EVAL-ADMP401Z [ADI]
Omnidirectional Microphone with Bottom Port and Analog Output; 全向麦克风与底部端口和模拟输出
| 型号： | EVAL-ADMP401Z |
| 厂家： | 
ADI |
| 描述： | Omnidirectional Microphone with Bottom Port and Analog Output |
| 文件： | 总13页 (文件大小：462K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Omnidirectional Microphone with
Bottom Port and Analog Output
Data Sheet
ADMP401
FEATURES
FUNCTIONAL BLOCK DIAGRAM
4.72 mm × 3.76 mm × 1.0 mm surface-mount package
High SNR of 62 dBA
Sensitivity of −42 dBV
OUTPUT
OUTPUT
AMPLIFIER
Flat frequency response from 100 Hz to 15 kHz
Low current consumption of <250 μA
Single-ended analog output
POWER
High PSR of 70 dB
ADMP401
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
VDD GND
Figure 1.
APPLICATIONS
Smartphones and feature phones
Teleconferencing systems
Digital video cameras
Bluetooth headsets
Video phones
Tablets
GENERAL DESCRIPTION
The ADMP4011 is a high quality, high performance, low power,
analog output, bottom-ported omnidirectional MEMS
enables long battery life for portable applications. The ADMP401
complies with the TIA-920 standard, Telecommunications
Telephone Terminal Equipment Transmission Requirements for
Wideband Digital Wireline Telephones.
microphone. The ADMP401 consists of a MEMS microphone
element, an impedance converter, and an output amplifier. The
ADMP401 sensitivity specification makes it an excellent choice
for both near field and far field applications. The ADMP401 has
a high SNR and flat wideband frequency response, resulting in
natural sound with high intelligibility. Low current consumption
The ADMP401 is available in a thin, 4.72 mm × 3.76 mm ×
1.0 mm surface-mount package. It is reflow solder compatible
with no sensitivity degradation. The ADMP401 is halide free.
1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending.
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2010–2012 Analog Devices, Inc. All rights reserved.
IMPORTANT LINKS for the ADMP401*
Last content update 09/20/2013 09:49 pm
DOCUMENTATION
PARAMETRIC SELECTION TABLES
Find Similar Products By Operating Parameters
AN-1181: Using a MEMS Microphone in a 2-Wire Microphone Circuit
AN-1165: Op Amps for MEMS Microphone Preamp Circuits
AN-1140: Microphone Array Beamforming
Consider ADMP404: Omnidirectional Microphone with Bottom Port
and Analog Output
Consider ADMP405: Omnidirectional Microphone with Bottom Port
and Analog Output
AN-1124: Recommendations for Sealing Analog Devices, Inc., Bottom-
Port MEMS Microphones from Dust and Liquid Ingress
Consider ADMP421: Omnidirectional Microphone with Bottom Port
AN-1112: Microphone Specifications Explained
and Analog Output
AN-1068: Reflow Soldering of the MEMS Microphone
Consider ADMP441: Omnidirectional Microphone with Bottom Port
and Analog Output
AN-1003: Recommendations for Mounting and Connecting Analog
Devices, Inc., Bottom-Ported MEMS Microphones
Introducing iMEMS(R) Microphones This video compares the ADMP401
Analog MEMS and the ADMP421 Digital MEMS with a BK Type 4939
Measurement microphone.
Consider ADMP504: Omnidirectional Microphone with Bottom Port
and Analog Output
Consider ADMP521: Omnidirectional Microphone with Bottom Port
and Analog Output
UG-278: EVAL-ADMP401Z-FLEX: Bottom-Ported Analog Output MEMS
Microphone Evaluation Board
UG-126: EVAL-ADMP401Z Bottom-Ported Analog Output MEMS
Microphone Evaluation Board
DESIGN COLLABORATION COMMUNITY
MS-2472: Analog and Digital MEMS Microphone Design
Considerations
MS-2275: Common Inter-IC Digital Interfaces for Audio Data Transfer
A History of Consumer Microphones:
Collaborate Online with the ADI support team and other designers
about select ADI products.
Industrial ICs Solutions Bulletin, Volume 10, Issue 8
Industrial ICs
Follow us on Twitter: www.twitter.com/ADI_News
Like us on Facebook: www.facebook.com/AnalogDevicesInc
DESIGN TOOLS, MODELS, DRIVERS & SOFTWARE
DESIGN SUPPORT
Microphone Beamforming Simulation Tool (32-bit)
Submit your support request here:
Linear and Data Converters
Embedded Processing and DSP
- Documentation for the microphone beamforming simulator
Microphone Beamforming Simulation Tool (64-bit)
- Documentation for the microphone beamforming simulator
Telephone our Customer Interaction Centers toll free:
Americas:
Europe:
China:
1-800-262-5643
00800-266-822-82
4006-100-006
India:
Russia:
1800-419-0108
8-800-555-45-90
PRODUCT RECOMMENDATIONS & REFERENCE DESIGNS
CN-0262: Low Noise Analog MEMS Microphone and Preamp with
Compression and Noise Gating
Quality and Reliability
Lead(Pb)-Free Data
CN-0207: High Performance Analog MEMS Microphone's Simple
Interface to SigmaDSP Audio Codec
SAMPLE & BUY
ADMP401
EVALUATION KITS & SYMBOLS & FOOTPRINTS
MEMS Microphone Evaluation Boards
View Price & Packaging
ADMP401Z Evaluation Board
ADMP401 Flex Evaluation Board
Symbols and Footprints
Request Evaluation Board
Request Samples
Check Inventory & Purchase
Find Local Distributors
* This page was dynamically generated by Analog Devices, Inc. and inserted into this data sheet.
Note: Dynamic changes to the content on this page (labeled 'Important Links') does not
constitute a change to the revision number of the product data sheet.
This content may be frequently modified.
ADMP401
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Connecting the ADMP401 to a Codec ......................................8
Connecting the ADMP401 to an Op Amp Gain Stage ............8
Supporting Documents ................................................................8
Handling Instructions.......................................................................9
Pick-and-Place Equipment ..........................................................9
Reflow Solder.................................................................................9
Board Wash ....................................................................................9
Reliability Specifications................................................................ 10
Outline Dimensions....................................................................... 11
Ordering Guide .......................................................................... 11
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Printed Circuit Board (PCB) Land Pattern Layout...................... 6
Typical Performance Characteristics ............................................. 7
Applications Information ................................................................ 8
REVISION HISTORY
7/12—Rev. D to Rev. E
8/11—Rev. B to Rev. C
Changes to Features Section, General Description Section, and
Page 1 Layout .................................................................................... 1
Add Note 1......................................................................................... 1
Changes to Frequency Response Parameter, Table 1 and Powers
Supply Rejection Parameter, Table 1.............................................. 3
Changes to Temperature Range Parameter, Table 2..................... 4
Changes to Figure 6, Figure 7, and Figure 8.................................. 7
Changes to Applications Information Section and Figure 10..... 8
Added Supporting Documents Section, Application Notes
Section, Circuit Notes Section, and Evaluation Board User
Guides Section .................................................................................. 8
Changes to THB Description Column, Table 5 and Temperature
Cycle Column, Table 5 ................................................................... 10
Changes to Ordering Guide .......................................................... 11
Changes to Figure 1...........................................................................1
Changes to Table 3.............................................................................4
Removed Terminal Side Down from Figure 3...............................5
Changes to Bullet 2 in Pick-and-Place Equipment Section.........9
Changes to Ordering Guide.......................................................... 11
12/10—Rev. A to Rev. B
Changes to Applications and General Description Sections.......1
Changes to Table 1.............................................................................3
8/10—Rev. 0 to Rev. A
Changes to Frequency Response Parameter, Table 1....................3
Changes to Supply Voltage Parameter, Table 2..............................4
Changes to Applications Information Section, Figure 9, and
Figure 10 .............................................................................................8
Updated Outline Dimensions....................................................... 11
1/12—Rev. C to Rev. D
Updated Outline Dimensions....................................................... 11
Changes to Figure 12...................................................................... 11
Added Figure 13.............................................................................. 11
Change to Ordering Guide............................................................ 11
4/10—Revision 0: Initial Version
Rev. E | Page 2 of 12
Data Sheet
ADMP401
SPECIFICATIONS
TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not
guaranteed.
Table 1.
Parameter
Symbol Test Conditions/Comments
Min Typ
Omni
Max Unit
PERFORMANCE
Directionality
Sensitivity
1 kHz, 94 dB SPL
−45 −42
−39
dBV
dBA
dBA SPL
dB
Hz
kHz
dB
%
dB
dB SPL
Signal-to-Noise Ratio
Equivalent Input Noise
Dynamic Range
Frequency Response1
SNR
EIN
62
32
88
60
15
Derived from EIN and maximum acoustic input
Low frequency, −3 dB point
High frequency, −3 dB point
Deviation limits from flat response within pass band
105 dB SPL
217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V
Peak
−3/+2
Total Harmonic Distortion
Power Supply Rejection
Maximum Acoustic Input
POWER SUPPLY
THD
PSR
3
70
120
Supply Voltage
Supply Current
VDD
IS
1.5
3.3
250
V
µA
OUTPUT CHARACTERISTICS
Output Impedance
Output DC Offset
ZOUT
200
0.8
90
Ω
V
µA
Output Current Limit
1 See Figure 6 and Figure 7.
Rev. E | Page 3 of 12
ADMP401
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
ESD CAUTION
Parameter
Rating
Supply Voltage
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
−0.3 V to +3.6 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007,
Test Condition B
Temperature Range
−40°C to +85°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t
25°C TO PEAK
TIME
Figure 2. Recommended Soldering Profile Limits
Table 3. Recommended Soldering Profile Limits
Profile Feature
Sn-Pb
Pb Free
Average Ramp Rate (TL to TP)
Preheat
1.25°C/sec maximum
1.25°C/sec maximum
Minimum Temperature (TSMIN
)
100°C
100°C
Maximum Temperature (TSMAX
)
150°C
200°C
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
60 sec to 75 sec
1.25°C/sec
60 sec to 75 sec
1.25°C/sec
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
45 sec to 75 sec
183°C
~50 sec
217°C
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec maximum
5 min maximum
245°C +0°C/−5°C
20 sec to 30 sec
3°C/sec maximum
5 min maximum
Time 25°C (t25°C) to Peak Temperature
Rev. E | Page 4 of 12
Data Sheet
ADMP401
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
OUTPUT
GND
2
1
GND
3
GND
6
V
DD
4
5
GND
BOTTOM VIEW
Not to Scale
Figure 3. Pin Configuration (Bottom View)
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
OUTPUT
GND
GND
GND
Description
1
2
3
4
5
6
Analog Output Signal
Ground
Ground
Ground
Power Supply
Ground
VDD
GND
Rev. E | Page 5 of 12
ADMP401
Data Sheet
PRINTED CIRCUIT BOARD (PCB) LAND PATTERN LAYOUT
The recommended PCB land pattern for the ADMP401 should
have a 1:1 ratio to the solder pads on the microphone package,
as shown in Figure 4. Take care to avoid applying solder paste to
the sound hole in the PCB.
A suggested solder paste stencil pattern layout is shown in
Figure 5. The diameter of the sound hole in the PCB should be
larger than the diameter of the sound port of the microphone.
A minimum diameter of 0.5 mm is recommended.
2.62
ø0.90 (3×)
ø1.10
ø1.68
2.54
2.40
1.20
1.27
ø0.70 (2×)
0.79
Figure 4. PCB Land Pattern Layout (Dimensions Shown in mm)
1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×)
0.649mm DIA. (2×)
0.85mm DIA. (3×)
2.4mm
1.2mm
2.54mm
1.27mm
2.62mm
3.41mm
Figure 5. Suggested Solder Paste Stencil Pattern Layout
Rev. E | Page 6 of 12
Data Sheet
ADMP401
TYPICAL PERFORMANCE CHARACTERISTICS
0
–10
–20
–30
–40
–50
–60
–70
–80
10
8
6
4
2
0
–2
–4
–6
–8
–10
50
100
1k
10k
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 6. Frequency Response Mask
Figure 8. Typical Power Supply Rejection vs. Frequency
10
0
–10
–20
10
100
1k
10k
FREQUENCY (Hz)
Figure 7. Typical Frequency Response (Measured)
Rev. E | Page 7 of 12
ADMP401
Data Sheet
APPLICATIONS INFORMATION
The ADMP401 output can be connected to a dedicated codec
microphone input (see Figure 9) or to a high input impedance
gain stage (see Figure 10). A 0.1 µF ceramic capacitor placed
close to the ADMP401 supply pin is used for testing and is
recommended to adequately decouple the microphone from
noise on the power supply. A dc-blocking capacitor is required
at the output of the microphone. This capacitor creates a high-
pass filter with a corner frequency at
CONNECTING THE ADMP401 TO AN OP AMP
GAIN STAGE
GAIN = (R + R )/R
1
1
2
0.1µF
R
R
2
1
V
DD
V
REF
1µF
MINIMUM
ADMP401
OUTPUT
V
O
ADA4897-1
10kΩ
fC = 1/(2π × C × R)
GND
V
REF
where R is the input impedance of the codec.
Figure 10. ADMP401 Connected to the ADA4897-1 Op Amp
A minimum value of 2.2 µF is recommended in Figure 9
because the input impedance of the ADAU1361/ADAU1761
can be as low as 2 kΩ at its highest PGA gain setting, which
results in a high-pass filter corner frequency at about 37 Hz.
Figure 10 shows the ADMP401 connected to the ADA4897-1
op amp configured as a noninverting preamplifier.
SUPPORTING DOCUMENTS
Application Notes
AN-1003, Recommendations for Mounting and Connecting
Analog Devices, Inc., Bottom-Ported MEMS Microphones
AN-1068, Reflow Soldering of the MEMS Microphone
AN-1112, Microphone Specifications Explained
CONNECTING THE ADMP401 TO A CODEC
MICBIAS
0.1µF
AN-1124, Recommendations for Sealing Analog Devices, Inc.,
Bottom-Port MEMS Microphones from Dust and Liquid
Ingress
ADAU1761
V
DD
OR
ADAU1361
2.2µF
MINIMUM
ADMP401
OUTPUT
AN-1140, Microphone Array Beamforming
LINN
Circuit Notes
GND
CN-0207, High Performance Analog MEMS Microphone’s Simple
Interface to SigmaDSP Audio Codec
LINP
CM
CN-0262, Low Noise Analog MEMS Microphone and Preamp
with Compression and Noise Gating
Figure 9. ADMP401 Connected to the Analog Devices ADAU1761 or
ADAU1361 Codec
Evaluation Board User Guides
UG-126, EVAL-ADMP401Z: Bottom-Ported Analog Output MEMS
Microphone Evaluation Board
UG-278, EVAL-ADMP401Z-FLEX: Bottom-Ported Analog
Output MEMS Microphone Evaluation Board
Rev. E | Page 8 of 12
Data Sheet
ADMP401
HANDLING INSTRUCTIONS
PICK-AND-PLACE EQUIPMENT
REFLOW SOLDER
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste that is used to attach the MEMS microphone to the PCB.
It is recommended that the solder reflow profile not exceed the
limit conditions specified in Figure 2 and Table 3.
•
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
BOARD WASH
When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.
•
•
Use care during pick-and-place to ensure that no high
shock events above 10 kg are experienced because such
events may cause damage to the microphone.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out or blow air into the microphone port.
Do not use excessive force to place the microphone on
the PCB.
•
•
Rev. E | Page 9 of 12
ADMP401
Data Sheet
RELIABILITY SPECIFICATIONS
The microphone sensitivity after stress must deviate by no more than 3 dB from the initial value.
Table 5.
Stress Test
Description
Low Temperature Operating Life
High Temperature Operating Life
THB
−40°C, 500 hours, powered
+125°C, 500 hours, powered
+85°C/85% relative humidity, 500 hours, powered
−40°C/+125°C, one cycle per hour, 1000 cycles
+150°C, 500 hours
−40°C, 500 hours
All pins, 0.5 kV
All pins, 1.5 kV
All pins, 0.2 kV
Temperature Cycle
High Temperature Storage
Low Temperature Storage
Component CDM ESD
Component HBM ESD
Component MM ESD
Rev. E | Page 10 of 12
Data Sheet
ADMP401
OUTLINE DIMENSIONS
4.82
4.72
4.62
3.30 REF
2.62 BSC
REFERENCE
CORNER
0.79 BSC
4.10 REF
PIN 1
0.90 DIA.
(PINS 1, 5, 6)
1
6
2
1.68 DIA.
3.86
3.76
3.66
3
2.54
BSC
2.40 BSC
1.10 DIA.
3.14
REF
1.27 BSC
(THRU HOLE)
1.20 BSC
0.25 DIA.
5
4
0.61 REF
0.70 DIA.
(PINS 2, 4)
0.68 REF
TOP VIEW
SIDE VIEW
BOTTOM VIEW
1.10
1.00
0.90
0.73 REF
0.24 REF
Figure 11. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
4.72 mm × 3.76 mm Body
(CE-6-1)
Dimensions shown in millimeters
DIRECTION OF FEED
PIN 1
Figure 12. Microphone Orientation in Tape Until Date Code 1213
DIRECTION OF FEED
PIN 1
Figure 13. Microphone Orientation in Tape Starting with Date Code 1213
ORDERING GUIDE
Model1
ADMP401ACEZ-RL
ADMP401ACEZ-RL7
EVAL-ADMP401Z
EVAL-ADMP401Z-FLEX
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option2
CE-6-1
Ordering Quantity
6-Terminal LGA_CAV, 13”Tape and Reel
6-Terminal LGA_CAV, 7”Tape and Reel
Evaluation Board
4,500
1,000
CE-6-1
Evaluation Board
1 Z = RoHS Compliant Part.
2 The CE-6-1 package option is halide free.
Rev. E | Page 11 of 12
ADMP401
NOTES
Data Sheet
©2010–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07712-0-7/12(E)
Rev. E | Page 12 of 12
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