A1101_16 [ALLEGRO]
Continuous-Time Switch Family;
| 型号： | A1101_16 |
| 厂家： | 
ALLEGRO MICROSYSTEMS |
| 描述： | Continuous-Time Switch Family |
| 文件： | 总13页 (文件大小：642K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
A1101, A1102, A1103, A1104, and A1106
Continuous-Time Switch Family
FEATURES AND BENEFITS
DESCRIPTION
• AEC-Q100 automotive qualified
• Continuous-time operation
□ Fast power-on time
The Allegro™ A1101-A1104 and A1106 Hall-effect switches
are next generation replacements for the popular Allegro
312x and 314x lines of unipolar switches. The A110x family,
produced with BiCMOS technology, consists of devices that
□ Low noise
• Stable operation over full operating temperature range
• Reverse battery protection
• Solid-state reliability
• Factory-programmed at end-of-line for optimum
performance
• Robust EMC performance
feature fast power-on time and low-noise operation. Device
programmingisperformedafterpackaging,toensureincreased
switchpointaccuracybyeliminatingoffsetsthatcanbeinduced
by package stress. Unique Hall element geometries and low-
offset amplifiers help to minimize noise and to reduce the
residualoffsetvoltagenormallycausedbydeviceovermolding,
temperature excursions, and thermal stress.
• High ESD rating
• Regulator stability without a bypass capacitor
The A1101-A1104 and A1106 Hall-effect switches include
the following on a single silicon chip: voltage regulator, Hall-
voltage generator, small-signal amplifier, Schmitt trigger, and
NMOS output transistor. The integrated voltage regulator
permits operation from 3.8 to 24 V. The extensive on-board
protectioncircuitrymakespossiblea±30Vabsolutemaximum
voltage rating for superior protection in automotive and
industrial motor commutation applications, without adding
external components. All devices in the family are identical
except for magnetic switchpoint levels.
Packages:
3-pin SOT23W (suffix LH)
3-pin SIP (suffix UA)
The small geometries of the BiCMOS process allow these
devices to be provided in ultrasmall packages. The package
styles available provide magnetically optimized solutions for
mostapplications.PackageLHisanSOT23W,aminiaturelow-
profilesurface-mountpackage,whilepackageUAisathree-lead
ultramini SIPfor through-hole mounting. Each package is lead
(Pb) free, with 100% matte-tin-plated leadframes.
LH: A1101, A1102,
A1103, A1104, and
A1106
UA: A1101,
A1102, A1103,
and A1104
Not to scale
UA: A1106
VCC
Regulator
To all subcircuits
VOUT
Amp
Gain
Offset
Trim
Control
GND
Functional Block Diagram
A1101-DS, Rev. 16
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
SPECIFICATIONS
Selection Guide
Part Number
A1101ELHLT-T
A1101ELHLX-T
A1101EUA-T
Packing*
Mounting
Ambient, TA
BRP (Min) BOP (Max)
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
Bulk, 500 pieces/bag
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SIP through hole
–40ºC to 85ºC
10
175
A1101LLHLT-T
A1101LLHLX-T
A1101LUA-T
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
Bulk, 500 pieces/bag
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SIP through hole
–40ºC to
150ºC
A1102ELHLT-T
A1102ELHLX-T
A1102EUA-T
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
Bulk, 500 pieces/bag
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SIP through hole
–40ºC to 85ºC
60
245
355
A1102LLHLT-T
A1102LLHLX-T
A1102LUA-T
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
Bulk, 500 pieces/bag
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SIP through hole
–40ºC to
150ºC
A1103ELHLT-T
A1103ELHLX-T
A1103LLHLT-T
A1103LLHLX-T
A1103LUA-T
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
Bulk, 500 pieces/bag
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SIP through hole
–40ºC to 85ºC
150
–40ºC to
150ºC
A1104EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
–40ºC to 85ºC
A1104LLHLT-T
A1104LLHLX-T
A1104LUA-T
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
Bulk, 500 pieces/bag
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SIP through hole
25
450
430
–40ºC to
150ºC
A1106EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
–40ºC to 85ºC
A1106LLHLT-T
A1106LLHLX-T
A1106LUA-T
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
Bulk, 500 pieces/bag
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SIP through hole
160
–40ºC to
150ºC
*Contact Allegro for additional packing options.
Absolute Maximum Ratings
Characteristic
Symbol
VCC
Notes
Rating
Units
V
Supply Voltage
30
–30
Reverse Supply Voltage
Output Off Voltage
VRCC
VOUT
VROUT
IOUTSINK
B
V
30
V
Reverse Output Voltage
Output Current
–0.5
V
25
mA
G
Magnetic Flux Density
Unlimited
–40 to 85
–40 to 150
165
Range E
Range L
ºC
ºC
ºC
ºC
Operating Ambient Temperature
TA
Maximum Junction Temperature
Storage Temperature
TJ(max)
Tstg
–65 to 170
Allegro MicroSystems, LLC
115 Northeast Cutoff
2
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
ELECTRICAL OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges, unless otherwise
noted
Characteristic
Symbol
Test Conditions
Min.
3.8
–
Typ.
Max.
Units
1
VCC
Operating, TJ < 165°C
–
24
V
Supply Voltage
Output Leakage Current
Output On Voltage
IOUTOFF
VOUT(SAT)
VOUT = 24 V, B < BRP
IOUT = 20 mA, B > BOP
–
10
µA
–
215
400
mV
Slew rate (dVCC/dt) < 2.5 V/μs, B > BOP + 5 G or B < BRP
– 5 G
2
tPO
–
–
4
µs
Power-On Time
3
tr
VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF
–
–
–
–
–
–
–
400
400
7.5
ns
ns
Output Rise Time
3
tf
VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF
Output Fall Time
ICCON
ICCOFF
IRCC
B > BOP
4.1
3.8
–
mA
mA
mA
Supply Current
B < BRP
7.5
Reverse Battery Current
VRCC = –30 V
–10
Supply Zener Clamp Voltage
VZ
IZ
ICC = 10.5 mA; TA = 25°C
VZ = 32 V; TA = 25°C
32
–
–
–
–
V
4
10.5
mA
Supply Zener Current
1
Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
For VCC slew rates greater than 250 V/μs, and TA = 150°C, the Power-On Time can reach its maximum value.
CS =oscilloscope probe capacitance.
2
3
4
Maximum current limit is equal to the maximum ICC(max) + 3 mA.
DEVICE QUALIFICATION PROGRAM
Contact Allegro for information.
EMC (ELECTROMAGNETIC COMPATABILITY) REQUIREMENTS
Contact Allegro for information.
3
2
1
3
1
2
Package LH
Terminal List
Package UA, 3-pin SIP
Number
Name
Description
Package LH
Package UA
1
2
3
1
3
2
VCC
VOUT
GND
Connects power supply to chip
Output from circuit
Ground
Allegro MicroSystems, LLC
115 Northeast Cutoff
3
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
MAGNETIC OPERATING CHARACTERISTICS1: over full operating voltage and ambient temperature ranges, un-
less otherwise noted
Characteristic
Symbol
Test Conditions
TA = 25°C
Min.
50
Typ.
100
100
180
180
280
280
–
Max.
160
175
230
245
340
355
350
450
400
430
130
145
175
190
285
300
330
430
300
330
80
Units
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
A1101
A1102
A1103
A1104
A1106
A1101
A1102
A1103
A1104
A1106
A1101
A1102
A1103
A1104
A1106
Operating Temperature Range
TA = 25°C
30
130
115
220
205
70
Operating Temperature Range
TA = 25°C
Operate Point
BOP
Operating Temperature Range
TA = 25°C
Operating Temperature Range
TA = 25°C
35
–
280
260
10
340
340
45
Operating Temperature Range
TA = 25°C
Operating Temperature Range
TA = 25°C
10
45
75
125
125
225
225
–
Operating Temperature Range
TA = 25°C
60
165
150
50
Release Point
BRP
Operating Temperature Range
TA = 25°C
Operating Temperature Range
TA = 25°C
25
–
180
160
20
240
240
55
Operating Temperature Range
TA = 25°C
Operating Temperature Range
TA = 25°C
20
55
80
30
55
80
Operating Temperature Range
TA = 25°C
30
55
80
30
55
80
Hysteresis
BHYS
Operating Temperature Range
TA = 25°C
30
55
80
20
55
–
Operating Temperature Range
TA = 25°C
20
55
–
70
105
105
140
140
Operating Temperature Range
70
1
Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields. This so-called alge-
braic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated by the absolute value of B, and the
sign indicates the polarity of the field (for example, a –100 G field and a 100 G field have equivalent strength, but opposite polarity).
Allegro MicroSystems, LLC
115 Northeast Cutoff
4
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
THERMAL CHARACTERISTICS: may require derating at maximum conditions; see application information
Characteristic
Symbol
Test Conditions
Value Units
Package LH, 1-layer PCB with copper limited to solder pads
228
110
165
ºC/W
ºC/W
ºC/W
2
Package LH, 2-layer PCB with 0.463 in. of copper area each side
Package Thermal Resistance
RθJA
connected by thermal vias
Package UA, 1-layer PCB with copper limited to solder pads
Power Derating Curve
TJ(max) = 165ºC; ICC = ICC(max)
25
24
23
V
CC(max)
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
Package LH, 2-layer PCB
(RθJA = 110 ºC/W)
Package UA, 1-layer PCB
(RθJA = 165 ºC/W)
Package LH, 1-layer PCB
(RθJA = 228 ºC/W)
4
V
CC(min)
3
2
20
40
60
80
100
120
140
160
180
Power Dissipation versus Ambient Temperature
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
20
40
60
80
100
120
140
160
180
Temperature (°C)
Allegro MicroSystems, LLC
115 Northeast Cutoff
5
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
CHARACTERISTIC DATA
Supply Current (On) versus Ambient Temperature
(A1101/02/03/04/06)
Supply Current (On) versus Supply Voltage
(A1101/02/03/04/06)
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
8.0
7.0
6.0
T
(°C)
A
V
(V)
CC
5.0
4.0
3.0
2.0
1.0
0
–40
25
24
3.8
150
–50
0
50
100
150
0
5
10
15
20
25
TA (°C)
VCC (V)
Supply Current (Off) versus Ambient Temperature
(A1101/02/03/04/06)
Supply Current (Off) versus Supply Voltage
(A1101/02/03/04/06)
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
T
A
(°C)
V
(V)
CC
–40
25
24
3.8
150
0
5
10
15
20
25
–50
0
50
100
150
TA (°C)
VCC (V)
Output Voltage (On) versus Ambient Temperature
(A1101/02/03/04/06)
Output Voltage (On) versus Supply Voltage
(A1101/02/03/04/06)
400
400
350
300
250
200
150
100
50
350
300
250
200
150
100
50
T
A
(°C)
V
(V)
CC
–40
25
24
3.8
150
0
0
–50
0
50
100
150
0
5
10
15
20
25
TA (°C)
VCC (V)
Allegro MicroSystems, LLC
115 Northeast Cutoff
6
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
FUNCTIONAL DESCRIPTION
time devices typically require programming after packaging to
tighten magnetic parameter distributions. In contrast, chopper-
stabilized switches employ an offset cancellation technique on
the chip that eliminates these offsets without the need for after-
packaging programming. The tradeoff is a longer settling time and
reduced frequency response as a result of the chopper-stabiliza-
tion offset cancellation algorithm.
OPERATION
The output of these devices switches low (turns on) when a
magnetic field (south polarity) perpendicular to the Hall element
exceeds the operate point threshold, BOP. After turn-on, the output
is capable of sinking 25 mA and the output voltage is VOUT(SAT)
When the magnetic field is reduced below the release point,
BRP, the device output goes high (turns off). The difference in
.
The choice between continuous-time and chopper-stabilized
designs is solely determined by the application. Battery manage-
ment is an example where continuous-time is often required. In
these applications, VCC is chopped with a very small duty cycle
in order to conserve power (refer to figure 2). The duty cycle
is controlled by the power-on time, tPO, of the device. Because
continuous-time devices have the shorter power-on time, they are
the clear choice for such applications.
the magnetic operate and release points is the hysteresis, Bhys, of
the device. This built-in hysteresis allows clean switching of the
output, even in the presence of external mechanical vibration and
electrical noise.
Powering-on the device in the hysteresis region, less than BOP and
higher than BRP, allows an indeterminate output state. The correct
state is attained after the first excursion beyond BOP or BRP.
CONTINUOUS-TIME BENEFITS
For more information on the chopper stabilization technique,
refer to Technical Paper STP 97-10, Monolithic Magnetic Hall
Sensing Using Dynamic Quadrature Offset Cancellation and
Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a
Track-and-Hold Signal Demodulator.
Continuous-time devices, such as the A110x family, offer the fast-
est available power-on settling time and frequency response. Due
to offsets generated during the IC packaging process, continuous-
(A)
(B)
VS
V+
VCC
VCC
RL
Output
A110x
VOUT
GND
VOUT(SAT)
0
B+
B–
0
BHYS
Figure 1: Switching Behavior of Unipolar Switches
On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength, and the B– direction indicates decreasing
south polarity field strength (including the case of increasing north polarity). This behavior can be exhibited when using a circuit such as that
shown in Panel B.
Allegro MicroSystems, LLC
115 Northeast Cutoff
7
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
ADDITIONAL APPLICATIONS INFORMATION
Extensive applications information for Hall-effect devices is
available in:
• Hall-Effect IC Applications Guide, Application Note 27701
• Hall-Effect Devices: Guidelines for Designing Subassemblies
Using Hall-Effect Devices, Application Note 27703.1
• Soldering Methods for Allegro’s Products – SMT and Through-
Hole, Application Note 26009
All are provided in Allegro Electronic Data Book, AMS-702,
and the Allegro Web site, www.allegromicro.com.
1
2
3
4
5
VCC
t
t
VOUT
Output Sampled
t
PO(max)
Figure 2: Continuous-Time Application, B < BRP
This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power. Position 1, power is applied to the
device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max). The case shown is where
the correct output state is HIGH. Position 3, tPO(max) has elapsed. The device output is valid. Position 4, after the output is valid, a control unit
reads the output. Position 5, power is removed from the device.
Allegro MicroSystems, LLC
115 Northeast Cutoff
8
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
POWER DERATING
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding TJ(max)
at a selected RθJA and TA.
Power Derating
,
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems Web site.)
Example: Reliability for VCC at TA=150°C, package UA, using
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
RθJA=165°C/W, TJ(max) =165°C, VCC(max)= 24 V, and
ICC(max) = 7.5 mA.
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RθJC, is relatively
small component of RθJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
ΔTmax = TJ(max) – TA = 165°C–150°C = 15°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = ΔTmax ÷RθJA =15°C÷165 °C/W=91mW
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max) = 91mW÷7.5mA=12.1 V
The result indicates that, at TA, the application and device can dis-
PD = VIN
I
(1)
×
IN
sipate adequate amounts of heat at voltages ≤VCC(est)
.
ꢀ
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀΔT = PD
R
(2)
×
θJA
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
able operation between VCC(est) and VCC(max) requires enhanced
RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
TJ = TA + ΔT
(3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 4 mA, and RθJA = 140 °C/W, then:
PD = VCC
I
= 12 V 4 mA = 48 mW
CC
×
×
ΔT = PD
R
= 48 mW 140 °C/W = 7°C
θJA
×
×
TJ = TA + ΔT = 25°C + 7°C = 32°C
Allegro MicroSystems, LLC
115 Northeast Cutoff
9
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
CUSTOMER PACKAGE DRAWING
For Reference Only – Not for Tooling Use
(Reference DWG-2840)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
+0.12
2.98
–0.08
D
1.49
4° 4°
A
3
+0.020
0.180
–0.053
0.96
D
+0.19
–0.06
+0.10
1.91
2.40
2.90
–0.20
0.70
D
1.00
0.25 MIN
2
1
0.55 REF
0.25 BSC
0.95
Seating Plane
Gauge Plane
Branded Face
PCB Layout Reference View
B
8X 10°
REF
1.00 0.13
+0.10
A1101, A1102,
A1103, A1104,
and A1106
NNT
0.05
–0.05
0.95 BSC
0.40 0.10
N = Last three digits of device part number
= Temperature Code (Letter)
T
A
B
Active Area Depth, 0.28 mm
Reference land pattern layout; all pads a minimum of 0.20 mm from all adjacent pads;
adjust as necessary to meet application process requirements and PCB layout tolerances
A1101, A1102,
A1103, A1104,
and A1106
NNN
C
D
Branding scale and appearance at supplier discretion
Hall elements, not to scale
N = Last three digits of device part number
C Standard Branding Reference View
Figure 3: Package LH, 3-Pin (SOT-23W)
Allegro MicroSystems, LLC
115 Northeast Cutoff
10
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
For Reference Only – Not for Tooling Use
(Reference DWG-9049)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
45°
B
+0.08
–0.05
4.09
1.52 0.05
E
C
2.04
2 X 10°
1.44
E
E
Mold Ejector
Pin Indent
+0.08
–0.05
3.02
45°
Branded
Face
2.16 MAX
0.51 REF
0.79 REF
A
1
2
3
+0.05
–0.07
+0.03
–0.06
0.43
0.41
1.27 NOM
NNT
15.75 0.25
1
D
Standard Branding Reference View
= Supplier emblem
N
T
= Last three digits of device part number
= Temperature code
A
B
C
D
Dambar removal protrusion (6X)
Gate and tie bar burr area
Active Area Depth, 0.50 mm REF
Branding scale and appearance at supplier discretion
Hall element, not to scale
E
Figure 4: Package UA, 3-Pin SIP
(A1101, A1102, A1103, and A1104)
Allegro MicroSystems, LLC
115 Northeast Cutoff
11
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
For Reference Only – Not for Tooling Use
(Reference DWG-9013)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
45°
B
+0.08
–0.05
4.09
1.52 0.05
E
C
2.04
2 X 10°
1.44
E
E
Mold Ejector
Pin Indent
+0.08
–0.05
3.02
45°
Branded
Face
A
1.02 MAX
0.79 REF
1
2
3
+0.05
–0.07
+0.03
–0.06
0.43
0.41
1.27 NOM
NNN
14.99 0.25
1
D
Standard Branding Reference View
= Supplier emblem
N
= Last three digits of device part number
A
B
C
D
Dambar removal protrusion (6X)
Gate and tie bar burr area
Active Area Depth, 0.50 mm REF
Branding scale and appearance at supplier discretion
Hall element, not to scale
E
Figure 5: Package UA, 3-Pin SIP
(A1106)
Allegro MicroSystems, LLC
115 Northeast Cutoff
12
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Revision History
Revision
Revision Date
Description of Revision
14
May 29, 2012
Add A1106 UA package drawing
15
16
January 1, 2015
Added the LX option to Selection Guide
September 30, 2015
Corrected LH package Active Area Depth value and LH package branding; added AEC-Q100
qualification under Features and Benefits
Copyright ©2015, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, LLC
115 Northeast Cutoff
13
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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