2DEB-2-Q24T [BOURNS]
Trans Voltage Suppressor Diode, Bidirectional, 17 Element, Silicon, MO-137, QSOP-24;
| 型号： | 2DEB-2-Q24T |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | Trans Voltage Suppressor Diode, Bidirectional, 17 Element, Silicon, MO-137, QSOP-24 局域网 光电二极管 |
| 文件： | 总2页 (文件大小：101K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
Applications
ꢀ Parallel printer ports, communication
ports
ꢀ Supports 15 KV IEC 61000-4-2 ESD
equipment specification†
DEA002
24Q
ꢀ Single device protects as many as 20 lines
on exposed pins, communications ports
ꢀ Hot-swappable designs
ꢀ IC protection
0036
ꢀ Incorporates 40 bi-directional PN
junction diodes
ꢀ Small form factor replaces 20 SOT23
packages
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
General Information
Package Schematic
How To Order
2 DEA - 2 - Q 24 R
The Model 2DEA Series is well-suited for
space constrained designs where the
requirements of international ESD standard
specification IEC 61000-4-2 must be met.
These highly integrated PN junction
diode arrays are especially effective for
use in PC notebooks and motherboards,
engineering workstations and portable
battery-powered devices such as PDAs
and cellular phones.
Space savings, as compared to popular
BAV99 SOT23 based implementations, can
yield a 75 % reduction in utilized board
area. In addition, significant assembly cost
reductions and manufacturing integrity
improvements can be realized.
VDD
VSS
Product Class
Thin-Film-on-Silicon
24 23 22 21 20 19 18 17 16 15 14 13
Product Function
ESD Protection Diode Array
DEA = 20 Lines
DEB = 17 Lines
Standard
Standard Package Style
Q =
QSOP
W = Wide-Body SOIC
1
2
3
4
5
6
VSS
7
8
9
10 11 12
VDD
Pin Count
Q = 24
W = 20
Dispensing
R = Reel T = Tube
Typical Part Marking
Two package options are available.
Model 2DEA consists of 20 bi-directional
diode pairs in a miniature 24-pin JEDEC
QSOP package. The 2DEB consists of 17
bi-directional diode pairs in a traditional
wide-body SOIC JEDEC package.
Represents total content. Layout may vary.
PRODUCT
FUNCTION
DEA002
Standard Part Numbers
PIN COUNT
24Q
PACKAGE STYLE
DATE CODE
YYWW
Part Number
(Tape & Reel)
Part Number
PIN 1 INDICATOR
(MOLDED INDENT)
Electrical Specifications
(Tubes)
MANUFACTURER'S
TRADEMARK
Supply Voltage (VDD - VSS)
...........................................-0.3 V to +12 V
Voltage @ Any Channel (Vin)
2DEA-2-Q24R
2DEA-2-Q24T
2DEB-2-W20R
2DEB-2-W20T
....................................-0.3 V to (VDD+0.5)
VSS = GND
Channel Clamp Current (lc)
(Continuous) .........................±15 mA max.
Forward Voltage (Vf)
@ lf = 1 mA..............0.8 V typ., 0.9 V max.
@ lf =12 mA ..............................1.5 V max.
Leakage Current
@ VSS < Vin < VDD = 12 V ......0.1 µA typ.
@ VSS < Vin < VDD = 12 V .....10 µA max.
Diode Capacitance ......................5 pF max.
Diode Power Rating ...............20 mW/diode
Power Dissipation @ 25 °C.............100 mw
ESD Protection†..15 KV per IEC 61000-4-2
human body test method
Environmental Specifications
Operating Temperature.-55 °C to +125 °C
Storage Temp. Range...-65 °C to +150 °C
Physical Specifications
Standard Packages and Pin Counts
QSOP.............................................24 Pin
Wide-Body SOIC ...........................20 Pin
Dispensing
QSOP .......................3,500 pcs./13 ” reel
56 pcs./tube
Wide-Body SOIC......3,500 pcs./13 ” reel
37 pcs./tube
† Note: IEC 61000-4-2 ESD test performance is measured at the systems level and system designs, enclosure shielding and other conventional ESD control measures usually influence
the results of these tests. Testing on the component level serves as an indicator that the system passes a specific compliance step, but does not ensure that the system passes at that
level. The Model 2DEA/DEB device, therefore, can support successful implementation of the IEC 61000-4-2 system level ESD standard.
Specifications are subject to change without notice.
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
QSOP
Wide-Body SOIC
Package Dimensions
Package Dimensions
A
12.66 - 12.86
(.496 - .505)
1.27
.635
(.025)
TYP.
0.66
(.026)
REF
TYP.
(0.50)
3.81 - 3.99
(.150 - .157)
7.40 - 7.60
(.291 - .299)
0.38 - 0.48
(.014 - .016)
PIN 1
.21 - .31
(.008 - .012)
PIN 1
2.44 - 2.64
(.096 - .104)
1.35 - 1.75
(.053 - .069)
0.10 - 0.30
(.004 - .012)
.10 - .25
(.004 - .010)
0.23 - 0.32
(.0091 - .0125)
.19 - .25
(.007 - .010)
0-8 °
10.11 - 10.51
(.398 - .414)
0-8°
.41 - 1.27
(.016 - .050)
5.80 - 6.20
(.228 - .244)
Model
A
2QSP24
8.56 - 8.74 (.337 - .344)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
JEDEC Reference Number MS-013.
QSOP Package Power
Temperature Derating Curve
Wide-Body SOIC Package Power
Temperature Derating Curve
Reliable Electronic Solutions
1.25
1.25
WBSOIC20
1.0
1.0
Asia-Pacific:
Tel: +886- (0)2 2562-4117
Fax: +886- (0)2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
North America:
Tel: +1-909 781-5500
Fax: +1-909 781-5700
2QSP24
.75
.50
.25
.75
.50
.25
0
25
50
75
100
125
150
0
25
50
75
100
125
150
°
AMBIENT TEMPERATURE ( C )
°
AMBIENT TEMPERATURE ( C )
www.bourns.com
09/02
Specifications are subject to change without notice.
COPYRIGHT© 2002, BOURNS, INC. LITHO IN U.S.A. REV. 9/02 e/TF0201
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