EVAL-ADMP404Z [ADI]
Omnidirectional Microphone with Bottom Port and Analog Output; 全向麦克风与底部端口和模拟输出型号: | EVAL-ADMP404Z |
厂家: | ADI |
描述: | Omnidirectional Microphone with Bottom Port and Analog Output |
文件: | 总12页 (文件大小:344K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Omnidirectional Microphone with
Bottom Port and Analog Output
ADMP404
Preliminary Technical Data
FEATURES
GENERAL DESCRIPTION
Tiny 3.35 mm × 2.50 mm × 0.88 mm surface-mount package
High SNR of 62 dBA
High sensitivity of −38 dBV
Flat frequency response from 100 Hz to 15 kHz
Low current consumption: <250 µA
Single-ended analog output
High PSRR of 70 dB
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
The ADMP404 is a high quality, low cost, low power, analog
output bottom-ported omnidirectional MEMS microphone.
The ADMP404 consists of a MEMS microphone element, an
impedance converter, and an output amplifier. The ADMP404
sensitivity specification makes it an excellent choice for both
near field and far field applications. The ADMP404 has a high
SNR and flat, wideband frequency response, resulting in natural
sound with high intelligibility. Low current consumption
enables long battery life for portable applications. A built-in
particle filter provides high reliability. The ADMP404 complies
with the TIA-920 Telecommunications Telephone Terminal
Equipment Transmission Requirements for Wideband Digital
Wireline Telephones standard.
APPLICATIONS
Smartphones and feature phones
Digital video cameras
Bluetooth headsets
Video phones
Teleconferencing systems
The ADMP404 is available in an ultraminiature 3.35 mm ×
2.50 mm × 0.88 mm surface-mount package. It is reflow solder
compatible with no sensitivity degradation. The ADMP404 is
halide free.
FUNCTIONAL BLOCK DIAGRAM
ASIC
MEMS
V
DD
ADMP404
MEMBRANE
BACKPLATE
IMPEDANCE
CONVERTER
OUTPUT
GND
OUTPUT AMPLIFIER
Figure 1.
Rev. PrH
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed byAnalog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksare the property oftheir respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2010 Analog Devices, Inc. All rights reserved.
ADMP404
Preliminary Technical Data
TABLE OF CONTENTS
Features .............................................................................................. 1
Connecting the ADMP404 to a Codec.......................................7
Connecting the ADMP404 to an Op Amp Gain Stage.............7
PCB Land Pattern Layout.................................................................8
Handling Instructions.......................................................................9
Pick and Place Equipment ...........................................................9
Reflow Solder.................................................................................9
Board Wash ....................................................................................9
Reliability Specifications................................................................ 10
Outline Dimensions........................................................................11
Ordering Guide ...........................................................................11
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Typical Performance Characteristics ............................................. 6
Applications Information ................................................................ 7
REVISION HISTORY
Rev. PrH | Page 2 of 12
Preliminary Technical Data
SPECIFICATIONS
ADMP404
TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not
guaranteed.
Table 1.
Parameter
Symbol Test Conditions/Comments
Min
Typ
Max
Unit
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio
Equivalent Input Noise
Frequency Response1
Omni
−38
62
32
100
15
1 kHz, 94 dB SPL
SNR
EIN
−41
−35
dBV
dBA
dBA SPL
Hz
Low frequency –3 dB point
High frequency –3 dB point
kHz
dB
%
Deviation from flat response within pass band −3
105 dB SPL
+2
3
Total Harmonic Distortion
THD
Power Supply Rejection Ratio PSRR
217 Hz, 100 mV p-p square wave
superimposed on VDD = 1.8 V
70
dB
Maximum Acoustic Input
POWER SUPPLY
Peak
120
dB SPL
Supply Voltage
Supply Current
VDD
IS
1.5
3.6
250
V
µA
OUTPUT CHARACTERISTICS
Output impedance
Output DC Offset
Output Current Limit
Polarity
ZOUT
200
0.8
90
Ω
V
µA
Noninverting2
1 See Figure 4 and Figure 6.
2 Positive going (increasing) pressure on the membrane results in a positive going (increasing) output voltage.
Rev. PrH | Page 3 of 12
ADMP404
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 2.
Parameter
Rating
3.6 V
Supply Voltage
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
160 dB
10,000 g
Per MIL-STD-883 Method 2007,
Test Condition B
Temperature Range
−40°C to +70°C
ESD CAUTION
CRITICAL ZONE
tP
T
TO T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK
TIME
Figure 2. Recommended Soldering Profile Limits
Table 3. Recommended Soldering Profile Limits
Profile Feature
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
Preheat
3°C/sec max
3°C/sec max
Minimum Temperature (TSMIN
Maximum Temperature (TSMAX
)
100°C
150°C
150°C
200°C
)
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
60 sec to 120 sec
3°C/sec
60 sec to 120 sec
3°C/sec
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
60 sec to 150 sec
183°C
60 sec to 150 sec
217°C
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
240°C + 0°C/−5°C
10 sec to 30 sec
6°C/sec max
6 minute max
260°C + 0°C/−5°C
20 sec to 40 sec
6°C/sec max
8 minute max
Time 25°C (t25°C) to Peak Temperature
Rev. PrH | Page 4 of 12
Preliminary Technical Data
ADMP404
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
2
1
OUTPUT
3
V
DD
ADMP404
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
OUTPUT
GND
Description
Analog Output Signal.
Ground.
1
2
3
VDD
Power Supply.
Rev. PrH | Page 5 of 12
ADMP404
Preliminary Technical Data
TYPICAL PERFORMANCE CHARACTERISTICS
10
8
10
6
4
0
2
0
–2
–4
–6
–8
–10
–10
–20
100
1k
10k
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 4. Frequency Response Mask
Figure 6. Typical Frequency Response (Measured)
0
–10
–20
–30
–40
–50
–60
–70
–80
100
1k
10k
FREQUENCY (Hz)
Figure 5. Typical Power Supply Rejection Ratio vs. Frequency
Rev. PrH | Page 6 of 12
Preliminary Technical Data
ADMP404
APPLICATIONS INFORMATION
The ADMP404 output can be connected to a dedicated codec
microphone input (see Figure 7) or to a high input impedance
gain stage (see Figure 8). A 0.1 µF ceramic capacitor (C1) at VDD
placed close to the ADMP404 supply pins is used for testing and
is recommended to adequately decouple the microphone from
noise on the power supply. A 1 µF or larger dc-blocking tantalum
capacitor (C2) is required at the output of the microphone.
CONNECTING THE ADMP404 TO AN OP AMP GAIN
STAGE
C1
0.1µF
V
DD
GND
C2
1µF
OUTPUT
3
2
7
U1
6
R1
10kΩ
OP177
ADMP404
4
CONNECTING THE ADMP404 TO A CODEC
C1
0.1µF
GAIN = (R2 + R3)/R3
GND
R2
V
DD
R3
GND
GND
ADAU1761
MIC INPUT
C2
1µF
OUTPUT
Figure 8. ADMP404 Connected to the OP177 Op Amp
ADMP404
GND
GND
Figure 7. ADMP404 Connected to the Analog Devices ADAU1761 Codec
Rev. PrH | Page 7 of 12
ADMP404
Preliminary Technical Data
PCB LAND PATTERN LAYOUT
The recommended PCB land pattern for the ADMP404 should
be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 9. Care should be taken to avoid
applying solder paste to the sound hole in the PCB. A suggested
solder paste stencil pattern layout is shown in Figure 10. The
diameter of the sound hole in the PCB should be larger than the
diameter of the sound port of the microphone. A minimum
diameter of 0.5 mm is recommended.
1.52
0.68
1.22
0.61
Ø1.55
1.90
Ø0.95
0.61
0.90
Figure 9. PCB Land Pattern Layout
1.55/1.05 DIA.
0.225 CUT WIDTH (2×)
0.8 × 0.6
2×
1.22
0.2 × 45
TYP
1.52mm
Figure 10. Suggested Solder Paste Stencil Pattern Layout
Rev. PrH | Page 8 of 12
Preliminary Technical Data
ADMP404
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
REFLOW SOLDER
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the limit
conditions specified in Figure 2 and Table 3.
•
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
BOARD WASH
When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.
•
•
•
Use care during pick-and-place to ensure that no high
shock events above 20 kg are experienced because such
events may cause damage to the microphone.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on
the PCB.
Rev. PrH | Page 9 of 12
ADMP404
Preliminary Technical Data
RELIABILITY SPECIFICATIONS
The microphone sensitivity after stress must deviate by no more than 3 dB from the initial value.
Table 5.
Stress Test
Description
Low Temperature Operating Life
High Temperature Operating Life
THB
−40°C, 500 hours, powered
+125°C, 500 hours, powered
+65°C/85% relative humidity (RH), 500 hours, powered
−40°C/+125°C, one cycle per hours, 100 cycles
+150°C, 500 hours
−40°C, 500 hours
All pins, 0.5 kV
All pins, 1.5 kV
All pins, 0.2 kV
Temperature Cycle
High Temperature Storage
Low Temperature Storage
Component CDM ESD
Component HBM ESD
Component MM ESD
Rev. PrH | Page 10 of 12
Preliminary Technical Data
OUTLINE DIMENSIONS
ADMP404
3.425
3.350
0.75 REF
1.52
1.08
0.30
3.275
REFERENCE
CORNER
0.30 BSC
0.25 NOM
0.20 MIN
BSC
DIA.
THRU HOLE
(SOUND PORT)
3.06 REF
0.90 × 0.68
(PINS 1, 3)
1.56 DIA.
1
0.95 DIA.
2.575
2.500
2.425
0.54
REF
2
1.22 BSC
2.21
REF
1.25
3
TOP VIEW
0.64 REF
BOTTOM VIEW
0.20 TYP
× 45°
0.98
0.88
0.78
0.65 REF
SIDE VIEW
0.21 REF
Figure 11. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
3.35 mm × 2.50 mm Body
(CE-3-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADMP404ACEZ
ADMP404ACEZ-RL
ADMP404ACEZ-RL7
EVAL-ADMP404Z
Temperature Range
−40°C to +70°C
−40°C to +70°C
−40°C to +70°C
Package Description
3-Terminal LGA_CAV
3-Terminal LGA_CAV, 13”Tape and Reel
3-Terminal LGA_CAV, 7”Tape and Reel
Evaluation Board
Package Option
CE-3-22
Ordering Quantity
1
10,000
1,000
CE-3-22
CE-3-22
1 Z = RoHS Compliant Part.
2 This package option is halide free.
Rev. PrH | Page 11 of 12
ADMP404
NOTES
Preliminary Technical Data
©2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR09027-0-4/10(PrH)
Rev. PrH | Page 12 of 12
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