HLMP-CW46-QRB00 [AVAGO]
T-1 3/4 SINGLE COLOR LED, WHITE, 5mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-CW46-QRB00 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 3/4 SINGLE COLOR LED, WHITE, 5mm, PLASTIC PACKAGE-2 光电 |
| 文件： | 总7页 (文件大小：72K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-CW46, HLMP-CW47, HLMP-CW76, HLMP-CW77
T-1 ¾ (5mm) Extra Bright Precision Optical
Performance White LED Lamps
Data Sheet
Description
Features
Well defined spatial radiation pattern
These high intensity white LED lamps are based on In-
GaN material technology. A blue LED die is coated by High luminous white emission
phosphor to produce white. The typical resulting color is
described by the coordinates x = 0.31, y = 0.31 using the
1931 CIE Chromaticity Diagram.
Viewing angle: 50° and 70°.
Standoff or non-standoff leads
Superior resistance to moisture
These T-1 ¾ lamps are untinted, diffused, and incorporate
precise optics which produce well-defined spatial radia-
tion patterns at specific viewing cone angle.
Applications
Electronic signs and signals
Small area illumination
Legend backlighting
Benefit
Reduced power consumption, higher reliability, and
increased optical/mechanical design flexibility com-
pared to incandescent bulbs and other alternative
white light sources.
General purpose indicators
Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing.
Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package Dimension A
Package Dimension B
5.ꢀꢀ ꢀ.ꢁꢀ
(ꢀ.197 ꢀ.ꢀꢀ08
5.ꢀꢀ ꢀ.ꢁꢀ
(ꢀ.197 ꢀ.ꢀꢀ08
1.14 ꢀ.ꢁꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
0.71 ꢀ.ꢁꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
0.71 ꢀ.ꢁꢀ
(ꢀ.343 ꢀ.ꢀꢀ08
DIMENSION H
1.14 ꢀ.ꢁꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ08
ꢁ.35 (ꢀ.ꢀ938
MAX.
ꢀ.7ꢀ (ꢀ.ꢀꢁ08
MAX.
1.5ꢀ ꢀ.15
(ꢀ.ꢀ59 ꢀ.ꢀꢀ68
31.6ꢀ
MIN.
31.6ꢀ
(1.ꢁ448
MIN.
(1.ꢁ448
DIMENSION H:
50°: 11.98 0.25mm (0.4715 0.01 inches)
70°: 11.09 0.25mm (0.43ꢀ5 0.01 inches)
ꢀ.7ꢀ (ꢀ.ꢀꢁ08
MAX.
CATHODE
LEAD
CATHODE
LEAD
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48
ꢀ.5ꢀ ꢀ.1ꢀ
(ꢀ.ꢀꢁꢀ ꢀ.ꢀꢀ48
SQ. TYP.
SQ. TYP.
1.ꢀꢀ
(ꢀ.ꢀ398
1.ꢀꢀ
MIN.
MIN.
(ꢀ.ꢀ398
5.0ꢀ ꢀ.ꢁꢀ
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08
5.0ꢀ ꢀ.ꢁꢀ
(ꢀ.ꢁꢁ0 ꢀ.ꢀꢀ08
CATHODE
FLAT
CATHODE
FLAT
ꢁ.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
ꢁ.54 ꢀ.30
(ꢀ.1ꢀꢀ ꢀ.ꢀ158
Notes:
1. All dimensions are in millimeters /inches.
2. Epoxy meniscus may extend about 1mm (0.040”) down the leads.
3. If heat-sinking application is required, the terminal for heat sink is anode.
Part Numbering System
H L M P - C W X X - X
X X X X
Mechanical Option
00: Bulk
DD: Ammo Pack Straight Leads
Color Bin Options
0: Full color bin distribution
B: Color bin 2 & 3 only
Maximum Intensity Bin
0: No maximum intensity bin limit
Others: Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Standoff Option
4ꢀ: 50° without standoff
47: 50° with standoff
7ꢀ: 70° without standoff
77: 70° with standoff
2
Device Selection Guide
Intensity (mcd8 at ꢁꢀ MA
Typical Viewing Angle,
Package
Part Number
ꢁ ½ (Degree8
Min.
Max.
Standoff
Dimension
HLMP-CW4ꢀ-PS0xx
HLMP-CW4ꢀ-QR0xx
HLMP-CW4ꢀ-QRBxx
HLMP-CW4ꢀ-RU0xx *
HLMP-CW4ꢀ-ST0xx *
HLMP-CW4ꢀ-STBxx *
HLMP-CW47-PS0xx
HLMP-CW47-QR0xx
HLMP-CW47-QRBxx
HLMP-CW47-RU0xx *
HLMP-CW47-ST0xx *
HLMP-CW47-STBxx *
HLMP-CW7ꢀ-NR0xx
HLMP-CW7ꢀ-PQ0xx
HLMP-CW7ꢀ-PQBxx
HLMP-CW7ꢀ-QT0xx *
HLMP-CW7ꢀ-RS0xx *
HLMP-CW7ꢀ-RSBxx *
HLMP-CW77-NR0xx
HLMP-CW77-PQ0xx
HLMP-CW77-PQBxx
HLMP-CW77-QT0xx *
HLMP-CW77-RS0xx *
HLMP-CW77-RSBxx *
50
50
50
50
50
50
50
50
50
50
50
50
70
70
70
70
70
70
70
70
70
70
70
70
880
2500
1900
1900
4200
3200
3200
2500
1900
1900
4200
3200
3200
1900
1500
1500
3200
2500
2500
1900
1500
1500
3200
2500
2500
No
No
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
A
A
A
A
A
A
B
B
B
B
B
B
A
A
A
A
A
A
B
B
B
B
B
B
1150
1150
1500
1900
1900
880
1150
1150
1500
1900
1900
ꢀ80
880
880
1150
1500
1500
ꢀ80
880
880
1150
1500
1500
* recommended for new designs.
Notes:
1. Tolerance for luminous intensity measurement is +/- 15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. 2 is the off-axis angle where the luminous intensity is ½ the on axis intensity
1/2
3
o
Absolute Maximum Rating at T = ꢁ5 C
A
Parameters
Value
Unit
DC forward current [1]
30
mA
Peak pulsed forward current [2]
Power dissipation
100
mA
mW
C
105
LED junction temperature
Operating temperature range
Storage temperature range
110
-40 to +85
-40 to +100
C
C
Notes:
1. Derate linearly as shown in figure 2.
2. Duty factor 10%, frequency 1KHz
o
Electrical/Optical Characteristics T = ꢁ5 C
A
Parameters
Symbol
Min
Typ
Max
Units
Test Condition
Forward voltage
VF
3.2
4.0
V
IF = 20 mA
Reverse Voltage [1]
VR
5.0
V
IR = 10 mA
Thermal resistance
RJ-PIN
XY
240
LED Junction to anode lead
IF = 20 mA
C/W
Chromaticity Coordinates [2]
0.31
0.31
Capacitance
Notes:
C
70
VF=0, f=1MHz
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at I = 10 A
R
2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
1.5
1.ꢁ
ꢀ.9
ꢀ.6
ꢀ.3
ꢀ
1.ꢀ
ꢀ.0
ꢀ.6
ꢀ.4
ꢀ.ꢁ
ꢀ.ꢀ
35
3ꢀ
ꢁ5
RθJ-A = 505°C/W
RθJ-A = 70ꢀ°C/W
ꢁꢀ
15
1ꢀ
5
ꢀ
30ꢀ
40ꢀ
50ꢀ
60ꢀ
70ꢀ
ꢀ
ꢁꢀ
4ꢀ
6ꢀ
0ꢀ
1ꢀꢀ
ꢀ
1ꢀ
ꢁꢀ
3ꢀ
AMBIENT TEMPERATURE - °C
WAVELENGTH - nm
FORWARD CURRENT - mA
Figure 1. Relative Intensity vs. Wavelength
Figure ꢁ. Forward Current vs. Ambient Tempera-
ture
Figure 3. Relative Intensity versus DC Forward
Current
4
ꢀ.ꢀꢁ5
ꢀ.ꢀꢁꢀ
ꢀ.ꢀ15
ꢀ.ꢀ1ꢀ
ꢀ.ꢀꢀ5
ꢀ.ꢀꢀꢀ
-ꢀ.ꢀꢀ5
-ꢀ.ꢀ1ꢀ
3ꢀ
ꢁ5
ꢁꢀ
15
1ꢀ
5
Intensity Bin Limit Table
1mA
Intensity (mcd8 at ꢁꢀ mA
5mA
Bin
N
P
Min
Max
ꢀ80
880
1ꢀmA
880
1150
1500
1900
2500
3200
4200
Q
R
1150
1500
1900
2500
3200
ꢁꢀmA
3ꢀmA
ꢀ.ꢀꢀꢀ
X-COORDINATES
ꢀ
S
-ꢀ.ꢀꢀ5
ꢀ.ꢀꢀ5
ꢀ.ꢀ1ꢀ ꢀ.ꢀ15
ꢁ.ꢀ ꢁ.ꢁ ꢁ.4 ꢁ.6 ꢁ.0 3.ꢀ 3.ꢁ 3.4 3.6
VF - FORWARD VOLTAGE - VOLTS
T
U
Figure 4. Chromaticity shift vs. Current
Figure 5. Forward Current vs. Forward Voltage
Tolerance for each bin limit is 15%
*Note: (x,y8 values @ ꢁꢀmA reference to (ꢀ,ꢀ8
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
ANGULAR DISPLACEMENT (°8
Figure 6. Spatial Radiation Pattern for CW4x
1
ꢀ.5
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
ANGULAR DISPLACEMENT (°8
Figure 7. Spatial Radiation Pattern for CW7x
5
Color Bin Limit Table
Color Bin Limits with Respect to CIE 1931 Chromaticity
Diagram
Rank
Limits (Chromaticity Coordinates8
X
Y
X
Y
X
Y
X
Y
0.330
0.3ꢀ0
0.287
0.295
0.2ꢀ4
0.2ꢀ7
0.283
0.305
0.330
0.318
0.29ꢀ
0.27ꢀ
0.280
0.248
0.287
0.295
0.35ꢀ
0.351
0.330
0.318
0.29ꢀ
0.27ꢀ
0.330
0.339
0.3ꢀ1
0.385
0.330
0.339
0.283
0.305
0.330
0.3ꢀ0
ꢀ.4ꢀ
1
2
3
4
ꢀ.35
1
4
BLACK
BODY
CURVE
ꢁ
ꢀ.3ꢀ
3
Tolerance for each bin limit is 0.01
ꢀ.ꢁ5
ꢀ.ꢁꢀ
Note:
1. Bin categories are established for classification of products. Products
may not be available in all bin categories. Please contact your Avago
Technologies representative for information on currently available
bins.
ꢀ.ꢁ6
ꢀ.3ꢀ
X-COORDINATE
ꢀ.34
ꢀ.30
Precautions:
Lead Forming:
Wave soldering parameter must be set and maintain
according to recommended temperature and dwell
time in the solder wave. Customer is advised to peri-
odically check on the soldering profile to ensure the
soldering profile used is always conforming to recom-
mended soldering condition.
If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C before handling.
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress in-
duced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED
chip die attach and wirebond.
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
Care must be taken during PCB assembly and solder-
ing process to prevent damage to LED component.
Recommended PC board plated through holes size for
The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for those
parts without standoff.
LED component leads.
LED component
Lead size
Plated through
hole diameter
Recommended soldering condition:
Diagonal
0.457 x 0.457mm 0.ꢀ4ꢀ mm
(0.025 inch)
(0.018 x 0.018inch)
(0.038 to 0.042 inch) 0.97ꢀ to 1.078 mm
Manual
Solder
Wave
Soldering
Dipping
0.508 x 0.508mm 0.718 mm
(0.028 inch) (0.041 to 0.045 inch 1.049 to 1.150mm
(0.020 x 0.020inch)
Pre-heat temperature
Preheat time
105 °C Max.
30 sec Max
250 °C Max.
3 sec Max.
-
-
Note: Refer to application note AN1027 for more information on solder-
ing LED components.
Peak temperature
Dwell time
2ꢀ0 °C Max.
5 sec Max
ꢀ
Recommended Wave Soldering Profile
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
ꢁ5ꢀ
ꢁꢀꢀ
15ꢀ
1ꢀꢀ
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
FLUXING
CONVEYOR SPEED = 1.03 M/MIN (6 FT/MIN8
PREHEAT SETTING = 15ꢀ C (1ꢀꢀ C PCB8
SOLDER WAVE TEMPERATURE = ꢁ45 C
AIR KNIFE AIR TEMPERATURE = 39ꢀ C
AIR KNIFE DISTANCE = 1.91 mm (ꢀ.ꢁ5 IN.8
AIR KNIFE ANGLE = 4ꢀ
SOLDER: SN63; FLUX: RMA
5ꢀ
3ꢀ
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
ꢀ
1ꢀ
ꢁꢀ
3ꢀ
4ꢀ
5ꢀ
6ꢀ
7ꢀ
0ꢀ
9ꢀ
1ꢀꢀ
TIME - SECONDS
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Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4119EN
AV02-3629EN - June 15, 2012
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