EVAL-ADMP404Z [ADI]

Omnidirectional Microphone with Bottom Port and Analog Output; 全向麦克风与底部端口和模拟输出
EVAL-ADMP404Z
型号: EVAL-ADMP404Z
厂家: ADI    ADI
描述:

Omnidirectional Microphone with Bottom Port and Analog Output
全向麦克风与底部端口和模拟输出

文件: 总12页 (文件大小:344K)
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Omnidirectional Microphone with  
Bottom Port and Analog Output  
ADMP404  
Preliminary Technical Data  
FEATURES  
GENERAL DESCRIPTION  
Tiny 3.35 mm × 2.50 mm × 0.88 mm surface-mount package  
High SNR of 62 dBA  
High sensitivity of −38 dBV  
Flat frequency response from 100 Hz to 15 kHz  
Low current consumption: <250 µA  
Single-ended analog output  
High PSRR of 70 dB  
Compatible with Sn/Pb and Pb-free solder processes  
RoHS/WEEE compliant  
The ADMP404 is a high quality, low cost, low power, analog  
output bottom-ported omnidirectional MEMS microphone.  
The ADMP404 consists of a MEMS microphone element, an  
impedance converter, and an output amplifier. The ADMP404  
sensitivity specification makes it an excellent choice for both  
near field and far field applications. The ADMP404 has a high  
SNR and flat, wideband frequency response, resulting in natural  
sound with high intelligibility. Low current consumption  
enables long battery life for portable applications. A built-in  
particle filter provides high reliability. The ADMP404 complies  
with the TIA-920 Telecommunications Telephone Terminal  
Equipment Transmission Requirements for Wideband Digital  
Wireline Telephones standard.  
APPLICATIONS  
Smartphones and feature phones  
Digital video cameras  
Bluetooth headsets  
Video phones  
Teleconferencing systems  
The ADMP404 is available in an ultraminiature 3.35 mm ×  
2.50 mm × 0.88 mm surface-mount package. It is reflow solder  
compatible with no sensitivity degradation. The ADMP404 is  
halide free.  
FUNCTIONAL BLOCK DIAGRAM  
ASIC  
MEMS  
V
DD  
ADMP404  
MEMBRANE  
BACKPLATE  
IMPEDANCE  
CONVERTER  
OUTPUT  
GND  
OUTPUT AMPLIFIER  
Figure 1.  
Rev. PrH  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed byAnalog Devices for its use, nor for any infringements of patents or other  
rightsof third parties that may result fromits use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarksandregisteredtrademarksare the property oftheir respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2010 Analog Devices, Inc. All rights reserved.  
 
 
 
 
ADMP404  
Preliminary Technical Data  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Connecting the ADMP404 to a Codec.......................................7  
Connecting the ADMP404 to an Op Amp Gain Stage.............7  
PCB Land Pattern Layout.................................................................8  
Handling Instructions.......................................................................9  
Pick and Place Equipment ...........................................................9  
Reflow Solder.................................................................................9  
Board Wash ....................................................................................9  
Reliability Specifications................................................................ 10  
Outline Dimensions........................................................................11  
Ordering Guide ...........................................................................11  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Functional Block Diagram .............................................................. 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Absolute Maximum Ratings............................................................ 4  
ESD Caution.................................................................................. 4  
Pin Configuration and Function Descriptions............................. 5  
Typical Performance Characteristics ............................................. 6  
Applications Information ................................................................ 7  
REVISION HISTORY  
Rev. PrH | Page 2 of 12  
 
Preliminary Technical Data  
SPECIFICATIONS  
ADMP404  
TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not  
guaranteed.  
Table 1.  
Parameter  
Symbol Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
PERFORMANCE  
Directionality  
Sensitivity  
Signal-to-Noise Ratio  
Equivalent Input Noise  
Frequency Response1  
Omni  
−38  
62  
32  
100  
15  
1 kHz, 94 dB SPL  
SNR  
EIN  
−41  
−35  
dBV  
dBA  
dBA SPL  
Hz  
Low frequency –3 dB point  
High frequency –3 dB point  
kHz  
dB  
%
Deviation from flat response within pass band −3  
105 dB SPL  
+2  
3
Total Harmonic Distortion  
THD  
Power Supply Rejection Ratio PSRR  
217 Hz, 100 mV p-p square wave  
superimposed on VDD = 1.8 V  
70  
dB  
Maximum Acoustic Input  
POWER SUPPLY  
Peak  
120  
dB SPL  
Supply Voltage  
Supply Current  
VDD  
IS  
1.5  
3.6  
250  
V
µA  
OUTPUT CHARACTERISTICS  
Output impedance  
Output DC Offset  
Output Current Limit  
Polarity  
ZOUT  
200  
0.8  
90  
Ω
V
µA  
Noninverting2  
1 See Figure 4 and Figure 6.  
2 Positive going (increasing) pressure on the membrane results in a positive going (increasing) output voltage.  
Rev. PrH | Page 3 of 12  
 
 
ADMP404  
Preliminary Technical Data  
ABSOLUTE MAXIMUM RATINGS  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 2.  
Parameter  
Rating  
3.6 V  
Supply Voltage  
Sound Pressure Level (SPL)  
Mechanical Shock  
Vibration  
160 dB  
10,000 g  
Per MIL-STD-883 Method 2007,  
Test Condition B  
Temperature Range  
−40°C to +70°C  
ESD CAUTION  
CRITICAL ZONE  
tP  
T
TO T  
L
P
T
P
RAMP-UP  
T
L
tL  
T
SMAX  
T
SMIN  
tS  
RAMP-DOWN  
PREHEAT  
t25°C TO PEAK  
TIME  
Figure 2. Recommended Soldering Profile Limits  
Table 3. Recommended Soldering Profile Limits  
Profile Feature  
Sn63/Pb37  
Pb-Free  
Average Ramp Rate (TL to TP)  
Preheat  
3°C/sec max  
3°C/sec max  
Minimum Temperature (TSMIN  
Maximum Temperature (TSMAX  
)
100°C  
150°C  
150°C  
200°C  
)
Time (TSMIN to TSMAX), tS  
Ramp-Up Rate (TSMAX to TL)  
60 sec to 120 sec  
3°C/sec  
60 sec to 120 sec  
3°C/sec  
Time Maintained Above Liquidous (tL)  
Liquidous Temperature (TL)  
60 sec to 150 sec  
183°C  
60 sec to 150 sec  
217°C  
Peak Temperature (TP)  
Time Within 5°C of Actual Peak Temperature (tP)  
Ramp-Down Rate  
240°C + 0°C/−5°C  
10 sec to 30 sec  
6°C/sec max  
6 minute max  
260°C + 0°C/−5°C  
20 sec to 40 sec  
6°C/sec max  
8 minute max  
Time 25°C (t25°C) to Peak Temperature  
Rev. PrH | Page 4 of 12  
 
 
 
 
Preliminary Technical Data  
ADMP404  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
GND  
2
1
OUTPUT  
3
V
DD  
ADMP404  
TOP VIEW  
(TERMINAL SIDE DOWN)  
Not to Scale  
Figure 3. Pin Configuration  
Table 4. Pin Function Descriptions  
Pin No.  
Mnemonic  
OUTPUT  
GND  
Description  
Analog Output Signal.  
Ground.  
1
2
3
VDD  
Power Supply.  
Rev. PrH | Page 5 of 12  
 
ADMP404  
Preliminary Technical Data  
TYPICAL PERFORMANCE CHARACTERISTICS  
10  
8
10  
6
4
0
2
0
–2  
–4  
–6  
–8  
–10  
–10  
–20  
100  
1k  
10k  
100  
1k  
10k  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
Figure 4. Frequency Response Mask  
Figure 6. Typical Frequency Response (Measured)  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
100  
1k  
10k  
FREQUENCY (Hz)  
Figure 5. Typical Power Supply Rejection Ratio vs. Frequency  
Rev. PrH | Page 6 of 12  
 
 
 
Preliminary Technical Data  
ADMP404  
APPLICATIONS INFORMATION  
The ADMP404 output can be connected to a dedicated codec  
microphone input (see Figure 7) or to a high input impedance  
gain stage (see Figure 8). A 0.1 µF ceramic capacitor (C1) at VDD  
placed close to the ADMP404 supply pins is used for testing and  
is recommended to adequately decouple the microphone from  
noise on the power supply. A 1 µF or larger dc-blocking tantalum  
capacitor (C2) is required at the output of the microphone.  
CONNECTING THE ADMP404 TO AN OP AMP GAIN  
STAGE  
C1  
0.1µF  
V
DD  
GND  
C2  
1µF  
OUTPUT  
3
2
7
U1  
6
R1  
10k  
OP177  
ADMP404  
4
CONNECTING THE ADMP404 TO A CODEC  
C1  
0.1µF  
GAIN = (R2 + R3)/R3  
GND  
R2  
V
DD  
R3  
GND  
GND  
ADAU1761  
MIC INPUT  
C2  
1µF  
OUTPUT  
Figure 8. ADMP404 Connected to the OP177 Op Amp  
ADMP404  
GND  
GND  
Figure 7. ADMP404 Connected to the Analog Devices ADAU1761 Codec  
Rev. PrH | Page 7 of 12  
 
 
 
 
 
ADMP404  
Preliminary Technical Data  
PCB LAND PATTERN LAYOUT  
The recommended PCB land pattern for the ADMP404 should  
be laid out to a 1:1 ratio to the solder pads on the microphone  
package, as shown in Figure 9. Care should be taken to avoid  
applying solder paste to the sound hole in the PCB. A suggested  
solder paste stencil pattern layout is shown in Figure 10. The  
diameter of the sound hole in the PCB should be larger than the  
diameter of the sound port of the microphone. A minimum  
diameter of 0.5 mm is recommended.  
1.52  
0.68  
1.22  
0.61  
Ø1.55  
1.90  
Ø0.95  
0.61  
0.90  
Figure 9. PCB Land Pattern Layout  
1.55/1.05 DIA.  
0.225 CUT WIDTH (2×)  
0.8 × 0.6  
2×  
1.22  
0.2 × 45  
TYP  
1.52mm  
Figure 10. Suggested Solder Paste Stencil Pattern Layout  
Rev. PrH | Page 8 of 12  
 
 
 
Preliminary Technical Data  
ADMP404  
HANDLING INSTRUCTIONS  
PICK AND PLACE EQUIPMENT  
REFLOW SOLDER  
The MEMS microphone can be handled using standard pick-  
and-place and chip shooting equipment. Care should be taken  
to avoid damage to the MEMS microphone structure as follows:  
For best results, the soldering profile should be in accordance  
with the recommendations of the manufacturer of the solder  
paste used to attach the MEMS microphone to the PCB. It is  
recommended that the solder reflow profile not exceed the limit  
conditions specified in Figure 2 and Table 3.  
Use a standard pickup tool to handle the microphone.  
Because the microphone hole is on the bottom of the  
package, the pickup tool can make contact with any part  
of the lid surface.  
BOARD WASH  
When washing the PCB, ensure that water does not make  
contact with the microphone port. Blow-off procedures and  
ultrasonic cleaning must not be used.  
Use care during pick-and-place to ensure that no high  
shock events above 20 kg are experienced because such  
events may cause damage to the microphone.  
Do not pick up the microphone with a vacuum tool that  
makes contact with the bottom side of the microphone.  
Do not pull air out of or blow air into the microphone port.  
Do not use excessive force to place the microphone on  
the PCB.  
Rev. PrH | Page 9 of 12  
 
 
 
 
ADMP404  
Preliminary Technical Data  
RELIABILITY SPECIFICATIONS  
The microphone sensitivity after stress must deviate by no more than 3 dB from the initial value.  
Table 5.  
Stress Test  
Description  
Low Temperature Operating Life  
High Temperature Operating Life  
THB  
−40°C, 500 hours, powered  
+125°C, 500 hours, powered  
+65°C/85% relative humidity (RH), 500 hours, powered  
−40°C/+125°C, one cycle per hours, 100 cycles  
+150°C, 500 hours  
−40°C, 500 hours  
All pins, 0.5 kV  
All pins, 1.5 kV  
All pins, 0.2 kV  
Temperature Cycle  
High Temperature Storage  
Low Temperature Storage  
Component CDM ESD  
Component HBM ESD  
Component MM ESD  
Rev. PrH | Page 10 of 12  
 
Preliminary Technical Data  
OUTLINE DIMENSIONS  
ADMP404  
3.425  
3.350  
0.75 REF  
1.52  
1.08  
0.30  
3.275  
REFERENCE  
CORNER  
0.30 BSC  
0.25 NOM  
0.20 MIN  
BSC  
DIA.  
THRU HOLE  
(SOUND PORT)  
3.06 REF  
0.90 × 0.68  
(PINS 1, 3)  
1.56 DIA.  
1
0.95 DIA.  
2.575  
2.500  
2.425  
0.54  
REF  
2
1.22 BSC  
2.21  
REF  
1.25  
3
TOP VIEW  
0.64 REF  
BOTTOM VIEW  
0.20 TYP  
× 45°  
0.98  
0.88  
0.78  
0.65 REF  
SIDE VIEW  
0.21 REF  
Figure 11. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]  
3.35 mm × 2.50 mm Body  
(CE-3-2)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
ADMP404ACEZ  
ADMP404ACEZ-RL  
ADMP404ACEZ-RL7  
EVAL-ADMP404Z  
Temperature Range  
−40°C to +70°C  
−40°C to +70°C  
−40°C to +70°C  
Package Description  
3-Terminal LGA_CAV  
3-Terminal LGA_CAV, 13Tape and Reel  
3-Terminal LGA_CAV, 7Tape and Reel  
Evaluation Board  
Package Option  
CE-3-22  
Ordering Quantity  
1
10,000  
1,000  
CE-3-22  
CE-3-22  
1 Z = RoHS Compliant Part.  
2 This package option is halide free.  
Rev. PrH | Page 11 of 12  
 
 
 
ADMP404  
NOTES  
Preliminary Technical Data  
©2010 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
PR09027-0-4/10(PrH)  
Rev. PrH | Page 12 of 12  

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