EVAL-AD5504EBZ [ADI]

High Voltage, Quad-Channel 12-Bit Voltage Output DAC; 高压,四通道12位电压输出DAC
EVAL-AD5504EBZ
型号: EVAL-AD5504EBZ
厂家: ADI    ADI
描述:

High Voltage, Quad-Channel 12-Bit Voltage Output DAC
高压,四通道12位电压输出DAC

高压
文件: 总20页 (文件大小:414K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
High Voltage, Quad-Channel  
12-Bit Voltage Output DAC  
Data Sheet  
AD5504  
FEATURES  
GENERAL DESCRIPTION  
Quad-channel high voltage DAC  
12-bit resolution  
The AD5504 is a quad-channel, 12-bit, serial input, digital-to-  
analog converter with on-chip high voltage output amplifiers  
and an integrated precision reference. The DAC output voltage  
Pin selectable 30 V or 60 V output range  
Integrated precision reference  
Low power serial interface with readback capability  
Integrated temperature sensor alarm function  
Power-on reset  
R_SEL  
ranges are programmable via the range select pin (  
). If  
R_SEL  
is held high, the DAC output ranges are 0 V to 30 V. If  
R_SEL  
is held low, the DAC output ranges are 0 V to 60 V. The  
on-chip output amplifiers allow an output swing within the  
range of AGND + 0.5 V to VDD − 0.5 V.  
LDAC  
Simultaneous updating via  
Wide operating temperature: −40°C to +105°C  
The AD5504 has a high speed serial interface, which is com-  
patible with SPI®-, QSPI™-, MICROWIRE™-, and DSP-interface  
standards and can handle clock speeds of up to 16.667 MHz.  
APPLICATIONS  
Programmable voltage sources  
High voltage LED drivers  
Receiver bias in optical communications  
FUNCTIONAL BLOCK DIAGRAM  
V
V
DD  
CLR R_SEL  
LOGIC  
LDAC  
1713kΩ  
REFERENCE  
122.36kΩ  
V
V
V
V
SDI  
SDO  
INPUT  
REGISTER  
A
DAC  
REGISTER  
A
OUTA  
OUTB  
OUTC  
OUTD  
DACA  
+
12  
12  
12  
12  
12  
1713kΩ  
INPUT  
SCLK  
SYNC  
ALARM  
CONTROL  
LOGIC  
122.36kΩ  
INPUT  
REGISTER  
B
DAC  
REGISTER  
B
DAC B  
+
1713kΩ  
122.36kΩ  
POWER-ON  
RESET  
INPUT  
REGISTER  
C
DAC  
REGISTER  
C
DAC C  
+
1713kΩ  
122.36kΩ  
+
INPUT  
REGISTER  
D
DAC  
REGISTER  
D
DAC D  
POWER-DOWN  
CONTROL LOGIC  
AD5504  
TEMPERATURE  
SENSOR  
DGND  
AGND  
Figure 1.  
Rev. B  
Document Feedback  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rightsof third parties that may result fromits use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks andregisteredtrademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Technical Support  
©2009-2012 Analog Devices, Inc. All rights reserved.  
www.analog.com  
 
 
 
 
AD5504  
Data Sheet  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Power-Down Mode.................................................................... 14  
DAC Channel Architecture....................................................... 14  
Selecting the Output Range ...................................................... 14  
Applications....................................................................................... 1  
General Description ......................................................................... 1  
Functional Block Diagram .............................................................. 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 4  
AC Characteristics........................................................................ 5  
Timing Characteristics ................................................................ 6  
Absolute Maximum Ratings............................................................ 8  
Thermal Resistance ...................................................................... 8  
ESD Caution.................................................................................. 8  
Pin Configuration and Function Descriptions............................. 9  
Typical Performance Characteristics ........................................... 10  
Terminology .................................................................................... 12  
Theory of Operation ...................................................................... 14  
Power-Up State ........................................................................... 14  
CLR  
Function.............................................................................. 14  
LDAC  
Function .......................................................................... 14  
Temperature Sensor ................................................................... 15  
Power Dissipation....................................................................... 15  
Power Supply Sequencing ......................................................... 15  
Serial Interface ................................................................................ 16  
Write Mode ................................................................................. 16  
Read Mode .................................................................................. 16  
Writing to the Control Register................................................ 16  
Interfacing Examples ................................................................. 18  
Outline Dimensions....................................................................... 19  
Ordering Guide .......................................................................... 19  
REVISION HISTORY  
12/12—Rev. A to Rev. B  
Changes to t4 Parameter, Table 4 .................................................... 6  
Changes to Figure 3 and Figure 4................................................... 7  
Changes to Pin 3 Description, Table 7 and Pin 4 Description,  
Table 7 ................................................................................................ 9  
Changes to Write Mode Section ................................................... 16  
Changes to Table 10........................................................................ 17  
10/10—Rev. 0 to Rev. A  
Changes to Figure 3 and Figure 4................................................... 7  
7/09—Revision 0: Initial Version  
Rev. B | Page 2 of 20  
 
Data Sheet  
AD5504  
The serial interface offers the user the capability of both writing  
to, and reading from, most of the internal registers. To reduce  
power consumption at power up, only the digital section of the  
AD5504 is powered up initially. This gives the user the ability to  
program the DAC registers to the required value while typically  
only consuming 30 μA of supply current. The AD5504 incor-  
porates power-on reset circuitry that ensures the DAC registers  
power up in a known condition and remain there until a valid  
write to the device has taken place. The analog section is  
powered up by issuing a power-up command via the SPI  
interface. The AD5504 provides software-selectable output  
loads while in the power-down mode.  
The AD5504 has an on-chip temperature sensor. When the  
ALARM  
active low CMOS output pin) flags an alarm and the AD5504  
enters a temperature power-down mode disconnecting the  
output amplifier thus removing the short-circuit condition. The  
AD5504 remains in power-down mode until a software power-up  
command is executed.  
temperature on the die exceeds 110°C, the  
pin (an  
The AD5504 is available in a compact 16-lead TSSOP. The AD5504  
is guaranteed to operate over the extended temperature range of  
−40°C to +105°C.  
Table 1. Related Device  
Part No.  
Description  
AD5501  
High Voltage, 12-Bit Voltage Output DAC  
Rev. B | Page 3 of 20  
AD5504  
Data Sheet  
SPECIFICATIONS  
VDD = 10 V to 62 V; VLOGIC = 2.3 V to 5.5 V; RL = 60 kΩ; CL = 200 pF; −40°C < TA < +105°C, unless otherwise noted.  
Table 2.  
Parameter  
Symbol Min  
Typ1 Max  
Unit  
Test Conditions/Comments  
ACCURACY2  
Resolution  
12  
Bits  
LSB  
Differential Nonlinearity  
Integral Nonlinearity  
60 V Mode  
DNL  
INL  
−1  
1
−2  
−3  
+2  
+3  
LSB  
LSB  
VDD = 62 V  
30 V Mode  
VDD = 62 V  
VOUTX Temperature Coefficient3, 4, 5  
Zero-Scale Error  
Zero-Scale Error Drift4  
Offset Error6  
Offset Error Drift4  
Full-Scale Error  
Full-Scale Error Drift4  
50  
ppm/°C  
mV  
µV/°C  
mV  
µV/°C  
mV  
mV/°C  
µV/°C  
% of FSR  
DAC code = half scale  
DAC code = 0  
60 V mode  
VZSE  
VOE  
VFSE  
100  
60  
+120  
60  
+275  
1
350  
+0.6  
10  
−80  
60 V mode  
−325  
−40°C to +25°C; 60 V mode  
+25°C to +105°C; 60 V mode  
Gain Error  
Gain Temperature Coefficient4  
DC Crosstalk4  
Due to Single Channel Full-Scale  
Output Change  
−0.6  
ppm of FSR/°C 60 V mode  
RL = 60 kΩ to AGND or VDD  
60 V mode  
3
4
mV  
mV  
Due to Powering Down (Per Channel)  
OUTPUT CHARACTERISTICS  
Output Voltage Range7  
Short-Circuit Current4, 8  
Capacitive Load Stability4  
RL = 60 kΩ to ∞  
60 V mode  
AGND + 0.5  
VDD − 0.5  
V
mA  
2
On any single channel  
1 V to 4 V step  
1
+1  
nF  
mA  
Load Current4  
−1  
On any single channel  
DC Output Impedance4  
DC Output Leakage4  
DIGITAL INPUTS  
3
10  
µA  
Input Logic High  
VIH  
2.0  
1.8  
V
V
V
µA  
pF  
VLOGIC = 4.5 V to 5.5 V  
VLOGIC = 2.3 V to 3.6 V  
VLOGIC = 2.3 V to 5.5 V  
Input Logic Low  
Input Current  
Input Capacitance4  
VIL  
IIL  
IIC  
0.8  
1
5
5
DIGITAL OUTPUTS  
Output High Voltage  
Output Low Voltage  
Three-State Leakage Current  
SDI, SDO, SCLK, LDAC, CLR, R_SEL  
ALARM  
VOH  
VOL  
VLOGIC − 0.4 V  
V
V
ISOURCE = 200 µA  
ISINK = 200 µA  
DGND + 0.4 V  
−1  
+1  
µA  
µA  
pF  
−10  
+10  
Output Capacitance4  
Rev. B | Page 4 of 20  
 
Data Sheet  
AD5504  
Parameter  
Symbol Min  
Typ1 Max  
Unit  
Test Conditions/Comments  
POWER SUPPLIES  
VDD  
10  
62  
V
VLOGIC  
2.3  
5.5  
V
Quiescent Supply Current (IQUIESCENT  
)
2
3
mA  
Static conditions; DAC  
outputs = midscale  
Logic Supply Current (ILOGIC  
DC PSRR4  
)
0.4  
2
µA  
VIH = VLOGIC; VIL = DGND  
DAC output = full-scale  
60 V Mode  
30 V Mode  
68  
76  
dB  
dB  
POWER-DOWN MODE  
Supply Current  
Software Power-Down Mode  
Junction Temperature8  
IDD_PWD  
TJ  
30  
50  
130  
µA  
°C  
TJ = TA + PTOTAL × θJA  
1 Typical specifications represent average readings at 25°C, VDD = 62 V and VLOGIC = 5 V.  
2 Valid in output voltage range of (VDD − 0.5 V) to (AGND + 0.5 V). Outputs are unloaded.  
3 Includes linearity, offset, and gain drift.  
4 Guaranteed by design and characterization. Not production tested.  
5 VOUTX refers to VOUTA, VOUTB, VOUTC, or VOUTD  
.
6 DAC code = 32 for 60 V mode; DAC code = 64 for 30 V mode.  
7
R_SEL  
R_SEL  
is held low. As the output voltage range is  
The DAC architecture gives a fixed linear voltage output range of 0 V to 30 V if  
is held high and 0 V to 60 V if  
limited by output amplifier compliance, VDD should be set to at least 0.5 V higher than the maximum output voltage to ensure compliance.  
8 If the die temperature exceeds 110°C, the AD5504 enters a temperature power-down mode putting the DAC outputs into a high impedance state thereby removing  
the short-circuit condition. Overheating caused by long term short-circuit condition(s) is detected by an integrated thermal sensor. After power-down, the AD5504  
stays powered down until a software power-up command is executed.  
AC CHARACTERISTICS  
VDD = 10 V to 62 V; VLOGIC = 2.3 V to 5.5 V; RL = 60 kΩ; CL = 200 pF; −40°C < TA < +105°C, unless otherwise noted.  
Table 3.  
Parameter1, 2  
Min Typ  
Max  
Unit  
Test Conditions/Comments3  
AC CHARACTERISTICS  
Output Voltage Settling Time  
60 V Mode  
¼ to ¾ scale settling to 1 LSB, RL = 60 kΩ  
45  
25  
55  
35  
µs  
µs  
30 V Mode  
Slew Rate  
0.65  
300  
170  
40  
V/µs  
nV-s  
mV  
nV-s  
nV-s  
nV-s  
nV-s  
μV p-p  
mV p-p  
Digital-to-Analog Glitch Energy  
Glitch Impulse Peak Amplitude  
Digital Feedthrough  
Digital Crosstalk  
Analog Crosstalk  
DAC-to-DAC Crosstalk  
Peak-to-Peak Noise  
1 LSB change around major carry in 60 V mode  
60 V mode  
5
600  
600  
140  
4
0.1 Hz to 10 Hz; DAC code = 0x800  
0.1 Hz to 10 kHz; DAC code = 0x800  
1 Guaranteed by design and characterization; not production tested.  
2 See the Terminology section.  
3 Temperature range is −40°C to + 105°C, typical at 25°C.  
Rev. B | Page 5 of 20  
 
 
 
AD5504  
Data Sheet  
TIMING CHARACTERISTICS  
VDD = 30 V, VLOGIC = 2.3 V to 5.5 V and −40°C < TA < +105°C; all specifications TMIN to TMAX, unless otherwise noted.  
Table 4.  
Parameter  
Limit1  
60  
10  
10  
25  
15  
5
Unit  
Test Conditions/Comments  
SCLK cycle time  
2
t1  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns typ  
μs typ  
ns min  
ns max  
ns min  
μs max  
μs max  
μs typ  
t2  
t3  
t4  
SCLK high time  
SCLK low time  
SYNC falling edge to SCLK rising edge setup time  
Data setup time  
Data hold time  
SCLK falling edge to SYNC rising edge  
Minimum SYNC high time  
LDAC pulse width low  
t5  
t6  
t7  
0
t8  
20  
20  
50  
15  
100  
20  
110  
55  
25  
50  
50  
5
t9  
t10  
t11  
t12  
t13  
t14  
t15  
t16  
t17  
t18  
SCLK falling edge to LDAC rising edge  
CLR pulse width low  
CLR pulse activation time  
ALARM clear time  
SCLK cycle time in read mode  
SCLK rising edge to SDO valid  
SCLK to SDO data hold time  
Power-on reset time (this is not shown in the timing diagrams)  
Power-on time (this is not shown in the timing diagrams)  
3
3
4
5
t19  
ALARM  
clear to output amplifier turn on (this is not shown in the timing  
diagrams)  
1 All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.  
2 Maximum SCLK frequency is 16.667 MHz.  
3 Under load conditions shown in Figure 2.  
4 Time from when the VDD/VLOGIC supplies are powered-up to when a digital interface command can be executed.  
5 Time required from execution of power-on software command to when the DAC outputs have settled to 1 V.  
200µA  
I
OL  
V
(MIN) – V (MAX)  
OL  
OH  
TO OUTPUT  
PIN  
2
C
L
50pF  
200µA  
I
OH  
Figure 2. Load Circuit for SDO Timing Diagram  
Rev. B | Page 6 of 20  
 
 
 
 
Data Sheet  
AD5504  
t1  
t4  
SCLK  
t2  
t8  
t7  
t3  
SYNC  
SDI  
t6  
t5  
R/W  
D0  
t9  
1
LDAC  
t10  
2
LDAC  
t11  
CLR  
3
t13  
ALARM  
t12  
4
V
OUTx  
1
2
3
4
ASYNCHRONOUS LDAC UPDATE MODE.  
SYNCHRONOUS LDAC UPDATE MODE.  
IN THE EVENT OF OVERTEMPERATURE CONDITION.  
V
REFERS TO ANY OF V  
, V  
V
OR V  
.
OUTx  
OUTA OUTB, OUTC  
OUTD  
Figure 3. Write Timing Diagram  
t14  
SCLK  
SYNC  
SDI  
X
A2  
X
X
X
X
X
X
R/W  
A1  
A0  
t16  
t15  
D8  
D11  
D10  
D9  
D0  
D2  
D1  
SDO  
Figure 4. Read Timing Diagram  
Rev. B | Page 7 of 20  
 
 
 
AD5504  
Data Sheet  
ABSOLUTE MAXIMUM RATINGS  
THERMAL RESISTANCE  
TA = 25°C, unless otherwise noted. Transient currents of up to  
100 mA do not cause SCR latch-up.  
θJA is specified for the worst-case conditions, that is, a device  
soldered in a circuit board for surface-mount packages.  
Thermal resistance is for a JEDEC 4-layer(2S2P) board.  
Table 5.  
Parameter  
Rating  
Table 6. Thermal Resistance  
Package Type  
16-Lead TSSOP  
VDD to AGND  
VLOGIC to DGND  
−0.3 V, + 64 V  
−0.3 V to +7 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VLOGIC + 0.3 V  
−0.3 V to VLOGIC + 0.3 V  
−0.3 V to +0.3 V  
150°C  
θJA  
Unit  
VOUTX to AGND1  
Digital Input to DGND  
SDO Output to DGND  
AGND to DGND  
Maximum Junction Temperature  
(TJ Maximum)  
112.60  
°C/W  
ESD CAUTION  
Storage Temperature Range  
Reflow Soldering  
−65°C to +150°C  
Peak Temperature  
260°C  
Time at Peak Temperature Range  
20 sec to 40 sec  
1 VOUTX refers to VOUTA, VOUTB, VOUTC, or VOUTD  
.
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Rev. B | Page 8 of 20  
 
 
 
Data Sheet  
AD5504  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
CLR  
SYNC  
SCLK  
SDI  
V
LOGIC  
ALARM  
V
AD5504  
TOP VIEW  
(Not to Scale)  
DD  
R_SEL  
SDO  
V
V
V
V
OUTA  
OUTB  
OUTC  
OUTD  
DGND  
AGND  
LDAC  
Figure 5. Pin Configuration  
Table 7. Pin Function Descriptions  
Pin No. Mnemonic Description  
1
2
CLR  
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all LDAC pulses are ignored.  
When CLR is activated, the input register and the DAC register are set to 0x000 and the outputs to zero scale.  
SYNC  
Falling Edge Synchronization Signal. This is the frame synchronization signal for the input data. When SYNC goes  
low, it enables the input shift register and data is transferred in on the rising edges of the following clocks. The  
selected DAC register is updated on the 16th falling SCLK, unless SYNC is taken high before this edge, in which case, the  
rising edge of SYNC acts as an interrupt, and the write sequence is ignored by the DAC.  
3
4
5
SCLK  
SDI  
Serial Clock Input. Data is clocked into the input shift register on the rising edge of the serial clock input. Data can  
be transferred at rates up to 16 MHz.  
Serial Data Input. This part has a 16-bit shift register. Data is clocked into the register on the rising edge of the  
serial clock input.  
Serial Data Output. CMOS output. This pin serves as the readback function for all DAC and control registers. Data  
is clocked out on the rising edge of SCLK and is valid on the falling edge of SCLK.  
SDO  
6
7
8
DGND  
AGND  
LDAC  
Digital Ground Pin.  
Analog Ground Pin.  
Load DAC Input. Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new  
data. This allows all DAC outputs to update simultaneously. Alternatively, this pin can be tied permanently low.  
9
VOUTD  
VOUTC  
VOUTB  
VOUTA  
R_SEL  
Buffered Analog Output Voltage from DAC D.  
Buffered Analog Output Voltage from DAC C.  
Buffered Analog Output Voltage from DAC B.  
Buffered Analog Output Voltage from DAC A.  
10  
11  
12  
13  
Range Select Pin. Tying this pin to DGND selects a DAC output range of 0 V to 60 V, alternatively tying R_SEL to  
V
LOGIC selects a DAC output range of 0 V to 30 V.  
14  
VDD  
Positive Analog Power Supply. 10 V to 62 V for the specified performance. This pin should be decoupled with 0.1 µF  
ceramic capacitors and 10 µF capacitors.  
15  
16  
ALARM  
VLOGIC  
Active Low CMOS Output Pin. This pin flags an alarm if the temperature on the die exceeds 110°C.  
Logic Power Supply; 2.3 V to 5.5 V. Decouple this pin with 0.1µF ceramic capacitors and 10 µF capacitors.  
Rev. B | Page 9 of 20  
 
AD5504  
Data Sheet  
TYPICAL PERFORMANCE CHARACTERISTICS  
0.8  
45.0025  
45.0000  
44.9975  
44.9950  
44.9925  
0.4  
0
–0.4  
–0.8  
32  
1008  
2048  
3056  
4064  
0
0.05  
0.10  
0.15  
0.20  
CODE  
TIME (ms)  
Figure 6. Typical INL  
Figure 9. Output Settling Time (Low to High)  
0.50  
0.25  
200  
100  
0
V
V
= 62V  
DD  
OUTx  
= 30V  
0
–0.25  
–0.50  
–100  
–200  
0
32  
1008  
2048  
3056  
4064  
2.5  
5.0  
7.5  
10.0  
CODE  
TIME (Seconds)  
Figure 10. Output Noise  
Figure 7. Typical DNL  
15.0050  
15.0025  
15.0000  
14.9975  
14.9950  
0.70  
0.65  
0.60  
0.55  
V
V
= 62V  
, V  
DD  
OUTB OUTC  
, AND V POWERED DOWN  
OUTD  
0.50  
0
0
0.05  
0.10  
0.15  
0.20  
15  
30  
45  
60  
TIME (ms)  
V
(V)  
OUTA  
Figure 8. Output Settling Time (High to Low)  
Figure 11. IDD vs. VOUTA  
Rev. B | Page 10 of 20  
 
Data Sheet  
AD5504  
2.2  
0.20  
0.15  
0.10  
0.05  
0
V
V
= 62V  
DD  
= V  
= V  
OUTC  
= V  
OUTD  
OUTA  
OUTB  
2.1  
2.0  
1.9  
–0.05  
–0.10  
–0.15  
–0.20  
V
V
V
V
= 30V; V SWITCHING  
OUTB  
OUTA  
OUTB  
OUTB  
OUTB  
= 0V TO 30V  
= 0V TO 45V  
= 0V TO 60V  
1.8  
0
15  
30  
OUTPUT VOLTAGE (V)  
45  
60  
15  
15  
0
2
4
6
8
10  
TIME (µs)  
Figure 12. IDD vs. VOUTA to VOUTD  
Figure 15. DAC-to-DAC Crosstalk  
2
0
6
5
4
3
2
1
0
V
OUTD  
OUTB  
–2  
–4  
–6  
–8  
V
V
V
OUTC  
OUTA  
–10  
0
5
10  
–1.0  
–0.5  
0
0.5  
1.0  
TIME (ms)  
LOAD CURRENT (mA)  
Figure 13. Digital-to-Analog Negative Glitch Impulse  
Figure 16. DAC-to-DAC Mismatch  
12  
10  
8
6
4
2
0
–2  
–4  
0
5
10  
TIME (ms)  
Figure 14. Digital-to-Analog Positive Glitch Impulse  
Rev. B | Page 11 of 20  
AD5504  
Data Sheet  
TERMINOLOGY  
Gain Temperature Coefficient  
Relative Accuracy  
The gain temperature coefficient is a measure of the change in  
gain with changes in temperature. It is expressed in (ppm of  
full-scale range)/°C.  
For the DAC, relative accuracy, or integral nonlinearity (INL),  
is a measure of the maximum deviation in LSBs from a straight  
line passing through the endpoints of the DAC transfer function.  
Digital-to-Analog Glitch Impulse  
Differential Nonlinearity  
Differential nonlinearity (DNL) is the difference between the  
measured change and the ideal 1 LSB change between any two  
adjacent codes. A specified differential nonlinearity of 1 LSB  
maximum ensures monotonicity. This DAC is guaranteed mono-  
tonic by design.  
Digital-to-analog glitch impulse is the impulse injected into the  
analog output when the input code in the DAC register changes  
state. It is normally specified as the area of the glitch in nV-s  
and is measured when the digital input code is changed by  
1 LSB at the major carry transition.  
Zero-Code Error  
DC and AC Power Supply Rejection Ratio (PSRR)  
Zero-code error is a measure of the output error when zero  
code (0x000) is loaded into the DAC register. Ideally, the output  
should be 0 V. The zero-code error is always positive in the  
AD5504 because the output of the DAC cannot go below 0 V.  
It is due to a combination of the offset errors in the DAC and  
output amplifier. Zero-code error is expressed in millivolts.  
PSRR indicates how the output of the DAC is affected by changes  
in the supply voltage. PSRR is the ratio of the change in VOUTA  
,
V
OUTB, VOUTC, or VOUTD to a change in VDD for full-scale output of  
the DAC. It is measured in decibels. For dc PSRR, VDD is dc  
varied 10%. For ac PSRR, VDD is ac varied 10%.  
DC Crosstalk  
Zero-Code Error Drift  
DC crosstalk is the dc change in the output level of one DAC in  
response to a change in the output of another DAC. It is measured  
with a full-scale output change on one DAC (or soft power-down  
and power-up) while monitoring another DAC kept at midscale.  
It is expressed in millivolts.  
Zero-code error drift is a measure of the change in zero-code  
error with a change in temperature. It is expressed in μV/°C.  
Offset Error  
A measure of the difference between VOUT (actual) and VOUT  
(ideal) expressed in millivolts in the linear region of the transfer  
function. Offset error is measured on the AD5504 with Code 32  
loaded in the DAC registers for 60 V mode and with Code 64  
loaded in the DAC registers for 30 V mode. Offset error is  
expressed in millivolts.  
DC crosstalk due to load current change is a measure of the  
impact that a change in load current on one DAC has to another  
DAC kept at midscale. It is expressed in μV/mA.  
Digital Feedthrough  
Digital feedthrough is a measure of the impulse injected into  
the analog output of a DAC from the digital input pins of the  
device but is measured when the DAC is not being written to  
Offset Error Drift  
Offset error drift is a measure of the change in offset error with  
a change in temperature. It is expressed in μV/°C.  
SYNC  
(
held high). It is specified in nV-s and measured with a  
full-scale change on the digital input pins, that is, from all 0s to  
all 1s or vice versa.  
Full-Scale Error  
Full-scale error is a measure of the output error when full-scale  
code (0xFFF) is loaded into the DAC register. Full-scale error is  
expressed in millivolts.  
Analog Crosstalk  
Analog crosstalk is the glitch impulse transferred to the output  
of one DAC due to a change in the output of another DAC. It is  
measured by loading one of the input registers with a full-scale  
code change (all 0s to all 1s or vice versa) while keeping  
high, and then pulsing  
Full-Scale Error Drift  
Full-scale error drift is a measure of the change in full-scale  
error with a change in temperature. It is expressed in μV/°C.  
LDAC  
LDAC  
low and monitoring the output of  
the DAC whose digital code has not changed. The area of the  
glitch is expressed in nV-s.  
Gain Error  
Gain error is a measure of the span error of the DAC. It is the  
deviation in slope of the DAC transfer characteristic from the  
ideal, expressed as a percentage of the full-scale range.  
Rev. B | Page 12 of 20  
 
 
Data Sheet  
AD5504  
DAC-to-DAC Crosstalk  
Capacitive Load Stability  
DAC-to-DAC crosstalk is the glitch impulse transferred to the  
output of one DAC due to a digital code change and subsequent  
output change of another DAC. This includes both digital and  
analog crosstalk. It is measured by loading one of the DACs  
with a full-scale code change (all 0s to all 1s or vice versa) with  
Capacitive load stability refers to the ability of the amplifier to  
drive a capacitive load. An amplifier output is considered stable  
if any overshoot or ringing has stopped before approximately  
1.5 times the settling time of the DAC has elapsed.  
LDAC  
low and monitoring the output of another DAC. The  
energy of the glitch is expressed in nV-s.  
Rev. B | Page 13 of 20  
AD5504  
Data Sheet  
THEORY OF OPERATION  
The AD5504 contains four DACs, four output amplifiers, and a  
precision reference in a single package. The architecture of a  
single DAC channel consists of a 12-bit resistor string DAC  
followed by an output buffer amplifier. The part operates from  
a single-supply voltage of 10 V to 62 V. The DAC output voltage  
format for the AD5501 is straight binary and the output voltage  
follows the formula  
D
4096  
VOUT  
=
× Range  
where:  
D is the code loaded to the DAC.  
R_SEL  
range is selected via the range select,  
, pin. The DAC  
is held high and 0 V to  
is held low. Data is written to the AD5504 in a  
R_SEL  
output range is 0 V to 30 V if  
R_SEL  
R_SEL  
R_SEL  
is low.  
Range = 30, if  
is high, and 60 if  
60 V if  
PRECISION  
REFERENCE  
16-bit word format (see Table 8), via a serial interface.  
POWER-UP STATE  
INPUT  
DAC  
REGISTER  
On power-up, the power-on reset circuitry clears the bits of the  
control register to 0x40 (see Table 10). This ensures that the  
analog section is initially powered down, which helps reduce  
power consumption. The user can program the DAC registers  
to the required values while typically consuming only 30 µA of  
supply current. The power-on reset circuitry also ensures that  
all the input and DAC registers power up in a known condition,  
0x000, and remain there until a valid write to the device has  
taken place. The analog section can be powered up by setting  
any or all of Bit C2 to Bit C5 of the control register to 1.  
GAIN  
DAC  
V
OUTx  
REGISTER  
12  
12  
AGND  
Figure 17. DAC Channel Architecture (Single-Channel Shown)  
SELECTING THE OUTPUT RANGE  
R_SEL  
The output range of the DACs is selected by the  
pin.  
pin is connected to Logic 1, the DAC output  
R_SEL  
R_SEL  
When the  
voltages can be set between 0 V and 30 V. When the  
is connected to Logic 0, the DAC output voltages can be set  
R_SEL  
pin  
POWER-DOWN MODE  
Each DAC channel can be individually powered up or powered  
down by programming the control register (see Table 10).  
When the DAC channel is powered down, the associated analog  
circuitry turns off to reduce power consumption. The digital  
section of the AD5504 remains powered up. The output of the  
DAC amplifier can be three-stated or connected to AGND via  
an internal 20 kΩ resistor, depending on the state of Bit C6 in  
the control register. The power-down mode does not change the  
contents of the DAC register to ensure that the DAC channel  
returns to its previous voltage when the power-down bit is set to 1.  
The AD5504 also offers the user the flexibility of updating the  
DAC registers during power-down. The control register can be  
read back at any time to check the status of the bits.  
between 0 V and 60 V. The state of  
time when the serial interface is not being used, that is, not  
R_SEL  
can be changed any  
during a read or write operation. When the  
changed, the voltage on the output pin remains the same until  
LDAC  
pin is  
the next write to the DAC register (and  
For example, if the user writes 0x800 to the DAC register when  
R_SEL  
is brought low).  
in 30 V mode (  
= 1), the output voltage is 15 V (assuming  
LDAC  
is low or has been pulsed low). When the user switches  
R_SEL  
to 60 V mode (  
user writes a new value to the DAC register.  
or be pulsed low for the output to change.  
= 0), the output stays at 15 V until the  
LDAC  
must be low  
CLR FUNCTION  
DAC CHANNEL ARCHITECTURE  
CLR  
The AD5504 has a hardware  
pin that is an asynchronous  
input is falling edge sensitive. Bringing the  
line low clears the contents of the input register and the  
The architecture of a single DAC channel consists of a 12-bit  
resistor string DAC followed by an output buffer amplifier (see  
Figure 17). The resistor string section is simply a string of  
resistors, each of Value R from VREF generated by the precision  
reference to AGND. This type of architecture guarantees DAC  
monotonicity. The 12-bit binary digital code loaded to the DAC  
register determines at which node on the string the voltage is  
tapped off before being fed into the output amplifier. The  
output amplifier multiplies the DAC output voltage to give a  
CLR  
clear input. The  
CLR  
CLR  
DAC registers to 0x000. The  
pulse activation time, that is,  
CLR  
the falling edge of  
typically 100 ns.  
to when the output starts to change, is  
LDAC FUNCTION  
LDAC  
The DAC outputs can be updated using the hardware  
LDAC  
LDAC  
is normally high. On the falling edge of , data  
is copied from the input registers to the DAC registers, and the  
DAC outputs are updated simultaneously (asynchronous update  
pin.  
R_SEL  
fixed linear voltage output range of 0 V to 60 V if  
= 0  
R_SEL  
or 0 V to 30 V if  
= 1. Each output amplifier is capable  
of driving a 60 kload while allowing an output swing within  
the range of AGND + 0.5 V and VDD − 0.5 V.  
Because the DAC architecture gives a fixed voltage output range  
of 0 V to 30 V or 0 V to 60 V, the user should set VDD to at least  
30.5 V or 60.5 V to use the maximum DAC resolution. The data  
LDAC  
mode, see Figure 3). If the  
is kept low, or is low on the  
falling edge of the 16th SCLK, the appropriate DAC register and  
DAC output are updated automatically (synchronous update  
mode, see Figure 3).  
Rev. B | Page 14 of 20  
 
 
 
 
 
 
 
 
Data Sheet  
AD5504  
The amount of heat generated can be calculated using the  
formula  
TJ = TA + (PTOTAL × θJA)  
TEMPERATURE SENSOR  
The AD5504 has an integrated temperature sensor that causes  
the part to enter thermal shutdown mode when the temperature  
on the die exceeds 110°C. In thermal shutdown mode, the  
analog section of the device powers down and the DAC outputs  
are disconnected, but the digital section remains operational,  
which is equivalent to setting the power-down bit in the control  
register. To indicate that the AD5504 has entered temperature  
shutdown mode, Bit 0 of the control register is set to 1 and the  
where:  
TJ is the package junction temperature.  
TA is the ambient temperature.  
P
TOTAL is the total power being consumed by the AD5504.  
θ
JA is the thermal impedance of the AD5504 package (see the  
Absolute Maximum Ratings section for this value).  
ALARM  
pin goes low. The AD5504 remains in temperature  
POWER SUPPLY SEQUENCING  
ALARM  
shutdown mode with Bit 0 set to 1 and the  
pin low, even  
if the die temperature falls, until Bit 0 in the control register is  
cleared to 0.  
The power supplies for the AD5504 can be applied in any order  
without affecting the device. However, the AGND and DGND  
pins should be connected to the relevant ground plane before  
the power supplies are applied. None of the digital input pins  
POWER DISSIPATION  
Drawing current from any of the voltage output pins causes a  
temperature rise in the die and package of the AD5504. The  
package junction temperature (TJ) should not exceed 130°C for  
normal operation. If the die temperature exceeds 110°C, the  
AD5504 enters thermal shutdown mode as described in the  
Temperature Sensor section.  
SYNC R_SEL CLR  
(SCLK, SDI,  
,
and ) should be allowed to float  
during power up. The digital input pins can be connected to  
pull-up (to VLOGIC) or pull-down (to DGND) resistors as  
required.  
Rev. B | Page 15 of 20  
 
 
 
AD5504  
Data Sheet  
SERIAL INTERFACE  
SYNC  
The AD5504 has a serial interface (  
, SCLK, SDI, and  
READ MODE  
SDO), which is compatible with SPI interface standards, as well  
with as most DSPs. The AD5504 allows writing of data, via the  
serial interface, to the input and control registers. The DAC  
registers are not directly writeable or readable.  
The AD5504 allows data readback via the serial interface from  
every register directly accessible to the serial interface, which is  
all registers except the DAC registers. To read back a register, it  
is first necessary to tell the AD5504 that a readback is required.  
W
The input shift register is 16 bits wide (see Table 8). The 16-bit  
This is achieved by setting the R/ bit to 1. The three address  
W
word consists of one read/write (R/ ) control bit, followed by  
bits then determine the register from which data is to be read  
back. Data from the selected register is then clocked out of the  
SDO pin on the next twelve clocks of the same frame.  
three address bits and 12 DAC data bits. Data is loaded MSB first.  
WRITE MODE  
The SDO pin is normally three-stated but becomes driven on  
the rising edge of the fifth clock pulse. The pin remains driven  
until the data from the register has been clocked out or the  
W
To write to a register, the R/ bit should be 0. The three  
address bits in the input register (see Table 9) then determine  
the register to update. The address bits (A2 to A0) are used for  
either DAC register selection or for writing to the control  
register. Data is clocked into the selected register during the  
remaining 12 clocks of the same frame. Figure 3 shows a timing  
diagram of a typical AD5504 write sequence. The write  
SYNC  
pin is returned high. Figure 4 shows the timing  
requirements during a read operation. Note that due to timing  
requirements of t14 (110 ns), the maximum speed of the SPI  
interface during a read operation should not exceed 9 MHz.  
SYNC  
WRITING TO THE CONTROL REGISTER  
sequence begins by bringing the  
line low. Data on the  
SDI line is clocked into the 16-bit shift register on the rising  
edge of SCLK. On the 16th falling clock edge, the last data bit is  
clocked in and the programmed function is executed (that is, a  
change in the selected DAC/DACs input register/registers or a  
change in the mode of operation). The AD5504 does not  
require a continuous SCLK and dynamic power can be saved by  
transmitting clock pulses during a serial write only. At this  
The control register is written when Bits[DB14:DB12] are 1.  
The control register sets the power-up state of the DAC outputs.  
A write to the control register must be followed by another  
write operation. The second write operation can be a write to a  
DAC input register or a NOP write. Figure 18 shows some  
typical combinations.  
SYNC  
stage, the  
either case, it must be brought high for a minimum of 20 ns  
SYNC  
line can be kept low or be brought high. In  
before the next write sequence for a falling edge of  
to  
initiate the next write sequence. Operate all interface pins close  
to the supply rails to minimize power consumption in the  
digital input buffers.  
Table 8. Input Register Bit Map  
DB15  
DB14 DB13 DB12 DB11 DB10 DB9  
DB8  
DB7  
DB6  
DB5  
Data  
DB4  
DB3  
DB2  
DB1  
DB0  
W
A2 A1 A0  
R/  
Table 9. Input Register Bit Functions  
Bit Description  
Indicates a read from or a write to the addressed register.  
These bits determine if the input registers or the control register are to be accessed.  
W
R/  
A2, A1, A0  
A2  
A1  
0
A0  
0
Function/Address  
No operation  
0
0
0
0
1
0
1
1
0
1
0
1
0
DAC A input register  
DAC B input register  
DAC C input register  
DAC D input register  
1
0
1
Write data contents to all four DAC input registers  
1
1
0
Reserved  
1
1
1
Control register  
D11:D0  
Data bits  
Rev. B | Page 16 of 20  
 
 
 
 
 
 
Data Sheet  
AD5504  
Table 10. Control Register Functions  
DB15  
DB14 DB13 DB12 DB11 DB10 DB9  
DB8  
DB7  
DB6  
DB5  
DB4  
DB3  
DB2  
DB1  
C1  
DB01  
W
1
1
1
0
0
0
0
0
C6  
C5  
C4  
C3  
C2  
C0  
R/  
1 Read-only bit. This bit should be 0 when writing to the control register.  
Table 11. Control Register Function Bit Descriptions  
Bit No.  
Bit Name  
Description  
DB0  
C0  
C0 = 0: the device is not in thermal shutdown mode.  
C0 = 1: the device is in thermal shutdown mode.  
DB1  
DB2  
C1  
C21  
C1 = 0: reserved. This bit should be 0 when writing to the control register.  
C2 = 0: DAC Channel A power-down (default).  
C2 = 1: DAC Channel A power-up.  
DB3  
DB4  
DB5  
DB6  
C31  
C41  
C51  
C6  
C3 = 0: DAC Channel B power-down (default).  
C3 = 1: DAC Channel B power-up.  
C4 = 0: DAC Channel C power-down (default).  
C4 = 1: DAC Channel C power-up.  
C5 = 0: DAC Channel D power-down (default).  
C5 = 1: DAC Channel D power-up.  
C6 = 0: outputs connected to AGND through a 20 kΩ resistor (default).  
C6 = 1: outputs are three-stated.  
1 If Bit C2 to Bit C5 are set to 0, the part is placed in power-down mode.  
WRITE TO  
CONTROL REGISTER  
NOP  
WRITE TO  
CONTROL REGISTER  
WRITE TO  
DAC REGISTER  
WRITE TO  
CONTROL REGISTER  
WRITE TO  
CONTROL REGISTER  
NOP  
WRITE TO  
CONTROL REGISTER  
WRITE TO  
CONTROL REGISTER  
WRITE TO  
DAC REGISTER  
WRITE N  
WRITE N + 1  
WRITE N + 2  
Figure 18. Control Register Write Sequences  
Rev. B | Page 17 of 20  
 
 
 
 
AD5504  
Data Sheet  
The Analog Devices ADSP-21065L is a floating point DSP with  
two serial ports (SPORTs). Figure 20 shows how one SPORT  
can be used to control the AD5504. In this example, the transmit  
frame synchronization (TFS) pin is connected to the receive  
frame synchronization (RFS) pin. The transmit and receive  
clocks (TCLK and RCLK) are also connected together. The user  
can write to the AD5504 by writing to the transmit register. When a  
read operation is performed, the data is clocked out of the AD5504  
on the last 12 SCLKs. The DSP receive interrupt can be used to  
indicate when the read operation is complete.  
INTERFACING EXAMPLES  
The SPI interface of the AD5504 is designed to allow it to be  
easily connected to industry-standard DSPs and microcon-  
trollers. Figure 19 shows how the AD5504 can be connected to  
the Analog Devices, Inc., Blackfin® D S P. The Blackfin has an  
integrated SPI port that can be connected directly to the SPI  
pins of the AD5504. Programmable input/output pins are also  
available and can be used to read or set the state of the digital  
input or output pins associated with the interface.  
AD5504  
ADSP-21065L  
TFSx  
AD5504  
SYNC  
SPISELx  
SYNC  
RFSx  
SCLK  
SCK  
TCLKx  
RCLKx  
MOSI  
SDI  
SCLK  
SDI  
SDO  
MISO  
DTxA  
DRxA  
PF10  
PF9  
PF8  
PF7  
R_SEL  
SDO  
ADSP-BF531  
LDAC  
CLR  
FLAG  
0
R_SEL  
FLAG  
1
LDAC  
CLR  
ALARM  
FLAG  
2
3
ALARM  
FLAG  
Figure 19. Interfacing to a Blackfin DSP  
Figure 20. Interfacing to an ADSP-21065L DSP  
Rev. B | Page 18 of 20  
 
 
 
Data Sheet  
AD5504  
OUTLINE DIMENSIONS  
5.10  
5.00  
4.90  
16  
9
8
4.50  
4.40  
4.30  
6.40  
BSC  
1
PIN 1  
1.20  
MAX  
0.15  
0.05  
0.20  
0.09  
0.75  
0.60  
0.45  
8°  
0°  
0.30  
0.19  
0.65  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-153-AB  
Figure 21. 16-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-16)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
Temperature Range  
−40°C to +105°C  
−40°C to +105°C  
Package Description  
Package Option  
AD5504BRUZ  
AD5504BRUZ-REEL  
EVAL-AD5504EBZ  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
Evaluation Board  
RU-16  
RU-16  
1 Z = RoHS Compliant Part..  
Rev. B | Page 19 of 20  
 
 
 
AD5504  
NOTES  
Data Sheet  
©2009-2012 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D07994-0-12/12(B)  
Rev. B | Page 20 of 20  

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