AON7520 [AOS]
Plastic Encapsulated Devicenull; 塑料封装Devicenull
| 型号： | AON7520 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Plastic Encapsulated Devicenull |
| 文件： | 总3页 (文件大小：102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOS Semiconductor
Product Reliability Report
AON7520, rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AON7520.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AON7520
passes AOS quality and reliability requirements.
Table of Contents:
I.
Product Description
II.
III.
IV.
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
• Latest Trench Power AlphaMOS (αMOS LV) technology
• Very Low RDS(ON) at 2.5V VGS
• Low Gate Charge
• ESD protection
Application
• Load switch, battery switch in portable devices
-RoHS Compliant
-Halogen-Free
Detailed information refers to datasheet.
II. Die / Package Information:
AON7520
Process
Standard sub-micron
Low voltage N channel
DFN 3.3x3.3 EP
Bare Cu
Package Type
Lead Frame
Die Attach
Solder paste
Bonding
Cu Clip
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
III. Result of Reliability Stress for AON7520
Test Item
Test Condition
Time
Point
Lot
Total
Number
of
Standard
Attribution Sample
size
Failures
0
168hr 85°c
/85%RH +3 cycle
reflow@260°c
-
12 lots
2618pcs
770pcs
JESD22-
A113
MSL
Precondition
168hrs
500 hrs
1000 hrs
3 lots
4 lots
3 lots
0
0
JESD22-
A108
Temp = 150 c,
Vgs=100% of
Vgsmax
HTGB
HTRB
77pcs / lot
770pcs
168hrs
500 hrs
1000 hrs
3 lots
4 lots
3 lots
JESD22-
A108
Temp = 150 c,
Vds=80% of
Vdsmax
77pcs / lot
847pcs
96 hrs
96 hrs
11 lots
0
0
0
JESD22-
A110
130 c, 85%RH,
33.3 psi, Vds =
80% of Vdsmax
HAST
(Note A*)
11 lots
77 pcs / lot
847pcs
JESD22-
A102
121c, 29.7psi,
RH=100%
Pressure Pot
(Note A*)
12 lots
77 pcs / lot
924pcs
250 / 500
cycles
JESD22-
A104
-65c to 150c,
air to air
Temperature
Cycle
(Note A*)
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 4.16
MTTF = 27446 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AON7520). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)]
= 1.83 x 109 / [2x (6x77x168 +8x77x500 +6x77x1000) x259] = 4.16
MTTF = 109 / FIT = 2.40 x 108hrs = 27446 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C )
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
32
100 deg C
13
115 deg C
5.64
130 deg C
2.59
150 deg C
1
Af
259
88
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
K = Boltzmann’s constant, 8.617164 X 10-5eV / K
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