CM1205-16CS [CALMIRCO]
ESD Protection Arrays, Chip Scale Package; ESD保护阵列，芯片级封装
| 型号： | CM1205-16CS |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | ESD Protection Arrays, Chip Scale Package |
| 文件： | 总7页 (文件大小：167K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CM1205
ESD Protection Arrays, Chip Scale Package
Product Description
Features
•
Functionally and pin compatible with CAMD’s
PACDN1404C, PACDN1408C and PACDN1416C
family of ESD protection devices
4, 8, or 16 transient voltage suppressors in a single
package
OptiguardTM coated for improved reliability at
assembly
In-system Electrostatic Discharge (ESD) protection
to +25kV contact discharge per IEC 61000-4-2
international standard
Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
Lead-free versions available
The CM1205 family of transient voltage suppressor
arrays provides a very high level of protection for sensi-
tive electronic components that may be subjected to
ESD.
•
•
•
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard (Level 4, +8kV contact dis-
charge). All I/Os are rated at +25kV using the IEC
61000-4-2 contact discharge method. Using the MIL-
STD-883D (Method 3015) specification for Human
Body Model (HBM) ESD, all pins are protected for con-
tact discharges to greater than +30kV.
•
•
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill.
Applications
•
•
ESD protection for sensitive electronic equipment
I/O port, keypad and button circuitry protection for
portable devices
The CM1205 features OptiGuardTM coating for
improved reliability at assembly and is available with
optional lead-free finishing.
•
•
•
•
•
•
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Cameras and Camcorders
Notebooks
Desktop PCs
Electrical Schematic
B1 B2 B3
B4 B5
B1 B2
B3
D1 D2 D3
D4 D5
A1 A2 A3
A4 A5
A1 A2
A3
C1 C2 C3
B1 B2 B3
C4 C5
B4 B5
CM1205-04CS/CP
CM1205-08CS/CP
A1 A2 A3
A4 A5
CM1205-16CS/CP
© 2003 California Micro Devices Corp. All rights reserved.
11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
1
CM1205
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
1
2
3
(see note 2)
B1
A1
B2
A2
B3
A3
A
B
L05
CM1405-04
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
1
2
3
4
5
(see note 2)
B1
A1
B2
A2
B3
A3
B4
A4
B5
A5
A
B
120508
CM1405-08
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
1
2
3
4
5
(see note 2)
A
D1
D2
C2
B2
A2
D3
C3
B3
A3
D4
C4
B4
A4
D5
B
C
D
C1
B1
A1
C5
B5
A5
120516
CM1405-16
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
2
Standard Finish
Lead-free Finish
Ordering Part
Ordering Part
1
1
Bumps
Package
CSP
Number
Part Marking
L05
Number
Part Marking
L05
6
CM1205-04CS
CM1205-08CS
CM1205-16CS
CM1205-04CP
CM1205-08CP
CM1205-16CP
10
20
CSP
120508
120516
120508
120516
CSP
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
11/17/03
CM1205
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
°C
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
1
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL PARAMETER
CONDITIONS
=10µA
MIN
TYP
MAX
UNITS
V
Reverse Standoff Voltage
I
5.5
V
REV
DIODE
I
Leakage Current
V =3.3V DC
100
nA
LEAK
IN
V
Signal Clamp Voltage
Positive Clamp
I
= 10mA
LOAD
SIG
5.6
-1.2
6.8
-0.8
8.0
-0.4
V
V
Negative Clamp
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2 & 3
ESD
+30
+25
kV
kV
b) Contact Discharge per IEC 61000-4-2
Level 4
V
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2 & 3
CL
+12
-8
V
V
Negative Transients
C
Channel Capacitance
At 2.5V DC, f = 1MHz
39
47
pF
Note 1: TA=25°C unless otherwise specified. GND in this document refers to the lower supply voltage.
Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground.
Note 3: These parameters are guaranteed by design and characterization.
© 2003 California Micro Devices Corp. All rights reserved.
11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
3
CM1205
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
0.300mm
Round
Pad Size on PCB
Pad Shape
Pad Definition
Non-Solder Mask defined pads
0.350mm Round
0.125 - 0.150mm
0.360mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50µm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.300mm DIA.
Solder Stencil Opening
0.360mm DIA.
Solder Mask Opening
0.350mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
11/17/03
CM1205
Mechanical Details
The CM1205 devices are packaged in custom Chip
Scale Packages (CSP).
CM1205-04CS/CP 6-bump CSP Mechanical Specifications
The CM1205-04CS/CP devices are packaged in a 6-
bump custom Chip Scale Package (CSP). Dimensions
are presented below.
Mechanical Package Diagrams
BOTTOM VIEW
OptiGuardTM
Coating
A1
PACKAGE DIMENSIONS
C1
Package
Bumps
Custom CSP
6
B1
3
2
1
Millimeters
Nom Max
Inches
Nom
Dim
Min
Min
Max
A1
A2
B1
B2
B3
C1
C2
D1
D2
1.109 1.154 1.199 0.0437 0.0454 0.0472
1.759 1.804 1.849 0.0693 0.0710 0.0728
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.638 0.707 0.776 0.0251 0.0278 0.0306
0.394 0.445 0.495 0.0155 0.0175 0.0195
B
A
D1
D2
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
SIDE
VIEW
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1205-04CS/CP
6-bump Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
QTY
PER
REEL
POCKET SIZE (mm)
B X A X K
TAPE WIDTH
W
REEL
DIA.
P
P
1
PART NUMBER
CHIP SIZE (mm)
0
0
0
0
CM1205-04CS/CP
1.804 X 1.154 X
0.644
1.98 X 1.32 X 0.91
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
P
Center Lines
of Cavity
1
Concentric around B.
User Direction of Feed
Figure 4. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
5
CM1205
Mechanical Details (cont’d)
CM1205-08CS/CP 10-bump CSP Mechanical Specifications
The CM1205-08CS/CP devices are packaged in a 10-
bump custom Chip Scale Package (CSP). Dimensions
are presented below.
Mechanical Package Diagrams
BOTTOM VIEW
OptiGuardTM
Coating
PACKAGE DIMENSIONS
A1
C1
Package
Bumps
Custom CSP
10
B1
5
4
3
2
1
Millimeters
Nom Max
Inches
Nom
Dim
Min
Min
Max
A1
A2
B1
B2
C1
C2
D1
D2
1.109 1.154 1.199 0.0437 0.0454 0.0472
3.059 3.104 3.149 0.1204 0.1222 0.1240
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.638 0.707 0.776 0.0251 0.0278 0.0306
0.394 0.445 0.495 0.0155 0.0175 0.0195
B
A
D1
D2
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
# per tape and
reel
3500 pieces
NOTE: DIMENSIONS IN MILLIMETERS
Controlling dimension: millimeters
Package Dimensions for CM1205-08CS/CP
10-bump Chip Scale Package
CSP Tape and Reel Specifications
QTY
PER
POCKET SIZE (mm)
B X A X K
TAPE WIDTH
W
REEL
P
P
1
PART NUMBER
CHIP SIZE (mm)
DIAMETER REEL
0
0
0
0
CM1205-08CS/CP 3.104 X 1.154 X 0.644
3.28 X 1.32 X 0.81
8mm
178mm (7") 3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
Center Lines
of Cavity
P
1
Concentric around B.
User Direction of Feed
Figure 5. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
11/17/03
CM1205
Mechanical Details (cont’d)
CM1205-16CS/CP 20-bump CSP Mechanical Specifications
The CM1205-16CS/CP devices are packaged in a 20-
bump custom Chip Scale Package (CSP). Dimensions
are presented below.
Mechanical Package Diagrams
BOTTOM VIEW
OptiGuardTM
Coating
PACKAGE DIMENSIONS
A1
C1
B1
Package
Bumps
Custom CSP
20
Millimeters
Nom Max
Inches
Nom
5
4
3
2
1
Dim
Min
Min
Max
A1
A2
B1
B2
C1
C2
D1
D2
2.409 2.454 2.499 0.0948 0.0966 0.0984
3.059 3.104 3.149 0.1204 0.1222 0.1240
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.638 0.707 0.776 0.0251 0.0278 0.0306
0.394 0.445 0.495 0.0155 0.0175 0.0195
B
A
D
C
D1
D2
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
SIDE
VIEW
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
# per tape and
reel
3500 pieces
DIMENSIONS IN MILLIMETERS
Controlling dimension: millimeters
Package Dimensions for CM1205-16CS/CP
20-bump Chip Scale Package
CSP Tape and Reel Specifications
QTY
PER
POCKET SIZE (mm)
B X A X K
TAPE WIDTH
W
REEL
P
P
1
PART NUMBER
CHIP SIZE (mm)
DIAMETER REEL
0
0
0
0
CM1205-16CS/CP 3.104 X 2.454 X 0.644
3.28 X 2.64 X 0.86
8mm
178mm (7") 3500 4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
P
Center Lines
of Cavity
1
Concentric around B.
User Direction of Feed
Figure 6. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
7
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