AP3211 [BCDSEMI]

1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER; 1.4MHz的, 1.5A异步DC-DC降压转换器
AP3211
型号: AP3211
厂家: BCD SEMICONDUCTOR MANUFACTURING LIMITED    BCD SEMICONDUCTOR MANUFACTURING LIMITED
描述:

1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER
1.4MHz的, 1.5A异步DC-DC降压转换器

转换器
文件: 总12页 (文件大小:453K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Features  
General Description  
Input Voltage Range: 4.5V to 18V  
Output Voltage Adjustable from 0.81V to 15V  
Fixed 1.4MHz Frequency  
High Efficiency: up to 92%  
Output Current: 1.5A  
Current Mode Control  
Built-in Over Current Protection  
Built-in Thermal Shutdown Function  
Built-in UVLO Function  
Built-in Over Voltage Protection  
Built-in Soft-start  
The AP3211 is a 1.4MHz fixed frequency, current  
mode, PWM buck (step-down) DC-DC converter,  
capable of driving a 1.5A load with high efficiency,  
excellent line and load regulation. The device  
integrates N-channel power MOSFET switch with  
low on-resistance. Current mode control provides fast  
transient response and cycle-by-cycle current limit.  
A standard series of inductors are available from  
several different manufacturers optimized for use  
with the AP3211. This feature greatly simplifies the  
design of switch-mode power supplies.  
The AP3211 is available in SOT-23-6 package.  
Applications  
LCD TV  
DPF  
Portable DVD  
SOT-23-6  
Figure 1. Package Type of AP3211  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
1
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Pin Configuration  
K Package  
(SOT-23-6)  
Pin 1 Dot by Marking  
6
5
4
SW  
IN  
1
2
3
BS  
GND  
FB  
EN  
Figure 2. Pin Configuration of AP3211 (Top View)  
Pin Description  
Pin Number  
Pin Name  
Function  
Bootstrap pin. A bootstrap capacitor is connected between the  
BS pin and SW pin. The voltage across the bootstrap capacitor  
drives the internal high-side NMOS switch  
1
2
BS  
GND  
Ground pin  
Feedback pin. This pin is connected to an external resistor  
divider to program the system output voltage. When VFB exceeds  
20% of the nominal regulation value of 0.81V, the OVP is  
triggered. When VFB0.25V, the oscillator frequency is lowered  
to realize short circuit protection  
Control input pin. Forcing this pin above 1.5V enables the IC.  
Forcing this pin below 0.4V shuts down the IC. When the IC is  
in shutdown mode, all functions are disabled to decrease the  
supply current below 1μA  
3
4
FB  
EN  
Supply input pin. A capacitor should be connected between the  
IN pin and GND to keep the DC input voltage constant  
Power switch output pin. This pin is connected to the inductor  
and bootstrap capacitor  
5
6
IN  
SW  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
2
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Functional Block Diagram  
Figure 3. Functional Block Diagram of AP3211  
Ordering Information  
AP3211  
-
Circuit Type  
G1: Green  
TR: Tape & Reel  
Package  
K: SOT-23-6  
Temperature  
Range  
Packing  
Type  
Package  
Part Number  
Marking ID  
SOT-23-6  
AP3211KTR-G1  
GCI  
Tape & Reel  
-40 to 85°C  
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant  
and green.  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
3
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Absolute Maximum Ratings (Note 1)  
Parameter  
Symbol  
VIN  
Value  
-0.3 to 20  
-0.3 to VIN+0.3  
21  
Unit  
V
Input Pin Voltage  
EN Pin Voltage  
VEN  
VSW  
VBS  
V
SW Pin Voltage  
V
Bootstrap Pin Voltage  
Feedback Pin Voltage  
Thermal Resistance  
Operating Junction Temperature  
Storage Temperature  
-0.3 to VSW+6  
-0.3 to 6V  
220  
V
VFB  
V
ºC/W  
ºC  
θJA  
TJ  
150  
TSTG  
-65 to 150  
ºC  
Lead Temperature (Soldering,  
10sec)  
TLEAD  
260  
ºC  
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to  
the device. These are stress ratings only, and functional operation of the device at these or any other conditions  
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute  
Maximum Ratings” for extended periods may affect device reliability.  
Recommended Operating Conditions  
Parameter  
Symbol  
VIN  
Min  
4.5  
Max  
Unit  
V
Input Voltage  
18  
Maximum Output Current  
Operating Ambient Temperature  
IOUT (MAX)  
TA  
1.5  
A
-40  
85  
ºC  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
4
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Electrical Characteristics  
VIN=VEN=12V, VOUT=3.3V, TA=25ºC, unless otherwise specified.  
Parameter  
Symbol  
VIN  
Conditions  
Min  
Typ  
Max  
18  
Unit  
V
Input Voltage  
4.5  
Quiescent Current  
IQ  
VFB=0.9V  
0.8  
0.1  
1.1  
1.0  
mA  
μA  
V
Shutdown Supply Current  
Feedback Voltage  
ISHDN  
VFB  
VFBOV  
IFB  
VEN=0V  
0.785 0.810 0.835  
0.972  
Feedback Over Voltage Threshold  
Feedback Bias Current  
Switch On-resistance  
V
VFB=0.85V  
ISW=1A  
-0.1  
0.1  
μA  
Ω
0.35  
RDSON  
VIN=18V,  
VEN=0V  
Switch Leakage Current  
Switch Current Limit  
ILEAK  
0.1  
2.4  
10  
μA  
1.8  
1.5  
A
ILIM  
VENH  
VENL  
VUVLO  
VHYS  
fOSC1  
fOSC2  
DMAX  
DMIN  
tON  
EN Pin Threshold  
V
0.4  
4.3  
VIN Rising  
3.3  
1.1  
3.8  
0.2  
1.4  
460  
90  
V
V
Input UVLO Threshold  
Input UVLO Hysteresis  
1.7  
0
MHz  
kHz  
%
Oscillator Frequency  
Short Circuit  
VFB=0.6V  
VFB=0.9V  
Max. Duty Cycle  
Min. Duty Cycle  
%
Minimum On Time  
Thermal Shutdown  
Thermal Shutdown Hysteresis  
Soft-start Time  
100  
160  
20  
ns  
TOTSD  
THYS  
tSS  
ºC  
ºC  
200  
μs  
Note 2: RDSON , tON, TOTSD, THYS and tSS are guaranteed by design.  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
5
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Typical Performance Characteristics  
TA=25ºC, VIN=12V, VEN=5VVOUT=3.3V, unless otherwise noted.  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
100  
90  
80  
70  
60  
50  
40  
0.75  
VIN=12V,VOUT=3.3V  
VIN=12V,VOUT=5V  
30  
20  
10  
0
VIN=12V  
VFB=0.9V  
VEN=5V  
0.70  
0.65  
0.60  
-60  
-40  
-20  
0
20  
40  
60  
80  
100 120 140 160  
0.01  
0.1  
0.5  
1
2
Temperature (oC)  
Output Current (A)  
Figure 4. Efficiency vs. Output Current  
Figure 5. Quiescent Current vs. Temperature  
3.8  
3.6  
3.4  
3.2  
3.0  
2.8  
0.96  
0.88  
0.80  
0.72  
0.64  
0.56  
0.48  
0.40  
2.6  
VIN=12V, VOUT=3.3V  
2.4  
2.2  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4  
-60  
-40  
-20  
0
20  
40  
60  
80  
100 120 140 160  
Output Current (A)  
Temperature (oC)  
Figure 6. Feedback Voltage vs.Temperature  
Figure 7. Output Voltage vs. Output Current  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
6
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Typical Performance Characteristics (Continued)  
TA=25ºC, VIN=12V, VEN=5VVOUT=3.3V, unless otherwise noted.  
3.0  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
3.8  
3.7  
3.6  
3.5  
3.4  
3.3  
3.2  
3.1  
3.0  
2.9  
2.8  
2.7  
2.6  
IOUT=1.2A  
IOUT=1.5A  
VOUT=3.3V  
4
6
8
10  
12  
14  
16  
18  
20  
4
6
8
10  
12  
14  
16  
18  
20  
Input Voltage (V)  
Input Voltage (V)  
Figure 8. Output Voltage vs. Input Voltage  
Figure 9. Maximum Output Current vs. Input Voltage  
VOUT (AC)  
20mV/div  
VSW  
5V/div  
VOUT (AC)  
100mV/div  
IL  
IL  
1A/div  
1A/div  
VIN  
10V/div  
Time (100μs/div)  
Time (400ns/div)  
Figure 10. Output Ripple (IOUT=1.5A)  
Figure 11.Load Transient (IOUT=1 to 1.5A)  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
7
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Typical Performance Characteristics (Continued)  
TA=25ºC, VIN=12V, VEN=5VVOUT=3.3V, unless otherwise noted.  
VEN  
3.4V/div  
VOUT  
1V/div  
VEN  
3.8V/div  
VOUT  
1V/div  
VSW  
5V/div  
VSW  
5V/div  
IL  
1A/div  
IL  
1A/div  
Time (10μs/div)  
Time (100μs/div)  
Figure 12. Enable Turn-on Characteristic  
Figure 13. Enable Turn-off Characteristic  
(Resistance Load, RLOAD=2.6Ω)  
(Resistance Load, RLOAD=2.6Ω)  
VOUT  
2V/div  
VOUT  
2V/div  
VFB  
VFB  
1V/div  
IL  
1A/div  
1V/div  
IL  
1A/div  
VSW  
VSW  
10V/div  
10V/div  
Time (400μs/div)  
Time (400μs/div)  
Figure 14. Short Circuit Protection (IOUT=1.5A)  
Figure 15.Short Circuit Recovery (RLOAD=2.6Ω)  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
8
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Typical Performance Characteristics (Continued)  
TA=25ºC, VIN=12V, VEN=5VVOUT=3.3V, unless otherwise noted.  
VFB  
500mV/div  
VFB  
500mV/div  
VOUT  
2V/div  
IL  
1A/div  
VOUT  
2V/div  
IL  
1A/div  
VSW  
10V/div  
VSW  
10V/div  
Time (200μs/div)  
Time (20μs/div)  
Figure 16. Over Voltage Protection (IOUT=1.5A)  
Figure 17. Over Voltage Recovery (IOUT=1.5A)  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
9
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Typical Application  
Figure 18. Typical Application Circuit of AP3211  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
10  
Data Sheet  
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER  
AP3211  
Mechanical Dimensions  
SOT-23-6  
Unit: mm(inch)  
0°  
8°  
2.820(0.111)  
3.020(0.119)  
0.300(0.012)  
0.200(0.008)  
0.400(0.016)  
0.300(0.012)  
0.600(0.024)  
6
5
4
Pin 1 Dot by Marking  
1
2
3
0.700(0.028)REF  
0.950(0.037)TYP  
0.100(0.004)  
0.200(0.008)  
0.000(0.000)  
0.150(0.006)  
1.800(0.071)  
2.000(0.079)  
0.900(0.035)  
1.300(0.051)  
1.450(0.057)  
MAX  
Jul. 2011 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
11  
BCD Semiconductor Manufacturing Limited  
http://www.bcdsemi.com  
- Headquarters  
- Wafer Fab  
BCD Semiconductor Manufacturing Limited  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.  
No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China  
800 Yi Shan Road, Shanghai 200233, China  
Tel: +86-21-24162266, Fax: +86-21-24162277  
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008  
REGIONAL SALES OFFICE  
Shenzhen Office  
Taiwan Office  
USA Office  
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office  
BCD Semiconductor (Taiwan) Company Limited  
BCD Semiconductor Corp.  
Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,  
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,  
30920 Huntwood Ave. Hayward,  
China  
Taiwan  
Tel: +886-2-2656 2808  
CA 94544, USA  
Tel: +86-755-8826 7951  
Tel : +1-510-324-2988  
Fax: +86-755-8826 7865  
Fax: +886-2-2656 2806  
Fax: +1-510-324-2788  

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