AP3408DNTR-G1 [BCDSEMI]

2A, 4MHz High Efficiency Synchronous Buck Converter; 2A , 4MHz的高效率同步降压转换器
AP3408DNTR-G1
型号: AP3408DNTR-G1
厂家: BCD SEMICONDUCTOR MANUFACTURING LIMITED    BCD SEMICONDUCTOR MANUFACTURING LIMITED
描述:

2A, 4MHz High Efficiency Synchronous Buck Converter
2A , 4MHz的高效率同步降压转换器

转换器
文件: 总12页 (文件大小:385K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter AP3408  
Features  
General Description  
Input Voltage Range: 2.6 to 5.5V  
Adjustable Output from 0.8 to 5V  
0.8V Reference Voltage with ± 2% Precision  
Output Current: 2A  
The AP3408 is a current mode, PWM synchronous  
buck DC/DC converter, capable of driving a 2A load  
with high efficiency, excellent line and load  
regulation. It operates in continuous PWM mode.  
High Efficiency up to 95%  
Low RDSON Internal Switches  
Programmable Frequency: 300kHz to 4MHz  
Current Mode Control  
Forced Continuous-mode Operation  
100% Duty Cycle  
Synchronizable Switching Frequency  
Power Good Output Voltage Monitoring  
Built-in Soft-start  
Built-in Short Circuit Protection  
Built-in Thermal Shutdown Protection  
Built-in Current Limit Function  
The AP3408 integrates synchronous P-channel and  
N-channel power MOSFET switches with low  
on-resistance. It is ideal for portable applications  
powered from a single Li-ion battery. 100% duty  
cycle and low on-resistance P-channel internal power  
MOSFET can maximize the battery life.  
The switching frequency of AP3408 can be  
programmable from 300kHz to 4MHz, which allows  
small-sized components, such as capacitors and  
inductors. A standard series of inductors from several  
different manufacturers are available. This feature  
greatly simplifies the design of switch-mode power  
supplies.  
Applications  
The AP3408 is available in DFN-3×3-10 and PSOP-8  
packages.  
Portable Media Player  
Digital Still and Video Cameras  
Notebook  
DFN-3×3-10  
PSOP-8  
Figure 1. Package Types of AP3408  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
1
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter  
AP3408  
Pin Configuration  
DN Package  
MP Package  
(PSOP-8)  
(DFN-3×3-10)  
Pin 1 Dot  
byM arking  
COMP  
FB  
SHDN/RT  
GND  
8
1
2
3
4
10  
9
1
2
3
4
5
COMP  
FB  
SHDN/RT  
7
6
5
SYNC  
GND  
SW  
Exposed Pad  
Connected to  
PGND  
Exposed Pad  
Connected to  
PGND  
8
PGOOD  
VDD  
SW  
VDD  
7
PGND  
PVDD  
6
PVDD  
PGND  
Figure 2. Pin Configuration of AP3408 (Top View)  
Pin Description  
Pin Number  
Pin Name  
Description  
DFN-3×3-10  
PSOP-8  
Oscillator resistor input. Connect a resistor to GND from  
SHDN/RT this pin to set the switching frequency. Forcing this pin to  
DD to shutdown the device  
1
1
V
External clock synchronization input. The oscillation  
frequency can be synchronized to an external oscillation  
applied to this pin. When tied to VDD, the internal  
oscillator is selected  
Signal ground. All small-signal ground, such as the  
compensation components and the exposed pad should be  
connected to this pin, which in turn connects to PGND at  
one point  
2
3
SYNC  
GND  
2
Internal power switch output. Connect this pin with one  
terminal of the inductor  
Power ground. Connect this pin as close as possible to CIN  
and COUT  
Power input supply. Decouple this pin to PGND with a  
capacitor  
Signal input supply. Decouple this pin to GND with a  
capacitor. Normally VDD is equal to VPVDD  
4
5
6
7
3
4
5
6
SW  
PGND  
PVDD  
VDD  
Power Good Indicator. Open-drain logic output that is  
pulled to ground when the output voltage is not within ±  
12.5% of regulation point  
Feedback voltage. This pin is the inverting input of internal  
error amplifier. It senses the converter output voltage  
through an external resistor divider. The internal reference  
voltage is 0.8V, which determines the output voltage  
through the resistor divider  
8
9
PGOOD  
FB  
7
8
Compensation input. This pin is the output of internal error  
amplifier. Connect external compensation elements to this  
pin to stabilize the control loop  
10  
COMP  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
2
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter  
AP3408  
Functional Block Diagram  
SHDN/RT  
1(1)  
6(5)  
PVDD  
2
CS  
SD  
SYNC  
SUM  
Oscillator  
10(8)  
COMP  
0.8V  
9(7)  
EA  
FB  
Clamp  
4(3)  
PWM  
OCP  
SW  
Control  
Logic  
SS  
0.4V  
0.7V  
0.9V  
5(4)  
3(2)  
PGND  
GND  
DC  
8
VREF  
PGOOD  
UVLO  
OTP  
7(6)  
VDD  
A (B)  
A for DFN-3X3-10  
B for PSOP-8  
Figure 3. Functional Block Diagram of AP3408  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
3
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter  
AP3408  
Ordering Information  
AP3408  
-
G1: Green  
Circuit Type  
TR: Tape & Reel  
Blank: Tube  
Package  
DN: DFN-3×3-10  
MP: PSOP-8  
Part Number  
Marking ID  
Temperature  
Packing  
Type  
Package  
Range  
Green  
AP3408DNTR-G1  
AP3408MP-G1  
Green  
DFN-3×3-10  
BFA  
Tape & Reel  
Tube  
-40 to 125°C  
3408MP-G1  
3408MP-G1  
PSOP-8  
AP3408MPTR-G1  
Tape & Reel  
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant  
and green.  
Absolute Maximum Ratings (Note 1)  
Parameter  
Symbol  
VDD  
Value  
-0.3 to 6  
Unit  
V
VDD Pin Voltage  
PVDD Pin Voltage  
FB Pin Voltage  
VPVDD  
VFB  
-0.3 to 6  
V
-0.3 to 6  
V
COMP Pin Voltage  
SW Pin Voltage  
SHDN/RT Pin Voltage  
VCOMP  
VSW  
-0.3 to 6  
V
-0.3 to VIN+0.3  
-0.3 to 6  
V
VSHDN/RT  
V
DFN-3×3-10  
PSOP-8  
110  
75  
Thermal Resistance  
ºC/W  
θJA  
Operating Junction Temperature  
Storage Temperature  
TJ  
150  
-65 to 150  
260  
ºC  
ºC  
ºC  
V
TSTG  
TLEAD  
Lead Temperature (Soldering, 10 sec)  
ESD (Machine Model)  
200  
ESD (Human Body Model)  
2000  
V
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to  
the device. These are stress ratings only, and functional operation of the device at these or any other conditions  
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute  
Maximum Ratings” for extended periods may affect device reliability.  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
4
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter  
Recommended Operating Conditions  
AP3408  
Parameter  
Symbol  
VIN  
Min  
2.6  
2
Max  
Unit  
V
Input Voltage  
5.5  
Maximum Output Current  
Operating Junction Temperature  
IOUT (MAX)  
TJ  
A
-40  
125  
ºC  
Electrical Characteristics  
VIN=VDD =VPVDD=3.3V, TA=25, unless otherwise specified.  
Parameters  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
INPUT SECTION  
Input Voltage Range  
Supply Current  
VDD  
IQ  
2.6  
5.5  
1
V
VFB=0.75V,  
No Switching  
Shutdown,  
VIN=5.5V  
460  
μA  
Shutdown Supply Current  
ISHDN  
VUVLO  
VHUVLO  
μA  
V
Under Voltage Threshold  
Lockout  
Under Voltage Hysteresis  
Lockout  
VDD Rising  
2.2  
300  
mV  
FEEDBACK SECTION  
Feedback Voltage  
VFB  
IFB  
RT  
0.784  
0.8  
0.1  
0.2  
0.816  
0.4  
V
μA  
Ω
FB Pin Bias Current  
Current Sense Transresistance  
VSHDN/RT=VIN  
=5.5V  
Switching Leakage Current  
Error Gain Amplifier Voltage  
1
μA  
GV  
GS  
800  
800  
μA  
/V  
Error  
1
Amplifier Trans-conductance  
1
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
5
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter AP3408  
Electrical Characteristics (Continued)  
VIN=VDD =VPVDD=3.3V, TA=25, unless otherwise specified.  
Parameters  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
OSCILLATOR SECTION  
RT Pin Voltage  
VRT  
fOSC  
0.8  
1
V
0.8  
0.3  
100  
1.2  
4
MHz  
MHz  
%
ROSC=330kΩ  
ADJ Frequency  
VFB=0.75V  
Switching Frequency  
Maximum Duty Cycle  
DMAX  
POWER SWITCH SECTION  
Switch Current Limit  
ILIMIT  
VFB=0.75V  
ISW=500mA  
2.2  
3.8  
A
Internal  
P-FET  
On  
On  
RPDSON  
0.11  
0.16  
0.17  
Ω
Resistance  
Internal  
N-FET  
RNDSON  
ISW=-500mA  
0.11  
Ω
Resistance  
SHDN/RT SECTION  
Shutdown Threshold  
PGOOD SECTION  
PGOOD Voltage Range  
VDD-0.7  
VDD-0.4  
V
±12.5  
±15  
%
PGOOD Pull Down  
Resistance  
120  
Ω
TOTAL DEVICE  
VDD=2.6 to 5.5V  
VOUT=2.5V  
Output Current  
IOUT  
2
A
Output  
Regulation  
Voltage  
Line  
VDD=2.7 to 5.5V  
IOUT=100mA  
LNR  
0.4  
%/V  
Output Voltage Load  
Regulation  
LOD  
tSS  
IOUT=0.01 to 2A  
±0.2  
1.5  
%
ms  
ºC  
Soft-start Time  
IOUT10mA  
Thermal  
Temperature  
Thermal  
Shutdown  
Shutdown  
TOTSD  
160  
THYS  
20  
ºC  
Temperature Hysteresis  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
6
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter  
AP3408  
Typical Performance Characteristics  
VIN=VDD =VPVDD=3.3V, TA=25, unless otherwise specified.  
700  
600  
600  
500  
500  
400  
300  
200  
100  
400  
300  
200  
100  
VIN=3.3V  
V
FB=0.75V  
VFB=0.75V  
-60  
-30  
0
30  
60  
90  
120  
150  
Ambient Temperature (oC)  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
Input Voltage (V)  
Figure 4. Supply Current vs. Input Voltage  
Figure 5. Supply Current vs. Ambient Temperature  
100  
140  
120  
100  
90  
80  
70  
60  
50  
40  
30  
80  
VOUT=2.5V  
VIN=3.3V  
VIN=3.3V  
VFB=0.75V  
60  
VIN=5.0V  
-60  
-30  
0
30  
60  
90  
120  
150  
Ambient Temperature (oC)  
0
500  
1000  
1500  
2000  
2500  
Output Current (mA)  
Figure 6. Efficiency vs. Output Current  
Figure 7. PMOS ON Resistance vs.  
Ambient Temperature  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
7
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter  
AP3408  
Typical Performance Characteristics (Continued)  
VIN=VDD =VPVDD=3.3V, TA=25, unless otherwise specified.  
1.2  
140  
1.1  
120  
1.0  
100  
0.9  
80  
ROSC=330k  
VIN=3.3V  
0.8  
VIN=3.3V  
60  
VFB=0.85V  
VOUT=2.5V  
0.7  
-60  
-30  
0
30  
60  
90  
120  
150  
-60  
-30  
0
30  
60  
90  
120  
150  
Ambient Temperature (OC)  
Ambient Temperature (oC)  
Figure 8. NMOS ON Resistance vs.  
Ambient Temperature  
Figure 9. Frequency vs. Ambient Temperature  
0.9  
0.8  
0.7  
0.6  
0.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
VIN=3.3V  
VIN=3.3V  
VOUT=2.5V  
-60  
-30  
0
30  
60  
90  
120  
150  
-40  
0
40  
80  
120  
160  
Ambient Temperature (OC)  
Temperature (OC)  
Figure 10. VFB vs. Ambient Temperature  
Figure 11. Current Limit vs. Ambient Temperature  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
8
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter AP3408  
Typical Application  
Figure 12. Typical Application of AP3408  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
9
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter  
AP3408  
Mechanical Dimensions  
DFN-3×3-10  
Unit: mm(inch)  
0.300(0.012)  
0.500(0.020)  
1.600(0.063)  
1.800(0.071)  
0.500(0.020)  
TYP  
2.900(0.114)  
3.100(0.122)  
N6  
`
N10  
2.300(0.090)  
2.500(0.098)  
2.900(0.114)  
3.100(0.122)  
PIN #1  
IDENTIFICATION  
Pin 1 Dot  
by Marking  
N5  
N1  
0.200(0.008)  
0.700(0.028)  
0.000(0.000)  
0.800(0.031)  
0.050(0.002)  
0.300(0.012)  
0.153(0.006)  
0.253(0.010)  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
10  
Preliminary Datasheet  
2A, 4MHz High Efficiency Synchronous Buck Converter  
AP3408  
Mechanical Dimensions (Continued)  
PSOP-8  
Unit: mm(inch)  
Jul. 2011 Rev. 1. 0  
BCD Semiconductor Manufacturing Limited  
11  
BCD Semiconductor Manufacturing Limited  
http://www.bcdsemi.com  
- Headquarters  
- Wafer Fab  
BCD Semiconductor Manufacturing Limited  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.  
No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China  
800 Yi Shan Road, Shanghai 200233, China  
Tel: +86-21-24162266, Fax: +86-21-24162277  
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008  
REGIONAL SALES OFFICE  
Shenzhen Office  
Taiwan Office  
USA Office  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office  
BCD Semiconductor (Taiwan) Company Limited  
BCD Semiconductor Corp.  
Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,  
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,  
30920 Huntwood Ave. Hayward,  
China  
Taiwan  
Tel: +886-2-2656 2808  
CA 94544, USA  
Tel: +86-755-8826 7951  
Tel : +1-510-324-2988  
Fax: +86-755-8826 7865  
Fax: +886-2-2656 2806  
Fax: +1-510-324-2788  

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