AP3211H [BCDSEMI]
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER; 1.4MHz的， 1.5A异步DC-DC降压转换器
| 型号： | AP3211H |
| 厂家： | 
BCD SEMICONDUCTOR MANUFACTURING LIMITED |
| 描述： | 1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER |
| 文件： | 总11页 (文件大小：460K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER AP3211H
General Description
Features
•
•
•
•
•
•
•
•
•
•
Input Voltage Range: 4.5V to 23V
The AP3211H is a 1.4MHz fixed frequency, current
mode, PWM buck (step-down) DC-DC converter,
capable of driving a 1.5A load with high efficiency,
excellent line and load regulation. The device
integrates N-channel power MOSFET switch with
low on-resistance. Current mode control provides fast
transient response and cycle-by-cycle current limit.
Fixed 1.4MHz Frequency
High Efficiency: up to 92%
Output Current: 1.5A
Current Mode Control
Built-in Over Current Protection
Built-in Thermal Shutdown Function
Built-in UVLO Function
Built-in Over Voltage Protection
Built-in Soft-start
A standard series of inductors are available from
several different manufacturers optimized for use
with the AP3211H. This feature greatly simplifies the
design of switch-mode power supplies.
Applications
The AP3211H is available in SOT-23-6 package.
•
•
•
LCD TV
DPF
Portable DVD
SOT-23-6
Figure 1. Package Type of AP3211H
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
1
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER AP3211H
Pin Configuration
K Package
(SOT-23-6)
Pin 1 Mark
6
5
4
SW
IN
1
2
3
BS
GND
FB
EN
Figure 2. Pin Configuration of AP3211H (Top View)
Pin Description
Pin Number
Pin Name
Function
Bootstrap pin. A bootstrap capacitor is connected between the
BS pin and SW pin. The voltage across the bootstrap
capacitor drives the internal high-side NMOS switch
Ground pin
1
2
BS
GND
Feedback pin. This pin is connected to an external resistor
divider to program the system output voltage. When VFB
exceeds 20% of the nominal regulation value of 0.81V, the
OVP is triggered. When VFB＜0.25V, the oscillator frequency
is lowered to realize short circuit protection
Control input pin. Forcing this pin above 1.5V enables the IC.
Forcing this pin below 0.4V shuts down the IC. When the IC
is in shutdown mode, all functions are disabled to decrease
the supply current below 1μA
3
4
FB
EN
Supply input pin. A capacitor should be connected between
the IN pin and GND pin to keep the DC input voltage
constant
Power switch output pin. This pin is connected to the inductor
and bootstrap capacitor
5
6
IN
SW
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
2
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER
AP3211H
Functional Block Diagram
5
IN
SCHOTTKY
FB
VREF
1
BOOSTRAP
REGULATOR
SS
HICCUP
CL
BS
2A/V
OSC
1.4MHz/
460KHz
RAMP
GENERATOR
2
VDD/VDD1
REGULATOR
CS
GND
OSC
1pF
S
Q
VLIMIT
CL
SWITCH/LDO
4
3
3.3V
REFERENCE
VOLTAGE
EN
FB
R
R
27pF
220k
6
1M
SW
SS
ERR AMP
PWM
COMPARATOR
Figure 3. Functional Block Diagram of AP3211H
Ordering Information
AP3211H
-
Circuit Type
G1: Green
Package
K: SOT-23-6
TR: Tape & Reel
Temperature
Packing
Type
Package
Range
Part Number
Marking ID
SOT-23-6
AP3211HKTR-G1
GBK
Tape & Reel
-40 to 85°C
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant
and green.
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
3
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER
Absolute Maximum Ratings (Note 1)
AP3211H
Parameter
Symbol
VIN
Value
-0.3 to 25
-0.3 to VIN+0.3
26
Unit
V
Input Pin Voltage
EN Pin Voltage
VEN
V
SW Pin Voltage
VSW
VBS
V
Bootstrap Pin Voltage
Feedback Pin Voltage
Operating Junction Temperature
Storage Temperature
-0.3 to VSW+6
-0.3 to 6
V
VFB
V
TJ
150
ºC
ºC
TSTG
-65 to 150
Lead Temperature
(Soldering, 10sec)
Thermal Resistance
(Junction to Ambient)
TLEAD
260
220
ºC
θJA
ºC/W
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter
Symbol
VIN
Min
4.5
Max
23
Unit
V
Input Voltage
Operating Ambient Temperature
TA
-40
85
ºC
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
4
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER
AP3211H
Electrical Characteristics
VIN=VEN=12V, VOUT=3.3V, TA=25ºC, unless otherwise specified.
Parameter
Symbol
VIN
Conditions
Min Typ Max Unit
Input Voltage
4.5
23
1.1
1.0
V
mA
µA
V
Quiescent Current
IQ
VFB=0.9V
VEN=0V
0.8
0.1
Shutdown Supply Current
Feedback Voltage
ISHDN
VFB
VFBOV
IFB
0.785 0.810 0.835
0.972
Feedback Over Voltage Threshold
Feedback Bias Current
Switch On-resistance
V
VFB=0.85V
ISW=1A
-0.1
0.1
µA
Ω
RDSON
0.385
0.1
VIN=23V,
VEN=0V
Switch Leakage Current
Switch Current Limit
ILEAK
10
µA
A
ILIM
VENH
VENL
VUVLO
VHYS
fOSC1
fOSC2
DMAX
DMIN
tON
1.8
1.5
2.4
EN Pin Threshold
V
0.4
4.3
Input UVLO Threshold
Input UVLO Hysteresis
VIN Rising
3.3
1.1
3.8
0.2
1.4
460
90
V
V
1.7
0
MHz
kHz
%
Oscillator Frequency
Short Circuit
VFB=0.6V
VFB=0.9V
Max. Duty Cycle
Min. Duty Cycle
%
Minimum On Time
Thermal Shutdown
Thermal Shutdown Hysteresis
Soft-start Time
100
160
20
ns
TOTSD
THYS
tSS
ºC
ºC
200
µs
Note 2: RDSON , tON, TOTSD, THYS and tSS are guaranteed by design.
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
5
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER
AP3211H
Typical Performance Characteristics
TA=25ºC, VIN=12V, VOUT=3.3V, unless otherwise noted.
100
90
80
70
60
50
40
30
20
10
0
1.00
0.96
0.92
0.88
0.84
0.80
0.76
0.72
0.68
0.01
0.1
1
-60
-40
-20
0
20
40
60
80
100 120 140 160
Case Temperature (oC)
Output Current (A)
Figure 4. Efficiency vs. Output Current
Figure 5. Quiescent Current vs. Case Temperature
0.96
3.40
3.36
3.32
3.28
3.24
3.20
3.16
3.12
0.88
0.80
0.72
0.64
0.56
0.48
0.40
-60
-40
-20
0
20
40
60
80
100 120 140 160
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Case Temperature (oC)
Output Current (A)
Figure 6. Feedback Voltage vs. Case Temperature
Figure 7. Output Voltage vs. Output Current
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
6
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER AP3211H
Typical Performance Characteristics (Continued)
TA=25ºC, VIN=12V, VOUT=3.3V, unless otherwise noted.
VOUT_AC
(10mV/div)
IL
VOUT_AC
(500mA/div)
(100mV/div)
VSW
(5V/div)
IOUT
(500mA/div)
Time (400ns/div)
Time (200μs/div)
Figure 8. Output Ripple (IOUT=1.5A)
Figure 9. Load Transient (IOUT=1A to 1.5A)
VEN
(5V/div)
VOUT
VEN
(5V/div)
VOUT
(2V/div)
(2V/div)
VSW
VSW
(5V/div)
(5V/div)
Time (100μs/div)
Time (40μs/div)
Figure 10. Enable Turn on Characteristic
Figure 11. Enable Turn off Characteristic
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
7
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER AP3211H
Typical Performance Characteristics (Continued)
TA=25ºC, VIN=12V, VOUT=3.3V, unless otherwise noted.
VOUT
(2V/div)
VOUT
(2V/div)
IL
IL
(1A/div)
(1A/div)
VSW
VSW
(5V/div)
(5V/div)
Time (100μs/div)
Time (100μs/div)
Figure 12. Short Circuit Protection (IOUT=1A)
Figure 13. Short Circuit Recovery (IOUT=1A)
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
8
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER
AP3211H
Typical Application
VIN=12V
5
1
6
CB
10nF
IN
BS
C1
10 F
25V
VOUT=3.3V
(1.5A)
L1 4.7 H
SW
C2
22 F
6.3V
D1
R1
49.9kꢀ
3
4
FB
EN
ON OFF
GND
2
R2
16.2kꢀ
Figure 14. Typical Application Circuit of AP3211H
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
9
Preliminary Datasheet
1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER
Mechanical Dimensions
AP3211H
SOT-23-6
Unit: mm(inch)
0°
8°
2.820(0.111)
3.020(0.119)
0.300(0.012)
0.200(0.008)
0.400(0.016)
0.300(0.012)
0.600(0.024)
6
5
4
Pin 1 Mark
1
2
3
0.700(0.028)REF
0.950(0.037)TYP
0.100(0.004)
0.200(0.008)
0.000(0.000)
0.150(0.006)
1.800(0.071)
2.000(0.079)
0.900(0.035)
1.300(0.051)
1.450(0.057)
MAX
Aug. 2012 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
10
BCD Semiconductor Manufacturing Limited
http://www.bcdsemi.com
- Headquarters
- Wafer Fab
BCD Semiconductor Manufacturing Limited
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.
No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China
800 Yi Shan Road, Shanghai 200233, China
Tel: +86-21-24162266, Fax: +86-21-24162277
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
REGIONAL SALES OFFICE
Shenzhen Office
Taiwan Office
USA Office
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office
BCD Semiconductor (Taiwan) Company Limited
BCD Semiconductor Corp.
Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
30920 Huntwood Ave. Hayward,
China
Taiwan
Tel: +886-2-2656 2808
CA 94544, USA
Tel: +86-755-8826 7951
Tel : +1-510-324-2988
Fax: +86-755-8826 7865
Fax: +886-2-2656 2806
Fax: +1-510-324-2788
相关型号：
©2020 ICPDF网 联系我们和版权申明