CM1410 [CALMIRCO]
4 Channel Headset EMI Filter with ESD Protection; 4通道耳机EMI滤波器与ESD保护
| 型号： | CM1410 |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | 4 Channel Headset EMI Filter with ESD Protection |
| 文件： | 总7页 (文件大小：493K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CM1410
4 Channel Headset EMI Filter with ESD Protection
Product Description
Features
•
Functionally and pin compatible with CSPEMI200A
The CM1410 is a quad low-pass filter array integrating
four pi-style filters (C-R-C) that reduce EMI/RFI emis-
sions while at the same time providing ESD protection.
This device is custom-designed to interface with the
headset port on a cellular telephone, and contains 3
different filter values. Each high quality filter provides
more than 20dB attenuation in the 800-2700 MHz
range. These pi-style filters support bidirectional filter-
ing, controlling EMI both to and from the microphone
and speaker elements. They also support bipolar sig-
nals, enabling audio signals to pass through without
distortion.
device
•
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
•
•
•
•
Four channels of EMI filtering with ESD protection
Includes 1 channel of ESD-only protection
Greater than 30dB attenuation at 1GHz
+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+15kV ESD protection on each channel (HBM)
Supports bipolar signals—ideal for
audio applications
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
11-bump, 2.046mm X 1.436mm footprint
Chip Scale Package (CSP)
•
•
•
In addition, the CM1410 provides a very high level of
protection for sensitive electronic components that may
be subject to electrostatic discharge (ESD). The
CM1410 can safely dissipate ESD strikes of +8kV, the
maximum requirement of the IEC 61000-4-2 interna-
tional standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than +15kV. The CM1410 also includes a sin-
gle channel of ESD-only protection.
•
•
•
Optiguard™ coated for improved reliability at
assembly
Lead-free version available
Applications
The CM1410 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight.
•
•
•
•
•
•
•
EMI filtering and ESD protection for audio ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
The CM1410 incorporates Optiguard™ coating which
results in improved reliability at assembly.The CM1410
is available in a space-saving, low-profile Chip Scale
Package with optional lead-free finishing.
Desktop PCs
Electrical Schematic
10
Ω
Ω
100
Ω
C3
A3
A4
B2
B1
C1
C2
MIC_OUT1
MIC_OUT2
SPKR_IN1
SPKR_IN2
SPKR_OUT1
SPKR_OUT2
ESD1
MIC_IN1
10
68Ω
C4
A2
MIC_IN2
B3
B4
GND
GND
© 2005 California Micro Devices Corp. All rights reserved.
09/15/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
1
CM1410
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2
C1
C2
C3
C4
A
B
C
MIC_IN1
ESD1
GND
GND
B1
B2
B3
B4
N103
MIC_IN2 SPKR_OUT1 SPKR_OUT2
Orientation
Marking
A2
A3
A4
A1
CM1410
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
A1
A2
A3
A4
B1
B2
B3
B4
C1
C2
C3
C4
NAME
N.B.
DESCRIPTION
No Bump – used for orientation / alignment
Microphone Input 2 (from microphone)
Speaker Output 1 (to speaker)
MIC_IN2
SPKR_OUT1
SPKR_OUT2
MIC_IN1
ESD1
Speaker Output 2 (to speaker)
Microphone Input 1 (from microphone)
ESD Protection Input. Provides a channel specifically for ESD protection purposes.
Device Ground
GND
GND
Device Ground
MIC_OUT1
MIC_OUT2
SPKR_IN1
SPKR_IN2
Microphone Output 1 (to audio circuitry)
Microphone Output 2 (to audio circuitry)
Speaker Input 1 (from audio circuitry)
Speaker Input 2 (from audio circuitry)
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Ordering Part
Bumps
Package
Number1
Part Marking
Number1
Part Marking
11
CSP
CM1410-03CS
N103
CM1410-03CP
N103
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
09/15/05
CM1410
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
-65 to +150
100
UNITS
°C
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
mW
mW
400
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
(NOTE 1)
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R1
R2
Resistance 1
90
100
110
75
Ω
Resistance 2
61
9
68
10
Ω
Ω
R3
Resistance 3
11
C1
Capacitance 1
Capacitance 2
Diode Leakage Current
38
80
47
57
pF
pF
μA
C2
100
120
1.0
ILEAK
VSIG
VIN=5.0V
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
5
-15
7
-10
15
-5
V
V
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2,4 and 5
15
8
kV
kV
b) Contact Discharge per IEC 61000-4-2
Level 4
VCL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2,3,4 and 5
+15
-19
V
V
Negative Transients
fC1
fC2
fC3
Cut-off frequency 1; Note 6
Cut-off frequency 2; Note 6
Cut-off frequency 3; Note 6
R = 100Ω, C = 47pF
R = 68Ω, C = 47pF
R = 10Ω, C = 100pF
53
61
33
MHz
MHz
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design and characterization.
Note 6: ZSOURCE=50Ω, ZLOAD=50Ω.
© 2005 California Micro Devices Corp. All rights reserved.
09/15/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
3
CM1410
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance
Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
09/15/05
CM1410
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance
Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
09/15/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
5
CM1410
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
0.275mm
Pad Size on PCB
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50μm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 6. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 7. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
09/15/05
CM1410
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
The CM1410 is supplied in a custom Chip Scale Pack-
age (CSP). Dimensions are presented below. For com-
plete information on the CSP, see the California Micro
Devices CSP Package Information document.
BOTTOM VIEW
A1
OptiGuardTM
Coating
C1
B1
PACKAGE DIMENSIONS
C
B
A
Package
Bumps
Custom CSP
11
Millimeters
Nom Max
Inches
Nom
Dim
Min
Min
Max
1
2
3
4
D1
D2
A1
A2
B1
B2
C1
C2
D1
D2
2.001 2.046 2.091 0.0788 0.0806 0.0823
1.391 1.436 1.481 0.0548 0.0565 0.0583
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.223 0.273 0.323 0.0088 0.0107 0.0127
0.168 0.218 0.268 0.0066 0.0086 0.0106
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1410
Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
B0 X A0 X K0
P0
P1
PART NUMBER
CHIP SIZE (mm)
CM1410
2.05 X 1.44 X 0.644
2.29 X 1.60 X 0.81
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
Po
±
Top
Cover
Tape
Ao
W
Bo
Ko
For Tape Feeder Reference
Embossment
Only including Draft.
P1
Center Lines
of Cavity
Concentric Around B.
User Direction of Feed
Figure 8. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
09/15/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
7
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