HSE-B1711-032 [CUI]

HEAT SINK;
HSE-B1711-032
型号: HSE-B1711-032
厂家: CUI INC    CUI INC
描述:

HEAT SINK

文件: 总4页 (文件大小:404K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
For more information, please visit the product page.  
date 05/09/2017  
page 1 of 4  
SERIES: HSE-BX-01 DESCRIPTION: HEAT SINK  
FEATURES  
• TO-220 package  
• round or slot hole option  
• low profile  
mounting hole  
thermal resistance1  
power  
MODEL  
dissipation1  
type  
size  
@ 75°C ΔT,  
nat conv  
(°C/W)  
@ 1 W,  
nat conv  
(°C/W)  
@ 1 W,  
200 LFM  
(°C/W)  
@ 1 W,  
400 LFM  
(°C/W)  
@ 75°C ΔT,  
nat conv  
(W)  
(mm)  
Ø3.8  
HSE-B2111-038  
HSE-B1711-032  
HSE-B1711-057  
round  
round  
slot  
19.74  
20.27  
24.19  
20.99  
22.39  
24.30  
6.12  
6.84  
7.07  
5.18  
5.05  
5.79  
3.80  
3.70  
3.10  
Ø3.2  
3.2 x 5.7  
Note:  
1. See performance curves for full thermal resistance details.  
PERFORMANCE CURVES  
HSE-B2111-038  
100  
90  
Without Airflow  
Heatsink Temperature Rise Above  
Ambient (ΔT = Ths - Ta) (°C)  
200 LFM  
400 LFM  
80  
70  
60  
50  
40  
30  
20  
Power  
(W)  
Natural  
Conv.  
200 LFM  
400 LFM  
0
1
2
3
4
5
0
0
0
20.99  
39.76  
59.46  
79.61  
97.29  
6.12  
5.18  
13.23  
19.90  
26.92  
34.35  
10.62  
15.87  
20.94  
26.37  
10  
0
Ths: “hot spot” temperature measured on the heatsink  
Ta: ambient temperature  
0
1
2
3
4
5
Dissipated Power (W)  
cui.com  
For more information, please visit the product page.  
CUI Inc SERIES: HSE-BX-01 DESCRIPTION: HEAT SINK  
date 05/09/2017page 2 of 4  
PERFORMANCE CURVES (CONTINUED)  
HSE-B1711-032  
100  
90  
Without Airflow  
200 LFM  
Heatsink Temperature Rise Above  
Ambient (ΔT = Ths - Ta) (°C)  
400 LFM  
80  
70  
60  
50  
40  
30  
20  
Power  
(W)  
Natural  
Conv.  
200 LFM  
400 LFM  
0
1
2
3
4
5
0
0
0
22.39  
44.78  
63.30  
79.94  
95.30  
6.84  
5.05  
13.44  
20.16  
26.86  
33.50  
9.99  
14.97  
19.95  
25.04  
Ths: “hot spot” temperature measured on the heatsink  
Ta: ambient temperature  
10  
0
0
1
2
3
4
5
Dissipated Power (W)  
HSE-B1711-057  
100  
90  
Without Airflow  
200 LFM  
Heatsink Temperature Rise Above  
Ambient (ΔT = Ths - Ta) (°C)  
80  
70  
60  
50  
40  
30  
20  
400 LFM  
Power  
(W)  
Natural  
Conv.  
200 LFM  
400 LFM  
0
1
2
3
4
5
0
0
0
24.30  
48.19  
72.44  
90.24  
109.19  
7.07  
5.79  
15.28  
22.86  
30.47  
38.84  
11.89  
17.72  
23.81  
29.57  
10  
0
Ths: “hot spot” temperature measured on the heatsink  
Ta: ambient temperature  
0
1
2
3
4
5
Dissipated Power (W)  
cui.com  
For more information, please visit the product page.  
CUI Inc SERIES: HSE-BX-01 DESCRIPTION: HEAT SINK  
date 05/09/2017page 3 of 4  
MECHANICAL DRAWING  
units: mm  
tolerance: ±0.5 mm  
MATERIAL  
FINISH  
AL 6063-T5  
black anodized  
4.4 g  
WEIGHT  
HSE-B2111-038  
HSE-B1711-057  
HSE-B1711-032  
cui.com  
For more information, please visit the product page.  
CUI Inc SERIES: HSE-BX-01 DESCRIPTION: HEAT SINK  
date 05/09/2017page 4 of 4  
REVISION HISTORY  
rev.  
description  
date  
1.0  
initial release  
05/09/2017  
The revision history provided is for informational purposes only and is believed to be accurate.  
Headquarters  
20050 SW 112th Ave.  
Tualatin, OR 97062  
800.275.4899  
Fax 503.612.2383  
cui.com  
techsupport@cui.com  
CUI offers a one (1) year limited warranty. Complete warranty information is listed on our website.  
CUI reserves the right to make changes to the product at any time without notice. Information provided by CUI is believed to be accurate and reliable. However, no responsibility is  
assumed by CUI for its use, nor for any infringements of patents or other rights of third parties which may result from its use.  
CUI products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any component of a  
life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.  

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