AS1334-BTDT-33 [AMSCO]

650mA, Ultra low Ripple Step Down DC/DC Converter; 650毫安,超低纹波降压DC / DC转换器
AS1334-BTDT-33
型号: AS1334-BTDT-33
厂家: AMS(艾迈斯)    AMS(艾迈斯)
描述:

650mA, Ultra low Ripple Step Down DC/DC Converter
650毫安,超低纹波降压DC / DC转换器

转换器
文件: 总17页 (文件大小:1733K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Datasheet  
AS1334  
650mA, Ultra low Ripple Step Down DC/DC Converter  
1 General Description  
2 Key Features  
Output Voltage Ripple: 2mV  
The AS1334 is a step-down DC-DC converter designed  
to power portable applications from a single Li-Ion  
battery. The device also achieves high-performance in  
mobile phones and other applications requiring low  
dropout voltage.  
PWM Switching Frequency: 2MHz  
Single Lithium-Ion Cell Operation  
Output Voltage Range: 1.2V to 3.4V  
(available in 100mV steps, see Ordering Information  
on page 16)  
The AS1334 operates from an input voltage range of 2.7  
to 5.5V while providing output voltages of 1.2, 1.5, 1.8,  
2.5, 3.0 and 3.3V.  
Fixed Output Voltages:  
- 1.2V, 1.5V, 1.8V, 2.5V, 3.0V, 3.3V  
Fixed-frequency PWM operation minimizes RF  
interference. Shutdown function turns the device off and  
reduces battery consumption to 0.01µA (typ.).  
Maximum Load Capability of 650mA  
97% High Efficiency, 94% Average Efficiency  
Current Overload Protection  
Thermal Overload Protection  
Power-OK  
The AS1334 is available in a TDFN(3x3) 8-pin package.  
A high switching frequency (2 MHz) allows use of tiny  
surface-mount components. Only three small external  
surface-mount components, an inductor and two  
ceramic capacitors are required.  
Soft Start  
Low Dropout Voltage (140 mΩ Typ PFET)  
TDFN(3x3) 8-pin  
3 Applications  
The AS1334 is an ideal solution to supply noise  
sensitive applications as cellular phones, hand-held  
radios, RF PC cards, battery powered RF devices, RFID  
chipsets, A/D Converter, Sensors and OpAmps.  
Figure 1. AS1334 - Typical Application Circuit  
3.3 µH  
PVIN  
SW  
VIN  
VOUT  
10 µF  
VDD  
FB  
AS1334  
10 µF  
EN  
ON  
POK  
OFF  
SGND  
PGND  
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AS1334  
Datasheet - Pin Assignments  
4 Pin Assignments  
Figure 2. Pin Configuration  
FB  
POK  
EN  
1
2
3
4
8
7
6
5
PGND  
SW  
AS1334  
PVIN  
SGND  
SGND  
9
VDD  
Pin Descriptions  
Table 1. Pin Descriptions  
Pin Name  
Pin Number  
Description  
1
Feedback Pin. Connect to the output at the output filter capacitor.  
FB  
Power-OK.  
2
0 = VOUT < 90% of VOUTNOM.  
POK  
1 = VOUT > 90% of VOUTNOM.  
Enable Input. Set this digital input high for normal operation. For shutdown,  
set low.  
3
EN  
+2.7V to +5.5V Power Supply Voltage. Analog Supply Input.  
4
5, 9  
6
VDD  
SGND  
PVIN  
Analog and Control Ground.  
+2.7V to +5.5V Power Supply Voltage. Input to the internal PFET switch.  
Switch Pin. Switch node connection to the internal PFET switch and NFET  
synchronous rectifier. Connect to an inductor with a saturation current rating  
that exceeds the maximum switch peak current limit specification of the  
AS1334.  
SW  
7
8
Power Ground.  
PGND  
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AS1334  
Datasheet - Absolute Maximum Ratings  
5 Absolute Maximum Ratings  
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,  
and functional operation of the device at these or any other conditions beyond those indicated in Electrical  
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may  
affect device reliability.  
Table 2. Absolute Maximum Ratings  
Parameter  
VDD, PVIN to SGND  
PGND to SGND  
POK, EN, FB  
Min  
-0.3  
-0.3  
Max  
+7.0  
+0.3  
Units  
V
Notes  
V
SGND - 0.3 VDD + 0.3  
PGND - 0.3 PVIN + 0.3  
V
7.0V max  
SW  
V
PVIN to VDD  
-0.3  
-40  
+0.3  
+85  
V
Operating Temperature Range  
°C  
ºC  
ºC  
Junction Temperature (TJ-MAX  
)
+150  
+150  
Storage Temperature Range  
-65  
Maximum Lead Temperature  
(Soldering, 10 sec)  
+260  
ºC  
ESD Rating  
Human Body Model  
Operating Ratings  
2
kV  
HBM MIL-Std. 883E 3015.7 methods  
Input Voltage Range  
2.7  
-40  
5.5  
650  
V
Recommended Load Current  
mA  
ºC  
Junction Temperature (TJ) Range  
+125  
In applications where high power  
dissipation and/or poor package thermal  
resistance is present, the maximum  
ambient temperature may have to be  
derated.  
Maximum ambient temperature (TA-MAX  
is dependent on the maximum operating  
junction temperature (TJ-MAX-OP  
125ºC), the maximum power dissipation  
of the device in the application (PD-MAX),  
and the junction-to ambient thermal  
resistance of the part/package in the  
application (θJA), as given by the  
following  
)
=
Ambient Temperature (TA) Range  
-40  
+85  
ºC  
equation: TA-MAX = TJ-MAX-OP – (θJA  
×
PD-MAX).  
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AS1334  
Datasheet - Electrical Characteristics  
6 Electrical Characteristics  
TA = TJ = -40ºC to +85ºC; PVIN = VDD = EN = 3.6V, unless otherwise noted  
. Typ. values are at TA=25°C.  
Table 3. Electrical Characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ Max Units  
1.176 1.2 1.224  
V
V
V
V
V
V
1.47  
1.5  
1.53  
1.764 1.8 1.836  
VOUT  
Output Voltage  
PVIN = 3.6V  
2.45  
2.94  
2.5  
3.0  
2.55  
3.06  
3.234 3.3 3.366  
EN = SW = 0V1  
ISHDN  
IQ  
Shutdown supply current  
DC bias current into VDD  
0.01  
2
µA  
FB = 0V, No Switching2  
1
1.4  
mA  
I
I
SW = 200mA; TA = +25°C  
SW = 200mA  
140  
200  
230  
415  
485  
RDSON(P) Pin-Pin Resistance for PFET  
RDSON(N) Pin-Pin Resistance for NFET  
mΩ  
mΩ  
ISW = -200mA; TA = +25°C  
ISW = -200mA  
300  
ILIM,PFET Switch peak current limit  
935 1100 1200 mA  
POK Output  
POK Output Low Voltage  
POK sinking 0.1mA  
VOL  
0.05  
90  
0.2  
500  
93  
V
nA  
%
POK Output High Leakage Current POK = 3.6V  
POK Threshold Rising edge, referenced to VOUT(NOM)  
Enable Input  
VIH,EN  
Logic high input threshold  
VIL,EN  
87  
1.2  
V
V
Logic low input threshold  
Pin pull down current  
0.5  
10  
IPIN,ENABLE  
Oscillator  
FOSC  
5
2
µA  
Internal oscillator frequency  
1.8  
2.2 MHz  
1. Shutdown current includes leakage current of PFET.  
2. IQ specified here is when the part is operating at 100% duty cycle.  
System Characteristics  
TA = 25ºC; PVIN = VDD = EN = 3.6V, unless otherwise noted  
. The following parameters are verified by characterisation  
and are not production tested  
.
Table 4. System Characteristics  
Symbol  
Parameter  
Conditions  
Min Typ Max Units  
EN = Low to High, VIN = 4.2V, COUT  
10µF, IOUT 1mA  
=
Turn on time (from Enable low to  
high transition)  
T_ON  
210 350  
µs  
Efficiency (L = 3.3µH, DCR ≤  
100mΩ)  
VIN = 3.6V, IOUT = 400mA  
η
96  
5
%
Ripple voltage, PWM mode1  
VIN = 4.2V, IOUT = 10mA to 400mA  
VOUT_ripple  
mVp-p  
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AS1334  
Datasheet - Electrical Characteristics  
Table 4. System Characteristics  
Symbol  
Parameter  
Conditions  
Min Typ Max Units  
VIN = 600mV perturbance, over Vin  
range 3.4V to 5.5V; TRISE = TFALL  
10µs, VOUT = 3.0V, IOUT = 100mA  
=
Line transient response  
Line_tr  
50  
50  
mVpk  
mVpk  
VIN = 4.2V, VOUT = 3.0V, transients up  
to 100mA, TRISE = TFALL = 10µs  
Load transient response  
Load_tr  
1. Ripple voltage should measured at COUT electrode on good layout PC board and under condition using sug-  
gested inductors and capacitors.  
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AS1334  
Datasheet - Typical Operating Characteristics  
7 Typical Operating Characteristics  
Circuit in Figure 23 on page 11, PVIN = VDD = EN = 3.6V, L = 3.3µH (LPS4018-332ML_), CIN = COUT = 10µF  
(GRM21BR61C106KA01) unless otherwise noted;  
Figure 3. Quiescent Current vs. VIN  
Figure 4. Shutdown Current vs. Temperature  
0.55  
0.3  
Vin=3.25V  
Vin=3.6V  
0.25  
Vin=4.2V  
Vin=5.5V  
0.5  
0.45  
0.4  
0.2  
0.15  
0.1  
0.05  
0
- 45°C  
+ 25°C  
+ 85°C  
0.35  
2.5  
3
3.5  
4
4.5  
5
5.5  
-40  
-15  
10  
35  
60  
85  
Supply Voltage (V)  
Temperature (°C)  
Figure 5. Switching Frequency Variation vs. Temp.  
Figure 6. Output Voltage vs. Supply Voltage  
4
3.06  
3
2
3.04  
3.02  
3
1
0
-1  
2.98  
-2  
Vin=3.6V  
Iout=50mA  
2.96  
Vin=4.2V  
Iout=300mA  
Iout=650mA  
-3  
Vin=5.5V  
-4  
2.94  
-40  
-15  
10  
35  
60  
85  
3.25  
3.75  
4.25  
4.75  
5.25  
Temperature (°C)  
Supply Voltage (V)  
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AS1334  
Datasheet - Typical Operating Characteristics  
Figure 7. Output Voltage vs. Temperature  
Figure 8. Efficiency vs. Output Current  
3.06  
100  
3.04  
3.02  
3
95  
90  
85  
80  
75  
70  
Vi n=3.25V  
Vi n=3.6V  
Vi n=3.9V  
Vi n=4.2V  
Vi n=4.5V  
Vi n=5.5V  
2.98  
Iout=50mA  
2.96  
Iout=300mA  
Iout=650mA  
2.94  
-40  
-15  
10  
35  
60  
85  
0
100 200 300 400 500 600 700  
Output Current (mA)  
Temperature (°C)  
Figure 9. Switch Peak Current Limit vs. Temperature;  
closed loop  
Figure 10. Load Transient Response; VOUT = 3.0V,  
VIN = 4.2V  
1.2  
1.15  
1.1  
1.05  
Vin=2.7V  
Vin=3.6V  
Vin=5.5V  
1
-40  
-15  
10  
35  
60  
85  
10µs/Div  
Temperature (°C)  
Figure 11. Startup; VIN = 3.6V, VOUT = 3.0V,  
Figure 12. Startup; VIN = 4.2V, VOUT = 3.0V,  
IOUT<1mA, RLOAD=3.3kΩ  
IOUT<1mA, RLOAD=3.3kΩ  
50µs/Div  
50µs/Div  
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AS1334  
Datasheet - Typical Operating Characteristics  
Figure 13. Shutdown Response; VIN=3.6V,  
Figure 14. Shutdown Response; VIN=4.2V,  
VOUT=3.0V, RLOAD=5Ω  
VOUT=3.0V, RLOAD=5Ω  
50µs/Div  
50µs/Div  
Figure 15. Line Transient Response; VIN=3.3V to  
3.9V, IOUT=100mA, VOUT=3.0V  
Figure 16. Timed Current Limit Response;  
VIN = 3.6V, VOUT=3.0V  
50µs/Div  
10µs/Div  
Figure 17. Output Voltage Ripple;  
VOUT = 3.0V, IOUT = 200mA  
Figure 18. VOUT Ripple in Skip Mode; VIN=3.31V,  
VOUT=3.0V, RLOAD=5Ω  
200ns/Div  
1µs/Div  
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AS1334  
Datasheet - Typical Operating Characteristics  
Figure 19. RDSON (P-Chanel) vs. Temp.; ISW=200mA  
Figure 20. RDSON (N-Chanel) vs. Temp.; ISW=-200mA  
350  
350  
300  
250  
200  
150  
300  
250  
200  
150  
100  
100  
Vin=2.7V  
Vin=2.7V  
50  
50  
Vin=3.6V  
Vin=3.6V  
Vin=5.5V  
Vin=5.5V  
0
0
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
Temperature (°C)  
Temperature (°C)  
Figure 21. EN High Threshold vs. VIN  
1.2  
1.15  
1.1  
1.05  
1
0.95  
0.9  
- 45°C  
+25°C  
+90°C  
0.85  
0.8  
2.5  
3
3.5  
4
4.5  
5
5.5  
Supply Voltage (V)  
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AS1334  
Datasheet - Detailed Description  
8 Detailed Description  
The AS1334 is a simple, step-down DC-DC converter optimized for powering portable applications that require low  
dropout voltages such as mobile phones, portable communicators, and similar battery powered RFID devices. Besides  
being packed with numerous features like current overload protection, thermal overload shutdown and soft start,  
AS1334 displays the following characteristics:  
Its operation is based on current-mode buck architecture with synchronous rectification for high efficiency.  
Allows the application to operate at maximum efficiency over a wide range of power levels from a single Li-Ion bat-  
tery cell.  
Provides for a maximum load capability of 650mA in PWM mode, wherein the maximum load range may vary  
depending on input voltage, output voltage and the selected inductor.  
Is ranked at an efficiency of around 96% for a 400mA load with a 3.6V input voltage.  
Figure 22. AS1334 - Functional Block Diagram  
PVIN  
POK  
VDD  
1.13V  
+
Oscillator  
Current  
Sense  
FB  
Mosfet  
Control  
Logic  
SW  
Soft Start  
Main Control  
EN  
Shutdown  
Control  
AS1334  
SGND  
PGND  
The size of the external components is reduced by using a high switching frequency (2MHz). Figure 1 on page 1  
demonstrates that only three external power components are required for implementation. Also, the system controller  
should set EN low during power-up and other low supply voltage conditions. See Shutdown Mode on page 12.  
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AS1334  
Datasheet - Detailed Description  
Figure 23. Typical Operating System Circuit  
3.3 µH  
PVIN  
SW  
FB  
VIN  
VOUT  
2.7V to 5.5V  
10 µF  
VDD  
EN  
AS1334  
10 µF  
System  
Controller  
POK  
ON/OFF  
SGND  
PGND  
Operating the AS1334  
AS1334’s control block turns on the internal PFET (P-channel MOSFET) switch during the first part of each switching  
cycle, thus allowing current to flow from the input through the inductor to the output filter capacitor and load. The  
inductor limits the current to a ramp with a slope of around (VIN - VOUT) / L, by storing energy in a magnetic field.  
During the second part of each cycle, the controller turns the PFET switch off, blocking current flow from the input, and  
then turns the NFET (N-channel MOSFET) synchronous rectifier on. As a result, the inductor’s magnetic field  
collapses, generating a voltage that forces current from ground through the synchronous rectifier to the output filter  
capacitor and load.  
While the stored energy is transferred back into the circuit and depleted, the inductor current ramps down with a slope  
around VOUT / L. The output filter capacitor stores charge when the inductor current is high, and releases it when low,  
smoothing the voltage across the load. The output voltage is regulated by modulating the PFET switch on time to  
control the average current sent to the load. The effect is identical to sending a duty-cycle modulated rectangular wave  
formed by the switch and synchronous rectifier at SW to a low-pass filter formed by the inductor and output filter  
capacitor.  
The output voltage is equal to the average voltage at the SW pin.  
While in operation, the output voltage is regulated by switching at a constant frequency and then modulating the  
energy per cycle to control power to the load. Energy per cycle is set by modulating the PFET switch on-time pulse  
width to control the peak inductor current. This is done by comparing the signal from the current-sense amplifier with a  
slope compensated error signal from the voltage-feedback error amplifier. At the beginning of each cycle, the clock  
turns on the PFET switch, causing the inductor current to ramp up. When the current sense signal ramps past the error  
amplifier signal, the PWM comparator turns off the PFET switch and turns on the NFET synchronous rectifier, ending  
the first part of the cycle.  
If an increase in load pulls the output down, the error amplifier output increases, which allows the inductor current to  
ramp higher before the comparator turns off the PFET. This increases the average current sent to the output and  
adjusts for the increase in the load. Before appearing at the PWM comparator, a slope compensation ramp from the  
oscillator is subtracted from the error signal for stability of the current feedback loop. The minimum on time of PFET in  
PWM mode is 50ns (typ.)  
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AS1334  
Datasheet - Detailed Description  
Internal Synchronous Rectifier  
To reduce the rectifier forward voltage drop and the associated power loss, the AS1334 uses an internal NFET as a  
synchronous rectifier. The big advantage of a synchronous rectification is the higher efficiency in a condition where the  
output voltage is low compared to the voltage drop across an ordinary rectifier diode. During the inductor current down  
slope in the second part of each cycle the synchronous rectifier is turned on. Before the next cycle the synchronous  
rectifier is turned off.  
There is no need for an external diode because the NFET is conducting through its intrinsic body diode during the  
transient intervals before it turns on.  
Power-OK  
The POK output indicates if the output voltage is within 90% of the nominal voltage level. As long as the output voltage  
is within regulation the open-drain POK output sinks current.  
Shutdown Mode  
If EN is set to high (>1.2V) the AS1334 is in normal operation mode. During power-up and when the power supply is  
less than 2.7V minimum operating voltage, the chip should be turned off by setting EN low. In shutdown mode the  
following blocks of the AS1334 are turned off, PFET switch, NFET synchronous rectifier, reference voltage source,  
control and bias circuitry. The AS1334 is designed for compact portable applications, such as mobile phones where the  
system controller controls operation mode for maximizing battery life and requirements for small package size  
outweigh the additional size required for inclusion of UVLO (Under Voltage Lock-Out) circuitry.  
Note: Setting the EN digital pin low (<0.5V) places the AS1334 in a 0.01µA (typ.) shutdown mode.  
Thermal Overload Protection  
To prevent the AS1334 from short-term misuse and overload conditions the chip includes a thermal overload  
protection. To block the normal operation mode the device is turning the PFET and the NFET off in PWM mode as  
soon as the junction temperature exceeds 150°C. To resume the normal operation the temperature has to drop below  
140°C.  
Note: Continuing operation in thermal overload conditions may damage the device and is considered bad practice.  
Current Limiting For Protection  
If in the PWM mode the cycle-by-cycle current limit of 1200mA (max.) is reached the current limit feature takes place  
and protects the device and the external components. A timed current limiting mode is working when a load pulls the  
output voltage down to approximately 0.375V. In this timed current limit mode the inductor current is forced to ramp  
down to a safe value. This is achived by turning off the internal PFET switch and delaying the start of the next cycle for  
3.5us. The synchronous rectifier is also turned off in the timed current limit mode.  
The advantage of the timed current limit mode is to prevent the device from the loss of the current control.  
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AS1334  
Datasheet - Application Information  
9 Application Information  
Inductor Selection  
For the external inductor, a 3.3µH inductor is recommended. Minimum inductor size is dependant on the desired effi-  
ciency and output current. Inductors with low core losses and small DCR at 2MHz are recommended.  
Table 5. Recommended Inductor  
Part Number  
L
DCR  
Current Rating Dimensions (L/W/T)  
Manufacturer  
Coilcraft  
www.coilcraft.com  
LPS4018-222ML_  
LPS4018-332ML_  
LPS4018-472ML_  
2.2µH  
3.3µH  
4.7µH  
0.070Ω  
0.080Ω  
0.125Ω  
2.9A  
2.4A  
1.9A  
3.9x3.9x1.7mm  
3.9x3.9x1.7mm  
3.9x3.9x1.7mm  
Capacitor Selection  
A 10µF capacitor is recommended for CIN as well as a 10µF for COUT. Small-sized X5R or X7R ceramic capacitors are  
recommended as they retain capacitance over wide ranges of voltages and temperatures.  
Input and Output Capacitor Selection  
Low ESR input capacitors reduce input switching noise and reduce the peak current drawn from the battery. Also low  
ESR capacitors should be used to minimize VOUT ripple. Multi-layer ceramic capacitors are recommended since they  
have extremely low ESR and are available in small footprints.  
For input decoupling the ceramic capacitor should be located as close to the device as practical. A 4.7µF input capaci-  
tor is sufficient for most applications. Larger values may be used without limitations.  
A 2.2µF to 10µF output ceramic capacitor is sufficient for most applications. Larger values up to 22µF may be used to  
obtain extremely low output voltage ripple and improve transient response.  
Table 6. Recommended Input and Output Capacitor  
Part Number  
C
TC Code Rated Voltage Dimensions (L/W/T)  
Manufacturer  
Murata  
www.murata.com  
GRM188R60J475KE19  
GRM219R60J475KE19  
GRM21BR61C475KA88  
GRM31CR71E475KA88  
GRM188R60J106ME47  
GRM21BR60J106KE19  
GRM21BR61A106KE19  
GRM32DR71C106KA01  
GRM21BR60J226ME39  
GRM32ER71A226KE20  
4.7µF  
4.7µF  
4.7µF  
4.7µF  
10µF  
10µF  
10µF  
10µF  
22µF  
22µF  
X5R  
X5R  
X5R  
X7R  
X5R  
X5R  
X5R  
X7R  
X5R  
X7R  
6.3V  
6.3V  
16V  
25V  
6.3V  
6.3V  
10V  
16V  
6.3V  
10V  
0603  
0805  
0805  
1206  
0603  
0805  
0805  
1210  
0805  
1210  
EN Pin Control  
Drive the EN pin using the system controller to turn the AS1334 ON and OFF. Use a comparator, Schmidt trigger or  
logic gate to drive the EN pin. Set EN high (>1.2V) for normal operation and low (<0.5V) for a 0.01µA (typ.) shutdown  
mode. Set EN low to turn off the AS1334 during power-up and under voltage conditions when the power supply is less  
than the 2.7V minimum operating voltage. The part is out of regulation when the input voltage is less than 2.7V.  
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13 - 17  
AS1334  
Datasheet - Application Information  
Layout Considerations  
The AS1334 converts higher input voltage to lower output voltage with high efficiency. This is achieved with an  
inductorbased switching topology. During the first half of the switching cycle, the internal PMOS switch turns on, the  
input voltage is applied to the inductor, and the current flows from PVDD line to the output capacitor (C2) through the  
inductor. During the second half cycle, the PMOS turns off and the internal NMOS turns on. The inductor current  
continues to flow via the inductor from the device PGND line to the output capacitor (C2). Referring to Figure 24, the  
AS1334 has two major current loops where pulse and ripple current flow. The loop shown in the left hand side is most  
important, because pulse current shown in Figure 24 flows in this path. The right hand side is next. The current  
waveform in this path is triangular, as shown in Figure 24. Pulse current has many high-frequency components due to  
fast di/dt. Triangular ripple current also has wide high-frequency components. Board layout and circuit pattern design  
of these two loops are the key factors for reducing noise radiation and stable operation. Other lines, such as from  
battery to C1(+) and C2(+) to load, are almost DC current, so it is not necessary to take so much care. Only pattern  
width (current capability) and DCR drop considerations are needed.  
Figure 24. Current Loop  
VIN  
3.25V to 5.5V  
i
fOSC = 2MHz  
i
+
VDD  
C1  
- 10 µF  
PVIN  
L1  
3.3 µH  
VOUT  
SW  
FB  
EN  
C2  
+
-
10 µF  
SGND  
PGND  
POK  
www.austriamicrosystems.com  
Revision 1.04  
14 - 17  
AS1334  
Datasheet - Package Drawings and Markings  
10 Package Drawings and Markings  
The devices are available in a TDFN(3x3) 8-pin package.  
Figure 25. TDFN(3x3) 8-pin Package  
D2  
D
SEE  
D2/2  
DETAIL B  
B
L
PIN 1 INDEX AREA  
(D/2 xE/2)  
K
B
N N-1  
b
PIN 1 INDEX AREA  
(D/2 xE/2)  
aaa  
C
2x  
e
bbb  
C
C A  
TOP VIEW  
(ND-1) X e  
BTM VIEW  
ddd  
e
Terminal Tip  
DETAIL B  
e/2  
ccc  
C
C
C
SEATING  
PLANE  
0.08  
SIDE VIEW  
Datum A or B  
EVEN TERMINAL SIDE  
Symbol  
A
Min  
0.70  
0.00  
Typ  
0.75  
Max  
0.80  
0.05  
Notes  
1, 2  
1, 2  
1, 2  
1, 2  
1, 2  
1, 2  
1, 2  
1, 2  
1, 2  
1, 2  
1, 2  
Symbol  
Min  
Typ  
3.00  
3.00  
Max  
Notes  
1, 2  
D BSC  
A1  
0.02  
E BSC  
1, 2  
A3  
0.20 REF  
D2  
E2  
L
1.60  
1.35  
0.30  
0º  
2.50  
1.75  
0.50  
14º  
1, 2  
L1  
0.03  
0.15  
0.13  
1, 2  
L2  
0.40  
1, 2  
aaa  
bbb  
ccc  
ddd  
eee  
ggg  
0.15  
0.10  
0.10  
0.05  
0.08  
0.10  
θ
K
1, 2  
0.20  
0.18  
1, 2  
b
0.25  
0.65  
8
0.30  
1, 2, 5  
e
N
1, 2  
ND  
4
1, 2, 5  
Notes:  
1. Figure 25 is shown for illustration only.  
2. All dimensions are in millimeters; angles in degrees.  
3. Dimensioning and tolerancing conform to ASME Y14.5 M-1994.  
4. N is the total number of terminals.  
5. The terminal #1 identifier and terminal numbering convention shall conform to JEDEC 95-1, SPP-012. Details of ter-  
minal #1 identifier are optional, but must be located within the zone indicated. The terminal #1 identifier may be either  
a mold or marked feature.  
6. Dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip.  
7. ND refers to the maximum number of terminals on side D.  
8. Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals  
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Revision 1.04  
15 - 17  
AS1334  
Datasheet - Ordering Information  
11 Ordering Information  
The device is available as the standard products shown in Table 7.  
Table 7. Ordering Information  
Ordering Code  
Marking Output  
Description  
Delivery Form  
Package  
650mA, Ultra low Ripple Step Down  
DC/DC Converter  
AS1334-BTDT-12  
Tape and Reel TDFN(3x3) 8-pin  
Tape and Reel TDFN(3x3) 8-pin  
Tape and Reel TDFN(3x3) 8-pin  
Tape and Reel TDFN(3x3) 8-pin  
Tape and Reel TDFN(3x3) 8-pin  
Tape and Reel TDFN(3x3) 8-pin  
Tape and Reel TDFN(3x3) 8-pin  
ASR2  
ASR3  
ASR4  
ASR5  
ASQY  
ASR6  
xxxx  
1.2V  
1.5V  
1.8V  
2.5V  
3.0V  
3.3V  
xxxx  
650mA, Ultra low Ripple Step Down  
DC/DC Converter  
AS1334-BTDT-15  
AS1334-BTDT-18  
AS1334-BTDT-25  
AS1334-BTDT-30  
AS1334-BTDT-33  
650mA, Ultra low Ripple Step Down  
DC/DC Converter  
650mA, Ultra low Ripple Step Down  
DC/DC Converter  
650mA, Ultra low Ripple Step Down  
DC/DC Converter  
650mA, Ultra low Ripple Step Down  
DC/DC Converter  
650mA, Ultra low Ripple Step Down  
DC/DC Converter  
AS1334-BTDT-xx1  
1. Non-standard devices are available between 1.2V and 3.4V in 100mV steps. For more information and inquiries  
contact http://www.austriamicrosystems.com/contact  
Note: All products are RoHS compliant and Pb-free.  
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect  
For further information and requests, please contact us mailto:sales@austriamicrosystems.com  
or find your local distributor at http://www.austriamicrosystems.com/distributor  
www.austriamicrosystems.com  
Revision 1.04  
16 - 17  
AS1334  
Datasheet  
Copyrights  
Copyright © 1997-2009, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe.  
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged,  
translated, stored, or used without the prior written consent of the copyright owner.  
All products and companies mentioned are trademarks or registered trademarks of their respective companies.  
Disclaimer  
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing  
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding  
the information set forth herein or regarding the freedom of the described devices from patent infringement.  
austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice.  
Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for  
current information. This product is intended for use in normal commercial applications. Applications requiring  
extended temperature range, unusual environmental requirements, or high reliability applications, such as military,  
medical life-support or life-sustaining equipment are specifically not recommended without additional processing by  
austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show  
deviations from the standard production flow, such as test flow or test location.  
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,  
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to  
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or  
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the tech-  
nical data herein. No obligation or liability to recipient or any third party shall arise or flow out of  
austriamicrosystems AG rendering of technical or other services.  
Contact Information  
Headquarters  
austriamicrosystems AG  
Tobelbaderstrasse 30  
A-8141 Unterpremstaetten, Austria  
Tel: +43 (0) 3136 500 0  
Fax: +43 (0) 3136 525 01  
For Sales Offices, Distributors and Representatives, please visit:  
http://www.austriamicrosystems.com/contact  
www.austriamicrosystems.com  
Revision 1.04  
17 - 17  

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