HSDL9000 [AGILENT]
Miniature Surface-Mount Ambient Light Photo Sensor; 微型表面贴装环境亮度传感器
| 型号： | HSDL9000 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Miniature Surface-Mount Ambient Light Photo Sensor |
| 文件： | 总14页 (文件大小：273K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent HSDL-9000
Miniature Surface-Mount
Ambient Light Photo Sensor
Data Sheet
Features
• Excellent responsivity which peaks
in the human luminosity curve at
550 nm
Close responsivity to the human eye
• Miniature PLCC surface-mount
package
Height – 1.1 mm
Width – 4.0 mm
Depth – 3.2 mm
• Ease of design with digital output
Integrated photodiode and
analog to digital output circuitry
Description
With the options of three digital
levels and an analog Gain Control
pin to fine tune the three
threshold levels to achieve better
sensitivity control, the HSDL-
9000 is ideal for applications in
which the measurement of
ambient light is used to control
display backlighting. Mobile
appliances such as mobile phones
and PDAs that draw heavy
current from the display back-
lighting will benefit from
The HSDL-9000 is a low cost,
digital-output ambient light photo
sensor in miniature industry-
standard PLCC lead-free surface-
mount package. It incorporates a
photodiode, which peaks in
human luminosity curve at 550
nm. Hence, it provides an
• Enable fine control of the backlight
intensity with adjustable sensitivity
control
3 digital levels
An Analog Gain Control
• Minimum power consumption
30 µA typical idle (standby) current
<10 nA typical shutdown current
excellent responsivity that is
close to the response of human
eyes, as shown in Figure 2.
• Guaranteed temperature
performance
–25°C to 85°C
incorporating the HSDL-9000 in
their designs to reduce the power
consumption significantly.
• 2.7 ≤ V ≤ 3.6 V
CC
• Lead-free package
• Low cost
Applications
• Detection of ambient light to control
display backlighting
Mobile devices – mobile phones,
PDAs
Automotive – dashboard
Consumer appliances – audio sets
• Daylight and artificial light exposed
devices
Ordering Information
Part Number
Packaging Type
Package
Quantity
HSDL-9000
Tape and Reel
6-lead PLCC with Top Transparent Epoxy Surface
1500
Application Circuit For HSDL-9000 Ambient Light Photo Sensor
V
CC
C1
R1
(5)
(1)
V
CC
AGain
D
OUT
ANALOG TO DIGITAL
CIRCUITRY
(6)
HSDL-9000
GND
(4)
A0
(2)
A1
(3)
Figure 1. Functional block diagram of HSDL-9000.
I/O Pins Configuration Table
Pin
Symbol
I/O
Description
Notes
1
V
CC
I
Supply Voltage
Regulated, 2.7 to 3.6 Volt
2
A0
I
Digital Gain Level Control_0
Digital Gain Level Control_1
Ground
This pin needs to be driven high or low and not left floating.
This pin needs to be driven high or low and not left floating.
Connect to System Ground
3
A1
I
4
GND
AGain
I
5
I
Analog Gain Constant Control
Digital Output
If not used, leave this pin unconnected.
[1]
6
D
OUT
O
Tri-State
Note:
1. The HSDL-9000 is in tri-state when it is in shut down mode.
[2]
I/O Truth Table
Logic Level
[3]
A1
A0
0
Description
High Gain
Incidence Light Threshold (Lux)
0
30
81
164
–
1
0
Medium Gain
Low Gain
0
1
1
1
Shut down
Notes:
2. AGain pin is left floating.
3. Measurements are carried out using incandescent light source.
2
Recommended Application Circuit Components
Component
Recommended Value
1.0 µF ± 20%, Tantalum
C1
[4]
Recommended R1 Values
Incidence Light Threshold (Lux)
R1
High Gain
Medium Gain
Low Gain
81
220 kΩ ± 5%, 0.25 W
430 kΩ ± 5%, 0.25 W
910 kΩ ± 5%, 0.25 W
Note:
23
25
28
50
63
71
108
133
4. Measurements are carried out using incandescent light source.
1.1
1.0
0.9
0.8
0.7
0.6
0.5
HSDL-9000
0.4
SILICON
0.3
EYE
0.2
0.1
0
350 450 550 650 750 850 950 1050
WAVELENGTH – nm
Figure 2. Relative spectral responsivity vs. wavelength.
Caution: The BiCMOS inherent to this design of this component increases the component’s
susceptibility to damage from Electrostatic Discharge (ESD). It is advised that normal static precautions
be taken in handling and assembly of this component to prevent damage and/or degradation, which may
be induced by the ESD.
3
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is ≤ 50°C/W
Parameter
Symbol
Min.
–25
–25
0
Max.
+85
+85
6
Units
°C
°C
V
Conditions
Storage Temperature
Operating Temperature
Supply Voltage
T
T
S
A
V
V
CC
Output Voltage: RxD
–0.5
6
V
O
Recommended Operating Conditions
Parameter
Symbol
Min.
–25
2.7
Max.
+85
3.6
Units
°C
V
Conditions
Operating Temperature
Supply Voltage
T
A
V
CC
V
IH
V
IL
Logic Input Logic High
Logic Low
V
CC
– 0.2
V
CC
V
0
0.2
V
Electrical & Optical Specifications
Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted.
Unspecified test conditions may be anywhere in their operating range.
All typical values (Typ.) are at 25°C with V at 3.0 V unless otherwise noted.
CC
Parameter
Symbol
Min.
Typ.
550
120
Max.
Units
nm
°
Conditions
Peak Sensitivity Wavelength
Viewing Angle
λ
P
Logic Input
Logic High
Logic Low
V
V
V
V
V
0
–0.2
–0.2
V
CC
V
IH
CC
0.2
V
IL
Output Voltage Logic High
Logic Low
V
0
V
CC
V
I
I
= –200 µA
= 200 µA
OH
OL
CC
OH
OL
0.2
V
Supply Current
I
I
33
10
100
100
µA
nA
CC
Shutdown Current
(SD)
CC
4
HSDL-9000 Package Outline
1.1 ± 0.2
4 ± 0.2
1.27 ± 0.1 1.27 ± 0.1
0.15 MAX.
0.55 ± 0.1
6
5
4
3.2 ± 0.2
3.5 ± 0.2
1
2
3
0.8 ± 0.3
0.15 MAX.
0.4
PIN
1.
SYMBOL
V
CC
2.
A0
3.
A1
4.
5.
6.
GND
AGain
D
OUT
SEATING PLANE
C
0.1 C
0.4 ± 0.1
Figure 3. Package outline dimensions.
5
Tape and Reel Dimensions
4.0 ± 0.1
2.0 ± 0.05
UNIT: mm
1.75 ± 0.1
1.5 +0
1
POLARITY
5.5 ± 0.05
PIN 1: V
CC
12.0 +0.3–0.1
4.22 ± 0.1
3.61 ± 0.1
PIN 4: GND
1.5 +0.25
0.304 ± 0.02
1.25 ± 0.1
8.0 ± 0.1
PROGRESSIVE DIRECTION
EMPTY
(40 mm MIN.)
PARTS MOUNTED
LEADER
(400 mm MIN.)
EMPTY
(40 mm MIN.)
UNIT: mm
DETAIL A
180 ± 0.5
2.0 ± 0.5
13.0 ± 0.2
+0
–2.5
62.5
R 1.0
LABEL
24 ± 0.5
DETAIL A
18.4 MAX.
+2
12.4
–0
Figure 4. Tape and reel dimensions.
6
Moisture Proof Packaging
Baking Conditions
All HSDL-9000 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
This part is compliant to JEDEC
Level 2a.
Package
In reels
In bulk
Temp.
60°C
Time
20 hours
5 hours
125°C
Baking should only be done once.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
Recommended Storage Conditions
Storage Temperature 10°C to 30°C
Relative Humidity
below
60% RH
PACKAGE IS
OPENED (UNSEALED)
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
twenty-eight days if stored at the
recommended storage conditions.
If times longer than 28 days are
needed, the parts must be stored
in a dry box.
ENVIRONMENT
LESS THAN 30°C,
AND LESS THAN
60% RH
YES
PACKAGE IS
OPENED LESS
THAN 672 HOURS
(4 WEEKS)
NO BAKING
IS NECESSARY
YES
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
NO
Figure 5. Baking conditions chart.
7
Reflow Profile
MAX. 260°C
R3 R4
255
230
220
200
R2
180
60 sec.
MAX.
ABOVE
220°C
160
120
R1
R5
80
25
0
50
100
150
200
250
300
t-TIME (SECONDS)
P1
HEAT
UP
P2
P3
SOLDER
REFLOW
P4
COOL
DOWN
SOLDER PASTE DRY
Figure 6. Reflow graph.
Process
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
∆T
Maximum ∆T/∆time
4°C/s
Heat Up
25°C to 160°C
160°C to 200°C
Solder Paste Dry
Solder Reflow
0.5°C/s
200°C to 255°C (260°C at 10 seconds max.)
255°C to 200°C
4°C/s
–6°C/s
Cool Down
200°C to 25°C
–6°C/s
The reflow profile is a straight-
line representation of a nominal
temperature profile for a con-
vective reflow solder process.
Process zone P2 should be of
sufficient time duration (60 to
–120 seconds) to dry the solder
paste. The temperature is raised
growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 200°C (392°F), to allow
the solder within the connections
to freeze solid.
The temperature profile is divided to a level just below the liquidus
into four process zones, each
with different ∆T/∆time tempera-
ture change rates. The ∆T/∆time
rates detailed in the above table.
The temperatures are measured
at the component to printed
circuit board connections.
point of the solder, usually
200°C (392°F).
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 255°C (491°F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 20 and 60 seconds. It
usually takes about 20 seconds to
assure proper coalescence of the
solder balls into liquid solder and
the formation of good solder
Process zone P4 is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25°C (77°F) should not exceed
–6°C per second maximum. This
limitation is necessary to allow
the PC board and transceiver’s
castellation I/O pins to change
dimensions evenly, putting
In process zone P1, the PC
board and I/O pins are heated to
a temperature of 160°C to
activate the flux in the solder
paste. The temperature ramp up
rate, R1, is limited to 4°C per
second to allow for even heating
of both the PC board and ALPS
I/O pins.
connections. Beyond a dwell time
of 60 seconds, the intermetallic
minimal stresses on the ALPS.
8
Appendix A : SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal
Stencil Aperture
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL
APERTURE
LAND PATTERN
SOLDER
MASK
PCBA
Figure 7. Stencil and PCBA.
1.1 Recommended Land Pattern
4.7
1.5
0.6
1.27
3.14
C
L
MOUNTING
CENTER
C
UNITS: mm
L
Figure 8. Stencil and PCBA.
9
1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) thick
stencil be used for solder paste
printing. This is to ensure
APERTURES AS PER
LAND DIMENSION
adequate printed solder paste
volume and no shorting.
0.152
Aperture opening for shield pad
is 1.5 mm x 0.6 mm as per land
pattern.
4.7
3.14
Figure 9. Solder stencil aperture.
5.1
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
0.2 MIN.
C
L
4.8
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
SOLDER MASK
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
C
L
UNITS: mm
Figure 10. Adjacent land keepout and solder mask areas.
10
Appendix B: PCB Layout Suggestion
3. C1 and C2 are optional V
CC
filter capacitors. They may be
The following PCB layout shows a
recommended layout that should
result in good electrical and EMI
performance. Things to note:
left out if the V is clean.
CC
A reference layout of a 2-layer
Agilent evaluation board for
HSDL-9000 based on the
guidelines stated above is shown
below. For more details, please
refer to Agilent Application Note
1114, Infrared Transceiver PC
Board Layout for Noise
1. The ground plane should be
continuous under the part, but
should not extend under the
shield trace.
2. The shield trace is a wide, low
inductance trace back to the
system ground.
Immunity.
Top Layer
Bottom Layer
Figure 11. PCB layout suggestions.
11
Appendix C: Optical Window Design for HSDL-9000
Optical Window Dimensions
is a cylindrical piece of
transparent plastic which makes
use of total internal reflection to
focus the light.
To ensure that the performance
of the HSDL-9000 will not be
affected by improper window
design, there are some con-
The thickness of the window
should be kept as minimum as
possible because there is a loss of
power in every optical window of
about 8% due to reflection (4%
on each side) and an additional
loss of energy in the plastic
material.
straints on the dimensions and
design of the window. There is a
constraint on the minimum size
of the window, which is placed in
front of the photodiode, so that it
will not affect the angular
response of the HSDL-9000.
This minimum dimension that is
recommended will ensure at least
a ± 35° light reception cone.
Figure 12 illustrates the two
types of window that we have
recommended which could either
be a flat window or a flat window
with light pipe.
If a smaller window is required, a
light pipe or light guide can be
used. A light pipe or light guide
Figure 12. Recommended window design.
12
The table and figure below show
the recommended dimensions of
the window. These dimension
values are based on a window
thickness of 1.0 mm with a
refractive index 1.585.
Figure 13. Recommended window dimensions.
WD: Working Distance between window front panel & HSDL-9000
D1: Window Diameter
T:
L:
Thickness
Length of Light Pipe
D2: Light Pipe Diameter
Z:
Distance between window rear panel and HSDL-9000
Table 4. Recommended Dimension for Optical Window
Flat Window
(L = 0.0)
Flat Window with Light Pipe
(D2 = 1.5; z = 0.5)
WD
(T+L+Z)
Z
D1
D1
–
L
1.5
2.0
2.5
3.0
0.5
1.0
1.5
5.00
2.25
3.25
4.25
5.00
–
–
–
–
–
2.5
1.5
All Dimensions are in mm.
The window should be placed
directly on top of the photodiode
to achieve better performance
and if a flat window with a light
pipe is used, dimension D2
the PIN) to optimize the
performance of HSDL-9000.
Please refer to Figure 14 for the
top view of the placement of the
window.
should be 1.5 mm (same size as
13
Optical Window Material
The recommended plastic
material for use as a window is
available from Bayer AG and
Bayer Antwerp N. V. (Europe),
Bayer Corp.(USA) and Bayer
Polymers Co., Ltd. (Thailand).
The material of the window is
recommended to be
polycarbonate. The surface finish
of the plastic should be smooth,
without any texture.
Table 5. Recommended Plastic Material
Material Number
Makrolon LQ2647
Makrolon LQ3147
Makrolon LQ3187
Visible Light Transmission
Refractive Index
1.587
87%
87%
85%
1.587
1.587
Figure 14. Placement of the window.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/International),
or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2003 Agilent Technologies, Inc.
May 5, 2003
5988-9204EN
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