A1101_12 [ALLEGRO]

The Allegro A1101-A1104 and A1106 Hall-effect switches are next generation replacements for the popular Allegro 312x and 314x lines of unipolar switches.; 快板A1101 - A1104和A1106霍尔效应开关是新一代替代单极开关的受欢迎的Allegro 312x和314x系列。
A1101_12
型号: A1101_12
厂家: ALLEGRO MICROSYSTEMS    ALLEGRO MICROSYSTEMS
描述:

The Allegro A1101-A1104 and A1106 Hall-effect switches are next generation replacements for the popular Allegro 312x and 314x lines of unipolar switches.
快板A1101 - A1104和A1106霍尔效应开关是新一代替代单极开关的受欢迎的Allegro 312x和314x系列。

开关
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A1101, A1102, A1103, A1104, and A1106  
Continuous-Time Switch Family  
Features and Benefits  
Continuous-time operation  
Fast power-on time  
Description  
The Allegro® A1101-A1104 and A1106 Hall-effect switches  
are next generation replacements for the popular Allegro  
312x and 314x lines of unipolar switches. The A110x family,  
Low noise  
Stable operation over full operating temperature range  
Reverse battery protection  
Solid-state reliability  
Factory-programmed at end-of-line for optimum  
performance  
Robust EMC performance  
produced with BiCMOS technology, consists of devices that  
feature fast power-on time and low-noise operation. Device  
programmingisperformedafterpackaging,toensureincreased  
switchpointaccuracybyeliminatingoffsetsthatcanbeinduced  
by package stress. Unique Hall element geometries and low-  
offset amplifiers help to minimize noise and to reduce the  
residualoffsetvoltagenormallycausedbydeviceovermolding,  
temperature excursions, and thermal stress.  
High ESD rating  
Regulator stability without a bypass capacitor  
The A1101-A1104 and A1106 Hall-effect switches include  
the following on a single silicon chip: voltage regulator,  
Hall-voltage generator, small-signal amplifier, Schmitt  
trigger, and NMOS output transistor. The integrated voltage  
regulator permits operation from 3.8 to 24 V. The extensive  
on-board protection circuitry makes possible a ±30 V absolute  
maximum voltage rating for superior protection in automotive  
andindustrialmotorcommutationapplications,withoutadding  
Packages: 3-pin SOT23W (suffix LH), and  
3-pin SIP (suffix UA)  
LH: A1101, A1102, A1103,  
A1104, and A1106  
Continued on the next page…  
UA: A1101, A1102,  
A1103, and A1104  
Not to scale  
UA: A1106  
Functional Block Diagram  
VCC  
Regulator  
To all subcircuits  
VOUT  
Amp  
Gain  
Offset  
Trim  
Control  
GND  
A1101-DS, Rev. 14  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
Description (continued)  
external components.All devices in the family are identical except  
provide magnetically optimized solutions for most applications.  
Package LH is an SOT23W, a miniature low-profile surface-mount  
package,whilepackageUAisathree-leadultraminiSIPforthrough-  
hole mounting. Each package is lead (Pb) free, with 100% matte  
tin plated leadframes.  
for magnetic switchpoint levels.  
The small geometries of the BiCMOS process allow these devices  
to be provided in ultrasmall packages. The package styles available  
Selection Guide  
Part Number  
A1101ELHLT-T  
A1101EUA-T  
A1101LLHLT-T  
A1101LUA-T  
A1102ELHLT-T  
A1102EUA-T  
A1102LLHLT-T  
A1102LUA-T  
A1103ELHLT-T  
A1103LLHLT-T  
A1103LUA-T  
A1104EUA-T  
A1104LLHLT-T  
A1104LUA-T  
A1106EUA-T  
A1106LLHLT-T  
A1106LUA-T  
Packing*  
Mounting  
Ambient, TA  
BRP (Min)  
BOP (Max)  
7-in. reel, 3000 pieces/reel  
Bulk, 500 pieces/bag  
3-pin SOT23W surface mount  
3-pin SIP through hole  
–40ºC to 85ºC  
10  
175  
7-in. reel, 3000 pieces/reel  
Bulk, 500 pieces/bag  
3-pin SOT23W surface mount  
3-pin SIP through hole  
–40ºC to 150ºC  
–40ºC to 85ºC  
7-in. reel, 3000 pieces/reel  
Bulk, 500 pieces/bag  
3-pin SOT23W surface mount  
3-pin SIP through hole  
60  
245  
7-in. reel, 3000 pieces/reel  
Bulk, 500 pieces/bag  
3-pin SOT23W surface mount  
3-pin SIP through hole  
–40ºC to 150ºC  
–40ºC to 85ºC  
–40ºC to 150ºC  
–40ºC to 85ºC  
–40ºC to 150ºC  
–40ºC to 85ºC  
–40ºC to 150ºC  
7-in. reel, 3000 pieces/reel  
7-in. reel, 3000 pieces/reel  
Bulk, 500 pieces/bag  
3-pin SOT23W surface mount  
3-pin SOT23W surface mount  
3-pin SIP through hole  
150  
25  
355  
450  
430  
Bulk, 500 pieces/bag  
3-pin SIP through hole  
7-in. reel, 3000 pieces/reel  
Bulk, 500 pieces/bag  
3-pin SOT23W surface mount  
3-pin SIP through hole  
Bulk, 500 pieces/bag  
3-pin SIP through hole  
7-in. reel, 3000 pieces/reel  
Bulk, 500 pieces/bag  
3-pin SOT23W surface mount  
3-pin SIP through hole  
160  
*Contact Allegro for additional packing options.  
Absolute Maximum Ratings  
Characteristic  
Symbol  
Notes  
Rating  
Units  
V
Supply Voltage  
VCC  
VRCC  
VOUT  
VROUT  
IOUTSINK  
B
30  
–30  
Reverse Supply Voltage  
Output Off Voltage  
V
30  
V
Reverse Output Voltage  
Output Current  
–0.5  
V
25  
mA  
G
Magnetic Flux Density  
Unlimited  
–40 to 85  
–40 to 150  
165  
Range E  
Range L  
ºC  
ºC  
ºC  
ºC  
Operating Ambient Temperature  
TA  
Maximum Junction Temperature  
Storage Temperature  
TJ(max)  
Tstg  
–65 to 170  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
2
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
ELECTRICAL OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges, unless otherwise noted  
Characteristic  
Supply Voltage1  
Symbol  
VCC  
Test Conditions  
Operating, TJ < 165°C  
Min.  
3.8  
Typ.  
Max. Units  
24  
10  
V
Output Leakage Current  
Output On Voltage  
IOUTOFF  
VOUT(SAT)  
VOUT = 24 V, B < BRP  
IOUT = 20 mA, B > BOP  
μA  
mV  
215  
400  
Slew rate (dVCC/dt) < 2.5 V/s, B > BOP + 5 G or  
B < BRP – 5 G  
Power-On Time2  
tPO  
4
μs  
Output Rise Time3  
Output Fall Time3  
tr  
VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF  
400  
400  
7.5  
ns  
ns  
tf  
VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF  
ICCON  
ICCOFF  
IRCC  
B > BOP  
4.1  
3.8  
mA  
mA  
mA  
Supply Current  
B < BRP  
7.5  
Reverse Battery Current  
Supply Zener Clamp Voltage  
Supply Zener Current4  
VRCC = –30 V  
–10  
VZ  
ICC = 10.5 mA; TA = 25°C  
32  
V
IZ  
VZ = 32 V; TA = 25°C  
10.5  
mA  
1 Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.  
2 For VCC slew rates greater than 250 V/s, and TA = 150°C, the Power-On Time can reach its maximum value.  
3 CS =oscilloscope probe capacitance.  
4 Maximum current limit is equal to the maximum ICC(max) + 3 mA.  
DEVICE QUALIFICATION PROGRAM  
Contact Allegro for information.  
EMC (Electromagnetic Compatibility) REQUIREMENTS  
Contact Allegro for information.  
Package LH  
Package UA, 3-pin SIP  
3
2
1
3
1
2
Terminal List  
Number  
Package LH Package UA  
Name  
Description  
VCC  
VOUT  
GND  
Connects power supply to chip  
Output from circuit  
Ground  
1
2
3
1
3
2
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
3
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
MAGNETIC OPERATING CHARACTERISTICS1 over full operating voltage and ambient temperature ranges, unless otherwise noted  
Characteristic  
Symbol  
Test Conditions  
TA = 25°C  
Min.  
50  
Typ.  
100  
100  
180  
180  
280  
280  
Max. Units  
160  
175  
230  
245  
340  
355  
350  
450  
400  
430  
130  
145  
175  
190  
285  
300  
330  
430  
300  
330  
80  
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
A1101  
A1102  
A1103  
A1104  
A1106  
A1101  
A1102  
A1103  
A1104  
A1106  
A1101  
A1102  
A1103  
A1104  
A1106  
Operating Temperature Range  
TA = 25°C  
30  
130  
115  
220  
205  
70  
Operating Temperature Range  
TA = 25°C  
Operate Point  
BOP  
Operating Temperature Range  
TA = 25°C  
Operating Temperature Range  
TA = 25°C  
35  
280  
260  
10  
340  
340  
45  
Operating Temperature Range  
TA = 25°C  
Operating Temperature Range  
TA = 25°C  
10  
45  
75  
125  
125  
225  
225  
Operating Temperature Range  
TA = 25°C  
60  
165  
150  
50  
Release Point  
BRP  
Operating Temperature Range  
TA = 25°C  
Operating Temperature Range  
TA = 25°C  
25  
180  
160  
20  
240  
240  
55  
Operating Temperature Range  
TA = 25°C  
Operating Temperature Range  
TA = 25°C  
20  
55  
80  
30  
55  
80  
Operating Temperature Range  
TA = 25°C  
30  
55  
80  
30  
55  
80  
Hysteresis  
BHYS  
Operating Temperature Range  
TA = 25°C  
30  
55  
80  
20  
55  
Operating Temperature Range  
TA = 25°C  
20  
55  
70  
105  
105  
140  
140  
Operating Temperature Range  
70  
1 Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields.  
This so-called algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated  
by the absolute value of B, and the sign indicates the polarity of the field (for example, a –100 G field and a 100 G field have equivalent strength, but  
opposite polarity).  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
4
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
Characteristic  
Symbol  
Test Conditions  
Value Units  
Package LH, 1-layer PCB with copper limited to solder pads  
228 ºC/W  
2
Package LH, 2-layer PCB with 0.463 in. of copper area each  
side connected by thermal vias  
RθJA  
Package Thermal Resistance  
110  
ºC/W  
Package UA, 1-layer PCB with copper limited to solder pads  
165 ºC/W  
Power Derating Curve  
TJ(max) = 165ºC; ICC = ICC(max)  
25  
24  
23  
V
CC(max)  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
8
7
6
5
Package LH, 2-layer PCB  
(RQJA = 110 ºC/W)  
Package UA, 1-layer PCB  
(RQJA = 165 ºC/W)  
Package LH, 1-layer PCB  
(RQJA = 228 ºC/W)  
4
V
CC(min)  
3
2
20  
40  
60  
80  
100  
120  
140  
160  
180  
Power Dissipation versus Ambient Temperature  
1900  
1800  
1700  
1600  
1500  
1400  
1300  
1200  
1100  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
Temperature (°C)  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
5
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
Characteristic Data  
Supply Current (On) versus Ambient Temperature  
(A1101/02/03/04/06)  
Supply Current (On) versus Supply Voltage  
(A1101/02/03/04/06)  
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0
8.0  
7.0  
6.0  
T
(°C)  
A
V
(V)  
CC  
5.0  
4.0  
3.0  
2.0  
1.0  
0
–40  
25  
24  
3.8  
150  
–50  
0
50  
100  
150  
0
5
10  
15  
20  
25  
TA (°C)  
VCC (V)  
Supply Current (Off) versus Ambient Temperature  
(A1101/02/03/04/06)  
Supply Current (Off) versus Supply Voltage  
(A1101/02/03/04/06)  
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0
T
A
(°C)  
V
(V)  
CC  
–40  
25  
24  
3.8  
150  
0
5
10  
15  
20  
25  
–50  
0
50  
100  
150  
TA (°C)  
VCC (V)  
Output Voltage (On) versus Ambient Temperature  
(A1101/02/03/04/06)  
Output Voltage (On) versus Supply Voltage  
(A1101/02/03/04/06)  
400  
400  
350  
300  
250  
200  
150  
100  
50  
350  
300  
250  
200  
150  
100  
50  
T
A
(°C)  
V
(V)  
CC  
–40  
25  
24  
3.8  
150  
0
0
–50  
0
50  
100  
150  
0
5
10  
15  
20  
25  
TA (°C)  
VCC (V)  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
6
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
Functional Description  
OPERATION  
packaging to tighten magnetic parameter distributions. In con-  
trast, chopper-stabilized switches employ an offset cancellation  
technique on the chip that eliminates these offsets without the  
need for after-packaging programming. The tradeoff is a longer  
settling time and reduced frequency response as a result of the  
chopper-stabilization offset cancellation algorithm.  
The output of these devices switches low (turns on) when a  
magnetic field (south polarity) perpendicular to the Hall ele-  
ment exceeds the operate point threshold, BOP. After turn-on,  
the output is capable of sinking 25 mA and the output voltage is  
VOUT(SAT). When the magnetic field is reduced below the release  
point, BRP, the device output goes high (turns off). The differ-  
ence in the magnetic operate and release points is the hysteresis,  
The choice between continuous-time and chopper-stabilized  
designs is solely determined by the application. Battery manage-  
ment is an example where continuous-time is often required. In  
these applications, VCC is chopped with a very small duty cycle  
in order to conserve power (refer to figure 2). The duty cycle  
is controlled by the power-on time, tPO, of the device. Because  
continuous-time devices have the shorter power-on time, they  
are the clear choice for such applications.  
Bhys, of the device. This built-in hysteresis allows clean switch-  
ing of the output, even in the presence of external mechanical  
vibration and electrical noise.  
Powering-on the device in the hysteresis region, less than BOP and  
higher than BRP, allows an indeterminate output state. The correct  
state is attained after the first excursion beyond BOP or BRP.  
CONTINUOUS-TIME BENEFITS  
For more information on the chopper stabilization technique,  
refer to Technical Paper STP 97-10, Monolithic Magnetic Hall  
Sensing Using Dynamic Quadrature Offset Cancellation and  
Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a  
Track-and-Hold Signal Demodulator.  
Continuous-time devices, such as the A110x family, offer the  
fastest available power-on settling time and frequency response.  
Due to offsets generated during the IC packaging process,  
continuous-time devices typically require programming after  
(A)  
(B)  
VS  
V+  
VCC  
VCC  
RL  
Output  
A110x  
VOUT  
GND  
VOUT(SAT)  
B+  
0
B–  
0
BHYS  
Figure 1. Switching Behavior of Unipolar Switches. On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field  
strength, and the B– direction indicates decreasing south polarity field strength (including the case of increasing north polarity). This behavior can  
be exhibited when using a circuit such as that shown in Panel B.  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
7
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
ADDITIONAL APPLICATIONS INFORMATION  
Extensive applications information for Hall-effect devices is  
available in:  
Hall-Effect IC Applications Guide, Application Note 27701  
Hall-Effect Devices: Gluing, Potting, Encapsulating, Lead  
Welding and Lead Forming, Application Note 27703.1  
Soldering Methods for Allegros Products – SMT and Through-  
Hole, Application Note 26009  
All are provided in Allegro Electronic Data Book, AMS-702,  
and the Allegro Web site, www.allegromicro.com.  
1
2
3
4
5
VCC  
t
t
VOUT  
Output Sampled  
t
PO(max)  
Figure 2. Continuous-Time Application, B < BRP.. This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power.  
Position 1, power is applied to the device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max)  
.
The case shown is where the correct output state is HIGH. Position 3, tPO(max) has elapsed. The device output is valid. Position 4, after the output is  
valid, a control unit reads the output. Position 5, power is removed from the device.  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
8
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
Power Derating  
Power Derating  
Example: Reliability for VCC at TA=150°C, package UA, using  
minimum-K PCB.  
The device must be operated below the maximum junction  
temperature of the device, TJ(max). Under certain combinations of  
peak conditions, reliable operation may require derating sup-  
plied power or improving the heat dissipation properties of the  
application. This section presents a procedure for correlating  
factors affecting operating TJ. (Thermal data is also available on  
the Allegro MicroSystems Web site.)  
Observe the worst-case ratings for the device, specifically:  
RJA=165°C/W, TJ(max) =165°C, VCC(max)= 24 V, and  
ICC(max) = 7.5 mA.  
Calculate the maximum allowable power level, PD(max). First,  
invert equation 3:  
The Package Thermal Resistance, RJA, is a figure of merit sum-  
marizing the ability of the application and the device to dissipate  
heat from the junction (die), through all paths to the ambient air.  
Its primary component is the Effective Thermal Conductivity,  
K, of the printed circuit board, including adjacent devices and  
traces. Radiation from the die through the device case, RJC, is  
relatively small component of RJA. Ambient air temperature,  
TA, and air motion are significant external factors, damped by  
overmolding.  
Tmax = TJ(max) – TA = 165°C150°C = 15°C  
This provides the allowable increase to TJ resulting from internal  
power dissipation. Then, invert equation 2:  
PD(max) = Tmax ÷RJA =1C÷165 °C/W=91mW  
Finally, invert equation 1 with respect to voltage:  
VCC(est) = PD(max) ÷ ICC(max) = 91mW÷7.5mA=12.1 V  
The effect of varying power levels (Power Dissipation, PD), can  
be estimated. The following formulas represent the fundamental  
relationships used to estimate TJ, at PD.  
The result indicates that, at TA, the application and device can  
dissipate adequate amounts of heat at voltages VCC(est)  
.
Compare VCC(est) to VCC(max). If VCC(est) VCC(max), then reli-  
able operation between VCC(est) and VCC(max) requires enhanced  
RJA. If VCC(est) VCC(max), then operation between VCC(est) and  
VCC(max) is reliable under these conditions.  
PD = VIN  
I
(1)  
×
IN  
T = PD  
R
(2)  
JA  
×
TJ = TA + ΔT  
(3)  
For example, given common conditions such as: TA= 25°C,  
VCC = 12 V, ICC = 4 mA, and RJA = 140 °C/W, then:  
PD = VCC  
I
= 12 V 4 mA = 48 mW  
×
×
CC  
T = PD  
R
= 48 mW 140 °C/W = 7°C  
×
×
JA  
TJ = TA + T = 25°C + 7°C = 32°C  
A worst-case estimate, PD(max), represents the maximum allow-  
able power level (VCC(max), ICC(max)), without exceeding TJ(max)  
at a selected RJA and TA.  
,
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
9
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
Package LH, 3-Pin (SOT-23W)  
+0.12  
–0.08  
2.98  
3
D
1.49  
4°±4°  
A
+0.020  
–0.053  
0.180  
D
0.96  
D
+0.10  
2.90  
+0.19  
–0.06  
2.40  
1.91  
–0.20  
0.70  
0.25 MIN  
1.00  
2
1
0.55 REF  
0.25 BSC  
0.95  
PCB Layout Reference View  
Seating Plane  
Gauge Plane  
B
Branded Face  
8X 10° REF  
C
Standard Branding Reference View  
1.00 ±0.13  
+0.10  
A1101, A1102,  
A1103, A1104,  
and A1106  
0.05  
NNT  
–0.05  
0.95 BSC  
0.40 ±0.10  
1
For Reference Only; not for tooling use (reference dwg. 802840)  
Dimensions in millimeters  
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions  
Exact case and lead configuration at supplier discretion within limits shown  
N = Last two digits of device part number  
T = Temperature code (letter)  
Active Area Depth, 0.28 mm REF  
A
B
A1101, A1102,  
A1103, and  
A1104 only  
Reference land pattern layout  
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary  
to meet application process requirements and PCB layout tolerances  
NNN  
C
D
Branding scale and appearance at supplier discretion  
Hall element, not to scale  
1
N = Last three digits of device part number  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
10  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
Package UA, 3-Pin SIP  
(A1101, A1102, A1103. and A1104)  
+0.08  
–0.05  
4.09  
45°  
B
C
E
2.04  
1.52 ±0.05  
1.44  
E
E
Mold Ejector  
Pin Indent  
NNT  
+0.08  
–0.05  
3.02  
45°  
Branded  
Face  
1
Standard Branding Reference View  
D
2.16  
MAX  
= Supplier emblem  
N = Last two digits of device part number  
T = Temperature code  
0.79 REF  
A
0.51  
REF  
1
2
3
For Reference Only; not for tooling use (reference DWG-9049)  
Dimensions in millimeters  
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions  
Exact case and lead configuration at supplier discretion within limits shown  
+0.03  
–0.06  
0.41  
15.75 ±0.51  
Dambar removal protrusion (6X)  
A
B
C
D
Gate burr area  
Active Area Depth, 0.50 mm REF  
Branding scale and appearance at supplier discretion  
E
Hall element, not to scale  
+0.05  
–0.07  
1.27 NOM  
0.43  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
11  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
Package UA, 3-Pin SIP  
(A1106)  
+0.08  
–0.05  
4.09  
45°  
B
C
E
2.04  
1.52 ±0.05  
10°  
1.44  
E
Mold Ejector  
Pin Indent  
NNT  
+0.08  
–0.05  
3.02  
E
A
45°  
Branded  
Face  
1
Standard Branding Reference View  
D
0.79 REF  
= Supplier emblem  
N = Last two digits of device part number  
T = Temperature code  
1.02  
MAX  
1
2
3
For Reference Only; not for tooling use (reference DWG-9065)  
Dimensions in millimeters  
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions  
Exact case and lead configuration at supplier discretion within limits shown  
14.99 ±0.25  
+0.03  
–0.06  
0.41  
Dambar removal protrusion (6X)  
A
B
C
D
Gate and tie bar burr area  
Active Area Depth, 0.50 mm REF  
Branding scale and appearance at supplier discretion  
Hall element (not to scale)  
+0.05  
–0.07  
0.43  
E
1.27 NOM  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
12  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A1101, A1102, A1103,  
A1104, and A1106  
Continuous-Time Switch Family  
Revision History  
Revision  
Revision Date  
Description of Revision  
Rev. 14  
May 29, 2012  
Add A1106 UA package drawing  
Copyright ©2006-2012, Allegro MicroSystems, Inc.  
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to per-  
mit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the  
information being relied upon is current.  
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the  
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.  
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;  
nor for any infringement of patents or other rights of third parties which may result from its use.  
For the latest version of this document, visit our website:  
www.allegromicro.com  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
13  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  

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