OPA827 [BB]
Low-Noise, High-Precision, JFET-Input, OPERATIONAL AMPLIFIER; 低噪声,高精度, JFET输入运算放大器型号: | OPA827 |
厂家: | BURR-BROWN CORPORATION |
描述: | Low-Noise, High-Precision, JFET-Input, OPERATIONAL AMPLIFIER |
文件: | 总7页 (文件大小:163K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
OPA827
OPA2827
SBOS376A − NOVEMBER 2006
Low-Noise, High-Precision, JFET-Input,
OPERATIONAL AMPLIFIER
FD EATURES
DESCRIPTION
OFFSET: 250µV (max)
DRIFT: 1µV/°C
The OPA827 series of JFET operational amplifiers
D
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combines outstanding dc precision with excellent ac
performance. It offers 100µV of offset, very low drift
(1µV/°C) over temperature, low bias currents, and very low
flicker noise of 400nVPP (0.1Hz to 10Hz). It operates over
a very wide supply voltage range of 4V to 18V on a low
4.5mA supply current. A dual version is also available for
the OPA827 family.
LOW NOISE: 4.5nV//Hz at 1kHz
BANDWIDTH: 18MHz
SLEW RATE: 22V/µs
BIAS CURRENT: 3pA
QUIESCENT CURRENT: 4.5mA/Ch
WIDE SUPPLY RANGE: +4V to +18V
SINGLE PACKAGES: MSOP-8, SO-8
DUAL PACKAGES: TSSOP-8, SO-8
Excellent ac characteristics, such as 18MHz gain
bandwidth (GBW) and 22V/µs slew rate, and precision dc
characteristics make the OPA827 series well-suited for a
wide range of applications such as 16- to 18-bit data
acquisition systems, transimpedance (I/V−conversion)
AD PPLICATIONS
amplifiers, filters, precision
professional audio applications.
10V front-ends, and
PRECISION +10V INPUT FRONT-ENDS
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TRANSIMPEDANCE AMPLIFIERS
INTEGRATORS
ACTIVE FILTERS
A/D CONVERTER DRIVERS
DAC OUTPUT BUFFERS
HIGH-PERFORMANCE AUDIO
PROCESS CONTROL
TEST EQUIPMENT
The single version (OPA827) is available in both MSOP-8
and standard SO-8 surface-mount packages. The dual
version (OPA2827) is available in the small TSSOP-8 and
in the standard SO-8 packages. All versions are specified
from −40°C to +125°C.
MEDICAL EQUIPMENT
+15V
µ
2.2 F
100nF
100pF
ADS8505
Ω
Ω
200
500
VIN
Ω
33.2k
Ω
500
REF
VIN
100pF
OPA827
µ
2.2 F
AGND1
CAP
µ
2.2 F
100nF
µ
2.2 F
DGND
AGND2
−
15V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
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Copyright 2006, Texas Instruments Incorporated
ꢖꢙ ꢑ ꢕ ꢔ ꢎꢍ ꢗꢔ ꢚ ꢔ ꢜ ꢎꢖ ꢐꢔ ꢌ ꢒꢝ ꢅ ꢙꢑ ꢏꢑ ꢓꢒ ꢔꢏ ꢋꢕ ꢒꢋꢓ ꢗꢑ ꢒꢑ ꢑꢌ ꢗ ꢎꢒꢙ ꢔꢏ ꢕꢖ ꢔꢓ ꢋꢍꢋꢓ ꢑꢒꢋ ꢎꢌꢕ ꢑꢏ ꢔ ꢗꢔ ꢕꢋꢛ ꢌ
ꢛꢎ ꢑ ꢜꢕ ꢝ ꢆꢔ ꢞ ꢑ ꢕ ꢉꢌ ꢕ ꢒꢏ ꢘꢐ ꢔ ꢌ ꢒꢕ ꢏ ꢔꢕ ꢔꢏ ꢚ ꢔꢕ ꢒꢙꢔ ꢏ ꢋꢛꢙ ꢒ ꢒꢎ ꢓꢙ ꢑꢌꢛ ꢔ ꢎꢏ ꢗꢋꢕ ꢓꢎ ꢌꢒꢋꢌꢘ ꢔ ꢒꢙꢔ ꢕꢔ
ꢖꢏ ꢎ ꢗꢘ ꢓ ꢒꢕ ꢟ ꢋꢒꢙ ꢎꢘ ꢒ ꢌꢎ ꢒꢋ ꢓ ꢔ ꢝ
www.ti.com
ꢂꢀꢠꢡ ꢢꢣ
www.ti.com
SBOS376A − NOVEMBER 2006
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handledwith appropriate precautions. Failure to observe
(1)
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V
(2)
Signal Input Terminals, Voltage . . . . . . . . (V−)−0.7 to (V+)+0.7V
proper handling and installation procedures can cause damage.
(2)
Current . . . . . . . . . . . . . . . . . . . . 10mA
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD V
(3)
Output Short-Circuit
. . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Temperature . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2)
(3)
Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.7V beyond the supply
rails should be current-limited to 10mA or less.
Short-circuit to ground, one amplifier per package.
(1)
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
Low Grade
SO-8
MSOP-8
SO-8
D
DGK
D
OPA827A
TBD
OPA827A
OPA2827A
TBD
OPA2827A
TSSOP-8
PW
High Grade
SO-8
MSOP-8
SO-8
D
DGK
D
OPA827
TBD
OPA827I
OPA2827
TBD
OPA2827I
TSSOP-8
PW
(1)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATIONS
TOP VIEW
OPA827
OPA2827
NC(1)
OUT A
−IN A
+IN A
V−
1
2
3
4
8
7
6
5
NC(1)
V+
1
2
3
4
8
7
6
5
V+
A
OUT B
−IN B
+IN B
−IN
+IN
V−
B
OUT
NC(1)
SO−8, MSOP−8
TSSOP−8, SO−8
(1) NC denotes no internal connection.
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ꢂ ꢀꢠ ꢡꢢꢣ
www.ti.com
SBOS376A − NOVEMBER 2006
ELECTRICAL CHARACTERISTICS: V = +4V to +18V
S
BOLDFACE limits apply over the specified temperature range, T = −405C to +1255C.
A
At T = +25°C, R = 10kΩ connected to V /2, and V
= V /2, unless otherwise noted.
A
L
S
OUT
S
OPA827A, OPA2827A
OPA827I, OPA2827I
PARAMETER
CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNIT
OFFSET VOLTAGE
Input Offset Voltage
Drift
V
V
=
= 0V, V =
S
15V
TBD
1
250
3.5
10
TBD
TBD
TBD
TBD
TBD
TBD
TBD
µV
OS
CM
dV /dT
OS
µV/5C
µV/V
µV/V
µV/V
vs Power Supply
PSRR
V
4V to 18V, V
= 0V
TBD
S
CM
Over Temperature
Channel Separation, dc
INPUT BIAS CURRENT
Input Bias Current
Over Temperature
Input Offset Current
NOISE
V
= +4V to +18V, V
= 0V
30
S
CM
TBD
TBD
I
3
TBD
3
TBD
TBD
TBD
*
TBD
*
TBD
TBD
TBD
pA
pA
pA
B
I
OS
Input Voltage Noise f=0.1 to 10Hz
Input Voltage Noise Density
f = 1kHz
e
V
=
18V, V
= 0V
0.4
*
µV
PP
n
S
CM
e
e
V
V
=
=
18V, V
18V, V
= 0V
= 0V
4.5
4.5
*
*
nV/√Hz
nV/√Hz
n
n
S
S
CM
CM
f = 10kHz
Input Current Noise Density
f = 1kHz
i
V
=
18V, V
= 0V
TBD
*
fA/√Hz
n
S
CM
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
V
CM
(V−)+2.5
108
(V+)−2.5
*
*
V
Common-Mode Rejection Ratio CMRR
Over Temperature
INPUT IMPEDANCE
Differential
(V−)+2.5V < V
CM
< (V+)−2.5V
TBD
dB
dB
TBD
TBD
13
10 ||TBD
*
*
Ω || pF
Ω || pF
13
10 ||7
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
A
R
= 1kΩ,
O
114
120
TBD
TBD
dB
OL
L
(V−)+2.75V<V <(V+)−2.1V
Over Temperature
R
= 1kW,
108
TBD
TBD
TBD
dB
L
(V−)+2.75V<V <(V+)−2.1V
O
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
C = 100pF
L
GBW
SR
18
*
*
*
*
*
*
MHz
V/µs
ns
G = +1
22
Settling Time, 0.1%
0.01% (16-bit)
t
4V Step, G = +1
4V Step, G = +1
TBD
TBD
TBD
TBD
S
ns
Overload Recovery Time
V
• Gain > V
µs
IN
S
Total Harmonic Distortion THD+N
+ Noise
G = +1, f = 1kHz
%
OUTPUT
Voltage Output Swing from Rail
Over Temperature
R
= 1kΩ, A
> 114dB
(V−)+2.75
(V+)−2.1
*
*
V
V
L
OL
R
= 1kW, A
> 108dB
(V−)+2.75
(V+)−2.1
*
*
L
OL
Output Current
I
|V − V
OUT
| < 1.5V
30
40
*
*
mA
mA
pF
OUT
S
Short-Circuit Current
Capacitive Load Drive
I
SC
LOAD
C
TBD
TBD
:
NOTE * indicates same specifications as for low-grade version of device.
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ꢂꢀꢠꢡ ꢢꢣ
www.ti.com
SBOS376A − NOVEMBER 2006
ELECTRICAL CHARACTERISTICS: V = +4V to +18V (continued)
S
BOLDFACE limits apply over the specified temperature range, T = −405C to +1255C.
A
At T = +25°C, R = 10kΩ connected to V /2, and V
= V /2, unless otherwise noted.
A
L
S
OUT
S
OPA827A, OPA2827A
OPA827I, OPA2827I
PARAMETER
CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNIT
POWER SUPPLY
Specified Voltage
V
4
18
*
*
*
V
S
Quiescent Current
(per amp.)
I
I
= 0
4.5
TBD
*
mA
Q
O
Over Temperature
TEMPERATURE RANGE
Specified Range
TBD
*
mA
−40
−55
+125
+125
*
*
*
*
°C
°C
Operating Range
Thermal Resistance
SO-8, MSOP-8, TSSOP-8
q
JA
150
*
°C/W
:
NOTE * indicates same specifications as for low-grade version of device.
4
PACKAGE OPTION ADDENDUM
www.ti.com
22-Nov-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SOIC
SOIC
Drawing
OPA827AID
PREVIEW
PREVIEW
D
D
8
8
75
TBD
TBD
Call TI
Call TI
Call TI
Call TI
POPA827AID
1500
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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Applications
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amplifier.ti.com
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Military
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logic.ti.com
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Microcontrollers
power.ti.com
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