CM1240-04DE [CALMIRCO]

Dual-Voltage ESD Protection Array for USB Port; 双电压ESD保护阵列的USB端口
CM1240-04DE
型号: CM1240-04DE
厂家: CALIFORNIA MICRO DEVICES CORP    CALIFORNIA MICRO DEVICES CORP
描述:

Dual-Voltage ESD Protection Array for USB Port
双电压ESD保护阵列的USB端口

文件: 总6页 (文件大小:141K)
中文:  中文翻译
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CM1240  
Dual-Voltage ESD Protection Array for USB Port  
channel of the CM1240 is a high voltage (HV) diode  
which has a capacitance of 25pF enabling it to protect  
power supply inputs or OLED power rails, etc.  
Features  
4 channels of ESD Protection  
8kV ESD protection (IEC 61000-4-2, contact  
discharge)  
The parts integrate avalanche-type ESD diodes, which  
provide a very high level of protection for sensitive  
electronic components that may be subjected to  
electrostatic discharge (ESD). The ESD protection  
diodes are designed and characterized to safely  
dissipate ESD strikes of 8kV, the maximum  
requirement of the IEC61000-4-2 international  
standard. Using the MIL-STD-883 (Method 3015)  
specification for Human Body Model (HBM) ESD, the  
pins are protected for contact discharges of greater  
than 16kV.  
16kV ESD protection (HBM)  
SOT-563  
TDFN-8, 1.70mm x 1.35mm, 0.4mm pitch  
TDFN-8, 2mm x 2mm, 0.5mm pitch  
Lead free  
16V clamp on Vcc  
Applications  
USB and Mini-USB applications  
I/O port protection for mobile handsets  
Wireless handsets  
This device is particularly well suited for portable  
electronics (e.g. wireless handsets, PDAs, notebook  
computers) because of its small package format and  
easy-to-use pin assignments. In particular, the  
CM1240 is ideal for protecting USB or mini USB ports  
operating at full speed (12Mbps).  
Product Description  
California Micro Devices’ CM1240 is a four channel  
ESD protection array. Three channels of the CM1240  
are low voltage (LV) diodes, which have a capacitance  
of 7pF enabling them to protect high speed I/O ports  
while providing robust ESD protection. The other  
The CM1240 is available in a space saving, low profile,  
lead-free TDFN-8 or SOT-563 package.  
PACKAGE / PINOUT DIAGRAMS  
TDFN-8  
SOT-563  
D1  
D2  
1
NC  
NC  
5
6
1
2
3
6
5
4
D1  
D2  
GND  
D3  
2
DAP  
NC  
NC  
7
8
D3  
3
4
VCC  
GND  
VCC  
Ordering Information  
PART NUMBERING INFORMATION  
Lead-free Finish  
Ordering Part Number  
Leads  
Package  
SOT-563  
Part Marking  
L40  
6
8
8
CM1240-F4SE  
CM1240-04DE  
CM1240-04D4  
TDFN-0.5mm  
TDFN-0.4mm  
L40 4E  
L4  
PIN DESCRIPTIONS  
© 2007 California Micro Devices Corp. All rights reserved.  
5/16/07  
490 N. McCarthy Blvd., Milpitas, CA 95035-5112  
l
Tel: 408.263.3214  
l
Fax: 408.263.7846  
l
www.cmd.com  
1
CM1240  
Specifications  
SOT-563  
PIN#  
TDFN  
PIN#  
NAME  
DESCRIPTION  
1
2
5
3
4
6
1
2
D1  
D2  
Cathode connection for Low Voltage ESD diode  
Cathode connection for Low Voltage ESD diode  
Cathode connection for Low Voltage ESD diode  
Cathode connection for High Voltage ESD diode  
No connect  
3
D3  
4
Vcc  
NC  
5
6
NC  
No connect  
7
NC  
No connect  
8
NC  
No connect  
DAP  
GND  
GND  
Anode-side connection for all ESD diodes  
Anode-side connection for all ESD diodes  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
RATING  
UNITS  
ESD Protection (HBM)  
Pin Voltages  
16  
kV  
Vcc to GND  
All other pins to GND  
[GND - 0.3] to +13  
[GND - 0.3] to +5.5  
V
V
Storage Temperature Range  
–65 to +150  
300  
°C  
°C  
Lead Temperature (soldering, 10sec)  
STANDARD OPERATING CONDITIONS  
PARAMETER  
RATING  
UNITS  
Operating temperature range  
–40 to +85  
°C  
© 2007 California Micro Devices Corp. All rights reserved.  
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112  
l
Tel: 408.263.3214  
l
Fax: 408.263.7846  
l
www.cmd.com  
5/16/07  
CM1240  
Specifications  
(NOTE 1)  
ELECTRICAL OPERATING CHARACTERISTICS  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
CLV  
CHV  
LV diode Capacitance at 3Vdc; 1MHz, 30mVac  
HV diode Capacitance at 3Vdc; 1MHz, 30mVac  
6
pF  
25  
pF  
μA  
μA  
ILV  
0.01  
0.01  
0.4  
0.4  
LV Diode Leakage at +3.3V reverse bias voltage  
HV Diode Leakage at +11V reverse bias voltage  
IHV  
VCL(LV)  
LV Diode Signal Clamp Voltage:  
Positive Clamp, 10mA  
5.6  
–1.5  
6.8  
–0.8  
9
–0.4  
V
V
Negative Clamp, –10mA  
VCL(HV)  
HV Diode Signal Clamp Voltage:  
Positive Clamp, 10mA  
13  
–1.5  
16  
–0.8  
19  
–0.4  
V
V
Negative Clamp, –10mA  
VESD  
In-system ESD withstand voltage:  
Note 2  
Human Body Model (MIL-STD-883, method 3015)  
IEC 61000-4-2, contact discharge method  
±25  
±12  
kV  
kV  
RDYN(LV) LV Diode Dynamic Resistance:  
Positive  
Negative  
2.8  
1.2  
Ω
Ω
RDYN(HV) HV Diode Dynamic Resistance:  
Positive  
Negative  
1
0.7  
Ω
Ω
Note 1: Guaranteed at 25°C only  
Note 2: ESD applied to input/output pins with respect to GND, one at a time. These parameters are guaranteed by design.  
© 2007 California Micro Devices Corp. All rights reserved.  
5/16/07  
490 N. McCarthy Blvd., Milpitas, CA 95035-5112  
l
Tel: 408.263.3214  
l
Fax: 408.263.7846  
l
www.cmd.com  
3
CM1240  
Mechanical Details  
SOT-563 Mechanical Specifications  
Mechanical Package Diagrams  
The CM1240 is supplied in a 6-pin SOT-563 package.  
Dimensions are presented below.  
TOP VIEW  
PACKAGE DIMENSIONS  
0.20  
A-B  
2X  
C
D
e1  
5
Package  
Leads  
SOT-563  
6
D
Millimeters  
Nom  
Inches  
Nom  
6
1
4
Dim.  
Min  
0.50  
0.17  
0.08  
Max  
Min  
Max  
A
b
0.55  
0.60 0.020 0.022 0.024  
0.27 0.007 0.009 0.011  
E1  
E
2X  
0.22  
0.20  
C D  
2
3
c
0.18 0.003  
0.007  
Pin 1  
Marking  
0.20 c  
e
b
D
E
1.60 BSC  
1.60  
0.063 BSC  
2X  
1.50  
1.70 0.059 0.063 0.067  
0.047 BSC  
E1  
e
1.20 BSC  
0.50 BSC  
1.00 BSC  
0.20 BSC  
SIDE VIEW  
A
0.020 BSC  
e1  
L
0.040 BSC  
0.10  
C
0.008 BSC  
SEATING  
PLANE  
# per  
tape and  
reel  
5000 pieces  
C
Controlling dimension: millimeters  
END VIEW  
c
L
* For best results, both grounds should be connected  
Package Dimensions for SOT-563.  
© 2007 California Micro Devices Corp. All rights reserved.  
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112  
l
Tel: 408.263.3214  
l
Fax: 408.263.7846  
l
www.cmd.com  
5/16/07  
CM1240  
Mechanical Details (cont’d)  
TDFN-08 Mechanical Specifications  
Mechanical Package Diagrams  
The CM1240 is supplied in an 8-lead 0.5mm TDFN  
package. Dimensions are presented below.  
D
For complete information on the TDFN-08, see the  
California Micro Devices TDFN Package Information  
document.  
8 7 6 5  
PACKAGE DIMENSIONS  
Package  
TDFN  
*
JEDEC  
No.  
MO-229 (Var. VCCD-3)  
Pin 1  
Marking  
Leads  
8
Millimeters  
Nom  
Inches  
Nom  
Dim.  
Min  
Max  
Min  
Max  
A
A3  
b
0.70  
0.75  
0.80 0.028 0.030 0.031  
0.008 REF  
1 2 3 4  
TOP VIEW  
0.20 REF  
0.25  
0.20  
1.90  
1.50  
1.90  
0.80  
0.30 0.008 0.010 0.012  
2.10 0.075 0.079 0.083  
1.70 0.059 0.063 0.067  
2.10 0.075 0.079 0.083  
1.00 0.031 0.035 0.039  
0.020 BSC  
D
2.00  
0.10  
C
D2  
E
1.60  
2.00  
E2  
e
0.90  
0.50 BSC  
A
A3  
SIDE VIEW  
K
0.20  
0.20  
0.008  
L
0.30  
0.40 0.008 0.012 0.016  
3000 pieces  
# per  
tape and  
reel  
1 2 3 4  
Controlling dimension: millimeters  
D2  
GND PAD  
*
This package is compliant with JEDEC standard MO-229, variation  
C0.25  
VCCD-3 with exception of the D2 and E2 dimensions as called out in  
the table above and the r1 dimension which is not specified in the  
MO-229 standard.  
L
R
8 7 6 5  
K
b
e
8X  
M
0.10  
C A B  
BOTTOM VIEW  
Package Dimensions for 8-Lead, 0.5mm pitch  
TDFN package  
© 2007 California Micro Devices Corp. All rights reserved.  
5/16/07  
490 N. McCarthy Blvd., Milpitas, CA 95035-5112  
l
Tel: 408.263.3214  
l
Fax: 408.263.7846  
l
www.cmd.com  
5
CM1240  
Mechanical Details (cont’d)  
TDFN-08 Mechanical Specifications  
Mechanical Package Diagrams  
Dimensions for the CM1240 supplied in a 8-lead,  
0.4mm pitch TDFN package are presented below.  
D
PACKAGE DIMENSIONS  
8 7 6 5  
Package  
TDFN  
*
JEDEC  
No.  
MO-229C  
Pin 1  
Marking  
Leads  
8
Millimeters  
Nom  
Inches  
Nom  
Dim.  
1 2 3 4  
TOP VIEW  
Min  
0.70  
0.00  
Max  
Min  
Max  
A
A1  
A3  
b
0.75  
0.80 0.028 0.030 0.031  
0.05 0.000 0.001 0.002  
0.008 REF  
0.02  
0.200 REF  
0.20  
0.10  
C
0.15  
1.60  
1.10  
1.25  
0.30  
0.25 0.006 0.008 0.010  
1.80 0.063 0.067 0.071  
1.30 0.043 0.047 0.051  
1.45 0.049 0.053 0.057  
0.50 0.012 0.016 0.020  
0.016 BSC  
D
1.70  
0.08  
C
D2  
E
1.20  
A1  
A3  
SIDE VIEW  
1.35  
A
b
E2  
e
0.40  
0.40 BSC  
8X  
M
0.10  
C A B  
K
0.20  
0.15  
0.008  
e
L
0.25  
0.35 0.006 0.010 0.014  
3000 pieces  
E2  
# per  
tape and  
reel  
Pin 1  
1
2
3
4
Locator  
GND  
PAD  
C0.2  
7
Controlling dimension: millimeters  
8
6
5
K
*
D2  
This package is compliant with JEDEC standard MO-229C with the  
L
exception of the D, D2, E, E2, K and L dimensions as called out in  
the table above.  
BOTTOM VIEW  
Recommend PCB Land Pattern  
Dimensions for 8-Lead, 0.4mm pitch  
TDFN package  
0.40  
0.30  
0.70  
Note: Dimensions in millimeters. Drawing not to scale.  
© 2007 California Micro Devices Corp. All rights reserved.  
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112  
l
Tel: 408.263.3214  
l
Fax: 408.263.7846  
l
www.cmd.com  
5/16/07  

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