AM3407E3VR [AITSEMI]

P-CHANNEL ENHANCEMENT MODE POWER MOSFET;
AM3407E3VR
型号: AM3407E3VR
厂家: AiT Semiconductor    AiT Semiconductor
描述:

P-CHANNEL ENHANCEMENT MODE POWER MOSFET

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AM3407  
MOSFET  
AiT Semiconductor Inc.  
www.ait-ic.com  
P-CHANNEL ENHANCEMENT MODE POWER MOSFET  
DESCRIPTION  
FEATURES  
The AM3407 uses advanced trench technology to  
provide excellent RDS(ON), low gate charge and  
operation with gate voltages as low as 4.5V. This  
device is suitable for use as a load switch or in PWM  
applications.  
VDS = -30V,ID = -4.1A  
R
R
DS(ON) < 95mΩ @ VGS=-4.5V  
DS(ON) < 65mΩ @ VGS=-10V  
High Power and current handing capability  
Surface Mount Package  
Available in SOT-23 Package  
The AM3407 is available in SOT-23 package.  
ORDERING INFORMATION  
APPLICATION  
PWM applications  
Package Type  
SOT-23  
Part Number  
AM3407E3R  
AM3407E3VR  
Load switch  
E3  
Power management  
V: Halogen free Package  
R: Tape & Reel  
P CHANNEL MOSFET  
Note  
AiT provides all RoHS products  
Suffix “ V “ means Halogen free Package  
Schematic diagram  
REV3.0  
-MAR 2010 RELEASED, JUL 2016 UPDATED -  
- 1 -  
AM3407  
MOSFET  
AiT Semiconductor Inc.  
www.ait-ic.com  
P-CHANNEL ENHANCEMENT MODE POWER MOSFET  
PIN DESCRIPTION  
Top View  
Pin #  
Symbol  
Function  
Gate  
1
2
3
G
S
D
Source  
Drain  
REV3.0  
-MAR 2010 RELEASED, JUL 2016 UPDATED -  
- 2 -  
AM3407  
MOSFET  
AiT Semiconductor Inc.  
www.ait-ic.com  
P-CHANNEL ENHANCEMENT MODE POWER MOSFET  
ABSOLUTE MAXIMUM RATINGS  
TA=25, unless otherwise noted  
VDS, Drain-Source Voltage  
-30V  
±20V  
VGS, Gate-Source Voltage  
ID, Drain Current-Continuous  
-4.1A  
IDM, Drain Current-PulsedNOTE1  
-20A  
PD, Maximum Power Dissipation  
1.4W  
TJ, TSTG, Operating Junction and Storage Temperature Range  
-55°C ~150°C  
Stresses above may cause permanent damage to the device. These are stress ratings only and functional operation of the device at  
these or any other conditions beyond those indicated in the Electrical Characteristics are not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
RθJA  
Limit  
90  
Units  
°C/W  
Thermal Resistance, Junction-to-AmbientNOTE2  
REV3.0  
-MAR 2010 RELEASED, JUL 2016 UPDATED -  
- 3 -  
AM3407  
MOSFET  
AiT Semiconductor Inc.  
www.ait-ic.com  
P-CHANNEL ENHANCEMENT MODE POWER MOSFET  
ELECTRICAL CHARACTERISTICS  
TA=25, unless otherwise noted  
Parameter  
Symbol  
Conditions  
Min  
Typ.  
Max  
Units  
Off Characteristics  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
On Characteristics NOTE 3  
Gate Threshold Voltage  
Drain-Source On-State  
Resistance  
BVDSS  
IDSS  
VGS=0V,ID=-250μA  
VDS=-24V,VGS=0V  
VGS=±20V,VDS=0V  
-30  
-33  
-
V
-
-
-
-
-1  
μA  
nA  
IGSS  
±100  
VGS(th)  
RDS(ON)  
gFS  
VDS=VGS,ID=-250μA  
VGS=-10V,ID=-4.1A  
VGS=-4.5V,ID=-4A  
VDS=-5V,ID=-4.1A  
-1  
-
-1.5  
55  
75  
-
-3  
65  
95  
-
V
mΩ  
S
-
Forward Transconductance  
Dynamic Characteristics NOTE 4  
Input Capacitance  
5.5  
Clss  
Coss  
Crss  
-
-
-
700  
120  
75  
-
-
-
VDS=-15V,VGS=0V,  
F=1.0MHz  
Output Capacitance  
pF  
ns  
Reverse Transfer Capacitance  
Switching Characteristics NOTE 4  
Turn-on Delay Time  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
9
5
-
-
-
-
-
-
-
Turn-on Rise Time  
VDD=-15V, RL=3.6Ω  
VGS=-10V, RGEN=3Ω  
Turn-Off Delay Time  
28  
13.5  
14  
3.1  
3
Turn-Off Fall Time  
Total Gate Charge  
Qg  
Qgs  
Qgd  
VDS=-15V,ID=-4A,  
VGS=-10V  
Gate-Source Charge  
nC  
V
Gate-Drain Charge  
Drain-Source Diode Characteristics  
Diode Forward VoltageNOTE3  
VSD  
VGS=0V, IS=-1A  
-
-
-1.2  
NOTE1: Repetitive Rating: Pulse width limited by maximum junction temperature.  
NOTE2: Surface Mounted on FR4 Board, t ≤ 10 sec.  
NOTE3: Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.  
NOTE4: Guaranteed by design, not subject to production  
REV3.0  
-MAR 2010 RELEASED, JUL 2016 UPDATED -  
- 4 -  
AM3407  
MOSFET  
AiT Semiconductor Inc.  
www.ait-ic.com  
P-CHANNEL ENHANCEMENT MODE POWER MOSFET  
TYPICAL PERFORMANCE CHARACTERISTICS  
1.  
3.  
5.  
Power Dissipation  
2.  
4.  
6.  
Drain Current  
Output Characteristics  
Drain-Source On-Resistance  
Transfer Characteristics  
Drain-Source On-Resistance  
REV3.0  
-MAR 2010 RELEASED, JUL 2016 UPDATED -  
- 5 -  
AM3407  
MOSFET  
AiT Semiconductor Inc.  
www.ait-ic.com  
P-CHANNEL ENHANCEMENT MODE POWER MOSFET  
7.  
Rdson vs. Vgs  
8.  
Capacitance vs. Vds  
9.  
Gate Charge  
10. Source- Drain Diode Forward  
11. Safe Operation Area  
REV3.0  
-MAR 2010 RELEASED, JUL 2016 UPDATED -  
- 6 -  
AM3407  
MOSFET  
AiT Semiconductor Inc.  
www.ait-ic.com  
P-CHANNEL ENHANCEMENT MODE POWER MOSFET  
12. Normalized Maximum Transient Thermal Impedance  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1. Switching Test Circuit  
2. Switching Waveforms  
REV3.0  
-MAR 2010 RELEASED, JUL 2016 UPDATED -  
- 7 -  
AM3407  
MOSFET  
AiT Semiconductor Inc.  
www.ait-ic.com  
P-CHANNEL ENHANCEMENT MODE POWER MOSFET  
PACKAGE INFORMATION  
Dimension in SOT-23 Package (Unit: mm)  
SYMBOL  
MIN.  
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.500  
MAX.  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
A
A1  
A2  
b
c
D
E
E1  
e
0.950TYP  
e1  
L
1.800  
2.000  
0.550REF  
L1  
θ
0.300  
0°  
0.500  
8°  
REV3.0  
-MAR 2010 RELEASED, JUL 2016 UPDATED -  
- 8 -  
AM3407  
MOSFET  
AiT Semiconductor Inc.  
www.ait-ic.com  
P-CHANNEL ENHANCEMENT MODE POWER MOSFET  
IMPORTANT NOTICE  
AiT Semiconductor Inc. (AiT) reserves the right to make changes to any its product, specifications, to  
discontinue any integrated circuit product or service without notice, and advises its customers to obtain the  
latest version of relevant information to verify, before placing orders, that the information being relied on is  
current.  
AiT Semiconductor Inc.'s integrated circuit products are not designed, intended, authorized, or warranted to  
be suitable for use in life support applications, devices or systems or other critical applications. Use of AiT  
products in such applications is understood to be fully at the risk of the customer. As used herein may involve  
potential risks of death, personal injury, or servere property, or environmental damage. In order to minimize  
risks associated with the customer's applications, the customer should provide adequate design and  
operating safeguards.  
AiT Semiconductor Inc. assumes to no liability to customer product design or application support. AiT  
warrants the performance of its products of the specifications applicable at the time of sale.  
REV3.0  
-MAR 2010 RELEASED, JUL 2016 UPDATED -  
- 9 -  

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