AP3406AMM-ADJTRG1 [BCDSEMI]

1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER; 为1.1MHz , 800毫安同步DC -DC降压转换器
AP3406AMM-ADJTRG1
型号: AP3406AMM-ADJTRG1
厂家: BCD SEMICONDUCTOR MANUFACTURING LIMITED    BCD SEMICONDUCTOR MANUFACTURING LIMITED
描述:

1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER
为1.1MHz , 800毫安同步DC -DC降压转换器

转换器
文件: 总13页 (文件大小:655K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Features  
General Description  
High Efficiency: up to 95%  
Output Current: 800mA  
Input Voltage Range: 2.5V to 5.5V  
Fixed 1.1MHz Frequency  
Current Mode Control  
100% Duty Cycle in Dropout  
Built-in Short Circuit Protection  
Built-in Thermal Shutdown Function  
Built-in Current Limit Function  
Shutdown Current: <1μA  
The AP3406A is a 1.1MHz fixed frequency, current  
mode, PWM synchronous buck (step-down) DC-DC  
converter, capable of driving a 800mA load with high  
efficiency, excellent line and load regulation. The  
device integrates a main switch and a synchronous  
switch without an external Schottky diode. It is ideal  
for powering portable equipment that runs from a  
single Li-ion battery.  
A standard series of inductors are available from  
several different manufacturers optimized for use  
with the AP3406A. This feature greatly simplifies the  
design of switch-mode power supplies.  
Applications  
This IC is available in TSOT-23-5, MSOP-10 and  
GPS  
WiFi Card  
Portable Media Player  
Digital Still and Video Cameras  
DFN-2×2-6(1) packages.  
TSOT-23-5  
MSOP-10  
DFN-2×2-6(1)  
Figure 1. Package Types of AP3406A  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
1
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Pin Configuration  
KT Package  
TSOT-23-5  
MM Package  
MSOP-10  
DN Package  
DFN-2×2-6(1)  
Mark  
Pin 1  
PGND  
VIN  
NC  
1
2
3
4
5
10  
9
EN  
GND  
SW  
FB  
FB  
1
2
3
6
5
4
1
2
3
5
4
NC  
SW  
EN  
NC  
NC  
8
GND  
NC  
GND  
SW  
EN  
7
6
VIN  
VIN  
FB  
Figure 2. Pin Configuration of AP3406A (Top View)  
Pin Description  
Pin Number  
MSOP-10  
Pin Name  
Function  
TSOT-23-5  
DFN-2×2-6(1)  
Control input pin. Forcing this pin above  
1.5V enables the IC. Forcing this pin  
below 0.6V shuts down the IC. When  
the IC is in shutdown mode, all  
functions are disabled to decrease the  
supply current below 1μA  
1
8
2
EN  
2
3
3
9
5
4
GND  
SW  
Ground pin  
Power switch output pin. Inductor  
connection to drain of the internal PFET  
and NFET switches  
Supply input pin. Bypass to GND with a  
10μF or greater ceramic capacitor  
Feedback pin. Connect it with an  
external resistor divider network to  
program the system output voltage  
4
5
1
5
3
VIN  
FB  
6
1
2, 4, 6, 7  
10  
NC  
No connection  
PGND  
Power ground pin  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
2
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Functional Block Diagram  
Figure 3. Functional Block Diagram of AP3406A  
Ordering Information  
AP3406A  
-
G1: Green  
Circuit Type  
Package  
TR: Tape & Reel  
KT: TSOT-23-5  
MM: MSOP-10  
ADJ: Adjustable Voltage  
DN: DFN-2×2-6(1)  
Temperature  
Range  
Package  
Part Number  
Marking ID  
Packing Type  
TSOT-23-5  
MSOP-10  
AP3406AKT-ADJTRG1  
AP3406AMM-ADJTRG1  
AP3406ADN-ADJTRG1  
L2A  
Tape & Reel  
Tape & Reel  
Tape & Reel  
-40 to 85°C  
3406AMM-G1  
BA  
DFN-2×2-6(1)  
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS  
compliant and green.  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
3
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Absolute Maximum Ratings (Note 1)  
Parameter  
Symbol  
VIN  
Value  
Unit  
V
Input Voltage  
-0.3 to 6  
Feedback Voltage  
EN Pin Voltage  
SW Pin Voltage  
VFB  
-0.3 to VIN +0.3  
-0.3 to VIN+0.3  
-0.3 to VIN+0.3  
V
VEN  
V
VSW  
V
TSOT-23-5  
250  
135  
100  
Thermal Resistance  
ºC/W  
MSOP-10  
θJA  
DFN-2×2-6(1)  
Operating Junction Temperature  
Storage Temperature  
TJ  
150  
ºC  
ºC  
ºC  
TSTG  
TLEAD  
-65 to 150  
260  
Lead Temperature (Soldering, 10sec)  
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to  
the device. These are stress ratings only, and functional operation of the device at these or any other conditions  
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute  
Maximum Ratings” for extended periods may affect device reliability.  
Recommended Operating Conditions  
Parameter  
Symbol  
VIN  
Min  
2.5  
Max  
Unit  
V
Input Voltage  
5.5  
Maximum Output Current  
Operating Ambient Temperature  
IOUT (MAX)  
TA  
800  
-40  
mA  
ºC  
85  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
4
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Electrical Characteristics  
VIN =VEN=3.6V, TA=25, unless otherwise specified. Specifications with boldface type apply over full  
operating temperature range from -40 to 85ºC.  
Parameters  
Symbol  
ICC  
Conditions  
Min  
Typ  
400  
Max  
600  
1
Unit  
μA  
Supply Current  
VFB=0.55V  
Shutdown Supply Current  
ISHDN  
VEN=0V, VIN=5.5V  
Rising edge  
0.01  
μA  
Under Voltage Lockout  
Threshold  
VUVLO  
2.27  
V
Under Voltage Lockout  
Hysteresis  
VHUVLO  
IFB  
200  
0.5  
mV  
nA  
V
Feedback Bias Current  
VFB=0.65V  
IOUT=100mA  
VIN=2.5V,  
-50  
50  
0.588/  
0.612/  
Feedback Voltage  
VFB  
0.600  
0.582  
0.618  
800  
800  
800  
V
OUT=0.9V  
VIN=3.6V,  
OUT=1.2V  
VIN=4.6V,  
OUT=3.3V  
Maximum Output Current  
mA  
IOUT (MAX)  
V
V
Switch Current Limit  
Oscillator Frequency  
ILIM  
fOSC  
VENL  
VENH  
IH  
VFB=0.55V  
0.95  
0.8  
1.25  
1.1  
A
1.4  
0.6  
MHz  
EN Pin Threshold  
V
1.5  
-0.1  
-0.1  
VEN=3.6V  
VEN=0V  
0.1  
0.1  
μA  
μA  
EN Pin Input Leakage  
Current  
IL  
Internal  
PFET  
On  
RDSONP  
ISW=100mA  
ISW=-100mA  
0.44  
Resistance  
Internal  
NFET  
On  
RDSONN  
DMAX  
TSS  
0.29  
100  
220  
%
μs  
Resistance  
Maximum Duty Cycle  
VFB=0.55V  
VEN=0V to VIN  
IOUT50mA  
Soft-start Time  
Thermal Shutdown  
Threshold  
TOTSD  
THYS  
160  
30  
ºC  
ºC  
Thermal Shutdown  
Hysteresis  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
5
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Typical Performance Characteristics  
L=10μH, CIN=COUT=10μF, TA=25oC, unless otherwise noted.  
0.7  
1.4  
0.6  
0.5  
0.4  
0.3  
0.2  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
VIN=3.6V  
VOUT=1.8V  
IOUT=0A  
VIN=3.6V  
VFB=0.55V  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
-60  
-40  
-20  
0
20  
40  
60  
80  
100 120 140 160  
Input Voltage (V)  
Temperature (oC)  
Figure 4. Frequency vs. Input Voltage  
Figure 5. Supply Current vs. Temperature  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
VIN=3.6V  
VIN=3.6V  
VOUT=1.8V  
VFB=0.55V  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (OC)  
Output Current (A)  
Figure 6. Current Limit vs. Temperature  
Figure 7. Output Voltage vs. Output Current  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
6
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Typical Performance Characteristics (Continued)  
400ns/div  
VSW  
VSW  
2V/div  
2V/div  
VOUT  
VOUT  
20mV/div  
20mV/div  
400ns/div  
400ns/div  
Figure 8. Light Load Operation  
(VIN=3.6V, VOUT=1.8V, IOUT=0mA)  
Figure 9. Heavy Load Operation  
(VIN=3.6V, VOUT=1.8V, IOUT=800mA)  
IIN  
IOUT  
500mA/div  
500mA/div  
VOUT  
2V/div  
VOUT  
100mV/div  
VEN  
2V/div  
200μs/div  
400μs/div  
Figure 10. Load Transient  
Figure 11. Start up from Shutdown  
(VIN=3.6V, VOUT=1.8V, IOUT=0mA to 800mA)  
(VIN=3.6V, VOUT=1.8V, RLOAD=2.5)  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
7
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Typical Performance Characteristics (Continued)  
VOUT  
1V/div  
VOUT  
1V/div  
VSW  
VSW  
2V/div  
2V/div  
IL  
1A/div  
IL  
1A/div  
10μs/div  
40μs/div  
Figure 12. Short Circuit Protection  
(VIN=3.6V, VOUT=1.8V, no load)  
Figure 13. Short Circuit Recovery  
(VIN=3.6V, VOUT=1.8V, no load)  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
TSOT-23-5  
MSOP-10  
TSOT-23-5  
MSOP-10  
VIN=4.2V  
VOUT=3.3V  
L=10μH  
VIN=3.6V  
VOUT=1.8V  
L=10μH  
0.1  
1
0.1  
1
Output Current (A)  
Output Current (A)  
Figure 14. Efficiency vs. Output Current  
Figure 15. Efficiency vs. Output Current  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
8
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Typical Performance Characteristics (Continued)  
2.0  
1.5  
1.0  
0.5  
0.0  
-0.5  
-1.0  
VIN=3.6V  
VOUT=1.8V  
-1.5  
-2.0  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (oC)  
Figure 16. Normalized Feedback Voltage vs. Temperature  
Typical Application  
150k  
R2  
300k  
R1  
EN  
VIN  
FB  
VOUT  
VIN  
L
AP3406A-ADJSW  
2.5V to 5.5V  
1.8V  
800mA  
10μH  
CIN  
COUT  
GND  
10μF  
10μF  
Figure 17. Typical Application of AP3406A  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
9
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Mechanical Dimensions  
TSOT-23-5  
Unit: mm(inch)  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
10  
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Mechanical Dimensions (Continued)  
MSOP-10  
Unit: mm(inch)  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
11  
Data Sheet  
1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A  
Mechanical Dimensions (Continued)  
DFN-2×2-6(1)  
Unit: mm(inch)  
Sep 2011 Rev. 1. 4  
BCD Semiconductor Manufacturing Limited  
12  
BCD Semiconductor Manufacturing Limited  
http://www.bcdsemi.com  
- Headquarters  
- Wafer Fab  
BCD Semiconductor Manufacturing Limited  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.  
No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China  
800 Yi Shan Road, Shanghai 200233, China  
Tel: +86-21-24162266, Fax: +86-21-24162277  
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008  
REGIONAL SALES OFFICE  
Shenzhen Office  
Taiwan Office  
USA Office  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office  
BCD Semiconductor (Taiwan) Company Limited  
BCD Semiconductor Corp.  
Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,  
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,  
30920 Huntwood Ave. Hayward,  
China  
Taiwan  
Tel: +886-2-2656 2808  
CA 94544, USA  
Tel: +86-755-8826 7951  
Tel : +1-510-324-2988  
Fax: +86-755-8826 7865  
Fax: +886-2-2656 2806  
Fax: +1-510-324-2788  

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