CM1409-06DE [CALMIRCO]
LCD and Camera EMI Filter Array with ESD Protection; 液晶显示器和照相机的EMI滤波器阵列与ESD保护
| 型号： | CM1409-06DE |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | LCD and Camera EMI Filter Array with ESD Protection |
| 文件： | 总7页 (文件大小：223K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRELIMINARY
CM1409
LCD and Camera EMI Filter Array with ESD Protection
Features
Product Description
•
•
•
Six and eight channels of EMI filtering with inte-
grated ESD protection
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
Greater than 35dB attenuation (typical) at 1 GHz
TDFN package with 0.50mm lead pitch:
• 6-ch. = 12-lead TDFN
• 8-ch. = 16-lead TDFN
Tiny TDFN package size:
• 12-lead: 3.0mm x 1.35mm (two styles)
• 16-lead: 4.0mm x 1.60mm
Increased robustness against vertical impacts
during manufacturing process
The CM1409 is a family of pi-style EMI filter arrays with
ESD protection, which integrates six and eight filters
(C-R-C) in small form factor TDFN 0.50mm pitch pack-
ages. The CM1409 has component values of 15pF-
100Ω-15pF per channel. The CM1409 has a cut-off fre-
quency of 110MHz and can be used in applications
with data rates up to 44Mbps. The parts include ESD
diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
ESD protection diodes safely dissipate ESD strikes of
15kV, well beyond the maximum requirement of the
IEC61000-4-2 international standard. Using the MIL-
STD-883 (Method 3015) specification for Human Body
Model (HBM) ESD, the pins are protected for contact
discharges at greater than 30kV.
•
•
•
•
•
•
Lead-free finishing
These devices are particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of their small package and easy-
to-use pin assignments. In particular, the CM1409 is
ideal for EMI filtering and protecting data and control
lines for the I/O data ports, LCD display and camera
interface in mobile handsets.
Applications
•
•
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
•
The CM1409 is housed in space-saving, low-profile 12-
and 16-lead TDFN packages with a 0.50mm pitch and
is available with lead-free finishing.
•
•
•
Electrical Schematic
100Ω
FILTER+ESDn*
FILTER+ESDn*
R
15pF
15pF
C
C
GND
1 of 6 or 8 EMI/RFI + ESD Channels
* See Package/Pinout Diagram
for expanded pin information.
© 2006 California Micro Devices Corp. All rights reserved.
06/16/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
PRELIMINARY
CM1409
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
BOTTOM VIEW
TOP VIEW
BOTTOM VIEW
(Pins Down View)
12 11 10 7
(Pins Up View)
5 6
(Pins Down View)
12 11 10 7
(Pins Up View)
9
8
1
2
3
4
9
8
1 2 3 4 5 6
GND
PAD
GND
PAD
N09F/E
N09EE
Pin 1
Marking
Pin 1
Marking
12 11 10
9
8
7
12 11 10 9 8 7
1
2
3
4
5
6
1
2
3
4
5
6
CM1409-06DF/DE
12 Lead TDFN Package
CM1409-E6DE
12 Lead TDFN Package
TOP VIEW
BOTTOM VIEW
(Pins Down View)
(Pins Up View)
16 15 14 13 12 11 10
9
1 2 3 4 5 6 7 8
GND
PAD
N098F/E
Pin 1
Marking
1
2
3
4
5
6
7
8
16 15 14 13 12 11 10 9
CM1409-08DF/DE
16 Lead TDFN Package
Note:
1) These drawings are not to scale.
PIN DESCRIPTIONS
DEVICE
PIN(s)
DEVICE
PIN(s)
-06
1
-08
1
NAME
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
GND
DESCRIPTION
-06
12
11
10
9
-08
16
15
14
13
12
11
10
9
NAME
DESCRIPTION
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
Filter + ESD Channel 5
Filter + ESD Channel 6
Filter + ESD Channel 7
Filter + ESD Channel 8
Device Ground
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
Filter + ESD Channel 5
Filter + ESD Channel 6
Filter + ESD Channel 7
Filter + ESD Channel 8
2
2
3
3
4
4
5
5
8
6
6
7
7
8
GND PAD
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish
Ordering Part
Number1
Ordering Part
Number1
Pins
12
Package
TDFN-12
TDFN-12
TDFN-16
Part Marking
Part Marking
N09EE
-
-
CM1409-E6DE
CM1409-06DE
CM1409-08DE
12
CM1409-06DF
CM1409-08DF
N09F
N098F
N09E
16
N098E
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
© 2006 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 06/16/06
PRELIMINARY
CM1409
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
-65 to +150
100
UNITS
°C
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
mW
mW
500
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL PARAMETER
CONDITIONS
MIN
80
TYP
100
30
MAX
120
36
UNITS
Ω
R
Resistance
CTOTAL
Total Channel Capacitance
At 2.5VDC Reverse Bias, 1MHz,
30mVAC
24
pF
C
Capacitance C1
At 2.5VDC Reverse Bias, 1MHz,
30mVAC
12
15
18
pF
VDIODE
ILEAK
VSIG
Standoff Voltage
IDIODE=10μA
6.0
0.1
V
Diode Leakage Current (reverse bias)
1.0
μA
VDIODE=+3.3V
Signal Clamp Voltage
Positive Clamp
ILOAD = 10mA
ILOAD = -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
Negative Clamp
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2 and 3
30
15
kV
kV
b) Contact Discharge per IEC 61000-4-
2 Level 4
RDYN
Dynamic Resistance
Positive
2.3
0.9
Ω
Ω
Negative
Cut-off Frequency
Channel R = 100Ω,
Channel C = 15pF
fC
ZSOURCE=50Ω, ZLOAD=50Ω
110
35
MHz
dB
Absolute Attenuation @ 1GHz from 0dB
Level
ZSOURCE = 50Ω, Z LOAD = 50Ω,
DC Bias = 0V; Notes 1, 4 and 5
A1GHz
Absolute Attenuation @ 800MHz to
6GHz from 0dB Level
ZSOURCE = 50Ω, Z LOAD = 50Ω,
DC Bias = 0V; Notes 1, 4 and 5
30
dB
A800MHz -
6GHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: These parameters are guaranteed by design and characterization.
Note 4: Attenuation / RF curves characterized by a network analyzer using microprobes.
Note 5: These parameters are NOT guaranteed by design, characterization and production.
© 2006 California Micro Devices Corp. All rights reserved.
06/16/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
PRELIMINARY
CM1409
Performance Information
Typical EMI Filter Performance (T =25°C, DC Bias=0V, 50 Ohm Environment)
A
Figure 1. Insertion Loss vs. Frequency (Filter Input to GND)
Typical Diode Capacitance vs. Input Voltage
DC Voltage
Figure 2. Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5VDC and 25°C)
© 2006 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 06/16/06
PRELIMINARY
CM1409
Mechanical Details
TDFN-12 Mechanical Specifications
Mechanical Package Diagrams
The CM1409-06DF/DE is supplied in an 12-lead,
0.5mm pitch TDFN package. Dimensions are pre-
sented below.
D
For complete information on the TDFN-12, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
12 11 10 9 8 7
Pin 1
Marking
PACKAGE DIMENSIONS
Package
TDFN
1 2 3 4 5 6
TOP VIEW
✝
JEDEC
No.
MO-229C
Leads
12
Millimeters
Nom
Inches
Nom
0.10
C
Dim.
Min
Max
Min
Max
A
A3
b
0.70
0.75
0.80 0.028 0.030 0.031
0.008 REF
0.20 REF
0.25
A3
SIDE VIEW
0.20
2.90
2.40
1.25
0.35
0.30 0.008 0.010 0.012
3.10 0.114 0.118 0.122
2.60 0.095 0.098 0.102
1.45 0.049 0.053 0.057
0.45 0.014 0.016 0.018
0.020 BSC
A
b
D
3.00
D2
E
2.50
8X
M
0.10
C A B
e
1.35
E2
E2
e
0.40
Pin 1
Locator
1
2
3
4
5
6
7
0.50 BSC
C0.2
GND PAD
K
0.20
0.20
0.008
12 11 10
9
8
L
0.25
0.30 0.008 0.010 0.012
3000 pieces
K
# per
tape and
reel
D2
L
BOTTOM VIEW
Controlling dimension: millimeters
✝
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
Dimensions for 12-Lead, 0.5mm pitch
TDFN package
© 2006 California Micro Devices Corp. All rights reserved.
06/16/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
PRELIMINARY
CM1409
Mechanical Details (cont’d)
TDFN-12 Mechanical Specifications
Mechanical Package Diagrams
The CM1409-E6DE is supplied in an 12-lead, 0.5mm
pitch TDFN package. Dimensions are presented
below.
D
For complete information on the TDFN-12, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
12 11 10 9 8 7
Pin 1
Marking
PACKAGE DIMENSIONS
Package
TDFN
1 2 3 4 5 6
TOP VIEW
✝
JEDEC
No.
MO-229C
Leads
12
Millimeters
Nom
Inches
Nom
0.10
C
Dim.
Min
Max
Min
Max
A
A3
b
0.70
0.75
0.80 0.028 0.030 0.031
0.008 REF
0.20 REF
0.25
A3
SIDE VIEW
0.20
2.90
2.10
1.25
0.25
0.30 0.008 0.010 0.012
3.10 0.114 0.118 0.122
2.30 0.083 0.087 0.091
1.45 0.049 0.053 0.057
0.35 0.008 0.012 0.014
0.020 BSC
A
b
D
3.00
D2
E
2.20
8X
M
0.10
C A B
e
1.35
E2
E2
e
0.30
Pin 1
1
2
3
4
5
6
7
Locator
0.50 BSC
C0.2
GND PAD
12 11 10
K
0.20
0.20
0.008
9
8
L
0.25
0.30 0.008 0.010 0.012
0.008 REF
K
M
N
0.20 REF
0.25 REF
N
D2
M
L
0.010 REF
# per
tape and
reel
3000 pieces
BOTTOM VIEW
Controlling dimension: millimeters
Dimensions for 12-Lead, 0.5mm pitch
TDFN package
✝
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
Cirtek POD-CEC-DFN12-015 3.00x1.35mm, 0.5mm pitch 12L TDFN
© 2006 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 06/16/06
PRELIMINARY
CM1409
Mechanical Details (cont’d)
TDFN-16 Mechanical Specifications
Mechanical Package Diagrams
The CM1409-08DE/DF is supplied in an 16-lead,
0.5mm pitch TDFN package. Dimensions are pre-
sented below.
D
For complete information on the TDFN-16, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
16 15 14 13 12
11 10 9
Pin 1
Marking
PACKAGE DIMENSIONS
Package
TDFN
1 2 3 4 5 6 7 8
TOP VIEW
✝
JEDEC
No.
MO-229C
Leads
16
Millimeters
Nom
Inches
Nom
0.10
C
Dim.
Min
Max
Min
Max
A
A3
b
0.70
0.75
0.80 0.028 0.030 0.031
0.008 REF
0.20 REF
0.25
A3
SIDE VIEW
0.20
3.90
3.10
1.50
0.30
0.30 0.008 0.010 0.012
4.10 0.153 0.157 0.161
3.30 0.122 0.126 0.130
1.70 0.059 0.063 0.067
0.50 0.012 0.016 0.020
0.020 BSC
A
D
4.00
D2
E
3.20
e
b
1.60
E2
E2
e
0.40
Pin 1
1
2
3
4
5
6
7
8
9
Locator
0.50 BSC
C0.2
GND PAD
K
0.20
0.20
0.008
16 15 14 13 12 11 10
L
0.30
0.40 0.008 0.010 0.012
0.010 REF
K
M
0.25 REF
D2
M
L
# per
tape and
reel
3000 pieces
BOTTOM VIEW
Controlling dimension: millimeters
✝
Dimensions for 16-Lead, 0.5mm pitch
TDFN package
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
Cirtek POD-CEC-DFN16-013 4.00x1.60mm, 0.5mm pitch 16L TDFN
© 2006 California Micro Devices Corp. All rights reserved.
06/16/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
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