OPA827 [BB]

Low-Noise, High-Precision, JFET-Input, OPERATIONAL AMPLIFIER; 低噪声,高精度, JFET输入运算放大器
OPA827
型号: OPA827
厂家: BURR-BROWN CORPORATION    BURR-BROWN CORPORATION
描述:

Low-Noise, High-Precision, JFET-Input, OPERATIONAL AMPLIFIER
低噪声,高精度, JFET输入运算放大器

运算放大器
文件: 总7页 (文件大小:163K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
OPA827  
OPA2827  
SBOS376A − NOVEMBER 2006  
Low-Noise, High-Precision, JFET-Input,  
OPERATIONAL AMPLIFIER  
FD EATURES  
DESCRIPTION  
OFFSET: 250µV (max)  
DRIFT: 1µV/°C  
The OPA827 series of JFET operational amplifiers  
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combines outstanding dc precision with excellent ac  
performance. It offers 100µV of offset, very low drift  
(1µV/°C) over temperature, low bias currents, and very low  
flicker noise of 400nVPP (0.1Hz to 10Hz). It operates over  
a very wide supply voltage range of 4V to 18V on a low  
4.5mA supply current. A dual version is also available for  
the OPA827 family.  
LOW NOISE: 4.5nV//Hz at 1kHz  
BANDWIDTH: 18MHz  
SLEW RATE: 22V/µs  
BIAS CURRENT: 3pA  
QUIESCENT CURRENT: 4.5mA/Ch  
WIDE SUPPLY RANGE: +4V to +18V  
SINGLE PACKAGES: MSOP-8, SO-8  
DUAL PACKAGES: TSSOP-8, SO-8  
Excellent ac characteristics, such as 18MHz gain  
bandwidth (GBW) and 22V/µs slew rate, and precision dc  
characteristics make the OPA827 series well-suited for a  
wide range of applications such as 16- to 18-bit data  
acquisition systems, transimpedance (I/V−conversion)  
AD PPLICATIONS  
amplifiers, filters, precision  
professional audio applications.  
10V front-ends, and  
PRECISION +10V INPUT FRONT-ENDS  
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TRANSIMPEDANCE AMPLIFIERS  
INTEGRATORS  
ACTIVE FILTERS  
A/D CONVERTER DRIVERS  
DAC OUTPUT BUFFERS  
HIGH-PERFORMANCE AUDIO  
PROCESS CONTROL  
TEST EQUIPMENT  
The single version (OPA827) is available in both MSOP-8  
and standard SO-8 surface-mount packages. The dual  
version (OPA2827) is available in the small TSSOP-8 and  
in the standard SO-8 packages. All versions are specified  
from −40°C to +125°C.  
MEDICAL EQUIPMENT  
+15V  
µ
2.2 F  
100nF  
100pF  
ADS8505  
200  
500  
VIN  
33.2k  
500  
REF  
VIN  
100pF  
OPA827  
µ
2.2 F  
AGND1  
CAP  
µ
2.2 F  
100nF  
µ
2.2 F  
DGND  
AGND2  
15V  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments  
semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
Copyright 2006, Texas Instruments Incorporated  
ꢖꢙ ꢑ ꢕ ꢔ ꢎꢍ ꢗꢔ ꢚ ꢔ ꢜ ꢎꢖ ꢐꢔ ꢌ ꢒꢝ ꢅ ꢙꢑ ꢏꢑ ꢓꢒ ꢔꢏ ꢋꢕ ꢒꢋꢓ ꢗꢑ ꢒꢑ ꢑꢌ ꢗ ꢎꢒꢙ ꢔꢏ ꢕꢖ ꢔꢓ ꢋꢍꢋꢓ ꢑꢒꢋ ꢎꢌꢕ ꢑꢏ ꢔ ꢗꢔ ꢕꢋꢛ ꢌ  
ꢛꢎ ꢑ ꢜꢕ ꢝ ꢆꢔ ꢞ ꢑ ꢕ ꢉꢌ ꢕ ꢒꢏ ꢘꢐ ꢔ ꢌ ꢒꢕ ꢏ ꢔꢕ ꢔꢏ ꢚ ꢔꢕ ꢒꢙꢔ ꢏ ꢋꢛꢙ ꢒ ꢒꢎ ꢓꢙ ꢑꢌꢛ ꢔ ꢎꢏ ꢗꢋꢕ ꢓꢎ ꢌꢒꢋꢌꢘ ꢔ ꢒꢙꢔ ꢕꢔ  
ꢖꢏ ꢎ ꢗꢘ ꢓ ꢒꢕ ꢟ ꢋꢒꢙ ꢎꢘ ꢒ ꢌꢎ ꢒꢋ ꢓ ꢔ ꢝ  
www.ti.com  
ꢂꢀꢠꢡ ꢢꢣ  
www.ti.com  
SBOS376A − NOVEMBER 2006  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be  
handledwith appropriate precautions. Failure to observe  
(1)  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V  
(2)  
Signal Input Terminals, Voltage . . . . . . . . (V−)−0.7 to (V+)+0.7V  
proper handling and installation procedures can cause damage.  
(2)  
Current . . . . . . . . . . . . . . . . . . . . 10mA  
ESD damage can range from subtle performance degradation to  
complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could  
cause the device not to meet its published specifications.  
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD V  
(3)  
Output Short-Circuit  
. . . . . . . . . . . . . . . . . . . . . . . . . . Continuous  
Operating Temperature . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C  
(1)  
Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods  
may degrade device reliability. These are stress ratings only, and  
functional operation of the device at these or any other conditions  
beyond those specified is not supported.  
(2)  
(3)  
Input terminals are diode-clamped to the power-supply rails.  
Input signals that can swing more than 0.7V beyond the supply  
rails should be current-limited to 10mA or less.  
Short-circuit to ground, one amplifier per package.  
(1)  
PACKAGE/ORDERING INFORMATION  
PRODUCT  
PACKAGE-LEAD  
PACKAGE DESIGNATOR  
PACKAGE MARKING  
Low Grade  
SO-8  
MSOP-8  
SO-8  
D
DGK  
D
OPA827A  
TBD  
OPA827A  
OPA2827A  
TBD  
OPA2827A  
TSSOP-8  
PW  
High Grade  
SO-8  
MSOP-8  
SO-8  
D
DGK  
D
OPA827  
TBD  
OPA827I  
OPA2827  
TBD  
OPA2827I  
TSSOP-8  
PW  
(1)  
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site  
at www.ti.com.  
PIN CONFIGURATIONS  
TOP VIEW  
OPA827  
OPA2827  
NC(1)  
OUT A  
−IN A  
+IN A  
V−  
1
2
3
4
8
7
6
5
NC(1)  
V+  
1
2
3
4
8
7
6
5
V+  
A
OUT B  
−IN B  
+IN B  
−IN  
+IN  
V−  
B
OUT  
NC(1)  
SO8, MSOP−8  
TSSOP8, SO8  
(1) NC denotes no internal connection.  
2
ꢂ ꢀꢠ ꢡꢢꢣ  
www.ti.com  
SBOS376A − NOVEMBER 2006  
ELECTRICAL CHARACTERISTICS: V = +4V to +18V  
S
BOLDFACE limits apply over the specified temperature range, T = −405C to +1255C.  
A
At T = +25°C, R = 10kconnected to V /2, and V  
= V /2, unless otherwise noted.  
A
L
S
OUT  
S
OPA827A, OPA2827A  
OPA827I, OPA2827I  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNIT  
OFFSET VOLTAGE  
Input Offset Voltage  
Drift  
V
V
=
= 0V, V =  
S
15V  
TBD  
1
250  
3.5  
10  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
µV  
OS  
CM  
dV /dT  
OS  
µV/5C  
µV/V  
µV/V  
µV/V  
vs Power Supply  
PSRR  
V
4V to 18V, V  
= 0V  
TBD  
S
CM  
Over Temperature  
Channel Separation, dc  
INPUT BIAS CURRENT  
Input Bias Current  
Over Temperature  
Input Offset Current  
NOISE  
V
= +4V to +18V, V  
= 0V  
30  
S
CM  
TBD  
TBD  
I
3
TBD  
3
TBD  
TBD  
TBD  
*
TBD  
*
TBD  
TBD  
TBD  
pA  
pA  
pA  
B
I
OS  
Input Voltage Noise f=0.1 to 10Hz  
Input Voltage Noise Density  
f = 1kHz  
e
V
=
18V, V  
= 0V  
0.4  
*
µV  
PP  
n
S
CM  
e
e
V
V
=
=
18V, V  
18V, V  
= 0V  
= 0V  
4.5  
4.5  
*
*
nV/Hz  
nV/Hz  
n
n
S
S
CM  
CM  
f = 10kHz  
Input Current Noise Density  
f = 1kHz  
i
V
=
18V, V  
= 0V  
TBD  
*
fA/Hz  
n
S
CM  
INPUT VOLTAGE RANGE  
Common-Mode Voltage Range  
V
CM  
(V−)+2.5  
108  
(V+)−2.5  
*
*
V
Common-Mode Rejection Ratio CMRR  
Over Temperature  
INPUT IMPEDANCE  
Differential  
(V−)+2.5V < V  
CM  
< (V+)−2.5V  
TBD  
dB  
dB  
TBD  
TBD  
13  
10 ||TBD  
*
*
|| pF  
|| pF  
13  
10 ||7  
Common-Mode  
OPEN-LOOP GAIN  
Open-Loop Voltage Gain  
A
R
= 1k,  
O
114  
120  
TBD  
TBD  
dB  
OL  
L
(V−)+2.75V<V <(V+)−2.1V  
Over Temperature  
R
= 1kW,  
108  
TBD  
TBD  
TBD  
dB  
L
(V−)+2.75V<V <(V+)−2.1V  
O
FREQUENCY RESPONSE  
Gain-Bandwidth Product  
Slew Rate  
C = 100pF  
L
GBW  
SR  
18  
*
*
*
*
*
*
MHz  
V/µs  
ns  
G = +1  
22  
Settling Time, 0.1%  
0.01% (16-bit)  
t
4V Step, G = +1  
4V Step, G = +1  
TBD  
TBD  
TBD  
TBD  
S
ns  
Overload Recovery Time  
V
Gain > V  
µs  
IN  
S
Total Harmonic Distortion THD+N  
+ Noise  
G = +1, f = 1kHz  
%
OUTPUT  
Voltage Output Swing from Rail  
Over Temperature  
R
= 1k, A  
> 114dB  
(V−)+2.75  
(V+)−2.1  
*
*
V
V
L
OL  
R
= 1kW, A  
> 108dB  
(V−)+2.75  
(V+)−2.1  
*
*
L
OL  
Output Current  
I
|V − V  
OUT  
| < 1.5V  
30  
40  
*
*
mA  
mA  
pF  
OUT  
S
Short-Circuit Current  
Capacitive Load Drive  
I
SC  
LOAD  
C
TBD  
TBD  
:
NOTE * indicates same specifications as for low-grade version of device.  
3
ꢂꢀꢠꢡ ꢢꢣ  
www.ti.com  
SBOS376A − NOVEMBER 2006  
ELECTRICAL CHARACTERISTICS: V = +4V to +18V (continued)  
S
BOLDFACE limits apply over the specified temperature range, T = −405C to +1255C.  
A
At T = +25°C, R = 10kconnected to V /2, and V  
= V /2, unless otherwise noted.  
A
L
S
OUT  
S
OPA827A, OPA2827A  
OPA827I, OPA2827I  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNIT  
POWER SUPPLY  
Specified Voltage  
V
4
18  
*
*
*
V
S
Quiescent Current  
(per amp.)  
I
I
= 0  
4.5  
TBD  
*
mA  
Q
O
Over Temperature  
TEMPERATURE RANGE  
Specified Range  
TBD  
*
mA  
−40  
−55  
+125  
+125  
*
*
*
*
°C  
°C  
Operating Range  
Thermal Resistance  
SO-8, MSOP-8, TSSOP-8  
q
JA  
150  
*
°C/W  
:
NOTE * indicates same specifications as for low-grade version of device.  
4
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Nov-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SOIC  
SOIC  
Drawing  
OPA827AID  
PREVIEW  
PREVIEW  
D
D
8
8
75  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
POPA827AID  
1500  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
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in which TI products or services are used. Information published by TI regarding third-party products or services  
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Use of such information may require a license from a third party under the patents or other intellectual property  
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Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Low Power Wireless www.ti.com/lpw  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2006, Texas Instruments Incorporated  

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