A62S6308X-10SI [AMICC]
64K X 8 BIT LOW VOLTAGE CMOS SRAM; 64K ×8位的低电压CMOS SRAM
| 型号： | A62S6308X-10SI |
| 厂家： | 
AMIC TECHNOLOGY |
| 描述： | 64K X 8 BIT LOW VOLTAGE CMOS SRAM |
| 文件： | 总17页 (文件大小：181K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
A62S6308 Series
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Document Title
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Revision History
Rev. No. History
Issue Date
Remark
1.0
Initial issue
September 01, 1997 Preliminary
1.1
Modify TSOP (TSSOP) pin configuration.
Modify SOP 32L, TSOP 32L and TSSOP 32L type
packages outline dimensions.
January 16, 1998
1.2
Change TSSOP 32L type package to sTSOP 32L.
Modify sTSOP 32L type package LE symbol dimensions.
Modify 32-pin TSOP package L symbol dimensions.
June 16, 1998
June 22, 1998
1.3
2.0
October 9, 1998
Final
Finalize ¾
Add 36-ball Mini BGA (6X8) package
(October, 1998, Version 2.0)
AMIC Technology, Inc.
A62S6308 Series
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Features
n Power supply range: 2.7V to 3.6V
n Access times:70/100 ns (max.)
n Current:
n All inputs and outputs are directly TTL-compatible
n Common I/O using three-state output
n Output enable and two chip enable inputs for easy
application
A62S6308-S series:
Operating: 40mA (max.)
n Data retention voltage: 2V (min.)
n Available in 32-pin SOP, TSOP, sTSOP (8
Standby: 15mA (max.)
*Operating:40mA (max.)
*Standby: 30mA (max.)
X
A62S6308-SI series:
13.4mm) forward type and 36-ball Mini BGA (6X8)
packages
n Extended operating temperature range:-25°C to 85°C
n Full static operation, no clock or refreshing required
General Description
The A62S6308 is a low operating current 524,288-bit
static random access memory organized as 65,536
words by 8 bits and operates on a low power supply
voltage from 2.7V to 3.6V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Two chip enable inputs are provided for POWER-DOWN
and a device enable and an output enable input are
included for easy interfacing.
Data retention is guaranteed at a power supply voltage
as low as 2V.
Pin Configurations
n SOP
n TSOP/(sTSOP)
(forward type)
n Mini BGA (6X8) Top View
NC
1
VCC
A15
CE2
32
31
30
1
2
3
4
5
6
NC
A14
A12
A7
2
3
A11
A9
A8
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A
B
C
D
A0
A1 CE2 A3
A6
A8
A10
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
WE
A13
A8
4
29
28
27
I/O4 A2
I/O5
A4
A7 I/O0
I/O1
WE
A13
WE
CE2
A15
VCC
NC
NC
A14
A12
A7
5
6
A6
NC A5
A5
A4
A3
A2
A9
7
26
A62S6308V
(A62S6308X)
VSS
VCC
8
A11
OE
A10
25
24
23
22
9
10
11
12
13
14
15
16
9
E VCC
VSS
1
I/O
10
11
12
13
14
15
16
0
I/O
F
G
H
I/O6
I/O7
NC NC
I/O2
A0
A1
A2
A3
CE1
A1
A0
A6
A5
A4
I/O7
21
20
19
18
17
NC A15 I/O3
OE
CE1
I/O0
I/O1
I/O6
I/O5
I/O4
I/O3
A9 A10 A11 A12 A13 A14
I/O2
GND
(October, 1998, Version 2.0)
1
AMIC Technology, Inc.
A62S6308 Series
Block Diagram
A0
VCC
GND
ROW
512 X 1024
A13
A14
A15
DECODER
MEMORY ARRAY
I/O1
COLUMN I/O
INPUT DATA
CIRCUIT
I/O8
CE2
CE1
OE
CONTROL
CIRCUIT
WE
Pin Descriptions - SOP
Pin Description - TSOP/sTSOP
Pin No.
Symbol
Description
Pin No.
Symbol
Description
1,2
NC
No Connection
1 - 4, 7,
11 - 20, 31
A0 - A15
Address Inputs
Write Enable
3 - 12, 23,
25 - 28, 31
A0 - A15
Address Inputs
5
WE
CE2
VCC
NC
13 - 15,
17 - 21
6
8
Chip Enable
I/O1 - I/O8
Data Inputs/Outputs
Power Supply
No Connection
16
22
GND
CE1
OE
Ground
9, 10
Chip Enable
21 - 23,
25 - 29
I/O1 - I/O8
Data Inputs/Outputs
24
29
Output Enable
Write Enable
24
30
GND
CE1
OE
Ground
WE
CE2
VCC
Chip Enable
30
32
Chip Enable
32
Output Enable
Power Supply
(October, 1998, Version 2.0)
2
AMIC Technology, Inc.
A62S6308 Series
Recommended DC Operating Conditions
(TA = 0°C to + 70°C, -25°C to 85°C)
Symbol
VCC
GND
VIH
Parameter
Supply Voltage
Min.
2.7
0
Typ.
Max.
Unit
V
3.0
3.6
Ground
0
-
0
V
Input High Voltage
Input Low Voltage
Output Load
2.0
-0.3
-
VCC + 0.3
V
VIL
-
+0.6
30
1
V
CL
-
pF
-
TTL
Output Load
-
-
Absolute Maximum Ratings*
*Comments
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . -25°C to + 85°C
Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C
Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V, GND = 0V)
A62S6308-70S/10S
A62S6308-70SI/10SI
Symbol
Parameter
Unit
Conditions
Min.
Max.
Min.
Max.
Input Leakage
Current
-
1
-
1
VIN = GND to VCC
çILIú
çILOú
ICC
mA
mA
CE1 = VIH or CE2 = VIL or
Output Leakage
Current
-
-
-
1
3
-
-
-
1
3
OE = VIH or WE = VIL
VI/O = GND to VCC
Active Power
Supply Current
CE1 = VIL, CE2 = VIH
II/O = 0mA
mA
mA
Min. Cycle, Duty = 100%
ICC1
40
40
CE1 = VIL, CE2 = VIH
II/O = 0mA
Dynamic Operating
Current
CE1 = VIL, CE2 = VIH
VIH = VCC, VIL = 0V
f = 1MHZ, II/O = 0mA
ICC2
-
5
-
5
mA
(October, 1998, Version 2.0)
3
AMIC Technology, Inc.
A62S6308 Series
DC Electrical Characteristics (continued)
A62S6308-70S/10S
A62S6308-70SI/10SI
Symbol
Parameter
Unit
Conditions
Min.
Max.
Min.
Max.
CE1 = VIH or
CE2 = VIL
ISB
-
0.5
-
0.5
mA
³ VCC - 0.2V
CE2 ³ VCC - 0.2V
VIN ³ 0V
CE1
Standby Power
Supply Current
ISB1
ISB2
-
-
15
15
-
-
30
30
mA
mA
CE2 £ 0.2V
VIN ³ 0V
VOL
VOH
Output Low Voltage
Output High Voltage
-
0.4
-
-
0.4
-
V
V
IOL = 2.1mA
IOH = -1.0mA
2.4
2.4
Truth Table
Mode
CE2
X
I/O Operation
High Z
High Z
High Z
DOUT
Supply Current
ISB, ISB1
CE1
H
OE
X
WE
X
Standby
X
L
X
X
ISB, ISB2
Output Disable
Read
L
L
L
H
H
L
H
ICC, ICC1, ICC2
ICC, ICC1, ICC2
ICC, ICC1, ICC2
H
H
Write
H
X
L
DIN
Note: X = H or L
Capacitance (TA = 25°C, f = 1.0MHz)
Symbol
CIN*
Parameter
Min.
Max.
Unit
pF
Conditions
VIN = 0V
Input Capacitance
6
8
CI/O*
Input/Output Capacitance
pF
VI/O = 0V
* These parameters are sampled and not 100% tested.
(October, 1998, Version 2.0)
4
AMIC Technology, Inc.
A62S6308 Series
AC Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V)
A62S6308-70S/SI
A62S6308-10S/SI
Symbol
Parameter
Unit
Min.
Max.
Min.
Max.
Read Cycle
tRC
Read Cycle Time
70
-
-
100
-
ns
ns
ns
tAA
Address Access Time
70
70
-
-
100
100
tACE1
-
CE1
CE2
Chip Enable Access Time
tACE2
tOE
-
-
70
35
-
-
-
100
50
-
ns
ns
ns
Output Enable to Output Valid
Chip Enable to Output in Low Z
tCLZ1
10
10
CE1
CE2
tCLZ2
tOLZ
10
5
-
-
10
5
-
-
ns
ns
ns
Output Enable to Output in Low Z
Chip Disable to Output in High Z
tCHZ1
0
25
0
35
CE1
CE2
tCHZ2
tOHZ
tOH
0
0
25
25
-
0
0
35
35
-
ns
ns
ns
Output Disable to Output in High Z
Output Hold from Address Change
10
10
Read Cycle
tWC
Write Cycle Time
70
60
0
-
-
100
80
0
-
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tCW
Chip Enable to End of Write
Address Setup Time
tAS
-
-
tAW
Address Valid to End of Write
Write Pulse Width
60
50
0
-
80
60
0
-
tWP
-
-
tWR
Write Recovery Time
-
-
tWHZ
tDW
Write to Output in High Z
Data to Write Time Overlap
Data Hold from Write Time
Output Active from End of Write
0
25
-
0
35
-
30
0
40
0
tDH
-
-
tOW
5
-
5
-
Notes: tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
(October, 1998, Version 2.0)
5
AMIC Technology, Inc.
A62S6308 Series
Timing Waveforms
Read Cycle 1(1, 2, 4)
tRC
Address
tAA
tOH
tOH
DOUT
Read Cycle 2 (1, 3, 4, 6)
CE1
tACE1
5
tCLZ1
5
tCHZ1
DOUT
Read Cycle 3 (1, 4, 7 ,8)
CE2
tACE2
5
tCHZ2
5
tCLZ2
DOUT
(October, 1998, Version 2.0)
6
AMIC Technology, Inc.
A62S6308 Series
Timing Waveforms (continued)
Read Cycle 4 (1)
tRC
Address
tAA
OE
tOE
tOH
5
tOLZ
CE1
tACE1
5
5
tCHZ1
tCLZ1
CE2
5
tACE2
tOHZ
5
tCHZ2
5
tCLZ2
DOUT
Notes: 1. WE is high for Read Cycle.
2. Device is continuously enabled CE1 = VIL and CE2 = VIH.
3. Address valid prior to or coincident with CE1 transition low.
4. OE = VIL.
5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
6. CE2 is high.
7. CE1 is low.
8. Address valid prior to or coincident with CE2 transition high.
(October, 1998, Version 2.0)
7
AMIC Technology, Inc.
A62S6308 Series
Timing Waveforms (continued)
Write Cycle 1(6)
(Write Enable Controlled)
tWC
Address
3
tAW
tWR
5
tCW
(4)
(4)
CE1
CE2
1
2
tAS
tWP
WE
tDW
tDH
DIN
tWHZ
tOW
DOUT
(October, 1998, Version 2.0)
8
AMIC Technology, Inc.
A62S6308 Series
Timing Waveforms (continued)
Write Cycle 2
(Chip Enable Controlled)
tWC
Address
3
tAW
tWR
5
tCW
CE1
CE2
(4)
(4)
1
tAS
5
tCW
2
tWP
WE
tDW
tDH
DIN
7
tWHZ
DOUT
Notes: 1. tAS is measured from the address valid to the beginning of Write.
2. A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low WE .
3. tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.
4. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.
5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.
6. OE is continuously low. ( OE = VIL)
7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
(October, 1998, Version 2.0)
9
AMIC Technology, Inc.
A62S6308 Series
AC Test Conditions
Input Pulse Levels
0.4V to 2.4V
5 ns
Input Rise and Fall Time
Input and Output Timing Reference Levels
Output Load
1.5V
See Figures 1 and 2
TTL
TTL
CL
CL
30pF
5pF
* Including scope and jig.
* Including scope and jig.
Figure 1. Output Load
Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW
Data Retention Characteristics (TA = 0°C to + 70°C or -25°C to 85°C)
Symbol
Parameter
Min.
Max.
Unit
Conditions
VDR1
2.0
3.6
V
CE1 ³ VCC - 0.2V
VCC for Data Retention
CE2 £ 0.2V
VDR2
2.0
3.6
V
CE1 ³ VCC - 0.2V or
CE1 £ 0.2V
S-Version
SI-Version
S-Version
SI-Version
-
-
-
-
10*
20**
10*
VCC = 2.0V
ICCDR1
mA
CE1 ³ VCC - 0.2V
CE2 ³ VCC - 0.2V
VIN ³ 0V
Data Retention Current
VCC = 2.0V
CE2 £ 0.2V
ICCDR2
mA
VIN ³ 0V
20**
tCDR
tR
Chip Disable to Data Retention Time
Operation Recovery Time
0
-
-
ns
ns
tRC
See Retention Waveform
VCC Rise Time from Data Retention Voltage
to Operating Voltage
tVR
5
-
ms
** A62S6308-70S/10S
A62S6308-70SI/10SI
ICCDR: Max. 3mA at TA = 0°C + 40°C
ICCDR: Max. 3mA at TA = 0°C + 40°C
*
(October, 1998, Version 2.0)
10
AMIC Technology, Inc.
A62S6308 Series
Low VCC Data Retention Waveform (1) ( CE1 Controlled)
DATA RETENTION MODE
VCC
CE1
2.7V
2.7V
tCDR
tR
VDR
³ 2V
tVR
VIH
VIH
CE1
³ VDR - 0.2V
Low VCC Data Retention Waveform (2) (CE2 Controlled)
DATA RETENTION MODE
VCC
CE2
2.7V
2.7V
tCDR
tR
VDR
³ 2V
tVR
VIL
VIL
CE2 < 0.2V
(October, 1998, Version 2.0)
11
AMIC Technology, Inc.
A62S6308 Series
Ordering Information
Part No.
Access Time (ns)
Operating Current
Max. (mA)
Standby Current
Package
Max. (mA)
A62S6308M-70S
A62S6308M-70SI
A62S6308V-70S
A62S6308V-70SI
A62S6308X-70S
A62S6308X-70SI
A62S6308G-70S
A62S6308G-70SI
A62S6308M-10S
A62S6308M-10SI
A62S6308V-10S
A62S6308V-10SI
A62S6308X-10S
A62S6308X-10SI
A62S6308G-10S
A62S6308G-10SI
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
15
30
15
30
15
30
15
30
15
30
15
30
15
30
15
30
32L SOP
32L SOP
32L TSOP
32L TSOP
32L sTSOP
32L sTSOP
36B Mini BGA
36B Mini BGA
32L SOP
70
32L SOP
32L TSOP
32L TSOP
32L sTSOP
32L sTSOP
36B Mini BGA
36B Mini BGA
100
(October, 1998, Version 2.0)
12
AMIC Technology, Inc.
A62S6308 Series
Package Information
SOP (W.B.) 32L Outline Dimensions
unit: inches/mm
32
17
q
L
16
1
b
Detail F
D
LE
e
S
y
See Detail F
Seating Plane
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
-
Max
0.118
-
Min
Nom
-
Max
A
A1
A2
b
-
-
3.00
-
0.004
0.101
0.014
0.006
-
-
0.10
2.57
0.36
0.15
-
-
0.106
0.016
0.008
0.805
0.445
0.050
0.556
0.031
0.055
-
0.111
0.020
0.012
0.817
0.450
0.056
0.566
0.039
0.063
0.036
0.004
10°
2.69
0.41
0.20
20.45
11.30
1.27
14.12
0.79
1.40
-
2.82
0.51
0.31
20.75
11.43
1.42
14.38
0.99
1.60
0.91
0.10
10°
c
D
E
0.440
0.044
0.546
0.023
0.047
-
11.18
1.12
13.87
0.58
1.19
-
e
HE
L
LE
S
y
-
-
-
-
0°
-
0°
-
q
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
(October, 1998, Version 2.0)
13
AMIC Technology, Inc.
A62S6308 Series
Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions
unit: inches/mm
D
q
L
LE
HD
Detail "A"
Detail "A"
y
S
b
Dimensions in inches
Dimensions in mm
Symbol
Min
-
Nom
Max
Min
Nom
Max
A
A1
A2
b
-
0.047
0.006
0.041
0.011
0.008
0.728
0.319
-
-
1.20
0.15
1.05
0.27
0.20
18.50
8.10
0.002
0.037
0.007
0.004
0.720
-
-
0.039
0.009
-
0.05
0.95
0.18
0.11
18.30
-
-
1.00
0.22
-
c
D
E
0.724
0.315
0.020 BSC
0.787
0.020
0.032
-
18.40
8.00
0.50 BSC
20.00
0.50
0.80
-
e
HD
L
0.779
0.795
0.024
-
19.80
20.20
0.60
-
0.016
0.40
LE
S
-
-
-
-
0.020
0.003
5°
0.50
0.08
5°
y
-
-
-
-
-
-
q
0°
0°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
(October, 1998, Version 2.0)
14
AMIC Technology, Inc.
A62S6308 Series
Package Information
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions
unit: inches/mm
q
L
LE
D1
D
Detail "A"
Detail "A"
0.076MM
S
b
SEATING PLANE
Dimensions in inches
Dimensions in mm
Symbol
Min
-
Nom
-
Max
0.049
-
Min
Nom
-
Max
-
A
A1
A2
b
1.25
-
-
-
0.002
0.037
0.007
0.05
0.95
0.17
0.039
0.008
0.041
0.009
1.00
1.05
0.23
0.158
8.10
0.20
c
0.0056 0.0059 0.0062 0.142
0.150
8.00
E
0.311
0.315
0.020 TYP
0.528
0.319
7.90
e
0.50 TYP
13.40
11.80
0.50
D
D1
L
0.520
0.461
0.012
0.535
0.469
0.028
13.20
11.70
0.30
13.60
11.90
0.70
0.465
0.020
LE
S
0.0275 0.0315 0.0355 0.700
0.0109 TYP
0.800
0.278 TYP
3°
0.900
q
0°
3°
5°
0°
5°
Notes:
1. The maximum value of dimension D1 includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
(October, 1998, Version 2.0)
15
AMIC Technology, Inc.
A62S6308 Series
Package Information
Mini BGA 6X8 (36 BALLS) Outline Dimensions
unit : millimeter(mm)
Bottom View
Pin A1 Index
Top View
Pin A1 Index
6
5
4
3 2 1
A
B
C
D
E
F
G
H
A
B
Diameter D
Solder Ball
B1
D
Symbol
Min
Typ
0.75
6.00
3.75
8.00
5.25
0.35
1.10
0.36
0.22
Max
A
B
-
-
5.90
6.10
B1
C
-
-
7.90
8.10
C1
D
-
0.30
1.00
-
-
0.40
1.20
-
E
E1
E2
-
-
(October, 1998, Version 2.0)
16
AMIC Technology, Inc.
相关型号：
©2020 ICPDF网 联系我们和版权申明