HSMT-C177 [AVAGO]

SINGLE COLOR LED, DEEP RED, 2mm, 2.00 X 1.25 MM, 0.40 MM HEIGHT, SURFACE MOUNT PACKAGE-2;
HSMT-C177
型号: HSMT-C177
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

SINGLE COLOR LED, DEEP RED, 2mm, 2.00 X 1.25 MM, 0.40 MM HEIGHT, SURFACE MOUNT PACKAGE-2

光电
文件: 总10页 (文件大小:228K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HSMx-C120/C177/C197/C265  
High Performance Chip LEDs  
Data Sheet  
Description  
Features  
High brightness AlInGaP material  
These chip type LEDs utilize Aluminium Indium Galium  
Phosphide (AlInGaP) material technology. The AlInGaP  
material has a very high luminous efficiency, capable of  
producing high light output over a wide range of drive  
currents. The available colors in this surface mount series  
are 592 nm Amber, 605 nm Orange, 626 nm Red and 639  
nm Deep Red.  
0805 or 0603 industry standard footprint with 0.4  
mm height for top emitting packages  
Also available in right angle emitting and reverse  
mounting packages  
Diffused optics  
Operating temperature range of –30°C to +85°C  
Compatible with IR soldering  
Allpackagesarebinnedbybothcolorandintensity,except  
for red and deep red color.  
Available in 4 colors  
These ChipLEDs come either in low profile top emitting  
packages (HSMx-C177/C197), in a side emitting package  
(HSMx-C120)orinareversemountpackage(HSMx-C265).  
The right angle ChipLED is suitable for applications such  
as LCD back lighting. The top emitting ChipLEDs with  
wide viewing angle are suitable for light piping and direct  
backlighting of keypads and panels. The reverse mount  
ChipLED is suitable for space saving.  
Available in 8 mm tape on 7" diameter reel  
Reel sealed in zip locked moisture barrier bags  
Applications  
Membrane switch indicator  
LCD backlighting  
Push button backlighting  
Front panel indicator  
Symbol backlighting  
Keypad backlighting  
Microdisplays  
In order to facilitate pick and place operation, these Chi-  
pLEDs are shipped in tape and reel, with 4000 units per  
reel for HSMx-C120/C177/C197 and 3000 units per reel  
for HSMx-C265.  
These packages are compatible with IR soldering pro-  
cess.  
Small message panel signage  
Device Selection Guide  
[1,2]  
Dimensions (mm)  
1.6 x 1.0 x 0.6  
2.0 x 1.25 x 0.4  
1.6 x 0.8 x 0.4  
3.4 x 1.25 x 1.1  
Amber  
Red  
Orange  
Deep Red  
Package Description  
Untinted, Non-diffused  
Untinted, Diffused  
HSMA-C120  
HSMA-C177  
HSMA-C197  
HSMA-C265  
HSMC-C120  
HSMC-C177  
HSMC-C197  
HSMC-C265  
HSML-C120  
HSML-C177  
HSML-C197  
HSML-C265  
HSMT-C177  
HSMT-C197  
HSMT-C265  
Untinted, Diffused  
Untinted, Non-diffused  
CAUTION:HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMT-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01.  
Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.  
Package Dimensions  
CATHODE MARK  
CATHODE MARK  
1.25  
(0.049)  
2.00 (0.079)  
0.80  
(0.031)  
1.60  
(0.063)  
POLARITY  
POLARITY  
DIFFUSED EPOXY  
0.40 (0.016)  
DIFFUSED EPOXY  
0.40 (0.016)  
PC BOARD  
0.16 (0.006)  
PC BOARD  
CATHODE LINE  
0.16 (0.006)  
CATHODE LINE  
0.40 0.15  
(0.016 0.006)  
0.40 0.15  
(0.016 0.006)  
0.30 0.15  
(0.012 0.006)  
1.10 (0.043) MIN.  
0.70 (0.028) MIN.  
SOLDERING  
TERMINAL  
SOLDERING  
TERMINAL  
HSMx-C177  
HSMx-C197  
3.4 (0.134)  
CATHODE  
MARK (ETCHED)  
CATHODE MARK  
(ANODE MARK FOR HSMH-C120)  
LED DIE  
LED DIE  
1.25 (0.049)  
0.3 (0.012)  
0.6 (0.024)  
1.6 (0.063)  
GREEN SOLDER MASK  
POLARITY  
POLARITY  
1.2  
(0.047)  
UNDIFFUSED  
EPOXY  
1.2 (0.047)  
CLEAR EPOXY  
1.1 (0.043)  
PC BOARD  
1.1 (0.043)  
1.0 (0.039)  
PC BOARD  
0.3 (0.012)  
0.5 (0.020)  
CATHODE LINE  
3 – 0.3 (0.012)  
0.50 0.15  
(0.020 0.006)  
0.50 0.15  
(0.020 0.006)  
CATHODE LINE  
SOLDERING  
TERMINAL  
SOLDERING  
TERMINAL  
HSMx-C120  
HSMx-C265  
NOTES:  
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).  
2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.  
2
Absolute Maximum Ratings at T = 25˚C  
A
Parameter  
HSMx-Cxxx  
Units  
mA  
mA  
mW  
V
DC Forward Current [1]  
Peak Pulsing Current[2]  
Power Dissipation  
25  
100  
60  
Reverse Voltage (IR = 100 µA)  
LED Junction Temperature  
Operating Temperature Range  
Storage Temperature Range  
Soldering Temperature  
5
95  
˚C  
–30 to +85  
–40 to +85  
˚C  
˚C  
See reflow soldering profile (Figures 8 & 9)  
Notes:  
1. Derate linearly as shown in Figure 4.  
2. Pulse condition of 1/10 duty and 0.1 ms width.  
Electrical Characteristics at T = 25˚C  
A
Forward Voltage  
Reverse Breakdown  
Capacitance C  
Thermal  
V (Volts)  
F
V (Volts)  
R
(pF), V = 0,  
Resistance  
F
@ I = 20 mA  
@ I = 100 µA  
f = 1 MHz  
Typ.  
11  
Rθ  
(˚C/W)  
F
R
J–PIN  
Part Number  
Typ.  
1.9  
1.9  
1.9  
1.9  
1.9  
1.9  
1.9  
1.9  
1.9  
1.9  
1.9  
Max.  
2.4  
2.4  
2.4  
2.4  
2.4  
2.4  
2.4  
2.4  
2.4  
2.4  
2.4  
Min.  
5
Typ.  
400  
300  
550  
400  
300  
550  
400  
300  
550  
300  
550  
HSMA-C120  
HSMA-C177/197  
HSMA-C265  
5
11  
5
11  
HSMC-C120  
5
15  
HSMC-C177/197  
HSMC-C265  
5
15  
5
15  
HSML-C120  
5
20  
HSML-C177/197  
HSML-C265  
5
20  
5
20  
HSMT-C177/197  
HSMT-C265  
5
15  
5
15  
V Tolerance: 0.1 V  
F
3
Optical Characteristics at T = 25˚C  
A
Luminous  
Intensity  
Color,  
Peak  
Viewing  
Angle  
Luminous  
Efficacy  
Dominant  
I (mcd)  
Wavelength  
Wavelength 2 θ  
η
V
1/2  
V
[1]  
[2]  
[3]  
@ 20 mA  
Min.  
28.5  
28.5  
28.5  
28.5  
28.5  
28.5  
28.5  
28.5  
28.5  
11.2  
11.2  
λ
peak  
(nm)  
λ
(nm)  
Degrees  
Typ.  
155  
130  
150  
155  
130  
150  
155  
130  
150  
130  
150  
(lm/w)  
Typ.  
480  
480  
480  
155  
155  
155  
370  
370  
370  
70  
d
Part Number  
HSMA-C120  
HSMA-C177/197  
HSMA-C265  
HSMC-C120  
HSMC-C177/197  
HSMC-C265  
HSML-C120  
Color  
Typ.  
90  
90  
75  
90  
90  
75  
90  
90  
75  
30  
25  
Typ.  
595  
595  
595  
637  
637  
637  
609  
609  
609  
660  
660  
Typ.  
592  
592  
592  
626  
626  
626  
605  
605  
605  
639  
639  
Amber  
Amber  
Amber  
Red  
Red  
Red  
Orange  
Orange  
Orange  
Deep Red  
Deep Red  
HSML-C177/197  
HSML-C265  
HSMT-C177/197  
HSMT-C265  
70  
Notes:  
1. The luminous intensity, I , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the  
V
lamp package.  
2. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.  
d
3. ꢀ θ is the off-axis angle where the luminous intensity is 1/2 the peak intensity.  
1/2  
4
Color Bin Limits  
[1]  
[1]  
Orange Color Bins  
Light Intensity (Iv) Bin Limits  
Intensity (mcd)  
Dom. Wavelength (nm)  
Bin ID  
Min.  
Max.  
Bin ID  
Min.  
Max.  
A
597.0  
600.0  
603.0  
606.0  
609.0  
612.0  
600.0  
603.0  
606.0  
609.0  
612.0  
615.0  
A
0.11  
0.18  
B
B
0.18  
0.29  
C
C
0.29  
0.45  
D
D
0.45  
0.72  
E
E
0.72  
1.10  
F
F
1.10  
1.80  
Tolerance: 1 nm  
G
1.80  
2.80  
H
2.80  
4.50  
J
4.50  
7.20  
K
7.20  
11.20  
18.00  
28.50  
45.00  
71.50  
112.50  
180.00  
285.00  
450.00  
715.00  
1125.00  
1800.00  
2850.00  
4500.00  
[1]  
Amber Color Bins  
L
11.20  
18.00  
28.50  
45.00  
71.50  
112.50  
180.00  
285.00  
450.00  
715.00  
1125.00  
1800.00  
2850.00  
Dom. Wavelength (nm)  
M
Bin ID  
Min.  
Max.  
N
A
582.0  
584.5  
587.0  
589.5  
592.0  
594.5  
584.5  
587.0  
589.5  
592.0  
594.5  
597.0  
P
B
Q
C
R
D
S
E
T
F
U
Tolerance: 1 nm  
V
W
X
Y
[1]  
Red Color Bins  
Tolerance: 15ꢀ  
Dom. Wavelength (nm)  
Bin ID  
Min.  
Max.  
-
620.0  
635.0  
Notes:  
Tolerance: 1 nm  
1. Bin categories are established for  
classification of products. Products may  
not be available in all categories. Please  
contact your Avago representative for  
information on currently available bins.  
2. The Iv binning specification set-up is for  
lowest allowable Iv binning only. There  
are no upper Iv bin limits.  
Note:  
1. Bin categories are established for classification of products. Products may not be available  
in all categories. Please contact your Avago representative for information on currently  
available bins.  
5
100  
1.4  
1.2  
100  
10  
1
AS  
AS  
90  
80  
70  
60  
50  
40  
30  
20  
RED  
AMBER  
AS  
DEEP  
RED  
1.0  
0.8  
0.6  
0.4  
0.2  
0
AS AlInGaP  
AS  
ORANGE  
AS AMBER  
AS ORANGE, RED  
and DEEP RED  
10  
0
0
0
5
10  
15  
20  
25  
30  
1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3  
500  
550  
600  
650  
700  
I
– FORWARD CURRENT – mA  
WAVELENGTH – nm  
V – FORWARD VOLTAGE – V  
F
F
Figure 1. Relative intensity vs. wavelength.  
Figure 2. Forward current vs. forward voltage.  
Figure 3. Luminous intensity vs. forward current.  
100  
90  
30  
25  
20  
80  
70  
60  
50  
40  
HSMx-C120/177/197  
15  
HSMx-C265  
10  
30  
20  
10  
5
0
0
0
10 20 30 40 50 60 70 80 90  
– AMBIENT TEMPERATURE – °C  
-90 -80 -70 -60 -50 -40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90  
T
A
ANGLE  
Figure 4. Maximum forward current vs.  
ambient temperature.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-90 -80 -70 -60 -50 -40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90  
ANGLE  
Figure 5. Relative intensity vs. angle for HSMx-C120.  
6
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-90 -80 -70 -60 -50 -40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90  
ANGLE  
Figure 6. Relative intensity vs. angle for HSMx-C177/197.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-90 -80 -70 -60 -50 -40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90  
ANGLE  
Figure 7. Relative intensity vs. angle for HSMx-C265.  
10 SEC. MAX.  
255 - 260 C  
3 C/SEC. MAX.  
217 C  
200 C  
10 SEC. MAX.  
230°C MAX.  
6 C/SEC. MAX.  
150 C  
4°C/SEC. MAX.  
3°C/SEC. MAX.  
140-160°C  
3 C/SEC. MAX.  
60-120SEC.  
4°C/SEC.  
MAX.  
60 SEC. MAX.  
OVER 2 MIN.  
TIME  
TIME  
Figure 9. Recommended Pb-free reflow soldering profile.  
Figure 8. Recommended reflow soldering profile.  
CENTERING  
BOARD  
CENTERING  
BOARD  
0.8 (0.031)  
1.2 (0.047)  
1.2  
1.2  
(0.047)  
0.8  
(0.031)  
0.8  
(0.031)  
(0.047)  
0.7  
(0.028)  
0.9  
(0.035)  
Figure 10. Recommended soldering pattern  
for HSMx-C177.  
Figure 11. Recommended soldering pattern  
for HSMx-C197.  
NOTE:  
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).  
7
2.2 (0.087) DIA. PCB HOLE  
0.4 (0.016)  
0.4 (0.016)  
0.7 (0.028)  
1.25 (0.049)  
0.15 (0.006)  
CENTERING  
BOARD  
1.4  
(0.055)  
2.3  
(0.091)  
1.4  
(0.055)  
0.8  
(0.031)  
1.2  
(0.047)  
0.8  
(0.031)  
Figure 12. Recommended soldering pattern for HSMx-C120.  
Figure 13. Recommended soldering pattern for HSMx-C265.  
USER FEED DIRECTION  
CATHODE SIDE  
PRINTED LABEL  
Figure 14. Reeling orientation.  
8.0 1.0 ꢀ0.ꢂ15 0.0ꢂꢃ3  
10.50 1.0 ꢀ0.ꢁ1ꢂ 0.0ꢂꢃ3  
Ø 1ꢂ.1 0.5  
ꢀØ 0.516 0.0203  
Ø 20.20 MIN.  
ꢀØ 0.7ꢃ5 MIN.3  
ꢂ.0 0.5  
ꢀ0.118 0.0203  
5ꢃ.60 1.00  
178.ꢁ0 1.00  
ꢀ7.02ꢁ 0.0ꢂꢃ3  
ꢀ2.ꢂꢁ6 0.0ꢂꢃ3  
ꢁ.0 0.5  
ꢀ0.157 0.0203  
5.0 0.5  
ꢀ0.1ꢃ7 0.0203  
6
PS  
Figure 15. Reel dimensions.  
NOTE:  
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).  
8
DIM. C  
(SEE TABLE 1)  
4.00 (0.1ꢀ7)  
CATHODE  
1.ꢀ0 (0.0ꢀ9)  
0.20 0.0ꢀ  
(0.008 0.002)  
1.75 (0.0692  
ꢀ.50 0.05  
(0.1ꢀ8 0.00ꢁ2  
DIM. A  
(SEE TABLE 12  
8.00 0.ꢀ0  
(0.ꢀ15 0.01ꢁ2  
DIM. B  
(SEE TABLE 1)  
CARRIER TAPE  
COVER TAPE  
USER FEED  
DIRECTION  
2.00 0.0ꢀ  
(0.079 0.002)  
4.00 (0.1ꢀ7)  
TABLE 1  
DIMENSIONS IN MILLIMETERS (INCHES)  
DIM. A DIM. B  
0.10 (0.004) 0.10 (0.004)  
DIM. C  
HSMx-C120  
POSITION IN  
CARRIER TAPE  
PART NUMBER  
0.10 (0.004)  
HSMx-C120 SERIES  
HSMx-C177 SERIES  
HSMx-C197 SERIES  
1.90 (0.07ꢀ) 1.1ꢀ (0.04ꢀ) 0.7ꢀ (0.030)  
2.30 (0.091) 1.40 (0.0ꢀꢀ) 0.60 (0.024)  
1.7ꢀ (0.069) 0.9ꢀ (0.037) 0.60 (0.024)  
DIM. A  
(SEE TABLE 1)  
DIM. B  
(SEE TABLE 1)  
HSMx-C120  
R 0.ꢀ 0.0ꢀ  
(0.020 0.002)  
DIM. C  
(SEE TABLE 1)  
4.00 (0.157)  
CATHODE  
1.50 (0.059)  
0.20 0.05  
(0.008 0.002)  
1.75 (0.069)  
3.50 0.05  
(0.138 0.002)  
DIM. A  
(SEE TABLE 1)  
8.00 0.30  
(0.315 0.012)  
DIM. B  
CARRIER TAPE  
COVER TAPE  
(SEE TABLE 1)  
USER FEED  
DIRECTION  
2.00 0.05  
(0.079 0.002)  
4.00 (0.157)  
TABLE 1  
DIMENSIONS IN MILLIMETERS (INCHES)  
DIM. A DIM. B  
0.10 (0.004) 0.10 (0.004)  
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057)  
DIM. C  
PART NUMBER  
0.10 (0.004)  
1.30 (0.051)  
Figure 16. Tape dimensions.  
NOTES:  
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).  
2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.  
9
END  
START  
Convective IR Reflow Soldering  
For more information on IR reflow  
soldering, refer to Application Note  
1060, Surface Mounting SMT LED Indicator  
Components.  
Storage Condition:  
THERE SHALL BE A  
MOUNTED WITH  
COMPONENTS  
THERE SHALL BE A  
MINIMUM OF 160 mm  
(6.3 INCH) OF EMPTY  
COMPONENT POCKETS  
SEALED WITH COVER  
TAPE.  
MINIMUM OF  
230 mm  
5 to 30°C @ 60% RH max.  
Baking is required under the  
condition:  
MINIMUM OF 160 mm  
(6.3 INCH) OF EMPTY  
COMPONENT POCKETS  
SEALED WITH COVER  
TAPE.  
(9.05 INCH)  
MAY CONSIST  
OF CARRIER  
AND/OR  
COVER TAPE.  
a) Humidity Indicator Card is >10ꢀ  
when read at 23 5°C  
Figure 17. Tape leader and trailer dimensions.  
b) Device exposed to factory condi-  
tions <30°C/60ꢀ RH more than  
672 hours.  
Baking recommended condition: 60  
5°C for 20 hours.  
For product information and a complete list of distributors, please go to our website: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.  
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0520EN  
AV02-0975EN - February 8, 2010  

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