PI200MC-A4 [AMI]
200DPI CIS Module; 200DPI CIS模块
| 型号： | PI200MC-A4 |
| 厂家： | 
AMI SEMICONDUCTOR |
| 描述： | 200DPI CIS Module |
| 文件： | 总7页 (文件大小：583K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
™
Peripheral
Imaging
Corporation
PI200MC-A4
200DPI CIS Module
Engineering Data Sheet
Key Features
• Light source, lens, and sensor are integrated into a single module
• 8 dpm resolution, 216 mm scanning length
• 437m sec/line scanning speed @ 4.0MHz clock rate
• Wide dynamic range
• Analog output
• 660 Red LED light source
• Compact size - 20.5 mm x 21.5 mm x 232 mm
• Low power
• Light weight
General Description
The PI200M-A4 is a CIS module. It is a long contact image sensor, using MOS image
sensor technology for high-speed performance and high sensitivity. The PI200M-A4 is
suitable for scanning A4 size (216 mm) documents with 8 dots per millimeter resolution.
Applications include document scanners, mark readers, and other office automation
equipment.
Functional Description
The PI200M-A4 imaging array consists of 27 sensors, PI3020 produced by Peripheral
Imaging Corp. The sensor is a monolithic chip with an array of 64 photo sensing elements,
of which 27 are cascaded to provide 1728 photo-detectors. These cascaded chips are
contiguously aligned in a single row and bonded to PCB. See Figure 1, PI200M-A4's
PAGE 1 OF 7 - PI200M-A4, 01/31/01
Block Diagram. This configuration allows a stream of sequential video pixels to be read
from its output port, i.e., starting from 1st pixel located next to the connector end of the
module and continues to and through the last pixel, 1728th. Each chip contains a
complete control circuitry. Integrated within monolithic chip is a set of multiplex switches,
and a digital shift register to control the chips sequential readout. Additionally, the chips
contain a chip selection switch that is interrogated in a sequence as each predecessor
chip completes its scanning process.
GLED
LED
LED
LED
LED
LED
LED
LED
LED
VLED
ROD LENS
1726
1728
1727
PHOTO SENSORS
VIDEO
LINE
1
2
3
4
5
- - - - - - - - - - - - - - - -
VN(-V)
VDD (+5)
GRD
SHIFT REGISTER
BUFFER
VIDEO AMPLIFIER
VOUT
CP
SP
GRD
Figure 1. PI200M-A4 Block Diagram
Figure 2, PI200M-A4's Cross Section, shows a mechanical cross section of the module's
internal structure. Mounted in the module is number of components. These components
function together to provide the module a complete integrated system. The LED light bar
illuminates the documents through the window and reflection from the imaged documents
is pickup and focused by the one-to-one graded indexed micro lens array.
The lens, through the glass window, focuses the scanned images from the document onto
the sensing plane of the sensor chips, which is mounted on the PCB. During the imaging
process, the document is passed across the glass window's surface.
The PCB board not only has the sensor chips mounted on it, but it has an on-board
amplifier, a clock buffer for both the Start Pulse, SP, and the module's master clock, CP,
buffer. This amplifier processes the pixel charges from the image sensor chips and
converts them into voltage signal to produce a sequential stream of video at the output pin
of the PI200M-A4 module.
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All these discussed components are housed in a small plastic housing which has a cover
glass, the window. This housing with its sealed windows protects the imaging array, the
micro lens assembly, and the LED light source from dust.
DOCUMENT SURFACE
GLASS WINDOW
LIGHT PATH
SENSORS
PCB
INSIDE PICTORIAL OF MODULE
Figure 2. PI200M-A4 Cross Section
Pin Out Description
There is one connector located at the end of the module. The outline of the module in
Figure 4 of the mechanical section illustrates the connector location. With the module
window facing down on flat surface, with the viewer looking down on backside of the
module, and with the connector's pins facing viewer, the connectors is located on the left
hand end of the module. The connector is a 2.0mm dual 8-pin rows with a total of 16 pin
connector, part # Berg 88054-X16. Its I/O designation is provided in Table 1. I/O
Designation. Pin number 1 location is indicated on the module outline. All of the odd pins
are on the bottom row with pin number one on the edge closest to end of module. All of
even pins are on the top row with pin 2 located adjacent to the pin 1.
Pin Number
1, 2 , 4 & 8
3
5 & 6
7
Symbol
Gnd
Vout
Vdd (+5V)
SP
Names and Functions
Ground; 0V
Analog Video Output
Positive power supply
Start Clock Pulse
9 &10
Vn (-5V to –12V)
CP
GLED
Negative power supply
Sampling clock pulse
Ground for the light source; 0V
Supply for the light source
11 & 12
13 & 14
15 & 16
VLED
Table 1. I/O Designation
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Absolute Maximum Rating:
Parameter
Power supply voltage
Symbols
Vdd
Idd
Vn
In
Maximum Rating
7.0
70
-15
20
5.75
600
Vdd
-0.5
Units
V
mA
V
mA
V
mA
V
VLED
ILED
Input clock pulse (high level) Vih
Input clock pulse (low level) Vil
V
Table 2. Absolute Maximum Rating
Note, these are the absolute maximums and are not to be used in prolonged operation.
Operating Environment
Operating temperature
Operating humidity
Storage temperature
Storage humidity
Top
Hop
Tstg
Hstg
0 to 50
0C
%
10 to 85
-25 to+85
5 to 95
0C
%
Table 3. Operating Environment
Electro-Optical Characteristics (25° C)
Parameter
Symbol
Parameter
1728
125
Units
elements
mm
Note
Number of photo detectors
Pixel to pixel spacing
Line scanning rate(1)
Tint
437
@ 4MHz
clock
msec
frequency
Clock frequency(2)
Bright output voltage
Bright output(4)
Fclk
Up
4.0
1.0
<+/-30
MHz
Volts
%
nonuniformity
Adjacent pixel(5)
nonuniformity
Upadj
<25
%
Dark nonuniformity(6)
Dark output voltage(6)
Modulation transfer
function(7)
Ud
Vd
MTF
<50
<75
>30
mV
mV
%
Table 4. Electro-optical characteristics at 25° C.
PAGE 4 OF 7 - PI200M-A4, 01/31/01
Definition:
(1) Tint is the line scanning rate or integration time. Tint is determined by the interval
between two start pulses (SP).
(2) Fclk is the main clock, CP, frequency.
(3) Vpavg = å Vp(n)/1728
(4) Up = [(Vpmax - Vp) / Vp] x 100% or [(Vp - Vpmin) / Vp] x 100%
(5) Upadj = MAX[ | (Vp(n) - Vp(n+l) | / Vp(n)] x 100%
Upadj is the nonuniformity percentage pixel to pixel
(6) Ud = Vdmax -Vdmin
Vdmin is the minimum dark output voltage, Vd, with light source off.
Vdmax: maximum dark output voltage, Vd, with light source off.
Vd is measured between the reset level of the video and the dark video signal level. This
fixed offset occurs because of the video line is reset to ground after each pixel and before
the following pixel. However, because the video signal is amplified and the offset is
adjusted to force the average dark video signal near ground, the average dark video
signal is only few millivolts from ground and reset level will be below ground.
(7) MTF = [(Vpmax - Vpmin) / (Vpmax + Vpmin)] x 100 [%] is the effective algorithm which
is used to make the measurements.
V(p)max: maximum output voltage at 4.0 lp/mm
V(p)min: minimum output voltage at 4.0 lp/mm
(8) lp / mm: line pair per mm
Recommended Operating Conditions (25 °C)
Item
Power Supply
Symbol
Vdd
Vn.
VLED
Idd
Ivn
ILED
Vih
Min
4.5
-4.5
4.5
42
5.0
300
Vdd-1.0
0
Mean
5.0
-5
5
50
Max
5.5
-12
5.5
55
6.0
550
Vdd
0.8
5.0
Units
V
V
V
ma
ma
ma
V
V
MHz
%
ns
ms
0C
450
Vdd-.5
Input voltage at digital high
Input voltage at digital low
Clock frequency
Clock pulse high duty cycle
Clock pulse high duration
Integration time
Vil
Fclk
Dclk
CPH
Tint
4.0
25
25
50(3)
0.347
5.0
50
Operating temperature
Top
Table 5. Recommended Operating Conditions (25 °C)
PAGE 5 OF 7 - PI200M-A4, 01/31/01
Switching Characteristics (25°C)
to
tw
CP
tprh
tdh
SP
tds
tdl
Vout
tsh
MODULE TIMING DIAGRAM
Figure 3. PI200M-A4 Timing Diagram
Each switch timing characteristics for the I/O clocks are defined in symbolic acronyms.
There is a corresponding clock's switching times for each symbol on the timing diagram.
These corresponding times for each symbol is given in the following Table 6.
Item
Symbol
to
tw
Min.
0.20
50
25
15
Mean
Max.
2.0
Units
m s
ns
%
Clock cycle time
Clock pulse width
Clock duty cycle
Prohibit crossing time tprh
of Start Pulse
75
ns
Data setup time
Data hold time
Signal delay time
Signal settling time
tds
tdh
tdl
10
35
20
90
ns
ns
ns
ns
tsh
Table 6. Symbol Definitions for the Above Timing Diagram
PAGE 6 OF 7 PI200M-A4, 01/31/01
Mechanical Description
Figure 4 is an overview drawing of the module with approximate dimensions. If a detailed
drawing is desired, especially for a design in application, a full size drawing is available
upon request.
END VIEW
ø1.65± HOLE
21.5
SIDE
TAPE
1X1-M2 TAPSIZE USE (DP6)
7.1±0.2
THE SURFACE
15.5±0.2
OF THE GLASS
ø2.2±0.05 HOLE
16.2±0.2
2X2-M2.6 TAPSIZE USE (DP6)
1.25
ALL DIMENSIONS IN MM UNLESS SPECIFIED
Figure 4. PI200M-A4 Module Outline
Printed in USA. All rights reserved. Specifications
©2001 AMI Semiconductor.
are subject to change without notice. Contents may not be reproduced in whole or in part without
the express prior written permission of AMIS. Information furnished herein is believed to be
accurate and reliable. However, no responsibility is assumed by AMIS for its use nor for any
infringement of patents or other rights granted by implication or otherwise under any patent
or patent rights of AMIS.
PAGE 7 OF 7 - PI200M-A4, 01/31/01
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