2DEA-2-W20TLF [BOURNS]

Trans Voltage Suppressor Diode, Bidirectional, 20 Element, Silicon, ROHS COMPLIANT, MS-013, SOIC-20;


型号：	2DEA-2-W20TLF
厂家：	BOURNS ELECTRONIC SOLUTIONS
描述：	Trans Voltage Suppressor Diode, Bidirectional, 20 Element, Silicon, ROHS COMPLIANT, MS-013, SOIC-20 局域网光电二极管
文件：	总3页 (文件大小：260K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Features

■ Lead free versions available

■ RoHS compliant (lead free version)*

■ Incorporates 40 bi-directional PN

junction diodes

■ Small form factor replaces 20 SOT23

packages

■ Supports 15 KV IEC 61000-4-2 ESD

equipment specification*

■ Single device protects as many as 20 lines

on exposed pins, communications ports

Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array

General Information

Package Schematic

The Model 2DEA Series is well-suited for space constrained

designs where the requirements of international ESD standard

specification IEC 61000-4-2 must be met.

VDD

VSS

24 23 22 21 20 19 18 17 16 15 14 13

These highly integrated PN junction diode arrays are espe-

cially effective for use in PC notebooks and motherboards,

engineering workstations and portable battery-powered

devices such as PDAs and cellular phones.

Space savings, as compared to popular BA V99 SOT23

based implementations, can yield a 75 % reduction in

utilized board area. In addition, significant assembly cost

reductions and manufacturing integrity improvements can

be realized.

VSS

10 11 12

VDD

Two package options are available. Model 2DEA consists of

20 bi-directional diode pairs in a miniature 24-pin JEDEC

QSOP package. The 2DEB consists of 17 bi-directional

diode pairs in a traditional wide-body SOIC JEDEC package.

Electrical & Environmental Characteristics

Electrical Characteristics

Supply Voltage

Symbol

- V

Minimum

-0.3

Nominal

Maximum

Unit

Voltage @ any Channel

Channel Clamp Current (continuous)

Forward Voltage:

-0.3

+ 0.5

@I = 1 mA

@I = 12 mA

0.8

0.1

0.9

1.5

Leakage Current @ V <V <V

= 12 V

µA

SS in DD

Diode Capacitance

Environmental Characteristics

Operating Temperature

-55

-65

+125

+150

°C

Storage Temperature

Diode Power Rating

stg

mW/diode

ESD Performance Withstand*:

Contact Discharge

Air Discharge

* Note: IEC 61000-4-2 ESD test performance is measured at the systems level and system designs, enclosure shielding and other conventional ESD control measures usually influence

the results of these tests. Testing on the component level serves as an indicator that the system passes a specific compliance step, but does not ensure that the system passes at that

level. The Model 2DEA/DEB device, therefore, can support successful implementation of the IEC 61000-4-2 system level ESD standard.

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Applications

■ Parallel printer ports, communication ports

■ Hot-swappable designs

■ IC protection

Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array

Mechanical Characteristics

QSOP Package Dimensions

Wide-Body SOIC Package Dimensions

12.66 - 12.86

(.496 - .505)

1.27

.635

(.025)

TYP.

0.66

(.026)

REF

TYP.

(0.50)

3.81 - 3.99

(.150 - .157)

7.40 - 7.60

(.291 - .299)

0.38 - 0.48

PIN 1

(.014 - .016)

.21 - .31

(.008 - .012)

PIN 1

2.44 - 2.64

(.096 - .104)

1.35 - 1.75

(.053 - .069)

0.10 - 0.30

(.004 - .012)

.10 - .25

(.004 - .010)

0.23 - 0.32

(.0091 - .0125)

.19 - .25

(.007 - .010)

0-8 °

10.11 - 10.51

(.398 - .414)

0-8°

.41 - 1.27

(.016 - .050)

5.80 - 6.20

(.228 - .244)

Governing dimensions are in mm. Dimensions in

parentheses are in inches and are approximate.

JEDEC Reference Number MS-013.

Model

2QSP24

8.56 - 8.74 (.337 - .344)

Governing dimensions are in mm. Dimensions in

parentheses are in inches and are approximate.

JEDEC Reference Number MO-137.

QSOP Package Power Temperature Derating Curve

Wide-Body SOIC Package Power Temperature Derating Curve

1.25

WBSOIC20

1.0

2QSP24

.75

.50

.25

.75

.50

.25

100

125

150

100

125

150

AMBIENT TEMPERATURE ( C )

Standard Part Numbers

Part Number

(Tape & Reel)

Part Number

(Tubes)

2DEA-2-Q24R

2DEA-2-Q24T

2DEB-2-W20R

2DEB-2-W20T

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array

Dispensing

For large quantities, the product will be dispensed in Tape and Reel (see diagram below).

DIMENSIONS = MM (INCHES)

No. of Pieces No. of Pieces

Package

Width

Pitch

per 13 ” reel

per tube

QSOP

24 Pin

WBSOIC

20 Pin

6.5 (0.256)

9.0 (0.354)

2.1 (0.083)

16 (0.630)

24 (0.945)

8 (0.315)

3,500

13 (0.519) 10.8 (0.425) 2.8 (0.110)

3,500

How To Order

2 DEA - 2 - Q 24 R __

Product Class

Thin-Film-on-Silicon

Product Function

ESD Protection Diode Array

DEA = 20 Lines

DEB = 17 Lines

Standard

Standard Package Style

Q =

QSOP

W = Wide-Body SOIC

Pin Count

Q = 24

W = 20

Dispensing

R =Reel

Reliable Electronic Solutions

T = Tube

Terminations

LF = 100 % Sn (lead free)

Blank = Sn/Pb

Asia-Pacific:

Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116

Europe:

Typical Part Marking

Tel: +41-41 768 5555 • Fax: +41-41 768 5510

The Americas:

Tel: +1-951 781-5500 • Fax: +1-951 781-5700

Represents total content. Layout may vary.

www.bourns.com

PRODUCT

FUNCTION

DEA002

24Q

YYWW

PIN COUNT

PACKAGE STYLE

PIN 1 INDICATOR

(MOLDED INDENT)

DATE CODE

MANUFACTURER'S

TRADEMARK

04/05

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

2DEA-2-W20TLF [BOURNS]

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