CGHV50200F [CREE]

200 W, 4400 - 5000 MHz, 50-Ohm Input;
CGHV50200F
型号: CGHV50200F
厂家: CREE, INC    CREE, INC
描述:

200 W, 4400 - 5000 MHz, 50-Ohm Input

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CGHV50200F  
200 W, 4400 - 5000 MHz, 50-Ohm Input/Output Matched, GaN HEMT  
Cree’s CGHV50200F is a gallium nitride (GaN) high electron mobility transistor (HEM
designed specifically with high efficiency, high gain and wide bandwidth capabilities, whi
makes the CGHV50200F ideal for troposcatter communications, 4.4 - 5.0 GHz C-Band SatCo
applications and Beyond Line of Sight. The GaN HEMT is matched to 50 ohm, for ease of use
It is designed for CW, pulse, and linear mode of power amplifier operation. The transistor i
supplied in a ceramic/metal flange package, type 440215.  
Typical Performance Over 4.4-5.0 GHz (TC = 25˚C) of Demonstration Amplifier  
Parameter  
4.4 GHz  
4.6 GHz  
4.8 GHz  
5.0 GHz  
Units  
Small Signal Gain  
14.9  
14.9  
14.9  
15.1  
dB  
CW Output Power1  
Output Power2  
173  
100  
11.4  
49  
177  
100  
11.6  
47  
170  
126  
11.0  
48  
166  
101  
11.8  
48  
W
W
dB  
%
Power Gain2  
Power Added Efficiency2  
1Note: Measured CW in the CGHV50200F-AMP at PIN = 43 dBm  
2Note: Measured at -30 dBc, 1.6 MHz from carrier, in the CGHV50200F-AMP1 under OQPSK modulation, 1.6 Msps, PN23,  
Alpha Filter = 0.2.  
Features  
Applications  
4.4 - 5.0 GHz Operation  
Troposcatter Communications  
180 W Typical PSAT  
Beyond Line of Sight – BLOS  
Satellite Communications  
11.5 dB Typical Power Gain  
48% Typical Power Efficiency  
50 Ohm Internally Matched  
Subject to change without notice.  
www.cree.com/rf  
1
Absolute Maximum Ratings (not simultaneous)  
Parameter  
Symbol  
Rating  
Units  
Conditions  
Drain-Source Voltage  
VDSS  
125  
Volts  
25˚C  
Gate-to-Source Voltage  
VGS  
10, +2  
-65, +150  
225  
Volts  
˚C  
25˚C  
Storage Temperature  
TSTG  
Operating Junction Temperature  
Maximum Forward Gate Current  
Maximum Drain Current1  
Soldering Temperature2  
T
˚C  
J
IGMAX  
IDMAX  
TS  
41.6  
mA  
A
25˚C  
25˚C  
17  
245  
˚C  
Screw Torque  
40  
in-oz  
˚C/W  
˚C  
τ
Thermal Resistance, Junction to Case  
Case Operating Temperature3  
RθJC  
0.81  
CW, 85˚C, PDISS = 166.4 W  
30 seconds  
TC  
-40, +150  
Note:  
1 Current limit for long term, reliable operation  
2 Refer to the Application Note on soldering at http://www.cree.com/rf/document-library  
3 See also, Power Dissipation Derating Curve on page 12  
Electrical Characteristics  
Characteristics  
Symbol  
Min.  
Typ.  
Max.  
Units  
Conditions  
DC Characteristics1 (TC = 25˚C)  
Gate Threshold Voltage  
Gate Quiescent Voltage  
Saturated Drain Current2  
VGS(th)  
VGS(Q)  
IDS  
-3.4  
-3.0  
-2.7  
37.4  
-2.6  
VDC  
VDC  
A
VDS = 10 V, ID = 41.6 mA  
VDS = 50 V, ID = 1.0 A  
VDS = 6 V, VGS = 2 V  
33.28  
150  
Drain-Source Breakdown Voltage  
VBR  
VDC  
VGS = -8 V, ID = 41.6 mA  
RF Characteristics3 (TC = 25˚C, F0 = 4.4 - 5.0 GHz unless otherwise noted)  
Small Signal Gain  
Small Signal Gain  
Small Signal Gain  
Power Gain4  
GSS1  
GSS2  
15.4  
15.3  
15.2  
12.1  
12.4  
12.2  
45  
dB  
dB  
dB  
dB  
dB  
dB  
%
VDD = 40 V, ID = 1.0 A, PIN = 10 dBm  
VDD = 40 V, ID = 1.0 A, PIN = 10 dBm  
VDD = 40 V, ID = 1.0 A, PIN = 10 dBm  
GSS3  
GP1  
VDD = 40 V, ID = 1.0 A, POUT = 48 dBm, Freq = 4.4 GHz  
VDD = 40 V, ID = 1.0 A, POUT = 48 dBm, Freq = 4.8 GHz  
VDD = 40 V, ID = 1.0 A, POUT = 48 dBm, Freq = 5.0 GHz  
VDD = 40 V, ID = 1.0 A, POUT = 48 dBm, Freq = 4.4 GHz  
VDD = 40 V, ID = 1.0 A, POUT = 48 dBm, Freq = 4.8 GHz  
VDD = 40 V, ID = 1.0 A, POUT = 48 dBm, Freq = 5.0 GHz  
VDD = 40 V, ID = 1.0 A, POUT = 48 dBm, Freq = 4.4 GHz  
VDD = 40 V, ID = 1.0 A, POUT = 48 dBm, Freq = 4.8 GHz  
VDD = 40 V, ID = 1.0 A, POUT = 48 dBm, Freq = 5.0 GHz  
Power Gain4  
GP2  
Power Gain4  
GP3  
Power Added Efficiency4  
Power Added Efficiency4  
Power Added Efficiency4  
OQPSK Linearity4  
OQPSK Linearity4  
OQPSK Linearity4  
PAE1  
PAE2  
PAE3  
ACLR1  
ACLR2  
ACLR3  
36  
%
35  
%
-29  
dBc  
dBc  
dBc  
-34  
-34  
No damage at all phase angles,  
VDD = 40 V, ID = 1.0 A, CW POUT = 180 W  
Y
Output Mismatch Stress  
VSWR  
3 : 1  
Notes:  
1 Measured on wafer prior to packaging.  
2 Scaled from PCM data.  
3 Measured in CGHV50200F-AMP  
4 Measured under 1.6 Msps OQPSK Modulation, PN23, Alpha Filter = 0.2  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
2
CGHV50200F Rev 1.1  
Typical Performance  
Figure 1. - Small Signal S-parameters  
CGHV50200F in Test Fixture  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
16  
S21  
S11  
S22  
14  
12  
10  
8
6
4
2
0
-2  
-4  
-6  
-8  
-10  
-12  
-14  
-16  
3.0  
3.2  
3.4  
3.6  
3.8  
4.0  
4.2  
4.4  
4.6  
4.8  
5.0  
5.2  
5.4  
5.6  
5.8  
6.0  
Frequency (GHz)  
Figure 2. - Modulated @ Spectral Regrowth = -30dBc, 1.6 MHz from Carrier  
1.6 Msps OQPSK Modulation  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
60  
55  
50  
45  
40  
35  
30  
25  
Pout  
20  
Gain  
15  
PAE  
10  
5
0
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
5.1  
5.2  
5.3  
Frequency (GHz)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
3
CGHV50200F Rev 1.1  
Typical Performance  
Figure 3. - Spectral Mask @ Average Output Power = 48dBm  
1.6 Msps OQPSK Modulation  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
10  
5
0
4.4 GHz  
4.8 GHz  
5 GHz  
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-6  
-5  
-4  
-3  
-2  
-1  
0
1
2
3
4
5
6
Frequency Offset (MHz)  
Figure 4. - Modulated Power Sweep  
1.6 Msps OQPSK Modulation  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
20  
65  
15  
10  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
5
Gain 4.4 GHz  
SR 4.4 GHz  
Gain 4.8 GHz  
SR 4.8 GHz  
Gain 5 GHz  
SR 5 GHz  
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
PAE 4.4 GHz  
PAE 4.8 GHz  
PAE 5 GHz  
0
30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52  
Average Output Power (dBm)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
4
CGHV50200F Rev 1.1  
Typical Performance  
Figure 5. - Modulated Power Sweep  
1.6 Msps OQPSK Modulation  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Id 4.4 GHz  
Id 4.8 GHz  
Id 5 GHz  
30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52  
Average Output Power (dBm)  
Figure 6. - Two Tone Power Sweep  
IMD3 @ 1 MHz Carrier Spacing  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
0
IMD3 4.4 GHz  
IMD3 4.8 GHz  
IMD3 5 GHz  
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
30  
32  
34  
36  
38  
40  
42  
44  
46  
48  
50  
52  
Average Output Power (dBm)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
5
CGHV50200F Rev 1.1  
Typical Performance  
Figure 7. - Two Tone Power Sweep  
IMD @ 1 MHz Carrier Spacing, 4.4 GHz  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
IMD3 4.4 GHz  
IMD5 4.4 GHz  
IMD7 4.4 GHz  
30  
32  
34  
36  
38  
40  
42  
44  
46  
48  
50  
52  
Average Output Power (dBm)  
Figure 8. - Two Tone Carrier Spacing Sweep  
@ 48 dBm Average Ouput Power, 4.4 GHz  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
0
-IMD3  
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
+IMD3  
-IMD5  
+IMD5  
-IMD7  
+IMD7  
0.1  
1.0  
10.0  
100.0  
Carrier Spacing (MHz)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
6
CGHV50200F Rev 1.1  
Typical Performance  
Figure 9. - Pulsed vs Frequency @ PIN = 43 dBm  
CGHV50200F in Test Fixture  
10% Duty, 100 uS Pulse Width  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
Pout  
Gain  
PAE  
0
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
5.1  
5.2  
5.3  
Frequency (GHz)  
Figure 10. - Pulsed Power Sweep  
CGHV50200F in Test Fixture  
10% Duty, 100 uS Pulse Width  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
Pout 4.4 GHz  
Pout 4.8 GHz  
Pout 5 GHz  
Gain 4.4 GHz  
Gain 4.8 GHz  
Gain 5 GHz  
PAE 4.4 GHz  
PAE 4.8 GHz  
PAE 5 GHz  
0
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
46  
Input Power (dBm)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
7
CGHV50200F Rev 1.1  
Typical Performance  
Figure 11. - AM-AM  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
16  
15  
14  
13  
12  
11  
10  
9
4.4 GHz  
4.8 GHz  
5 GHz  
8
7
6
5
4
3
2
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
46  
48  
Input Power (dBm)  
Figure 12. - AM-PM  
VDD = 40 V, IDQ = 1 A, Tcase = 25°C  
16  
14  
12  
10  
8
4.4 GHz  
4.8 GHz  
5 GHz  
6
4
2
0
-2  
-4  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
46  
48  
Input Power (dBm)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
8
CGHV50200F Rev 1.1  
CGHV50200F-AMP Demonstration Amplifier Circuit  
CGHV50200F-AMP Demonstration Amplifier Circuit Outline  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
9
CGHV50200F Rev 1.1  
CGHV50200F-AMP Demonstration Amplifier Circuit Schematic  
CGHV50200F-AMP Demonstration Amplifier Circuit Bill of Materials  
Designator  
Description  
Qty  
R1  
C1,C6  
C2  
RES, 5.1,OHM, +/- 1%, 1/16W,0603  
CAP, 4.7PF, +/-1%,250V, 0805,  
CAP, 2.4pF, +/- 0.25 pF,250V, 0603  
CAP, 470PF, 5%, 100V, 0603, X  
CAP,33000PF, 0805,100V, X7R  
CAP 10UF 16V TANTALUM  
CAP, 2.0PF, +/-1%,250V, 0805,  
CAP, 1.0UF, 100V, 10%, X7R, 1210  
CAP, 33 UF, 20%, G CASE  
1
2
1
2
2
1
1
1
1
2
1
1
4
4
1
C3,C8  
C4,C9  
C5  
C7  
C10  
C11  
J1,J2  
J3  
CONN, SMA, PANEL MOUNT JACK  
HEADER RT>PLZ .1CEN LK 9POS  
PCB, RF35, 2.5 X 3.0 X 0.250  
2-56 SOC HD SCREW 1/4 SS  
#2 SPLIT LOCKWASHER SS  
CGHV50200F  
-
-
-
Q1  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
10  
CGHV50200F Rev 1.1  
CGHV50200F Power Dissipation De-rating Curve  
180  
160  
140  
120  
100  
80  
Note 1  
60  
40  
20  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
225  
250  
Maximum Case Temperature (°C)  
Note 1 : Shaded area exceeds Maximum Case Operating Temperature (See Page 2)  
Electrostatic Discharge (ESD) Classifications  
Parameter  
Symbol  
HBM  
Class  
Test Methodology  
JEDEC JESD22 A114-D  
JEDEC JESD22 C101-C  
Human Body Model  
Charge Device Model  
1A (> 250 V)  
CDM  
2 (125 V to 250 V)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
11  
CGHV50200F Rev 1.1  
Product Dimensions CGHV50200F (Package Type — 440215)  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
12  
CGHV50200F Rev 1.1  
Part Number System  
CGHV50200F  
Package  
Power Output (W)  
Upper Frequency (GHz)  
Cree GaN High Voltage  
Parameter  
Value  
Units  
Upper Frequency1  
Power Output  
Package  
5.0  
200  
GHz  
W
-
Flange  
Table 1.  
Note1: Alpha characters used in frequency code  
indicate a value greater than 9.9 GHz. See Table  
2 for value.  
Character Code  
Code Value  
A
B
C
D
E
0
1
2
3
4
5
6
7
8
9
F
G
H
J
K
1A = 10.0 GHz  
2H = 27.0 GHz  
Examples:  
Table 2.  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
13  
CGHV50200F Rev 1.1  
Product Ordering Information  
Order Number  
Description  
Unit of Measure  
Image  
CGHV50200F  
GaN HEMT  
Each  
CGHV50200F-TB  
Test board without GaN HEMT  
Each  
CGHV50200F-AMP  
Test board with GaN HEMT installed  
Each  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
14  
CGHV50200F Rev 1.1  
Disclaimer  
Specifications are subject to change without notice. Cree, Inc. believes the information contained within this data sheet to be accurate  
and reliable. However, no responsibility is assumed by Cree for any infringement of patents or other rights of third parties which may  
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Cree. Cree makes no warranty,  
representation or guarantee regarding the suitability of its products for any particular purpose. “Typical” parameters are the average  
values expected by Cree in large quantities and are provided for information purposes only. These values can and do vary in different  
applications and actual performance can vary over time. All operating parameters should be validated by customer’s technical experts  
for each application. Cree products are not designed, intended or authorized for use as components in applications intended for surgical  
implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result in personal injury or  
death or in applications for planning, construction, maintenance or direct operation of a nuclear facility.  
For more information, please contact:  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
www.cree.com/rf  
Sarah Miller  
Marketing  
Cree, RF Components  
1.919.407.5302  
Ryan Baker  
Marketing & Sales  
Cree, RF Components  
1.919.407.7816  
Tom Dekker  
Sales Director  
Cree, RF Components  
1.919.407.5639  
Cree, Inc.  
4600 Silicon Drive  
Durham, North Carolina, USA 27703  
USA Tel: +1.919.313.5300  
Fax: +1.919.869.2733  
Copyright © 2013 - 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are  
registered trademarks of Cree, Inc.  
www.cree.com/rf  
15  
CGHV50200F Rev 1.1  

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CREE

CGHV59070P

70 W, 4.4-5.9 GHz, 50 V, RF Power GaN HEMT
CREE

CGHV59350

350 W, 5200 - 5900 MHz, 50-Ohm Input
CREE

CGHV59350-AMP

RF Power Field-Effect Transistor,
CREE

CGHV59350-AMP1

350 W, 5200 - 5900 MHz, 50-Ohm Input
CREE

CGHV59350-TB

350 W, 5200 - 5900 MHz, 50-Ohm Input
CREE

CGHV59350F

350 W, 5200 - 5900 MHz, 50-Ohm Input
CREE