twice programmable die (CY2037A, CY2037B[1], and  
CY2037-2)  
Enables reprogramming of programmed part to correct errors,  
Simple 2-wire programming interface  
and control excess inventory  
On-chip oscillator runs from 10 - 30 MHz fundamental tuned  
Enables programming of output frequency after packaging  
crystal  
Lowers cost of oscillator because PLL may be programmed to  
EPROM-selectable TTL or CMOS duty cycle levels  
a high frequency using a low frequency, low cost crystal  
Operating frequency:  
1 - 133 MHz at 5V  
1 - 100 MHz at 3.3V  
1 - 66.6 MHz at 2.7V  
Duty cycle centered at 1.4V or VDD/2  
Provides flexibility to service most TTL or CMOS applications  
Provides flexibility in output configurations and testing  
Enables low power operations or output enable functions  
Sixteen selectable post divide options, using PLL or reference  
oscillator output  
Enables two frequency options for meeting different industry  
standards, that is, PAL/NTSC  
Programmable power down (PD#) or OE pin (CY2037A,  
CY2037B, and CY2037-2)  
Provides flexibility for system applications through selectable  
instantaneous or synchronous change in outputs  
Frequency select (CY2037-3)  
Suitable for most PC, consumer, and networking applications  
Programmable asynchronous or synchronous OE and power  
down (PD#) modes (CY2037A, CY2037B, and CY2037-2)  
Lowers inventory costs because the same die services both  
applications  
Low jitter outputs typically:  
< ± 100 ps (pk-pk) at 5V and f>33 MHz  
< ± 125 ps (pk-pk) at 3.3V and f>33 MHz  
Enables encapsulation in small size, surface mount packages  
Has lower EMI than oscillators  
3.3V or 5V operation  
Small die  
Controlled rise and fall times and output slew rate  
Table 1. Device Functionality: Output Frequencies  
Parameter  
Fo  
Description  
Output frequency  
Condition  
Min  
1
Max  
133  
100  
66  
Unit  
MHz  
MHz  
MHz  
VDD = 4.5V–5.5V  
V
DD = 3.0V–3.6V  
DD = 2.7V–3.0V  
1
V
1
Note  
1. CY2037A and CY2037B are identical. However, CY2037B is recommended for all new designs.  
Cypress Semiconductor Corporation  
Document Number: 38-07354 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised March 06, 2008  
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CY2037  
Logic Block Diagram  
PD#/OE  
or FS  
CONFIGURATION  
EPROM  
HIGH  
ACCURACY  
PLL  
X
G
CRYSTAL  
X
D
OSCILLATOR  
MUX  
CLKOUT  
/ 1, 2, 4, 8, 16, 32, 64, 128  
Document Number: 38-07354 Rev. *E  
Page 2 of 11  
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CY2037  
Die Pad Description  
Horizontal scribe  
VDD  
VDD  
XX  
CLKOUT  
N/C  
Note  
Active die size: X = 55.9 mils / 1420.1 μm  
Scribe: X (horizontal) = 2.6 mils / 65.6 μm  
Vertical scribe  
Device Name  
Y (vertical) = 3.0 mils / 76.9  
Bond pad opening: 85 m x 85  
Pad pitch: 125 m x 125  
(pad center to pad center)  
μm  
XD  
Y
μ
μm  
μ
μm  
N/C  
XG  
VSS  
VSS  
PD#/OE or FS  
X
Die Pad Summary  
Die  
X Coordinate Y Coordinate  
Name  
VDD  
Description  
Pad  
(μm)  
124.7  
1291.35  
124.7  
124.7  
124.7  
124.7  
(μm)  
855.6, 731  
99.6, 225.2  
481.8  
1, 2  
Voltage supply  
VSS  
XD  
XX  
8, 9  
4
Ground  
Crystal connection  
No connect [2]  
Crystal connection  
3
606.4  
XG  
6
232.6  
PD#/OE  
or FS  
7
108  
CY2037A, CY2037B, and CY2037-2: EPROM-programmable power down  
or output enable pad  
CY2037-3: Frequency select. Serves as VPP in programming mode for all  
devices  
CLKOUT 11  
1282.45  
901.8  
Clock output. Also serves as three-state input during programming.  
N/C  
5, 10  
124.7,1282.45  
357.2, 769.4 No connect (so do not bond to these pads)  
Note  
2. For customers not bonding the X or X pad to external pins, an alternative bonding option would be shorting the Xx pad to the X pad.  
D
G
D
Document Number: 38-07354 Rev. *E  
Page 3 of 11  
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CY2037  
Functional Description  
EPROM Configuration Block  
CY2037 is an EPROM-programmable, high accuracy,  
PLL-based die designed for the crystal oscillator market. The die  
attaches directly to a low cost 10 - 30 MHz crystal and can be  
packaged into a 4-pin through-hole or surface mount packages.  
The oscillator devices may be stocked as blank parts and custom  
frequencies programmed in-package at the last stage before  
shipping. This enables fast-turn manufacture of custom and  
standard crystal oscillators without the need for dedicated,  
expensive crystals.  
Table 2 summarizes the features that are configurable by  
EPROM. Refer “7C8038x/7C8034X Programming Specification”  
for further details. This specification can be obtained from your  
Cypress factory representative.  
.
Table 2. EPROM Adjustable Features  
Adjustable Features  
Adjust  
Frequency  
Feedback Counter Value (P)  
Reference Counter Value (Q)  
Output Divider Selection  
CY2037 contains an on-chip oscillator and a unique oscillator  
tuning circuit for fine-tuning of the output frequency. The crystal  
C
load may be selectively adjusted by programming a set of seven  
Oscillator Tuning (Load Capacitance Values)  
Duty Cycle Levels (TTL or CMOS)  
EPROM bits. This feature is used to compensate for crystal  
variations or to obtain a more accurate synthesized frequency.  
Power Management Mode (OE or PD#)  
CY2037 uses EPROM programming with a simple 2-wire, 4-pin  
interface that includes VSS and VDD. Clock outputs may be  
generated up to 133 MHz at 5V or up to 100 MHz at 3.3V. The  
entire configuration can be reprogrammed once, which allows  
the programmed inventory to be altered or reused.  
Power Management Timing (Synchronous or Asynchronous)  
PLL Output Frequency  
CY2037 PLL die is designed for very high resolution. It has a  
12-bit feedback counter multiplier and a 10-bit reference counter  
divider. This enables the synthesis of highly accurate and stable  
output clock frequencies with zero or low PPM error. The clock  
is further modified by eight output divider options of 1, 2, 4, 8, 16,  
32, 64, and 128. The divider input can be selected as the PLL or  
crystal oscillator output, providing a total of 16 separate output  
options. For further flexibility, the ouput is selectable between  
TTL and CMOS duty cycle levels.  
CY2037 contains a high resolution PLL with 12-bit multiplier and  
10-bit divider. The output frequency of the PLL is determined by  
the following formula:  
2 • (P + 5)  
(Q + 2)  
---------------------------  
FREF  
FPLL  
=
In this formula, P is the feedback counter value and Q is the  
reference counter value. P and Q are EPROM programmable  
values.  
CY2037, CY2037B, and CY2037-2 also contain flexible power  
management controls. These parts include both power down  
(PD#) and OE features with integrated pull up resistors. The PD#  
and OE modes have an additional setting to determine timing  
(asynchronous or synchronous) with respect to the output signal.  
When PD# or OE modes are enabled, CLKOUT is pulled low by  
a weak pull down. The weak pull down is easily overdriven by  
another active CLKOUT for applications that require multiple  
CLKOUTs on a single signal path.  
Power Management Features (except CY2037-3)  
CY2037 contains EPROM-programmable PD# and OE  
functions. If power down is selected, all active circuitry on the  
chip is shut down when the control pin goes LOW. The oscillator  
and PLL circuits must relock when the part leaves the power  
down mode. If output enable mode is selected, the output is  
tri-stated and weakly pulled low when the control pin goes low.  
In this mode the oscillator and PLL circuits continue to operate,  
allowing a rapid return to normal operation when the control input  
is deasserted.  
Controlled rise and fall times, unique output driver circuits, and  
innovative circuit layout techniques enable CY2037 to have low  
jitter and accurate outputs, making it suitable for most PC,  
networking, and consumer applications.  
In addition, the PD# and OE modes can be programmed to occur  
synchronously or asynchronously with respect to the output  
signal. When the asynchronous setting is used, the power down  
or output disable occurs immediately (allowing for logic delays),  
regardless of the position in the clock cycle. However, when the  
synchronous setting is used, the part waits for a falling edge at  
the output before the power down or output enable signal is  
initiated, thus preventing output glitches. In asynchronous or  
synchronous setting, the output is always enabled  
synchronously by waiting for the next falling edge of the output.  
On the other hand, CY2037-3 contains a frequency select  
function in place of the power down and output enable modes.  
For example, consumer products often require frequency  
compatibility with different electrical standards around the world.  
With this frequency select feature, a product that incorporates  
CY2037-3 could be compatible with both NTSC for North  
American, and PAL for Europe by simply changing the FS line.  
The twice programmable feature is also absent in CY2037-3,  
because the second EPROM row is now being used for the  
alternate frequency.  
Document Number: 38-07354 Rev. *E  
Page 4 of 11  
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CY2037  
Crystal Oscillator Tuning Circuit  
CY2037 contains a unique tuning circuit to fine-tune the output frequency of the device. The tuning circuit consists of an array of eleven  
load capacitors on both sides of the oscillator drive inverter. The capacitor load values are EPROM-programmable and may be  
increased in small increments. As the capacitor load is increased the circuit is fine-tuned to a lower frequency. The capacitor load  
values vary from 0.17 pF to 8 pF for a 100:1 total control ratio. The tuning increments are shown in Table 3. Refer to “7C8038x/7C8034x  
Programming Specification” for further details.  
Figure 1. Crystal Oscillator Tuning Circuit  
Rf  
External Crystal  
C6  
C5  
C4  
C3  
C2  
C1  
C0  
Cgo  
C7  
C8  
C9 C10  
Cdo  
CD6 CD5 CD4 CD3 CD2 CD1 CD0  
CD3 CD4 CD5 CD6  
CD = EPROM BIT  
T = TRANSISTOR  
C = LOAD CAPACITOR  
Table 3. Crystal Oscillator Parameter  
Parameter  
Description  
Feedback resistor, VDD = 4.5–5.5V  
Feedback resistor, VDD = 2.7–3.6V  
Capacitors have ± 20% tolerance  
Min  
Typ.  
Max  
Unit  
Rf  
0.5  
1.0  
2
4
3.5  
9.0  
MΩ  
MΩ  
Cg  
Gate capacitor  
Drain capacitor  
Series cap  
Series cap  
Series cap  
Series cap  
Series cap  
Series cap  
Series cap  
Series cap  
Series cap  
Series cap  
Series cap  
13  
9
pF  
pF  
pF  
pF  
pF  
pF  
pF  
pF  
pF  
pF  
pF  
pF  
pF  
Cd  
C0  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
C8  
C9  
C10  
0.27  
0.52  
1.00  
0.7  
1.4  
2.6  
5.0  
0.45  
0.85  
1.7  
3.3  
Document Number: 38-07354 Rev. *E  
Page 5 of 11  
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CY2037  
CY2037A/CY2037B Versus CY2037-2  
Inkless Die Pick Map (DPM) Format  
CY2037A and CY2037B contain a shadow register in addition to  
the EPROM register. The shadow register is an exact copy of the  
EPROM register and is the default register when the Valid bit is  
not set. It is useful when the prototype or production environment  
calls for measuring and adjusting the CLKOUT frequency  
several times. Multiple adjustments can be performed with the  
shadow register. After the required frequency is achieved the  
EPROM register is permanently programmed.  
Cypress ships inkless wafers to customers with an  
accompanying die pick map, which is used to determine the good  
die for assembly and programming. Customers can also access  
individual DPM files at their convenience through  
ftp.cypress.com with a valid user account login and password.  
Contact your local Cypress Field Application Engineer (FAE) or  
sales representative for a customer FTP account. The DPM files  
are named with the fab lot number and wafer number scribed on  
the wafer. The DPM files are transferred to the customer’s FTP  
account when the factory ships out the wafers against their  
purchase order (PO).  
Some production flows do not require the use of the shadow  
register. If this is the case, then CY2037-2 is the chosen device  
and CY2037-2 has a disabled shadow register. CY2037-3  
contains the shadow register.  
Frequency Select Feature of CY2037-3  
CY2037-3 contains a frequency select function in place of the  
powerdown and the output enable functions. With the frequency  
select feature, customers can switch two different frequencies  
that are configured in the two EPROM rows. Table 4 lists the  
definition of the frequency select pin (FS).  
Table 4. Frequency Select Pin Decoding for CY2037-3  
FS Pin  
Output Frequency  
0
1
From EPROM row 0 configuration  
From EPROM row 1 configuration  
Document Number: 38-07354 Rev. *E  
Page 6 of 11  
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CY2037  
Input voltage.............................................. –0.5V to VDD+0.5  
Storage temperature (non-condensing)........ 55°C to +150°C  
Junction temperature.................................. –40°C to +100°C  
Absolute Maximum Ratings  
Exceeding maximum ratings may shorten the useful life of the  
device. User guidelines are not tested.[3]  
Static discharge voltage............................................... 2000V  
(per MIL-STD-883, Method 3015)  
Supply voltage..................................................0.5 to +7.0V  
Operating Conditions  
Parameter  
Description  
Min  
Max  
Unit  
VDD  
Supply voltage (3.3V)  
2.7  
4.5  
3.6  
5.5  
V
V
Supply voltage (5.0V)  
[4]  
TAJ  
Operating temperature, Junction  
–10  
+100  
°C  
CTTL  
Max. capacitive load on outputs for TTL levels  
VDD = 4.5–5.5V, output frequency = 1 - 40 MHz  
50  
25  
pF  
pF  
VDD = 4.5–5.5V, output frequency = 40 - 133 MHz  
CCMOS  
Max. capacitive load on outputs for CMOS levels  
VDD = 4.5–5.5V, output frequency = 1 - 66.6 MHz  
50  
25  
30  
15  
15  
pF  
pF  
pF  
pF  
pF  
VDD = 4.5–5.5V, output frequency = 66.6 - 133 MHz  
VDD = 3.0–3.6V, output frequency = 1 - 40 MHz  
V
DD = 3.0–3.6V, output frequency = 40 - 100 MHz  
DD = 2.7–3.0V, output frequency = 1 - 66 MHz  
V
XREF  
tPU  
Reference frequency, input crystal. Fundamental tuned crystals only  
10  
30  
50  
MHz  
ms  
Power up time for all VDDs to reach minimum specified voltage (power ramps must  
be monotonic)  
0.05  
Electrical Characteristics  
Over the Operating Range[5]  
Parameter  
VIL  
Description  
Test Conditions  
Min  
Typ. Max  
Unit  
Low level input voltage  
VDD = 4.5V - 5.5V  
DD = 2.7V - 3.6V  
0.8  
0.2VDD  
V
V
V
VIH  
High level input voltage  
Low level output voltage  
VDD = 4.5V - 5.5V  
DD = 2.7V - 3.6V  
2.0  
0.7VDD  
V
V
V
VOL  
VDD = 4.5V - 5.5V, IOL= 16 mA  
VDD = 2.7V - 3.6V, IOL= 8 mA  
0.4  
0.4  
V
V
VOHCMOS  
High level output voltage, VDD = 4.5V - 5.5V, IOH = –16 mA  
DD = 2.7V - 3.6V, IOH = –8 mA  
VDD – 0.4  
V
V
V
VDD – 0.4  
CMOS levels  
VOHTTL  
High level output voltage, VDD = 4.5V - 5.5V, IOH = –8 mA  
TTL levels  
2.4  
V
IIL  
Input low current  
Input high current  
Power supply current,  
Unloaded  
VIN = 0V  
10  
5
μA  
μA  
IIH  
IDD  
VIN = VDD  
VDD = 4.5V - 5.5V, output frequency <= 133 MHz  
45  
25  
mA  
mA  
VDD = 2.7V - 3.6V, output frequency <= 100 MHz  
[6]  
IDDS  
Standby current  
Input pull up resistor  
VDD = 2.7V - 3.6V  
10  
50  
μA  
RUP  
VDD = 4.5V - 5.5V, VIN = 0V  
VDD = 4.5V - 5.5V, VIN = 0.7VDD  
1.1  
50  
3.0  
100  
8.0  
200  
MΩ  
kΩ  
IOE_CLKOUT CLKOUT pull down current VDD = 5.0  
20  
μA  
Notes  
3. Stresses greater than listed can impair the life of the device.  
4. This product is sold in die form so operating conditions are specified for the die, or junction temperature.  
5. This part was characterized in a 20-pin SOIC package with external crystal, Electrical Characteristics can change with other package types.  
6. If external reference is used, it is required to stop the reference (set reference to LOW) during power down.  
Document Number: 38-07354 Rev. *E  
Page 7 of 11  
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CY2037  
Output Clock Switching Characteristics  
Over the Operating Range[7]  
Parameter  
Description  
Test Conditions  
Min  
Typ  
Max Unit  
t1w  
Output duty cycle at 1.4V, 1 - 40 MHz, CL <=50 pF  
45  
45  
40  
40  
55  
55  
60  
60  
%
%
%
%
VDD = 4.5–5.5V  
40 - 66 MHz, CL <=15 pF  
66 - 125 MHz, CL <=25 pF  
125 - 133 MHz, CL <=15 pF  
t1w = t1A ÷ t1B  
t1x  
t1y  
t1z  
t2  
Output duty cycle at VDD/2, 1 - 66.6 MHz, CL <=25 pF  
45  
40  
40  
55  
60  
60  
%
%
%
V
DD = 4.5–5.5V  
66.6 - 125 MHz, CL <=25 pF  
125 - 133 MHz, CL <=15 pF  
t
1x = t1A ÷ t1B  
Output duty cycle at VDD/2, 1 - 40 MHz, CL <=30 pF  
DD = 3.0–3.6 40 - 100 MHz, CL <=15 pF  
t1y = t1A ÷ t1B  
45  
40  
55  
60  
%
%
V
Output duty cycle at VDD/2, 1 - 40 MHz, CL <=15 pF  
40  
40  
60  
60  
%
%
VDD = 2.7–3.0  
1y = t1A ÷ t1B  
40 - 66.6 MHz, CL <=10 pF  
t
Output clock rise time  
Between 0.8V - 2.0V, VDD = 4.5V - 5.5V, CL = 50 pF  
Between 0.8V - 2.0V, VDD = 4.5V - 5.5V, CL = 25 pF  
Between 0.8V - 2.0V, VDD = 4.5V - 5.5V, CL = 15 pF  
Between 0.2VDD - 0.8VDD, VDD = 4.5V - 5.5V, CL = 50 pF  
Between 0.2VDD - 0.8VDD, VDD = 3.0V - 3.6V, CL = 30 pF  
Between 0.2VDD - 0.8VDD, VDD = 2.7V - 3.6V, CL = 15 pF  
1.8  
1.2  
0.9  
3.4  
4.0  
2.4  
ns  
ns  
ns  
ns  
ns  
ns  
t3  
Output clock fall time  
Between 0.8V - 2.0V, VDD = 4.5V - 5.5V, CL = 50 pF  
Between 0.8V - 2.0V, VDD = 4.5V - 5.5V, CL = 25 pF  
Between 0.8V - 2.0V, VDD = 4.5V - 5.5V, CL = 15 pF  
Between 0.2VDD - 0.8VDD, VDD = 4.5V - 5.5V, CL = 50 pF  
Between 0.2VDD - 0.8VDD, VDD = 3.0V - 3.6V, CL = 30 pF  
Between 0.2VDD - 0.8VDD, VDD = 2.7V - 3.6V, CL = 15 pF  
1.8  
1.2  
0.9  
3.4  
4.0  
2.4  
ns  
ns  
ns  
ns  
ns  
ns  
t4  
Startup time out of power  
down  
PD# pin LOW to HIGH[8]  
1
2
ms  
ns  
ns  
t5a  
t5b  
Power down delay time  
(synchronous setting)  
PD# pin LOW to output LOW  
(T = period of output clk)  
T/2  
10  
T+10  
15  
Power down delay time  
(asynchronous setting)  
PD# pin LOW to output LOW  
t6  
Power up time  
From power on[8]  
1
2
ms  
ns  
t7a  
Output disable time  
(synchronous setting)  
OE pin LOW to output Hi-Z  
(T = period of output clk)  
T/2  
T+10  
t7b  
t8  
Output disable time  
(asynchronous setting)  
OE pin LOW to output Hi-Z  
10  
T
15  
ns  
Output enable time  
(always synchronous  
enable)  
OE pin LOW to HIGH  
(T = period of output clk)  
1.5T+2 ns  
5
t9  
Peak-to-peak period jitter  
VDD = 4.5V - 5.5V, Fo > 33 MHz, VCO > 100 MHz  
VDD = 2.7V - 3.6V, Fo > 33 MHz, VCO > 100 MHz  
±100 ±125  
±125 ±200  
±250 1% of  
FO  
ps  
ps  
ps  
VDD = 2.7V - 5.5V, Fo < 33 MHz  
Notes  
7. Not all parameters measured in production testing.  
8. Oscillator start time cannot be guaranteed for all crystal types. This specification is for operation with AT cut crystals with ESR < 70 ohms.  
Document Number: 38-07354 Rev. *E  
Page 8 of 11  
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CY2037  
Switching Waveforms  
Figure 2. Duty Cycle Timing (t1w, 1x, t1y, t1z)  
t
t
1B  
t
1A  
OUTPUT  
Figure 3. Output Rise/Fall Time  
VDD  
0V  
OUTPUT  
t
2
t
3
Figure 4. Power Down Timing (synchronous and asynchronous modes)  
VDD  
0V  
VIH  
POWER  
DOWN  
VIL  
t4  
CLKOUT  
[
(synchronous 9]  
)
T
t5a  
1/f  
CLKOUT  
[
(asynchronous 10]  
)
t5b  
1/f  
Figure 5. Power Up Timing  
VDD  
0V  
VDD – 10%  
POWER  
t6  
UP  
min. 30 μs  
max. 30 ms  
CLKOUT  
1/f  
Notes  
9. In synchronous mode the power down or output tri-state is not initiated until the next falling edge of the output clock.  
10. In asynchronous mode the power down or output tri-state occurs within 25 ns regardless of position in the output clock cycle.  
Document Number: 38-07354 Rev. *E  
Page 9 of 11  
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CY2037  
Ordering Information[11]  
Ordering Code  
CY2037AWAF  
Status  
Obsolete  
Obsolete  
Obsolete  
Obsolete  
Obsolete  
Active  
Type  
Wafer Thickness  
14 ± 0.5 mils  
14 ± 0.5 mils  
14 ± 0.5 mils  
14 ± 0.5 mils  
11 ± 0.5 mils  
14 ± 0.5 mils  
11 ± 0.5 mils  
14 ± 0.5 mils  
Operating Range  
Inked Wafer  
Inked Wafer  
Inked Wafer  
Inked Wafer  
Inked Wafer  
Inkless Wafer  
Inkless Wafer  
Inkless Wafer  
–10°C to +100°C  
–10°C to +100°C  
–10°C to +100°C  
–10°C to +100°C  
–10°C to +100°C  
–10°C to +100°C  
–10°C to +100°C  
–10°C to +100°C  
CY2037-2WAF  
CY2037-3WAF  
CY2037BWAF  
CY2037B-11WAF  
CY2037BWAF-IL  
CY2037B-11WAF-IL  
Active  
CY2037-2WAF-IL  
Obsolete, CY2037BWAF-IL is  
recommended for new designs  
CY2037-3WAF-IL  
Obsolete  
Inkless Wafer  
14 ± 0.5 mils  
–10°C to +100°C  
Notes  
11. The only difference between the CY2037A/CY2037B, and the CY2037-2 is that the CY2037-2 has the shadow register disabled. CY2037-3 replaces the power  
down options with a frequency select and contains the shadow register.  
Document Number: 38-07354 Rev. *E  
Page 10 of 11  
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CY2037  
Document History Page  
Document Title: CY2037 High-Accuracy EPROM Programmable PLL Die for Crystal Oscillators  
Document Number: 38-07354  
Orig. of  
REV.  
ECN NO. Issue Date  
Description of Change  
Change  
DSG  
RBI  
**  
112248  
121857  
291092  
522769  
03/01/02  
12/14/02  
See ECN  
See ECN  
Change from Spec number: 38-00679 to 38-07354  
Power up requirements added to Operating Conditions Information  
Updated Min. Operating Temperature, Junction  
*A  
*B  
*C  
RGL  
RGL  
Added CY2037B information. Updated absolute maximum Junction temper-  
ature specification. Updated Ordering information table.  
Added Die Pad description and coordinates  
*D  
*E  
804376  
See ECN  
RGL  
Minor Change: To post on web  
2192266  
See ECN DPF/PYRS Added Inkless Die information.  
© Cypress Semiconductor Corporation, 2002-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of  
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for  
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as  
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems  
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),  
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,  
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress  
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without  
the express written permission of Cypress.  
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES  
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document Number: 38-07354 Rev. *E  
Revised March 06, 2008  
Page 11 of 11  
Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided  
that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names mentioned in this document may be the trademarks of their respective holders.  
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