HDSP-B5BZ [AVAGO]

31.8 mm (1.25 inch) General Purpose 5x7 Dot Matrix Alphanumeric Displays; 31.8毫米( 1.25英寸)通用的5x7点阵字母数字显示器
HDSP-B5BZ
型号: HDSP-B5BZ
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

31.8 mm (1.25 inch) General Purpose 5x7 Dot Matrix Alphanumeric Displays
31.8毫米( 1.25英寸)通用的5x7点阵字母数字显示器

显示器 光电
文件: 总8页 (文件大小:86K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HDSP-B5xZ Series  
31.8 mm (1.25 inch) General Purpose  
5x7DotMatrixAlphanumericDisplays  
DataSheet  
Description  
Features  
These displays have a 31.8 mm (1.25 inch) character  
height. The devices are available in either common row  
anode or common row cathode configurations. The  
displays come in only black face paint. The Bi-color  
display consists of GaP Red (HER) and GaP Green  
colors.  
• 5x7 Dot matrix font  
X-Y stackable  
• Pin-out  
– 26.66 mm (1.05 in.) Dual-In-Line (DIP) leads on 2 mm  
(0.079 in.) centers  
Choice of colors  
– Bi-color: red and green  
These parts are subjected to Out-going QualityAssur-  
ance (OQA) inspection with an AQL of 0.065% for  
functional and visual/cosmetic defects.  
• Face paint color: black  
Design flexibility  
Common row anode or common row cathode  
Categorized for luminance  
Devices  
Applications  
• Suitable for indoor use  
HDSP-  
Description  
• Not recommended for industrial applications, i.e.,  
operating temperature requirements exceeding 85°C or  
below –35°C  
B5AZ  
31.8 mm Black Surface Bi-Color  
Common Row Anode  
B5BZ  
31.8 mm Black Surface Bi-Color  
Common Row Cathode  
[1]  
Extreme temperature cycling not recommended  
Note:  
1. For details, please contact your local Avago components sales office  
or an authorized distributor.  
Package Dimensions  
5.3 x 4 = 21.20  
(0.209 x 4 = 0.835)  
COL 1  
ROW 1  
2
3
4
5
3.82  
(0.150)  
2
3
4
5
6
7
36.95  
(1.455)  
5.3 x 6 = 31.8  
(0.209 x 6 = 1.254)  
PIN 1  
16.00  
(0.630)  
26.35  
(1.037)  
36.95  
(1.455)  
PART NO.  
9.00  
(0.354)  
26.66  
(1.050)  
4.19  
(0.079)  
0.50  
(0.020)  
2 x 8 = 16.00  
(0.079 x 8 = 0.632)  
2
Internal Circuit Diagram  
HDSP-B5AZ  
COLUMN  
1
2
3
4
5
1
18  
17  
16  
15  
14  
13  
12  
11  
10  
PIN  
ROW  
1
2
3
4
5
6
7
2
3
4
5
6
7
8
THE SIGN  
THE SIGN  
REPRESENTS HER COLOR CHIPS  
REPRESENTS GREEN COLOR CHIPS  
PIN  
CONNECTION  
1
2
CATHODE COLUMN 1 HER  
ANODE ROW 1  
3
ANODE ROW 2  
4
ANODE ROW 3  
5
ANODE ROW 4  
6
ANODE ROW 5  
7
ANODE ROW 6  
8
ANODE ROW 7  
9
NO PIN  
10  
11  
12  
13  
14  
15  
16  
17  
18  
CATHODE COLUMN 5 GREEN  
CATHODE COLUMN 5 HER  
CATHODE COLUMN 4 GREEN  
CATHODE COLUMN 4 HER  
CATHODE COLUMN 3 GREEN  
CATHODE COLUMN 3 HER  
CATHODE COLUMN 2 GREEN  
CATHODE COLUMN 2 HER  
CATHODE COLUMN 1 GREEN  
3
Internal Circuit Diagram  
HDSP-B5BZ  
COLUMN  
1
2
3
4
5
1
18  
17  
16  
15  
14  
13  
12  
11  
10  
PIN  
ROW  
1
2
3
4
5
6
7
2
3
4
5
6
7
8
THE SIGN  
THE SIGN  
REPRESENTS HER COLOR CHIPS  
REPRESENTS GREEN COLOR CHIPS  
PIN  
CONNECTION  
1
2
ANODE COLUMN 1 HER  
CATHODE ROW 1  
3
CATHODE ROW 2  
4
CATHODE ROW 3  
5
CATHODE ROW 4  
6
CATHODE ROW 5  
7
CATHODE ROW 6  
8
CATHODE ROW 7  
9
NO PIN  
10  
11  
12  
13  
14  
15  
16  
17  
18  
ANODE COLUMN 5 GREEN  
ANODE COLUMN 5 HER  
ANODE COLUMN 4 GREEN  
ANODE COLUMN 4 HER  
ANODE COLUMN 3 GREEN  
ANODE COLUMN 3 HER  
ANODE COLUMN 2 GREEN  
ANODE COLUMN 2 HER  
ANODE COLUMN 1 GREEN  
4
Absolute Maximum Ratings at T = 25˚C  
A
GaP Red  
GaP Green  
Parameter  
HDSP-B5AZ/ B5BZ  
HDSP-B5AZ/ B5BZ  
Units  
[1]  
Average Power per Dot  
36  
36  
mW  
[1]  
Peak Forward Current per Dot  
(1/ 8 Duty Cycle at 10 KHz)  
Average Forward Current per Dot  
Reverse Voltage per Dot  
Operating Temperature  
Storage Temperature  
100  
100  
mA  
mA  
V
[1,2]  
[1,2]  
13  
13  
3
3
–35to +85  
–35 to +85  
–35to+85  
–35 to +85  
°C  
°C  
[3]  
Wave Soldering Temperature for 3 seconds  
(2 mm [0.078 in.] below Body)  
250  
250  
°C  
Notes:  
1. Do not exceed maximum average current per dot.  
2. Derate above 25°C at 0.17 mA/ °C.  
3. Not recommended to be soldered more than 2 times. Minimum interval between solderings is 15 minutes.  
Total soldering time not to exceed 3 seconds.  
5
Optical/ Electrical Characteristics at T = 25˚C  
A
GaP Red  
Devices  
HDSP-  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
= 40 mA,  
1/ 8 Duty Factor  
Luminous Intensity/ Dot  
(Digit Average)  
I
v
2
mcd  
I
FP  
[1]  
Peak Wavelength  
λ
λ
632  
622  
2.1  
nm  
nm  
V
I = 20 mA  
peak  
d
F
[2]  
B5AZ  
B5BZ  
Dominant Wavelength  
Forward Voltage  
I = 20 mA  
F
V
2.6  
2:1  
I = 20 mA  
F
F
[3]  
Reverse Voltage  
V
3.0  
V
I = 100 µA  
R
R
Luminous Intensity  
Matching Ratio  
I
v-m  
I = 40 mA,  
FP  
1/ 8 Duty Factor  
GaP Green  
Devices  
HDSP-  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
Luminous Intensity/ Dot  
(Digit Average)  
I
v
3.4  
mcd  
I = 40 mA,  
FP  
1/ 8 Duty Factor  
[1]  
Peak Wavelength  
λ
λ
568  
573  
2.3  
nm  
nm  
V
I = 20 mA  
peak  
d
F
[2]  
Dominant Wavelength  
Forward Voltage  
I = 20 mA  
F
B5AZ  
B5BZ  
V
2.6  
2:1  
I = 20 mA  
F
F
[3]  
Reverse Voltage  
V
3.0  
V
I = 100 µA  
R
R
Luminous Intensity  
Matching Ratio  
I
v-m  
I = 40 mA,  
FP  
1/ 8 Duty Factor  
Bi-Color  
Devices  
HDSP-  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
2
Luminance/ Unit  
(Digit Average)  
I
v
124.1  
215  
372  
Cd/ m  
I = 40 mA,  
FP  
1/ 8 Duty Factor  
B5AZ  
B5BZ  
[1]  
Notes:  
1. The digits are categorized for luminance. The category is designated by a letter on the side of the package.  
2. The dominant wavelength, λ , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the  
d
device.  
3. Typical specification for reference only. Do not exceed absolute maximum ratings.  
6
2
Bi-Color (Cd/ m atI = 40mA,1/ 8DutyFactor)  
FP  
[2]  
[2]  
Bin Name  
Min.  
Max.  
149  
179  
215  
258  
310  
372  
H
I
124.1  
149.1  
179.1  
215.1  
258.1  
310.1  
J
K
L
M
Hue Grade  
Bin  
7
Coordinate  
4
5
6
8
9
10  
X
Y
0.542-0.553  
0.445-0.456  
0.552-0.563  
0.435-0.446  
0.562-0.573  
0.425-0.436  
0.572-0.583  
0.415-0.426  
0.582-0.593  
0.405-0.416  
0.592-0.603  
0.395-0.406  
0.602-0.613  
0.385-0.396  
Notes:  
1. Hue categories are established for classification of products. Products may not be available in all bin categories.  
2. Tolerance for each intensity bin limit is ± 10%.  
[1]  
ColorBinLimits (nm)  
GaP Green  
[2]  
[2]  
Bin Name  
Min.  
Max.  
571  
3
569.1  
571.1  
573.1  
4
573  
5
575  
Notes:  
1. Bin categories are established for classification of products. Products may not be available in  
all bin categories.  
2. Tolerance for each color bin limit is ± 1.0 nm.  
7
15  
45  
40  
35  
30  
25  
20  
15  
2.5  
2.0  
1.5  
1.0  
0.5  
GaP RED  
12  
9
GaP RED/GaP GREEN  
GaP GREEN  
6
10  
5
3
0
0
0
I
0
0.5  
V – FORWARD VOLTAGE – V  
F
1.0  
1.5  
2.0  
2.5  
3.0  
0
10 20 30 40 50 60 70 80 90  
– AMBIENT TEMPERATURE – °C  
0
20  
40  
60  
80  
100  
T
– PEAK FORWARD CURRENT – mA  
A
PEAK  
Figure 1. Maximum allowable average  
current per dot vs. ambient temperature.  
Figure 2. Forward current vs. forward voltage.  
Figure 3. Relative luminance vs. peak  
forward current.  
Contrast Enhancement  
Device Reliability  
For information on contrast  
enhancement, please see  
Application Note 1015.  
For reliability information, please  
see the reliability datasheet  
31.8 mm Gener a l Pur pose 5 x 7  
Dot Ma trix Alpha numeric  
Displays.  
Soldering/ Cleaning  
Cleaning agents from the ketone  
family (acetone, methyl ethyl  
ketone, etc.) and from the  
chlorinated hydrocarbon family  
(methylene chloride, trichloroeth-  
ylene, carbon tetrachloride, etc.)  
are not recommended for cleaning  
LED parts. All of these various  
solvents attack or dissolve the  
encapsulating epoxies used to  
form the package of plastic LED  
parts.  
For information on soldering  
LEDs please refer to Application  
Note 1027.  
For product information and a complete list of distributors, please go to our website: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.  
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5988-1746EN  
5988-5217EN June 24, 2006  

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