AS1334_07 [AMSCO]
650mA, Ultra low Ripple Step Down DC/DC Converter; 650毫安，超低纹波降压DC / DC转换器
| 型号： | AS1334_07 |
| 厂家： | 
AMS(艾迈斯) |
| 描述： | 650mA, Ultra low Ripple Step Down DC/DC Converter |
| 文件： | 总19页 (文件大小：932K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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The technical content of this austriamicrosystems datasheet is still valid.
Contact information:
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Tel: +43 (0) 3136 500 0
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Datasheet
AS1334
650mA, Ultra low Ripple Step Down DC/DC Converter
1 General Description
The AS1334 is a step-down DC-DC converter designed to power
portable applications from a single Li-Ion battery. The device also
achieves high-performance in mobile phones and other applications
requiring low dropout voltage.
2 Key Features
ꢀ
ꢀ
ꢀ
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Output Voltage Ripple: 2mV
PWM Switching Frequency: 2MHz
Single Lithium-Ion Cell Operation
Output Voltage Range: 1.2V to 3.4V
The AS1334 operates from an input voltage range of 2.7 to 5.5V
while providing output voltages of 1.2, 1.5, 1.8, 2.5, 3.0 and 3.3V.
(available in 100mV steps, see Ordering Information on pae 1
ꢀ
Fixed Output Voltages:
- 1.2V, 1.5V, 1.8V, 2.5V, 3.0V, 3.3V
Fixed-frequency PWM operation minimizes RF interference.
Shutdown function turns the device off and reduces battery
consumption to 0.01µA (typ).
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Maximum Load Capability of 650mA
97% High Efficiency, 94% Average Efficincy
Current Overload Protection
ThermOverload Protection
PowerOK
The AS1334 is available in a TDFN(3x3) 8-pin package. A high
switching frequency (2 MHz) allows use of tiny surface-mount
components. Only three small external surface-mount components,
an inductor and two ceramic capacitors are required.
Soft Start
Low Dropout Voltage 40 mΩ Typ PFET)
TDFN(3x3) pin
3 Appcations
The AS13is an ideal solution to supply noise sensitive
pplicaons as cellular phones, hand-held radios, RF PC cards,
baery powered RF devices, RFID chipsets, A/D Converter, Sensors
and OpAmps.
Figure 1. AS1334 - Typical Application Circuit
3.3 µH
PVIN
SW
VIN
VOUT
1µF
VDD
FB
AS1334
10 µF
EN
ON
POK
OFF
SGND
PGND
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AS1334
Datasheet - Pin Assignments
4 Pin Assignments
Figure 2. Pin Configuration
FB
POK
EN
1
2
3
4
8
7
6
5
PGND
SW
AS1334
PVIN
SGND
SGND
9
VDD
4.1 Pin Descriptions
Table 1. Pin Descriptions
Pin Number
Pin Name
Description
1
Fdback Pin. Conneoutput at the output filter capacitor.
Power-OK.
FB
2
0 = VOUT < 90% of VOUTNOM.
POK
1 = VOT > 90% of VOUTNOM.
3
4
Enable Inut. Set this digital input high for normal operation. For shutdown, set low.
+2V +5.5V Power Supply Voltage. Analog Supply Input.
EN
VDD
Analnd Control Ground. Connect these pins with low resistance to PGND.
+2V to +5.5V Power Supply Voltage. Input to the internal PFET switch.
5, 9
6
SGND
PVIN
Switch Pin. Switch node connection to the internal PFET switch and NFET synchronous rectifier.
Connect to an inductor with a saturation current rating that exceeds the maximum switch peak
current limit specification of the AS1334.
7
8
SW
Power Ground. Connect this pin with low resistance to SGND.
PGND
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AS1334
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
Min
Max
Units
Notes
VDD, PVIN to SGND
PGND to SGND
POK, EN, FB
-0.3
-0.3
+7.0
+0.3
V
V
SGND - 0.3
PGND - 0.3
-0.3
VDD + 0.3
PVIN + 0.3
+0.3
V
7.0V max
SW
V
PVIN to VDD
V
Input Voltage Range
Recommended Load Current
2.7
5.5
V
650
mA
In applications where hpower dissipation and/
or poor pacage rmal resistance is present,
the maximum ambint temperature may have to
be derated.
Mamum ambient temperature (TA-MAX) is
dpendet on the maximum operating junction
temprature (TJ-MAX-OP = 125ºC), the maximum
power dissipation
Ambient Temperature (TA) Range
-40
+85
ºC
of the device in the application (PD-MAX), and the
junction-to ambient thermal resistance of the
part/package in the application (θJA), as given by
the following
equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Electrostatic Discharge
Human Body Model
kV
Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Junction Temperature (TJ-MAX
)
+150
+150
ºC
ºC
Storage Temperature Range
-5
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
Package Body Temperatur
+260
86
ºC
%
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Hdity
5
Non-condensing
Moisture Sensve Level
1
Represents a max. floor life time of unlimited
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Revision 1.09
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AS1334
Datasheet - Electrical Characteristics
6 Electrical Characteristics
TA = TJ = -40ºC to +85ºC; PVIN = VDD = EN = 3.6V, unless otherwise noted
.
Typical values are at TA=25°C.
Table 3. Electrical Characteristics
Symbol
Parameter
Conditions
Min
-40
Typ
Max Units
Operating Temperature Range
TA
+85
1.224
1.53
°C
V
1.176
1.47
1.764
2.45
2.94
3.234
1.2
1.5
1.8
2.5
3.0
3
V
1.836
2.55
V
VOUT
Output Voltage
PVIN = 3.6V
V
3.06
V
3.366
V
EN = SW = 0V1
ISHDN
IQ
Shutdown supply current
DC bias current into VDD
001
2
µA
mA
FB = 0V, No Switcing2
1
1.4
ISW = 200mA; TA = +25°C
140
200
230
415
485
RDSON(P) Pin-Pin Resistance for PFET
RDSON(N) Pin-Pin Resistance for NFET
mΩ
I
I
I
SW = 20A
SW = -200TA = +25°C
SW = -200m
300
mΩ
ILIM,PFET
POK Output
VOL
Switch peak current limit
935
1100 1200
mA
POK Output Low Voltage
POK Output High Leakage Cuent
POK Threshold
POK sinking 0.1mA
0.05
90
0.2
500
93
V
nA
%
POK = 3.6V
Falling refeenced to VOUT(NOM)
87
Enable Input
VIH,EN
Logic high input threshold
Logic low input threshold
1.2
V
V
VIL,EN
0.5
10
IPIN,ENABLE Pin pull down current
5
2
µA
Oscillator
FOSC
Internal oscillator frequecy
1.8
2.2
MHz
1. Shutdown current includes leakge crent of PFET.
2. IQ specified here is when thpart is operating at 100% duty cycle.
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AS1334
Datasheet - Electrical Characteristics
6.1 System Characteristics
TA = 25ºC; PVIN = VDD = EN = 3.6V, unless otherwise noted. The following parameters are verified by characterisation and are not production
tested
.
Table 4. System Characteristics
Symbol
Parameter
Conditions
Min Typ Max Units
EN = Low to High, VIN = 4.2V, COUT = 10µF,
IOUT ≤ 1mA
Turn on time (from Enable low to high
transition)
T_ON
210 350
µs
VIN = 3.6V, IOUT = 400mA
Efficiency (L = 3.3µH, DCR ≤ 100mΩ)
η
96
5
%
Ripple voltage, PWM mode1
VIN = 4.2V, IOUT = 10mA to 400mA
VOUT_ripple
mVp-
VIN = 600mV perturbance, over VIN range 3.4V
to 5.5V; TRISE = TFALL = 10µs, VOUT = 3.0V,
IOUT = 100mA
Line transient response
Load transient response
Line_tr
50
50
mVpk
mVpk
VIN = 4.2V, VOUT = 3.0V, transients up to
100mA, TRISE = TFALL = 10µs
Load_tr
1. Ripple voltage should measured at COUT electrode on good layout PC board nd under condition using sugged indtors and capac-
itors.
Note: All limits are guaranteed. The parameters with min and max vare guaranteed with duction tests or SQC (Statistical Quality
Control) methods.
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AS1334
Datasheet - Typical Operating Characteristics
7 Typical Operating Characteristics
Circuit in Figure 23 on page 11, PVIN = VDD = EN = 3.6V, L = 3.3µH (LPS4018-332ML_), CIN = COUT = 10µF (GRM21BR61C106KA01)
unless otherwise noted.
Figure 3. Quiescent Current vs. VIN
Figure 4. Shutdown Current vs. Temperature
0.55
0.3
Vin=3.25V
Vin=3.6V
0.25
Vin=4.2V
Vin=5.5V
0.5
0.45
0.4
0.2
0.15
0.1
0.05
0
- 45°C
+ 25°C
+ 85°C
0.35
2.5
3
3.5
4
4.5
5
5.5
-40
-15
10
5
60
85
SupplyVoltage (V)
Temperature (°C)
Figure 5. Switching Frequency Variation vs. Temperature
re 6. Output Voltage vs. upply Voltage
4
3.06
3
2
3.04
3.02
3
1
0
-1
-2
2.98
Vin=3.6V
Iout=50mA
2.96
=4.2V
Vin5V
Iout=300mA
Iout=650mA
-3
-4
2.94
-40
-15
10
35
0
85
3.25
3.75
4.25
4.75
5.25
Temperatur(°C)
SupplyVoltage (V)
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AS1334
Datasheet - Typical Operating Characteristics
Figure 7. Output Voltage vs. Temperature
Figure 8. Efficiency vs. Output Current
3.06
100
3.04
3.02
3
95
90
85
80
75
70
Vi n=3.25V
Vi n=3.6V
Vi n=3.9V
Vi n=4.2V
Vi n=4.5V
Vi n=5.
2.98
2.96
2.94
Iout=50mA
Iout=300mA
Iout=650mA
-40
-15
10
35
60
85
0
100 200 300 400 500 600 700
Output Curren(mA
Temperature (°C)
Figure 9. Switch Peak Current Limit vs. Temperature; closed loop
Figure 10. LoaTransient Response; VOUT = 3.0V, VIN = 4.2V
1.2
1.15
1.1
1.05
Vin=2.7V
Vin=3.6
Vin=5.
1
-40
-15
10
35
0
85
10µs/Div
Temperature (°C)
Figure 11. Startup; VIN = 3.6V, VOUT = 30V, IOUT<1mA,
RLOAD=3.3kΩ
Figure 12. Startup; VIN = 4.2V, VOUT = 3.0V, IOUT<1mA,
RLOAD=3.3kΩ
50µs/Div
50µs/Div
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AS1334
Datasheet - Typical Operating Characteristics
Figure 13. Shutdown Response; VIN=3.6V, VOUT=3.0V,
RLOAD=5Ω
Figure 14. Shutdown Response; VIN=4.2V, VOUT=3.0V,
RLOAD=5Ω
50µs/Div
50µs/Div
Figure 15. Line Transient Response; VIN=3.3V to 3.9V,
IOUT=100mA, VOUT=3.0V
Figure 16. TimeCurrent Limit Response; VIN=3.6V, VOUT=3.0V
10µs/Div
50µs/Div
Figure 17. Output Voltage Ripple; VOUT 3.0VIOUT = 200mA
Figure 18. VOUT Ripple in Skip Mode; VIN=3.31V, VOUT=3.0V,
RLOAD=5Ω
200ns/Div
1µs/Div
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AS1334
Datasheet - Typical Operating Characteristics
Figure 19. RDSON (P-Channel) vs. Temp.; ISW=200mA
Figure 20. RDSON (N-Channel) vs. Temp.; ISW=-200mA
350
350
300
250
200
150
300
250
200
150
100
100
Vin=2.7V
Vin=2.7V
50
50
Vin=3.6V
Vin=3.6V
Vin=5.5V
Vin=5.5V
0
0
-40
-15
10
35
60
85
-40
-15
10
35
0
85
Temperature (°C)
Temperature (°C)
Figure 21. EN High Threshold vs. VIN
1.2
1.15
1.1
1.05
1
0.95
0.9
- 45°C
+25°
+90
0.85
0.8
2.5
3
3.5
4
4.5
5
5.5
SupplyVoltage (V)
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AS1334
Datasheet - Detailed Description
8 Detailed Description
The AS1334 is a simple, step-down DC-DC converter optimized for powering portable applications that require low dropout voltages such as
mobile phones, portable communicators, and similar battery powered RFID devices. Besides being packed with numerous features like current
overload protection, thermal overload shutdown and soft start, AS1334 displays the following characteristics:
ꢀ
ꢀ
ꢀ
Its operation is based on current-mode buck architecture with synchronous rectification for high efficiency.
Allows the application to operate at maximum efficiency over a wide range of power levels from a single Li-Ion battery cell.
Provides for a maximum load capability of 650mA in PWM mode, wherein the maximum load range may vary depending on input voltage,
output voltage and the selected inductor.
ꢀ
Is ranked at an efficiency of around 96% for a 400mA load with a 3.6V input voltage.
Figure 22. AS1334 - Functional Block Diagram
VIN
POK
VDD
1.13V
–
+
Oscillator
Curt
Sense
FB
Mosfet
Control
Logic
SW
Soft Start
Main ont
EN
Shutdo
Cool
AS1334
SGND
PGND
The size of the external components is reduced by using a high switching frequency (2MHz). Figure 1 on page 1 demonstrates that only three
external power components are required for implementation. Also, the system controller should set EN low during power-up and other low supply
voltage conditions. See Shutdown Mode on page 12.
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AS1334
Datasheet - Detailed Description
Figure 23. Typical Operating System Circuit
3.3 µH
PVIN
SW
FB
VIN
VOUT
2.7V to 5.5V
10 µF
VDD
AS1334
10 µF
EN
System Con-
troller
POK
ON/OFF
ND
PGN
8.1 Operating the AS1334
AS1334’s control block turns on the internal PFP-channel MOSFETswitcduring the first part of each switching cycle, thus allowing current
to flow from the input through the inductor to thoutput filter capacioad. The inductor limits the current to a ramp with a slope of around
(VIN - VOUT) / L, by storing energy in a magnetic field.
During the second part of each cycle, the controller turns the FET witch off, blocking current flow from the input, and then turns the NFET (N-
channel MOSFET) synchronous rectifier on. As a reult, the inductor’s magnetic field collapses, generating a voltage that forces current from
ground through the synchronous rectifier to the output ter capacitor and load.
While the stored energy is transferred back into he cuit and depleted, the inductor current ramps down with a slope around VOUT / L. The
output filter capacitor stores charge when the inducurrent is high, and releases it when low, smoothing the voltage across the load. The
output voltage is regulated by modulating he PFET switch on time to control the average current sent to the load. The effect is identical to
sending a duty-cycle modulated rectangulwae formed by the switch and synchronous rectifier at SW to a low-pass filter formed by the
inductor and output filter capacitor.
The output voltage is equal to e aveage voltage at the SW pin.
While in operation, te outpt voltage is regulated by switching at a constant frequency and then modulating the energy per cycle to control
power to the load. Eney per cycle is set by modulating the PFET switch on-time pulse width to control the peak inductor current. This is done
by comparing the signal frm the current-sense amplifier with a slope compensated error signal from the voltage-feedback error amplifier. At the
beginning of eaccyclethe clock turns on the PFET switch, causing the inductor current to ramp up. When the current sense signal ramps past
the error aier signal, the PWM comparator turns off the PFET switch and turns on the NFET synchronous rectifier, ending the first part of the
cyce.
If an ncrease in load pulls the output down, the error amplifier output increases, which allows the inductor current to ramp higher before the
compartor turns off the PFET. This increases the average current sent to the output and adjusts for the increase in the load. Before appearing
at the PWM comparator, a slope compensation ramp from the oscillator is subtracted from the error signal for stability of the current feedback
loop. The minimum on time of PFET in PWM mode is 50ns (typ).
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AS1334
Datasheet - Detailed Description
8.2 Internal Synchronous Rectifier
To reduce the rectifier forward voltage drop and the associated power loss, the AS1334 uses an internal NFET as a synchronous rectifier. The
big advantage of a synchronous rectification is the higher efficiency in a condition where the output voltage is low compared to the voltage drop
across an ordinary rectifier diode. During the inductor current down slope in the second part of each cycle the synchronous rectifier is turned on.
Before the next cycle the synchronous rectifier is turned off.
There is no need for an external diode because the NFET is conducting through its intrinsic body diode during the transient intervals before it
turns on.
8.3 Power-OK
The POK output indicates if the output voltage is within 90% of the nominal voltage level. As long as the output voltage is within regulation the
open-drain POK output sinks current.
8.4 Shutdown Mode
If EN is set to high (>1.2V) the AS1334 is in normal operation mode. During power-up and when the power supply is less than 2.7V minium
operating voltage, the chip should be turned off by setting EN low. In shutdown mode the following blocks of the AS1334 arturned off, PFET
switch, NFET synchronous rectifier, reference voltage source, control and bias circuitry. The AS1334 is designed for comact prtable
applications, such as mobile phones where the system controller controls operation mode for maximizing battery life ad reqirements for small
package size outweigh the additional size required for inclusion of UVLO (Under Voltage Lock-Out) circuitry.
Note: Setting the EN digital pin low (<0.5V) places the AS1334 in a 0.01µA typ) shuown mode.
8.5 Thermal Overload Protection
To prevent the AS1334 from short-term misuse and overload conditions tchip includes a thermal ovload protection. To block the normal
operation mode the device is turning the PFET and the NFET off in PWM mode as soon as the juncon temperature exceeds 150°C. To resume
normal operation the temperature has to drop below 140°C.
Note: Continuing operation in thermal overload conitios may damage the device d is onsidered bad practice.
8.6 Current Limiting For Protection
If in the PWM mode the cycle-by-cycle current liof 1200mA (max.) is reacd the current limit feature takes place and protects the device and
the external components. A timed current limimode is working woad pulls the output voltage down to approximately 0.375V. In this
timed current limit mode the inductor current is forced to ramp down e value. This is achieved by turning off the internal PFET switch and
delaying the start of the next cycle for 3.5us. The synchronourectifier is also turned off in the timed current limit mode.
The advantage of the timed current limit mode is to prevent the evce from the loss of the current control.
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AS1334
Datasheet - Application Information
9 Application Information
9.1 Inductor Selection
For the external inductor, a 3.3µH inductor is recommended. Minimum inductor size is dependant on the desired efficiency and output current.
Inductors with low core losses and small DCR at 2MHz are recommended.
Table 5. Recommended Inductor
Part Number
L
DCR
Current Rating
2.9A
Dimensions (L/W/T)
3.9x3.9x1.7mm
3.9x3.9x1.7mm
3.9x3.9x1.7mm
Manufacturer
Coilcraft
www.coilcraft.com
LPS4018-222ML_
LPS4018-332ML_
LPS4018-472ML_
2.2µH
3.3µH
4.7µH
0.070Ω
0.080Ω
0.125Ω
2.4A
1.9A
9.2 Capacitor Selection
A 10µF capacitor is recommended for CIN as well as a 10µF for COUT. Small-sized X5R or X7R ceramic capacitors arecomended as they
retain capacitance over wide ranges of voltages and temperatures.
9.2.1 Input and Output Capacitor Selection
Low ESR input capacitors reduce input switching noise and reduce the peak crent dran from the battery. Also low ESR capacitors should be
used to minimize VOUT ripple. Multi-layer ceramic capacitors are recommended nce they have extremely ow ESR and are available in small
footprints.
For input decoupling the ceramic capacitor should be located as close to e device as practical. A 4.7F input capacitor is sufficient for most
applications. Larger values may be used without limitations.
A 2.2µF to 10µF output ceramic capacitor is sufficient for mot appcations. Larger values up t22µF may be used to obtain extremely low out-
put voltage ripple and improve transient response.
Table 6. Recommended Input and Output Capacitr
Part Number
C
TC Code
X5R
Rated Vltage
V
Dimensions (L/W/T)
Manufacturer
Murata
www.murata.com
GRM188R60J475KE19
GRM219R60J475KE19
GRM21BR61C475KA88
GRM31CR71E475KA88
GRM188R60J106ME47
GRM21BR60J106KE19
GRM21BR61A106KE19
GRM32DR71C106KA01
GRM21BR60J226ME39
GRM32ER71A226KE20
4.7µF
4.7µF
4.7µF
4.7µF
10µF
10µF
10µF
10F
µF
22µF
0603
0805
0805
1206
0603
0805
0805
1210
0805
1210
X5R
3V
X5R
16V
X7R
25V
5R
6.3V
X5R
6.3V
X5R
10V
X7R
16V
X5R
6.3V
X7R
10V
9.3 EN Pin Conol
Drive the EN pin sing the system controller to turn the AS1334 ON and OFF. Use a comparator, Schmidt trigger or logic gate to drive the EN pin.
Set EN high (>1.V) fonormal operation and low (<0.5V) for a 0.01µA (typ) shutdown mode. Set EN low to turn off the AS1334 during power-up
and under ge conditions when the power supply is less than the 2.7V minimum operating voltage. The part is out of regulation when the
inut voltais lss than 2.7V.
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AS1334
Datasheet - Application Information
9.4 Layout Considerations
The AS1334 converts higher input voltage to lower output voltage with high efficiency. This is achieved with an inductor based switching
topology. During the first half of the switching cycle, the internal PMOS switch turns on, the input voltage is applied to the inductor, and the
current flows from PVDD line to the output capacitor (C2) through the inductor. During the second half cycle, the PMOS turns off and the internal
NMOS turns on. The inductor current continues to flow via the inductor from the device PGND line to the output capacitor (C2). Referring to
Figure 24, the AS1334 has two major current loops where pulse and ripple current flow. The loop shown in the left hand side is most important,
because pulse current shown in Figure 24 flows in this path. The right hand side is next. The current waveform in this path is triangular, as shown
in Figure 24. Pulse current has many high-frequency components due to fast di/dt. Triangular ripple current also has wide high-frequency
components. Board layout and circuit pattern design of these two loops are the key factors for reducing noise radiation and stable operation.
Other lines, such as from battery to C1(+) and C2(+) to load, are almost DC current, so it is not necessary to take so much care. Only pattern
width (current capability) and DCR drop considerations are needed.
Figure 24. Current Loop
VIN
3.25V to 5.5V
i
fOSC = 2MHz
i
+
-
VDD
C1
PVIN
L1
10 µF
3.3 µH
VOUT
W
EN
FB
C2
+
-
10 µF
SGND
PGND
POK
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Revision 1.09
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AS1334
Datasheet - Package Drawings and Markings
10 Package Drawings and Markings
Figure 25. TDFN(3x3) 8-pin Marking
Table 7. Packaging Code YYWWQZZ
YY
WW
Q
ZZ
manufacturing week
year identifier
plant identifier
free choice / traceabilitcode
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Revision 1.09
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AS1334
Datasheet - Package Drawings and Markings
Figure 26. TDFN(3x3) 8-pin Package
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Revision 1.09
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AS1334
Datasheet - Ordering Information
11 Ordering Information
The device is available as the standard products shown in Table 8.
Table 8. Ordering Information
Ordering Code
Marking
Output
Description
Delivery Form
Package
650mA, Ultra low Ripple Step Down DC/DC
Converter
AS1334-BTDT-12
Tape and Reel
TDFN(3x3) 8-pin
ASR2
1.2V
650mA, Ultra low Ripple Step Down DC/DC
Converter
AS1334-BTDT-15
AS1334-BTDT-18
AS1334-BTDT-25
AS1334-BTDT-30
AS1334-BTDT-33
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape aneel
TDFN(3x3) 8-pin
TDFN(3x3) 8-pin
TDFN(3x38-pi
TDFN(3x3) 8-pin
TDN(3x3) 8-pin
TDFN(3x3) 8-pin
ASR3
ASR4
ASR5
ASQY
ASR6
xxxx
1.5V
1.8V
2.5V
3.0V
3.3V
xxxx
650mA, Ultra low Ripple Step Down DC/DC
Converter
650mA, Ultra low Ripple Step Down DC/DC
Converter
650mA, Ultra low Ripple Step Down DC/DC
Converter
650mA, Ultra low Ripple Step Down DC/DC
Converter
650mA, Ultra low Ripple Step Down DC/DC
Converer
AS1334-BTDT-xx1
1. Non-standard devices are available between 1.2V and 3.4V in 100mV steps. or moe information and iuirecontact http://www.aus-
triamicrosystems.com/contact
Note: All products are RoHS compliant.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystms.cm/ICdirect
Technical Support is found at http://www.austriamicrosystms.com/Technicalport
For further information and requests, please cntact us mailto:sales@austamicrosystems.com
or find your local distributor at http://www.astriamicrosystems.com/disbutor
Design the AS1334 online at http://waustriamicrosystem/analogbench
analogbench is a powerful design and simulation supporat operates in on-line and off-line mode to evaluate performance and
generate application-specific bill-of-materials for ausriamicrosystems' power management devices.
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Revision 1.09
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AS1334
Datasheet
Copyrights
Copyright © 1997-2010, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®.
All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of
the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale.
austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding
the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and pries
any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG fo
current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature rae,
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment ar
specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100
parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location.
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamirosysms AG shall not
be liable to recipient or any third party for any damages, including but not limiteto personal injury, property dam, loss f profits, loss of use,
interruption of business or indirect, special, incidental or consequential damags, of any nd, in connection with or ariing out of the furnishing,
performance or use of the technical data herein. No obligation or liability to recipnt or any third party shall rie oflow out of
austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters
austriamicrosystems AG
Tobelbaderstrasse 30
A-8141 Unterpremstaten, Astria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 313525 1
FSales Oices, Distributors and Representatives, please visit:
http://ww.austriamicrosystems.com/contact
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