HSMU-A100-R00J1 [AVAGO]
SINGLE COLOR LED, AMBER, 2.2mm, PLASTIC, LCC-2;型号: | HSMU-A100-R00J1 |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | SINGLE COLOR LED, AMBER, 2.2mm, PLASTIC, LCC-2 光电 |
文件: | 总13页 (文件大小:221K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HSMx-A10x-xxxxx
PLCC-2, Surface Mount LED Indicator
Data Sheet
Description
Features
This family of SMT LEDs is packaged in the industry
standard PLCC-2 package. These SMT LEDs have high
reliability performance and are designed to work under
a wide range of environmental conditions. This high
reliability feature makes them ideally suited to be used
under harsh interior automotive as well as interior signs
application conditions.
• Industry standard PLCC-2 package
• High reliability LED package
• High brightness using AlInGaP and InGaN dice tech-
nologies
• Available in full selection of colors
• Super wide viewing angle at 120˚
To facilitate easy pick & place assembly, the LEDs
are packed in EIA-compliant tape and reel. Every reel will
be shipped in single intensity and color bin, except red
color, to provide close uniformity.
• Available in 8 mm carrier tape on 7 inch reel (2000
pieces)
• Compatible with both IR and TTW soldering process
Applications
These LEDs are compatible with IR solder reflow process.
Due to the high reliability feature of these products, they
can also be mounted using through-the-wave soldering
process.
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
The super wide viewing angle at 120˚ makes these
LEDs ideally suited for panel, push button, or general
backlighting in automotive interior, office equipment,
industrial equipment, and home appliances. The flat
top emitting surface makes it easy for these LEDs
to mate with light pipes. With the built-in reflector
pushing up the intensity of the light output, these LEDs
are also suitable to be used as LED pixels in interior elec-
tronic signs.
• Electronic signs and signals
– Interior full color sign
– Variable message sign
• Office automation, home appliances, industrial
equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precau-
tions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
ꢁ.8 0.ꢁ
ꢁ.ꢁ 0.ꢁ
ꢂ.9 0.ꢁ
0.ꢂ TYP.
0.8 0.ꢂ
ꢀ.ꢁ 0.ꢁ
ꢀ.5 0.ꢁ
0.8 0.ꢀ
0.5 0.ꢂ
CATHODE MARKING
(ANODE MARKING FOR AlGaAs DEVICES)
TOP MOUNT
ꢁ.8 0.ꢁ
ꢁ.ꢁ 0.ꢁ
ꢂ.9 0.ꢁ
5.ꢁ 0.ꢁ
ꢀ.ꢁ 0.ꢁ
0.ꢂ TYP.
CATHODE MARKING
0.5 0.ꢂ
REVERSE MOUNT
NOTE: ALL DIMENSIONS IN MILLIMETERS.
2
Table 1. Device Selection Guide
Red
Part Number
Min IV (mcd)
4.50
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
GaP
HSMS-A100-J00J1
HSMS-A100-L00J1
HSMS-A100-H70J2
HSMS-A100-J80J2
HSMH-A100-L00J1
HSMH-A100-N00J1
HSMH-A100-M80J2
HSMC-A100-Q00J1
HSMC-A100-R00J1
HSMC-A101-S00J1
HSMZ-A100-T00J1
HSMC-A100-P30J1
15.00
15.00
-
-
20
20
10
10
20
20
10
20
20
20
20
20
11.20
3.55
-
GaP
7.20
GaP
5.60
-
14.00
GaP
11.20
28.50
22.40
71.50
112.50
180.00
285.00
45.00
15.00
50.00
-
-
AlGaAs
AlGaAs
AlGaAs
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
-
56.00
100.00
140.00
220.00
350.00
-
-
-
-
-
90.00
Red Orange
Part Number
Min IV (mcd)
71.50
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
AlInGaP
HSMJ-A100-Q00J1
HSMJ-A101-S00J1
HSMJ-A100-T40J1
HSMV-A100-T00J1
HSMJ-A100-R40J1
HSMV-A100-S80J1
100.00
-
20
20
20
20
20
20
180.00
285.00
285.00
112.50
224.00
200.00
-
AlInGaP
-
715.00
-
AlInGaP
350.00
AlInGaP
-
-
285.00
560.00
AlInGaP
AlInGaP
Orange
Part Number
Min IV (mcd)
4.50
Typ. IV (mcd)
15.00
Max. IV (mcd)
Test Current (mA)
Dice Technology
GaP
HSMD-A100-J00J1
HSMD-A100-L00J1
HSMD-A100-K4PJ2
HSML-A100-Q00J1
HSML-A101-S00J1
-
20
20
10
20
20
11.20
15.00
-
GaP
7.20
-
18.00
GaP
71.50
100.00
220.00
-
-
AlInGaP
AlInGaP
180.00
3
Table 1. Device Selection Guide (Cont.)
Yellow / Amber
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
GaP
HSMY-A100-J00J1
HSMY-A100-L00J1
HSMY-A100-J35J2
HSMA-A100-Q00J1
HSMA-A101-S00J1
HSMU-A100-S00J1
HSMA-A101-R8WJ1
HSMU-A100-S4WJ1
4.50
11.20
4.50
12.00
12.00
-
-
20
20
10
20
20
20
20
20
-
GaP
9.00
GaP
71.50
180.00
180.00
140.00
180.00
100.00
220.00
320.00
-
-
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
-
-
355.00
450.00
-
Yellow Green
Part Number
Min IV (mcd)
4.50
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
GaP
HSMG-A100-J02J1
HSMG-A100-K72J2
HSME-A100-M02J1
HSME-A100-N82J1
18.00
-
20
10
20
20
9.00
-
70.00
-
18.00
-
GaP
18.00
AlInGaP
AlInGaP
35.50
90.00
Emerald Green
Part Number
Min IV (mcd)
2.80
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
GaP
HSMG-A100-H01J1
HSMG-A100-H41J2
HSME-A100-L01J1
HSME-A100-M3PJ1
8.00
-
7.20
-
20
10
20
20
2.80
-
40.00
-
GaP
11.20
AlInGaP
AlInGaP
18.00
35.50
Green
Part Number
Min IV (mcd)
112.50
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
InGaN
HSMM-A101-R00J1
HSMM-A100-S00J1
HSMM-A100-U4PJ1
HSMM-A100-V7PJ1
200.00
-
20
20
20
20
180.00
350.00
-
InGaN
450.00
-
-
1125.00
1800.00
InGaN
900.00
InGaN
Blue
Part Number
Min IV (mcd)
28.50
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
InGaN
HSMN-A101-N00J1
HSMN-A100-P00J1
HSMN-A100-R4YJ1
HSMN-A100-S4YJ1
50.00
-
20
20
20
20
45.00
70.00
-
InGaN
112.50
180.0
-
-
285.00
450.0
InGaN
InGaN
4
Part Numbering System
HSM x - A x x x - x x
x
x x
8 9
1
2
3
4
5
6
7
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters
HSMS/D/Y/G
30 mA
HSMH
30 mA
100 mA
60 mW
HSMC/J/L/A
30 mA [3,4]
100 mA
HSME
20 mA [4]
100 mA
48 mW
HSMZ/V/U
30 mA [3,4]
100 mA
HSMM/K/B/N
30 mA
DC Forward Current [1]
Peak Forward Current [2]
Power Dissipation
Reverse Voltage
100 mA
63 mW
100 mA
63 mW
72 mW
114 mW
5 V
Junction Temperature
Operating Temperature
Storage Temperature
110°C
–55°C to +100°C
–55°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 30 mA is recommended for best long term performance.
4. Operation at current below 5 mA is not recommended.
5
Optical Characteristics (T = 25˚C)
A
Luminous
Intensity/
Total Flux
Peak
Dominant
Viewing Angle
2 θ1/2
(Degrees)
Typ.
Luminous
[1]
[2]
[3]
Wavelength Wavelength
Efficacy ηv
(lm/W)
Typ.
Dice
Technology
λ
(nm)
λD (nm)
Typ.
Iv(mcd)/Φv(mlm)
Typ.
PEAK
Color
Part Number
HSMS-A100
HSMH-A100
HSMC-A10x
HSMZ-A100
HSMJ-A10x
HSMV-A100
HSMD-A100
HSML-A10x
HSMY-A100
HSMA-A10x
HSMU-A100
HSMG-A100
HSME-A100
HSMG-A100
HSME-A100
HSMM-A10x
HSMK-A10x
HSMB-A100
HSMN-A10x
Typ.
Red
GaP
635
645
635
639
621
623
600
609
583
592
594
565
575
558
566
523
502
428
468
626
637
626
630
615
617
602
605
585
590
592
569
570
560
560
525
505
462
470
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
63
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
AlGaAs
AlInGaP
AlInGaP
AlInGaP
AlInGaP
GaP
150
155
240
263
380
320
520
480
500
590
560
650
610
500
300
65
Red
Orange
Orange
AlInGaP
GaP
Amber
AlInGaP
AlInGaP
GaP
Yellow
Green
Emerald
Green
Green
Cyan
AlInGaP
GaP
AlInGaP
InGaN
InGaN
GaN
Blue
InGaN
75
Notes:
1. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the device.
D
2.
θ
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
3. Radiant intensity, I in watts/steradian, may be calculated from the equation I = I /η , where I is the luminous intensity in candelas and η is
e
e
v
v
v
v
the luminous efficacy in lumens/watt.
Electrical Characteristics (T = 25˚C)
A
Forward Voltage VF (Volts) @ I = 20 mA
Reverse Voltage
V @ 100 μA
R
Reverse Voltage
V @ 10 μA
R
Thermal
Resistance
F
Part Number
HSMS/D/Y/G
HSMH
Typ.
2.2
1.9
1.9
2.2
3.9
3.4
Max.
2.6
Min.
Min.
—
—
—
—
5
Rθ (°C/W)
JP
5
180
180
280
280
280
280
2.6
5
HSMC/J/L/A/E
HSMZ/V/U
HSMB
2.4
5
2.6
5
4.3
—
—
HSMM/K/N
4.05
5
6
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
BLUE
CYAN
EMERALD GREEN
YELLOW GREEN
GREEN
AMBER
ORANGE
RED ORANGE
RED
0.2
0.1
0
380
430
480
530
580
630
680
730
780
WAVELENGTH – nm
1.0
0.8
0.6
0.4
0.2
0
GaP
EMERALD
GREEN
GaP
YELLOW
GREEN
GaP YELLOW
GaP ORANGE
GaP RED
GaN BLUE
380
430
480
530
580
630
680
730
780
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
35
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Gap
30
HSMS/D/Y/G
HSMZ/V/U
AlInGaP
AlGaAs
25
InGaN
GaN
20
HSMH
15
HSMC/J/L/A/E
HSMM/K/N
HSMB
10
5
0
0
5
10
15
20
25
30 35
0
1
2
3
4
5
DC FORWARD CURRENT – mA
FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative intensity vs. forward current.
35
35
30
30
HSMS/D/G/
HSMS/D/G/Y/H
HSMC/J/L/A
HSMZ/V/U
Y/H/Z/V/U
25
25
20
15
10
5
HSMC/J/L/A
20
HSME
HSME
HSMM/K/N
HSMB
15
HSMM/K/B/N
10
5
0
0
0
20
40
60
80
100
120
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 4. Maximum forward current vs. ambient temperature. Derated
based on TJMAX = 110˚C, RθJA = 500˚C/W.
Figure 4b. Maximum Forward Current Vs. Solder Point Temperature. De-
rated based on TJMAX = 110°C, RθJP = 180°C/W or 280°C/W.
7
540
530
0.5
0.4
0.3
0.2
0.1
0
GREEN
CYAN
520
510
500
490
480
470
460
GaP/AlGaAs/
AlInGaP
-0.1
BLUE
25
-0.2
-0.3
InGaN/GaN
50
0
5
10
15
20
30
35
-100
-50
0
100
150
CURRENT – mA
TEMPERATURE – °C
Figure 5. Dominant wavelength vs. forward current – InGaN devices.
Figure 6. Forward voltage shift vs. temperature.
1.0
0.8
0.6
0.4
0.2
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Radiation Pattern.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
10 to 30 SEC.
200
255 - 260 C
3 C/SEC. MAX.
217 C
200 C
150
6 C/SEC. MAX.
FLUXING
100
150 C
3 C/SEC. MAX.
60 - 120 SEC.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
50
30
100 SEC. MAX.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME
TIME – SECONDS
(Acc. to J-STD-020C)
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
Figure 8. Recommended Pb-free reflow soldering profile.
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
Figure 9. Recommended wave soldering profile.
8
4.50
1.50
2.60
SOLDER RESIST
Figure 10. Recommended soldering pad pattern
TRAILER
COMPONENT
LEADER
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
Figure 11. Tape leader and trailer dimensions
4
0.1
4
0.1
2
0.05
2.29 0.1
1.75 0.1
3.5 0.05
+0.1
–0
Ø 1.5
C
3.81 0.1
+0.3
–0.1
8
A
+0.1
3.05 0.1
Ø1
–0
8°
0.229 0.01
Figure 12. Tape dimensions
9
Ø 20.5 0.ꢀ
+0.5
–0
2
+0
–2.5
62.5
180
Ø 1ꢀ 0.2
+1.50
–0.00
8.4
(MEASURED AT OUTER EDGE)
14.4 (MAX. MEASURED AT HUB)
LABEL AREA (111 mm x 57 mm)
WITH DEPRESSION (0.25 mm)
7.9 (MIN.)
10.9 (MAX.)
Figure 13. Reel dimensions.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 14. Reeling orientation.
10
Intensity Bin Select (X X )
Intensity Bin Limits
5
6
Individual reel will contain parts
from one half bin only.
Bin ID
G1
G2
H1
H2
J1
Min. (mcd)
1.80
Max. (mcd)
2.24
X
5
Min I Bin
2.24
2.80
v
2.80
3.55
3.55
4.50
X
6
4.50
5.60
0
2
3
4
5
6
7
8
9
Full Distribution
J2
5.60
7.20
2 half bins starting from X51
3 half bins starting from X51
4 half bins starting from X51
5 half bins starting from X51
2 half bins starting from X52
3 half bins starting from X52
4 half bins starting from X52
5 half bins starting from X52
K1
K2
L1
7.20
9.00
9.00
11.20
11.20
14.00
18.00
22.40
28.50
35.50
45.00
56.00
71.50
90.00
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
1125.00
1400.00
1800.00
2240.00
14.00
L2
18.00
M1
M2
N1
N2
P1
P2
Q1
Q2
R1
R2
S1
22.40
28.50
35.50
45.00
56.00
71.50
90.00
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
1125.00
1400.00
1800.00
2240.00
2850.00
S2
T1
T2
U1
U2
V1
V2
W1
W2
X1
X2
Tolerance of each bin limit = 12%
11
Color Bin Select (X )
Color Bin Limits
Color Bin Limits
7
Individual reel will contain parts
from one full bin only.
Blue
A
Min. (nm)
Max. (nm)
465.0
Amber
Min. (nm)
Max. (nm)
584.5
460.0
465.0
470.0
475.0
A
B
C
D
E
582.0
584.5
587.0
589.5
592.0
594.5
B
470.0
587.0
X
7
C
475.0
589.5
0
Full Distribution
A and B only
592.0
D
480.0
Z
Y
W
V
U
T
594.5
B and C only
F
597.0
C and D only
Cyan
A
Min. (nm)
490.0
Max. (nm)
495.0
D and E only
E and F only
B
495.0
500.0
Orange
Min. (nm)
597.0
Max. (nm)
600.0
F and G only
C
500.0
505.0
A
B
C
D
E
S
G and H only
D
505.0
510.0
600.0
603.0
Q
P
N
M
L
A, B, and C only
B, C, and D only
C, D, and E only
D, E, and F only
E, F, and G only
F, G, and H only
A, B, C, and D only
E, F, G, and H only
B, C, D, and E only
C, D, E, and F only
A, B, C, D, and E only
B, C, D, E, and F only
603.0
606.0
606.0
609.0
Green
A
B
Min. (nm)
515.0
Max. (nm)
520.0
609.0
612.0
520.0
525.0
C
D
525.0
530.0
Red Orange
A
Min. (nm)
611.0
Max. (nm)
616.0
K
1
530.0
535.0
B
616.0
620.0
2
3
Emerald
Green
A
B
4
Min. (nm)
552.5
Max. (nm)
555.5
Red
Min. (nm)
Max. (nm)
5
Full Distribution
Tolerance of each bin limit = 1 nm.
6
555.5
558.5
C
D
558.5
561.5
561.5
564.5
Yellow
Green
E
Min. (nm)
564.5
Max. (nm)
567.5
F
567.5
570.5
G
H
570.5
573.5
573.5
576.5
12
Packaging Option (X X )
Moisture Sensitivity
8
9
Option Test Current
Package Type
Top Mount
Reel Size
7 inch
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the
reliability of the product. Do refer to Avago Application
Note AN5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
J1
20 mA
20 mA
20 mA
20 mA
10 mA
10 mA
10 mA
10 mA
2 mA
J4
Top Mount
13 inch
7 inch
H1
H4
J2
Reverse Mount
Reverse Mount
Top Mount
13 inch
7 inch
A. Storage before use
J5
Top Mount
13 inch
7 inch
-
Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to reflow
the LEDs per the original MSL rating.
H2
H5
L2
Reverse Mount
Reverse Mount
Top Mount
13 inch
7 inch
-
It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
-
The humidity indicator card (HIC) shall be read im-
mediately upon opening of MBB.
-
The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
-
For any unuse LEDs, they need to be stored
in sealed MBB with desiccant or desiccator at
<5%RH.
D. Control of assembled boards
-
If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB need
to be stored in sealed MBB with desiccant or desic-
cator at <5%RH to ensure no LEDs have exceeded
their floor life of 672 hours.
E. Baking is required if:
-
-
-
“10%” is Not blue and “5%” HIC indicator turns
pink.
The LEDs are exposed to condition of >30°C / 60%
RH at any time.
The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60 5°C for 20 hours.
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Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes AV01-0040EN
AV02-0198EN - January 28, 2014
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