HDSP-B5XZ [AVAGO]

91.44 mm (3.6 inch) General Purpose 5 x 7 Dot Matrix Alphanumeric Displays; 91.44毫米( 3.6英寸)通用5× 7点阵字母数字显示器
HDSP-B5XZ
型号: HDSP-B5XZ
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

91.44 mm (3.6 inch) General Purpose 5 x 7 Dot Matrix Alphanumeric Displays
91.44毫米( 3.6英寸)通用5× 7点阵字母数字显示器

显示器
文件: 总12页 (文件大小:122K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HDSP-S5xE/S5xG/B5xZ Series  
91.44 mm (3.6 inch) General Purpose 5 x 7 Dot Matrix  
Alphanumeric Displays  
DataSheet  
Description  
Features  
These displays have a 91.44 mm (3.6 inch) character  
height. The devices are available in either common  
row anode or common row cathode configurations.  
The displays come in only black face paint and are  
available in a choice of GaP Red or GaP Green colors.  
The Bi-color display consists of GaP Red and GaP  
Green colors.  
• 5 x 7 Dot matrix font  
• Stackable horizontally  
• Pin-out  
– 76.2 mm (3.0 in.) Dual-In-Line (DIP) leads on 5.08 mm  
(0.2 in.) centers  
Choice of colors  
– Single color: red or green  
– Bi-color: red and green  
These parts are subjected to Outgoing Quality Assur-  
ance (OQA) inspection with an AQL of 0.065% for  
functional and visual/cosmetic defects.  
• Face paint color: black  
Design flexibility  
Common row anode or Common row cathode  
Applications  
Categorized:  
– Single color: luminous intensity  
– Bi-Color: luminance  
• Suitable for indoor use  
• Not recommended for industrial applications, i.e. oper-  
ating temperature requirements exceeding 85°C or  
below –35°C  
Green categorized for color  
[1]  
Extreme temperature cycling not recommended  
Devices  
GaP Red GaP Green  
HDSP-  
S53E  
S58E  
HDSP-  
S53G  
S58G  
Description  
91.44 mm Black Surface Common Row Anode  
91.44 mm Black Surface Common Row Cathode  
91.44 mm Black Surface Bi-Color Common Row Anode  
91.44 mm Black Surface Bi-Color Common Row Cathode  
B53Z  
B58Z  
Note:  
1. For details, please contact your local Avago components sales office or an authorized distributor.  
Package Dimensions  
Single Color  
76.00  
(2.992)  
60.96  
(2.400)  
COL 1  
ROW  
2
3
4
5
1
2
3
4
5
6
7
106.55  
(4.195) (3.600)  
91.44  
76.20  
(3.000)  
10.16 (0.40)  
PIN 1  
PART NO.  
13.00 (0.512)  
0.80  
(0.031)  
5.08  
(0.200)  
4.80 ± 0.50  
(0.189)  
76.20  
(3.000)  
NOTES:  
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).  
2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm.  
2
Internal Circuit Diagram  
Common Row Anode – Single Color  
COLUMN  
1
2
3
3
4
5
6
13  
4
11  
10  
PIN  
PIN NO.  
CONNECTION  
ROW  
1
2
ANODE ROW 5  
1
2
3
4
5
6
7
9
14  
8
ANODE ROW 7  
3
CATHODE COLUMN 2  
CATHODE COLUMN 3  
ANODE ROW 4  
4
5
6
CATHODE COLUMN 5  
ANODE ROW 6  
7
8
ANODE ROW 3  
9
ANODE ROW 1  
10  
11  
12  
13  
14  
CATHODE COLUMN 4  
CATHODE COLUMN 3  
ANODE ROW 4  
CATHODE COLUMN 1  
ANODE ROW 2  
5
12  
1
7
2
3
Internal Circuit Diagram  
Common Row Cathode – Single Color  
COLUMN  
1
2
3
3
4
5
6
13  
4
11  
10  
PIN  
PIN NO.  
CONNECTION  
ROW  
1
2
CATHODE ROW 5  
CATHODE ROW 7  
ANODE COLUMN 2  
ANODE COLUMN 3  
CATHODE ROW 4  
ANODE COLUMN 5  
CATHODE ROW 6  
CATHODE ROW 3  
CATHODE ROW 1  
ANODE COLUMN 4  
ANODE COLUMN 3  
CATHODE ROW 4  
ANODE COLUMN 1  
CATHODE ROW 2  
1
2
3
4
5
6
7
9
14  
8
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
5
12  
1
7
2
4
Package Dimensions  
Bi-Color  
76.00  
(2.992)  
60.96  
(2.400)  
COL 1  
ROW  
2
3
4
5
1
2
3
4
5
6
7
106.55  
(4.195) (3.600)  
91.44  
76.20  
(3.000)  
10.16 (0.40)  
PART NO.  
13.00 (0.512)  
5.08  
(0.200)  
0.80  
(0.031)  
4.80 (0.189)  
76.20  
(3.000)  
NOTES:  
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).  
2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm.  
5
Internal Circuit Diagram  
Common Row Anode – Bi-Color  
3
COLUMN  
1
2
4
5
21  
7
22  
8
1
2
5
6
19  
20  
15  
16  
PIN  
ROW  
PIN NO.  
CONNECTION  
1
2
3
4
5
6
COLUMN 1 GREEN  
COLUMN 1 HER  
ROW 7 GREEN  
ROW 7 HER  
17  
1
2
3
4
5
6
7
18  
COLUMN 2 GREEN  
COLUMN 2 HER  
27  
28  
7, 21 COLUMN 3 GREEN  
8, 22 COLUMN 3 HER  
9
ROW 5 GREEN  
ROW 5 HER  
10  
23  
24  
11, 25 ROW 4 GREEN  
12, 26 ROW 4 HER  
13  
14  
15  
16  
17  
18  
19  
20  
23  
24  
27  
28  
ROW 6 GREEN  
COLUMN 6 HER  
COLUMN 5 GREEN  
COLUMN 5 HER  
ROW 1 GREEN  
ROW 1 HER  
25 11  
26 12  
COLUMN 4 GREEN  
COLUMN 4 HER  
ROW 3 GREEN  
ROW 3 HER  
9
10  
ROW 2 GREEN  
ROW 2 HER  
13  
14  
3
4
THE SIGN  
THE SIGN  
REPRESENTS HER COLOR DICE  
REPRESENTS GREEN COLOR DICE  
6
Internal Circuit Diagram  
Common Row Cathode – Bi-Color  
3
COLUMN  
1
2
4
5
21  
7
22  
8
1
2
5
6
19  
20  
15  
16  
PIN  
PIN NO.  
CONNECTION  
ROW  
1
2
3
4
5
6
COLUMN 1 GREEN  
COLUMN 1 HER  
ROW 7 GREEN  
ROW 7 HER  
17  
1
2
3
4
5
6
7
18  
COLUMN 2 GREEN  
COLUMN 2 HER  
27  
28  
7, 21 COLUMN 3 GREEN  
8, 22 COLUMN 3 HER  
9
ROW 5 GREEN  
ROW 5 HER  
10  
23  
24  
11, 25 ROW 4 GREEN  
12, 26 ROW 4 HER  
13  
14  
15  
16  
17  
18  
19  
20  
23  
24  
27  
28  
ROW 6 GREEN  
COLUMN 6 HER  
COLUMN 5 GREEN  
COLUMN 5 HER  
ROW 1 GREEN  
ROW 1 HER  
25 11  
26 12  
COLUMN 4 GREEN  
COLUMN 4 HER  
ROW 3 GREEN  
ROW 3 HER  
9
10  
ROW 2 GREEN  
ROW 2 HER  
13  
14  
3
4
THE SIGN  
THE SIGN  
REPRESENTS HER COLOR DICE  
REPRESENTS GREEN COLOR DICE  
7
Absolute Maximum Ratings at T = 25˚C  
A
GaP Red  
GaP Green  
Parameter  
HDSP-S53E/ S58E/ B53Z/ B58Z  
HDSP-S53G/ S58G/ B53Z/ B58Z  
Units  
[1]  
Average Power per Dot  
130  
130  
mW  
[1]  
Peak Forward Current per Dot  
(1/ 8 Duty Cycle at 10 KHz)  
Average Forward Current per Dot  
Reverse Voltage per Dot  
Operating Temperature  
Storage Temperature  
80  
100  
mA  
mA  
V
[1,2]  
[1,3]  
25  
25  
3
3
–35to +85  
–35 to +85  
–35to+85  
–35 to +85  
°C  
°C  
[4]  
Wave Soldering Temperature for 3 seconds  
(2 mm [0.078 in.] below Body)  
250  
250  
°C  
Notes:  
1. Do not exceed maximum average current per dot.  
2. Derate above 25°C at 0.20 mA/ °C.  
3. Derate above 25°C at 0.33 mA/ °C.  
4. Not recommended to be soldered more than 2 times. Minimum interval between solderings is 15 minutes. Total soldering time not to exceed 3 seconds.  
8
Optical/ Electrical Characteristics at T = 25˚C  
A
GaP Red  
Devices  
HDSP-  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
I = 40 mA,  
FP  
1/ 8 Duty Factor  
Luminous Intensity/ Unit  
(Digit Average)  
I
v
2.2  
4.0  
7.47  
mcd  
[1]  
Peak Wavelength  
λ
λ
632  
622  
4.1  
nm  
nm  
V
I = 20 mA  
peak  
d
F
S53E  
S58E  
B53Z  
B58Z  
[2]  
Dominant Wavelength  
Forward Voltage  
I = 20 mA  
F
V
5.2  
2:1  
I = 20 mA  
F
F
[3]  
Reverse Voltage  
V
3.0  
V
I = 100 µA  
R
R
Luminous Intensity  
Matching Ratio  
I
v-m  
I = 40 mA,  
FP  
1/ 8 Duty Factor  
GaP Green  
Devices  
HDSP-  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
Luminous Intensity/ Unit  
(Digit Average)  
I
v
3.31  
6.23  
11.22  
mcd  
I = 40 mA,  
FP  
1/ 8 Duty Factor  
[1]  
Peak Wavelength  
λ
λ
568  
573  
4.5  
nm  
nm  
V
I = 20 mA  
peak  
d
F
S53G  
S58G  
B53Z  
B58Z  
[2]  
Dominant Wavelength  
I = 20 mA  
F
Forward Voltage  
V
5.2  
2:1  
I = 20 mA  
F
F
[3]  
Reverse Voltage  
V
3.0  
V
I = 100 µA  
R
R
Luminous Intensity  
Matching Ratio  
I
v-m  
I = 40 mA,  
FP  
1/ 8 Duty Factor  
Bi-Color  
Devices  
HDSP-  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
2
Luminance/ Unit  
(Digit Average)  
I
v
72.0  
130  
258.0  
Cd/ m  
I = 40 mA,  
FP  
1/ 8 Duty Factor  
B53Z  
B58Z  
[1]  
Notes:  
1. The digits are categorized for luminous intensity or luminance. The intensity or luminance category is designated by a letter on the side of the package.  
2. The dominant wavelength, λ , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.  
d
3. Typical specification for reference only. Do not exceed absolute maximum ratings.  
9
[1]  
Intensity Bin Limits (mcd at I = 40 mA, 1/ 8 Duty Factor)  
FP  
GaP Red  
[2]  
[2]  
Bin Name  
Min.  
2.2  
Max.  
3.3  
G
H
I
3.31  
4.98  
4.97  
7.47  
GaP Green  
[2]  
[2]  
Bin Name  
Min.  
3.31  
4.98  
7.48  
Max.  
4.97  
7.47  
H
I
J
11.22  
2
Bi-Color (Cd/ m atI = 40mA,1/ 8DutyFactor)  
FP  
[2]  
[2]  
Bin Name  
Min.  
72  
Max.  
86  
E
F
G
H
I
86  
104  
124  
149  
179  
215  
258  
104.1  
124.1  
149.1  
179.1  
215.1  
J
K
Hue Grade  
Bin  
7
Coordinate  
4
5
6
8
9
10  
X
Y
0.542-0.553  
0.445-0.456  
0.552-0.563  
0.435-0.446  
0.562-0.573  
0.425-0.436  
0.572-0.583  
0.415-0.426  
0.582-0.593  
0.405-0.416  
0.592-0.603  
0.395-0.406  
0.602-0.613  
0.385-0.396  
Notes:  
1. Hue categories are established for classification of products. Products may not be available in all bin categories.  
2. Tolerance for each intensity bin limit is ± 10%.  
[1]  
ColorBinLimits (nm)  
GaP Green  
[2]  
[2]  
Bin Name  
Min.  
Max.  
571  
3
569.1  
571.1  
573.1  
4
573  
5
575  
Notes:  
1. Bin categories are established for classification of products. Products may not be available in  
all bin categories.  
2. Tolerance for each color bin limit is ± 1.0 nm.  
10  
45  
40  
35  
30  
25  
20  
15  
30  
25  
20  
15  
10  
5
GaP RED  
GaP RED  
GaP GREEN  
GaP  
5
10  
5
0
0
0
1
2
3
4
6
0
20  
40  
60  
80  
100  
T
– AMBIENT TEMPERATURE – °C  
V – FORWARD VOLTAGE – V  
F
A
Figure 1. Maximum allowable average  
current per dot vs. ambient temperature.  
Figure 2. Forward current vs. forward voltage.  
1.4  
1.2  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
1.0  
GaP RED  
0.8  
GaP GREEN  
0.6  
0.4  
0.2  
0
0
5 10 15 20 25 30 35 40 45 50 55 60 65  
0
10 20 30 40 50 60 70 80 90 100  
– PEAK FORWARD CURRENT – mA  
I
I
– PEAK DOT CURRENT – mA  
PEAK  
PEAK  
Figure 4. Relative luminance vs. peak forward current.  
Figure 3. Relative efficiency (luminous  
intensity per dot) vs. peak current per dot.  
11  
Contrast Enhancement  
Device Reliability  
For information on contrast  
enhancement, please see  
Application Note 1015.  
For reliability information, please  
see the reliability data sheet  
91.44 mm Gener a l Pur pose  
5 x 7 Dot Ma trix Alpha numeric  
Displays.  
Soldering/ Cleaning  
Cleaning agents from the ketone  
family (acetone, methyl ethyl  
ketone, etc.) and from the  
chlorinated hydrocarbon family  
(methylene chloride, trichloroeth-  
ylene, carbon tetrachloride, etc.)  
are not recommended for cleaning  
LED parts. All of these various  
solvents attack or dissolve the  
encapsulating epoxies used to  
form the package of plastic LED  
parts.  
For information on soldering  
LEDs, please refer to Application  
Note 1027.  
For product information and a complete list of distributors, please go to our website: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.  
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved.  
5988-1731EN May 18, 2006  

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