HLMP-CW46-PS0XX [AVAGO]
T-1 (5mm) Extra Bright Precision Optical Performance White LED Lamps.; T-1 （5毫米）超亮精密光学性能的白光LED灯。
| 型号： | HLMP-CW46-PS0XX |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 (5mm) Extra Bright Precision Optical Performance White LED Lamps. |
| 文件： | 总8页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-CW46, HLMP-CW47. HLMP-CW76, HLMP-CW77
T-1 ¾ (5mm) Extra Bright Precision Optical
Performance White LED Lamps.
Data Sheet
Description
Features
• Well defined spatial radiation pattern
• High luminous white emission
• Viewing angle: 50° and 70°.
• Standoff or non-standoff leads
• Superior resistance to moisture
These high intensity white LED lamps are based on
InGaN material technology. A blue LED die is coated
by phosphor to produce white. The typical resulting
color is described by the coordinates x = 0.31, y = 0.31
using the 1931 CIE Chromaticity Diagram.
These T-1 ¾ lamps are untinted, diffused, and
incorporate precise optics which produce well-defined
spatial radiation patterns at specific viewing cone
angle.
Applications
• Electronic signs and signals
• Small area illumination
• Legend backlighting
• General purpose indicators
Benefit
• Reduced power consumption, higher reliability, and
increased optical/mechanical design flexibility
compared to incandescent bulbs and other
alternative white light sources.
Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and
processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package Dimension A
Package Dimension B
5.ꢀꢀ ꢀ.2ꢀ
(ꢀ.197 ꢀ.ꢀꢀ08
5.ꢀꢀ ꢀ.2ꢀ
(ꢀ.197 ꢀ.ꢀꢀ08
0.71 ꢀ.2ꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
1.14 ꢀ.2ꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
0.71 ꢀ.2ꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
DIMENSION H
1.14 ꢀ.2ꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
2.35 (ꢀ.ꢀ938
MAX.
ꢀ.7ꢀ (ꢀ.ꢀ208
MAX.
1.5ꢀ ꢀ.15
(ꢀ.ꢀ59 ꢀ.ꢀꢀ68
31.6ꢀ
(1.2448
31.6ꢀ
(1.2448
MIN.
DIMENSION H:
MIN.
50°: 11.98 0.25mm (0.4715 0.01 inches)
70°: 11.09 0.25mm (0.43ꢀ5 0.01 inches)
ꢀ.7ꢀ (ꢀ.ꢀ208
MAX.
CATHODE
LEAD
CATHODE
LEAD
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀ2ꢀ ꢀ.ꢀꢀ48
SQ. TYP.
1.ꢀꢀ
(ꢀ.ꢀ398
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀ2ꢀ ꢀ.ꢀꢀ48
MIN.
SQ. TYP.
1.ꢀꢀ
(ꢀ.ꢀ398
MIN.
Notes:
5.0ꢀ ꢀ.2ꢀ
1. All dimensions are in millimeters /inches.
2. Epoxy meniscus may extend about 1mm
(0.040") down the leads.
3. If heat-sinking application is required, the
terminal for heat sink is anode.
(ꢀ.220 ꢀ.ꢀꢀ08
5.0ꢀ ꢀ.2ꢀ
(ꢀ.220 ꢀ.ꢀꢀ08
CATHODE
FLAT
CATHODE
FLAT
2.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
2.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
Part Numbering System
H L M P - CW XX - X X X XX
Mechanical Option
ꢀꢀ: Bulk
DD: Ammo Pack Straight Leads
Color Bin Options
ꢀ: Full color bin distribution
B: Color bin 2 & 3 only
Maximum Intensity Bin
ꢀ: No maximum intensity bin limit
Others: Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Standoff Option
46: 5ꢀ˚ without standoff
47: 5ꢀ˚ with standoff
76: 7ꢀ˚ without standoff
77: 7ꢀ˚ with standoff
2
Device Selection Guide
Intensity (mcd) at 20 MA
Typical Viewing Angle,
Package
Part Number
2θ ½ (Degree)
Min.
00ꢀ
Max.
25ꢀꢀ
19ꢀꢀ
19ꢀꢀ
4200
3200
3200
25ꢀꢀ
19ꢀꢀ
19ꢀꢀ
4200
3200
3200
19ꢀꢀ
15ꢀꢀ
15ꢀꢀ
3200
2500
2500
19ꢀꢀ
15ꢀꢀ
15ꢀꢀ
3200
2500
2500
Standoff
No
Dimension
HLMP-CW46-PSꢀxx
HLMP-CW46-QRꢀxx
HLMP-CW46-QRBxx
HLMP-CW46-RU0xx
HLMP-CW46-ST0xx
HLMP-CW46-STBxx
HLMP-CW47-PSꢀxx
HLMP-CW47-QRꢀxx
HLMP-CW47-QRBxx
HLMP-CW47-RU0xx
HLMP-CW47-ST0xx
HLMP-CW47-STBxx
HLMP-CW76-NRꢀxx
HLMP-CW76-PQꢀxx
HLMP-CW76-PQBxx
HLMP-CW76-QT0xx
HLMP-CW76-RS0xx
HLMP-CW76-RSBxx
HLMP-CW77-NRꢀxx
HLMP-CW77-PQꢀxx
HLMP-CW77-PQBxx
HLMP-CW77-QT0xx
HLMP-CW77-RS0xx
HLMP-CW77-RSBxx
5ꢀ
5ꢀ
5ꢀ
50
50
50
5ꢀ
5ꢀ
5ꢀ
50
50
50
7ꢀ
7ꢀ
7ꢀ
70
70
70
7ꢀ
7ꢀ
7ꢀ
70
70
70
A
A
A
A
A
A
B
B
B
B
B
B
A
A
A
A
A
A
B
B
B
B
B
B
115ꢀ
115ꢀ
1500
1900
1900
00ꢀ
No
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
No
115ꢀ
115ꢀ
1500
1900
1900
60ꢀ
00ꢀ
No
00ꢀ
No
1150
1500
1500
60ꢀ
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
00ꢀ
00ꢀ
1150
1500
1500
Notes:
1. Tolerance for luminous intensity measurement is +/- 15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. 2θ is the off-axis angle where the luminous intensity is ½ the on axis intensity
1/2
5. Part numbers in BOLD are recommended for new designs.
3
o
Absolute Maximum Rating at T = 25 C
A
Parameters
Value
3ꢀ
Unit
mA
mA
mW
oC
[1]
DC forward current
[2]
Peak pulsed forward current
1ꢀꢀ
Power dissipation
1ꢀ5
LED junction temperature
Operating temperature range
Storage temperature range
11ꢀ
-4ꢀ to +05
-4ꢀ to +1ꢀꢀ
oC
oC
Notes:
1. Derate linearly as shown in figure 2.
2. Duty factor 10%, frequency 1KHz
o
Electrical/Optical Characteristics T = 25 C
A
Parameters
Symbol Min
Typ
Max
Units
V
Test Condition
IF = 2ꢀ mA
Forward voltage
Reverse Voltage
VF
3.2
4.ꢀ
[1]
VR
5.ꢀ
V
oC/W
IR = 1ꢀ µA
LED Junction to anode lead
Thermal resistance
RθJ-PIN
X
Y
24ꢀ
[2]
Chromaticity Coordinates
ꢀ.31
ꢀ.31
IF = 2ꢀ mA
Capacitance
C
7ꢀ
VF=ꢀ, f=1MHz
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at I = 10 µA
R
2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
1.ꢀ
ꢀ.0
ꢀ.6
ꢀ.4
ꢀ.2
ꢀ.ꢀ
1.5
1.2
ꢀ.9
ꢀ.6
ꢀ.3
ꢀ
35
3ꢀ
25
RθJ-A = 505˚C/W
RθJ-A = 70ꢀ˚C/W
2ꢀ
15
1ꢀ
5
ꢀ
30ꢀ
40ꢀ
50ꢀ
60ꢀ
70ꢀ
ꢀ
1ꢀ
2ꢀ
3ꢀ
ꢀ
2ꢀ
4ꢀ
6ꢀ
0ꢀ
1ꢀꢀ
WAVELENGTH - nm
FORWARD CURRENT - mA
AMBIENT TEMPERATURE - ˚C
Figure 1. Relative Intensity vs. Wavelength
Figure 2. Forward Current vs. Ambient
Temperature
Figure 3. Relative Intensity versus DC
Forward Current
4
ꢀ.ꢀ25
ꢀ.ꢀ2ꢀ
ꢀ.ꢀ15
ꢀ.ꢀ1ꢀ
ꢀ.ꢀꢀ5
ꢀ.ꢀꢀꢀ
-ꢀ.ꢀꢀ5
-ꢀ.ꢀ1ꢀ
3ꢀ
25
2ꢀ
15
1ꢀ
5
Intensity Bin Limit Table
Intensity (mcd) at 20 mA
1mA
5mA
Bin
N
P
Min
60ꢀ
Max
00ꢀ
1ꢀmA
00ꢀ
115ꢀ
15ꢀꢀ
19ꢀꢀ
25ꢀꢀ
32ꢀꢀ
42ꢀꢀ
2ꢀmA
Q
115ꢀ
15ꢀꢀ
19ꢀꢀ
25ꢀꢀ
32ꢀꢀ
R
ꢀ
3ꢀmA
-ꢀ.ꢀꢀ5 ꢀ.ꢀꢀꢀ
2.ꢀ 2.2 2.4 2.6 2.0 3.ꢀ 3.2 3.4 3.6
- FORWARD VOLTAGE - VOLTS
S
ꢀ.ꢀꢀ5
ꢀ.ꢀ1ꢀ ꢀ.ꢀ15
V
F
X-COORDINATES
T
Figure 4. Chromaticity shift vs. Current
Figure 5. Forward Current vs. Forward
Voltage
U
*Note: (x,y) values @ 20mA reference to
(0,0)
Tolerance for each bin limit is ± 15%
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
ANGULAR DISPLACEMENT (˚8
Figure 6. Spatial Radiation Pattern for
CW4x
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
ANGULAR DISPLACEMENT (˚8
Figure 7. Spatial Radiation Pattern for
CW7x
5
Color Bin Limit Table
Color Bin Limits with Respect to
CIE 1931 Chromaticity Diagram
Rank
Limits (Chromaticity Coordinates)
ꢀ.4ꢀ
1
X
Y
X
Y
X
Y
X
Y
ꢀ.33ꢀ
ꢀ.36ꢀ
ꢀ.207
ꢀ.295
ꢀ.264
ꢀ.267
ꢀ.203
ꢀ.3ꢀ5
ꢀ.33ꢀ
ꢀ.310
ꢀ.296
ꢀ.276
ꢀ.20ꢀ
ꢀ.240
ꢀ.207
ꢀ.295
ꢀ.356
ꢀ.351
ꢀ.33ꢀ
ꢀ.310
ꢀ.296
ꢀ.276
ꢀ.33ꢀ
ꢀ.339
ꢀ.361
ꢀ.305
ꢀ.33ꢀ
ꢀ.339
ꢀ.203
ꢀ.3ꢀ5
ꢀ.33ꢀ
ꢀ.36ꢀ
ꢀ.35
1
4
BLACK
2
3
4
BODY
CURVE
2
ꢀ.3ꢀ
3
ꢀ.25
ꢀ.2ꢀ
ꢀ.26
ꢀ.3ꢀ
ꢀ.34
ꢀ.30
X-COORDINATE
Tolerance for each bin limit is ± ꢀ.ꢀ1
Note:
1. Bin categories are established for classification of products. Products may not be available
in all bin categories. Please contact your Avago Technologies representative for information
on currently available bins.
6
Precautions:
Lead Forming:
•
Wave soldering parameter must be set and maintain
according to recommended temperature and dwell time
in the solder wave. Customer is advised to periodically
check on the soldering profile to ensure the soldering
profile used is always conforming to recommended
soldering condition.
•
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
•
If lead forming is required before soldering, care must be
taken to avoid any excessive mechanical stress induced
to LED package. Otherwise, cut the leads of LED to length
after soldering process at room temperature. The solder
joint formed will absorb the mechanical stress of the lead
cutting from traveling to the LED chip die attach and
wirebond.
•
•
If necessary, use fixture to hold the LED component in
proper orientation with respect to the PCB during
soldering process.
Proper handling is imperative to avoid excessive thermal
stresses to LED components when heated. Therefore, the
soldered PCB must be allowed to cool to room
temperature, 25°C before handling.
•
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
•
•
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
•
Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
•
The closest LED is allowed to solder on board is 1.59mm
below the body (encapsulant epoxy) for those parts
without standoff.
Recommended PC board plated through holes size for
LED component leads.
•
Recommended soldering condition:
Manual Solder
Wave Soldering Dipping
LED component
ead size
Plated through
hole diameter
Diagonal
Pre-heat temperature 1ꢀ5 °C Max.
−
ꢀ.457 x ꢀ.457mm
(ꢀ.ꢀ10 x ꢀ.ꢀ10inch8 (ꢀ.ꢀ25 inch8 (ꢀ.ꢀ30 to ꢀ.ꢀ42 inch8
ꢀ.646 mm
ꢀ.976 to 1.ꢀ70 mm
Preheat time
3ꢀ sec Max
−
ꢀ.5ꢀ0 x ꢀ.5ꢀ0mm ꢀ.710 mm 1.ꢀ49 to 1.15ꢀmm
(ꢀ.ꢀ2ꢀ x ꢀ.ꢀ2ꢀinch8 (ꢀ.ꢀ20 inch8 (ꢀ.ꢀ41 to ꢀ.ꢀ45 inch8
Peak temperature
Dwell time
25ꢀ °C Max.
3 sec Max.
26ꢀ °C Max.
5 sec Max
Note: Refer to application note AN1027 for more information
on soldering LED components.
Recommended Wave Soldering Profile
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
25ꢀ
2ꢀꢀ
15ꢀ
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
FLUXING
CONVEYOR SPEED = 1.03 M/MIN (6 FT/MIN8
PREHEAT SETTING = 15ꢀ C (1ꢀꢀ C PCB8
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 39ꢀ C
AIR KNIFE DISTANCE = 1.91 mm (ꢀ.25 IN.8
AIR KNIFE ANGLE = 4ꢀ
1ꢀꢀ
SOLDER: SN63; FLUX: RMA
5ꢀ
3ꢀ
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
ꢀ
1ꢀ
2ꢀ
3ꢀ
4ꢀ
5ꢀ
6ꢀ
7ꢀ
0ꢀ
9ꢀ
1ꢀꢀ
TIME - SECONDS
7
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5989-1431EN - May 29, 2006
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