ADP5034ACPZ-1-R7 [ADI]

Dual 3 MHz, 1200 mA Buck Regulators with Two 300 mA LDOs; 双3兆赫, 1200毫安降压型稳压器具有两个300毫安的LDO
ADP5034ACPZ-1-R7
型号: ADP5034ACPZ-1-R7
厂家: ADI    ADI
描述:

Dual 3 MHz, 1200 mA Buck Regulators with Two 300 mA LDOs
双3兆赫, 1200毫安降压型稳压器具有两个300毫安的LDO

稳压器
文件: 总28页 (文件大小:701K)
中文:  中文翻译
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Dual 3 MHz, 1200 mA Buck  
Regulators with Two 300 mA LDOs  
ADP5034  
Data Sheet  
4 mm LFCSP to meet demanding performance and board space  
requirements.  
FEATURES  
Main input voltage range: 2.3 V to 5.5 V  
The high switching frequency of the buck regulators enables tiny  
multilayer external components and minimizes the board space.  
When the MODE pin is set to high, the buck regulators operate in  
forced PWM mode. When the MODE pin is set to low, the buck  
regulators operate in PWM mode when the load is above a pre-  
defined threshold. When the load current falls below a predefined  
threshold, the regulator operates in power save mode (PSM),  
improving the light load efficiency.  
Two 1200 mA buck regulators and two 300 mA LDOs  
24-lead, 4 mm × 4 mm LFCSP package  
Regulator accuracy: 3ꢀ  
Factory programmable or external adjustable VOUTx  
3 MHz buck operation with forced PWM and auto PWM/PSM  
modes  
BUCK1/BUCK2: output voltage range from 0.8 V to 3.8 V  
LDO1/LDO2: output voltage range from 0.8 V to 5.2 V  
LDO1/LDO2: low input supply voltage from 1.7 V to 5.5 V  
LDO1/LDO2: high PSRR and low output noise  
The two bucks operate out of phase to reduce the input capaci-  
tor requirement. The low quiescent current, low dropout voltage,  
and wide input voltage range of the ADP5034 LDOs extend the  
battery life of portable devices. The ADP5034 LDOs maintain  
power supply rejection greater than 60 dB for frequencies as  
high as 10 kHz while operating with a low headroom voltage.  
APPLICATIONS  
Power for processors, ASICS, FPGAs, and RF chipsets  
Portable instrumentation and medical devices  
Space constrained devices  
Regulators in the ADP5034 are activated through dedicated  
enable pins. The default output voltages can be externally set in  
the adjustable version, or factory programmable to a wide range  
of preset values in the fixed voltage version.  
GENERAL DESCRIPTION  
The ADP5034 combines two high performance buck regulators  
and two low dropout (LDO) regulators in a small, 24-lead 4 mm ×  
TYPICAL APPLICATION CIRCUIT  
AVIN  
HOUSEKEEPING  
C
0.1µF  
AVIN  
VOUT1  
L1 1µH  
VIN1  
SW1  
FB1  
2.3V TO  
5.5V  
V
AT  
OUT1  
1200mA  
C1  
R1  
R2  
4.7µF  
BUCK1  
MODE  
C5  
10µF  
PGND1  
ON  
EN1  
VIN2  
EN2  
EN1  
OFF  
PWM  
MODE  
PSM/PWM  
VOUT2  
MODE  
L2 1µH  
SW2  
FB2  
C2  
4.7µF  
V
AT  
OUT2  
1200mA  
R3  
R4  
BUCK2  
C6  
10µF  
EN2  
EN3  
PGND2  
EN3  
VOUT3  
FB3  
V
AT  
OUT3  
300mA  
LDO1  
(ANALOG)  
R5  
R6  
VIN3  
1.7V TO  
5.5V  
C7  
1µF  
C3  
1µF  
EN4  
ON  
VOUT4  
FB4  
V
AT  
EN4  
OUT4  
300mA  
OFF  
LDO2  
(DIGITAL)  
R7  
R8  
VIN4  
C8  
1µF  
C4  
1µF  
ADP5034  
AGND  
Figure 1.  
Rev. A  
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rights of third parties that may result from its use. Specifications subject to change without notice. No  
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Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2011 Analog Devices, Inc. All rights reserved.  
 
 
ADP5034  
Data Sheet  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Theory of Operation ...................................................................... 15  
Power Management Unit........................................................... 15  
BUCK1 and BUCK2 .................................................................. 17  
LDO1 and LDO2........................................................................ 18  
Applications Information.............................................................. 19  
Buck External Component Selection....................................... 19  
LDO External Component Selection ...................................... 21  
Power Dissipation and Thermal Considerations ....................... 22  
Buck Regulator Power Dissipation .......................................... 22  
Junction Temperature................................................................ 23  
PCB Layout Guidelines.................................................................. 24  
Typical Application Schematics.................................................... 25  
Bill of Materials........................................................................... 25  
Outline Dimensions....................................................................... 26  
Ordering Guide .......................................................................... 26  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Typical Application Circuit ............................................................. 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
General Specifications ................................................................. 3  
BUCK1 and BUCK2 Specifications ........................................... 4  
LDO1 and LDO2 Specifications................................................. 4  
Input and Output Capacitor, Recommended Specifications.. 5  
Absolute Maximum Ratings............................................................ 6  
Thermal Resistance ...................................................................... 6  
ESD Caution.................................................................................. 6  
Pin Configuration and Function Descriptions............................. 7  
Typical Performance Characteristics ............................................. 8  
REVISION HISTORY  
10/11—Rev. 0 to Rev. A  
Change to Table 4, Endnote 1 ..........................................................5  
Changes to Absolute Maximum Ratings, Table 5 .........................6  
Changes to Table 7, Pin Function Descriptions ............................7  
Changes to TPC Section...................................................................8  
Moved Power Dissipation and Thermal Considerations  
Change to Features Section ............................................................. 1  
Changes to General Description Section ...................................... 1  
Changes to Figure 1.......................................................................... 1  
Change to Table 1, Low UVLO Input Voltage Falling Parameter,  
Symbol Column................................................................................ 3  
Change to Table 2, Output Voltage Accuracy Parameter, Test  
Conditions/Comment Column ...................................................... 4  
Change to Table 2, Line Regulation Parameter, Symbols  
Column .............................................................................................. 4  
Change to Table 2, Load Regulation Parameter, Symbols  
Column .............................................................................................. 4  
Changes to Table 2, Reversed the RPFET and RNFET Symbols for  
the SW On Resistance Parameter and Changes to Typ and Max  
Columns............................................................................................. 4  
Changes to Table 3, Output Accuracy Parameter, Test  
Conditions/Comments Column..................................................... 4  
Changes to Table 3, Line Regulation Parameter, Symbols  
Column and Test Conditions/Comments Column ..................... 4  
Change to Table 3, Changes to Dropout Voltage Parameter and  
Added Specification to Dropout Voltage Parameter.................... 5  
Change to Table 3, Endnote 3 ......................................................... 5  
Change to Table 4, BUCK1, BUCK2 Output Capacitor  
Section.............................................................................................. 22  
Change to Equation 5 Where Statement ..................................... 22  
Change to Equation 6..................................................................... 22  
Change to Undervoltage Lockout Section .................................. 16  
Changes to Figure 46...................................................................... 16  
Change to Figure 47 ....................................................................... 17  
Changes to LDO1/LDO2 Section ................................................ 18  
Changes to Output Capacitor Section and Table 8.................... 19  
Change to VRIPPLE Equation, Table 9, and Figure 50................... 20  
Changes to Input and Output Capacitor Properties Section.... 21  
Changes to Equation 3................................................................... 22  
Changes to Junction Temperature Section.................................. 23  
Changes to LDO Regulator Power Dissipation Section............ 23  
Changes to Figure 52 and Figure 53............................................. 25  
Moved Bill of Materials Section.................................................... 25  
Changes to Ordering Guide.......................................................... 26  
6/11—Revision 0: Initial Version  
Parameter, Min Column Value ....................................................... 5  
Rev. A | Page 2 of 28  
 
Data Sheet  
ADP5034  
SPECIFICATIONS  
GENERAL SPECIFICATIONS  
VAVIN = VIN1 = VIN2 = 2.3 V to 5.5 V; VIN3 = VIN4 = 1.7 V to 5.5 V; TJ = −40°C to +125°C for minimum/maximum specifications, and TA =  
25°C for typical specifications, unless otherwise noted.  
Table 1.  
Parameter  
Symbol  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
INPUT VOLTAGE RANGE  
THERMAL SHUTDOWN  
Threshold  
VAVIN, VIN1, VIN2  
2.3  
5.5  
V
TSSD  
TSSD-HYS  
TJ rising  
150  
20  
°C  
°C  
Hysteresis  
START-UP TIME1  
BUCK1, LDO1, LDO2  
BUCK2  
tSTART1  
tSTART2  
250  
300  
μs  
μs  
EN1, EN2, EN3, EN4, MODE INPUTS  
Input Logic High  
VIH  
1.1  
V
Input Logic Low  
Input Leakage Current  
INPUT CURRENT  
VIL  
VI-LEAKAGE  
0.4  
1
V
μA  
0.05  
All Channels Enabled  
All Channels Disabled  
VIN1 UNDERVOLTAGE LOCKOUT  
High UVLO Input Voltage Rising  
High UVLO Input Voltage Falling  
Low UVLO Input Voltage Rising  
Low UVLO Input Voltage Falling  
ISTBY-NOSW  
ISHUTDOWN  
No load, no buck switching  
TJ = −40°C to +85°C  
108  
0.3  
175  
1
μA  
μA  
UVLOVIN1RISE  
UVLOVIN1FALL  
UVLOVIN1RISE  
UVLOVIN1FALL  
3.9  
V
V
V
V
3.1  
2.275  
1.95  
1 Start-up time is defined as the time from EN1 = EN2 = EN3 = EN4 from 0 V to VAVIN to VOUT1, VOUT2, VOUT3, and VOUT4 reaching 90% of their nominal level. Start-up  
times are shorter for individual channels if another channel is already enabled. See the Typical Performance Characteristics section for more information.  
Rev. A | Page 3 of 28  
 
ADP5034  
Data Sheet  
BUCK1 AND BUCK2 SPECIFICATIONS  
VAVIN = VIN1 = VIN2 = 2.3 V to 5.5 V; TJ = −40°C to +125°C for minimum/maximum specifications, and TA = 25°C for typical  
specifications, unless otherwise noted.1  
Table 2.  
Parameter  
Symbol  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
OUTPUT CHARACTERISTICS  
Output Voltage Accuracy  
VOUT1, VOUT2  
PWM mode; ILOAD1 = ILOAD2 = 0 mA to  
1200 mA  
−3  
+3  
%
Line Regulation  
Load Regulation  
(ΔVOUT1/VOUT1)/ΔVIN1  
(ΔVOUT2/VOUT2)/ΔVIN2  
(ΔVOUT1/VOUT1)/ΔIOUT1  
(ΔVOUT2/VOUT2)/ΔIOUT2  
,
PWM mode  
−0.05  
−0.1  
0.5  
%/V  
%/A  
V
,
ILOAD = 0 mA to 1200 mA, PWM mode  
VOLTAGE FEEDBACK  
OPERATING SUPPLY CURRENT  
BUCK1 Only  
VFB1, VFB2  
Models with adjustable outputs  
MODE = ground  
ILOAD1 = 0 mA, device not switching, all  
other channels disabled  
ILOAD2 = 0 mA, device not switching, all  
other channels disabled  
ILOAD1 = ILOAD2 = 0 mA, device not switching,  
LDO channels disabled  
0.485  
0.515  
IIN  
44  
ꢀA  
ꢀA  
ꢀA  
mA  
BUCK2 Only  
IIN  
55  
BUCK1 and BUCK2  
IIN  
67  
PSM CURRENT THRESHOLD  
SW CHARACTERISTICS  
SW On Resistance  
IPSM  
PSM to PWM operation  
100  
RNFET  
RPFET  
RNFET  
RPFET  
ILIMIT1, ILIMIT2  
RPDWN-B  
fSW  
VIN1 = VIN2 = 3.6 V  
VIN1 = VIN2 = 3.6 V  
VIN1 = VIN2 = 5.5 V  
VIN1 = VIN2 = 5.5 V  
pFET switch peak current limit  
Channel disabled  
155  
205  
137  
162  
1950  
75  
240  
310  
204  
243  
2300  
mΩ  
mΩ  
mΩ  
mΩ  
mA  
Ω
Current Limit  
1600  
2.5  
ACTIVE PULL-DOWN  
OSCILLATOR FREQUENCY  
3.0  
3.5  
MHz  
1 All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC).  
LDO1 AND LDO2 SPECIFICATIONS  
VIN3 = (VOUT3 + 0.5 V) or 1.7 V (whichever is greater) to 5.5 V, VIN4 = (VOUT4 + 0.5 V) or 1.7 V (whichever is greater) to 5.5 V; CIN = COUT  
1 μF; TJ = −40°C to +125°C for minimum/maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted.1  
=
Table 3.  
Parameter  
Symbol  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
INPUT VOLTAGE RANGE  
OPERATING SUPPLY CURRENT  
Bias Current per LDO2  
VIN3, VIN4  
1.7  
5.5  
V
IVIN3BIAS/IVIN4BIAS  
IOUT3 = IOUT4 = 0 μA  
IOUT3 = IOUT4 = 10 mA  
IOUT3 = IOUT4 = 300 mA  
10  
60  
165  
30  
100  
245  
μA  
μA  
μA  
IIN  
Total System Input Current  
Includes all current into AVIN, VIN1, VIN2, VIN3,  
and VIN4  
LDO1 or LDO2 Only  
LDO1 and LDO2 Only  
IOUT3 = IOUT4 = 0 μA, all other channels disabled  
IOUT3 = IOUT4 = 0 μA, buck channels disabled  
53  
74  
μA  
μA  
OUTPUT CHARACTERISTICS  
Output Voltage Accuracy  
VOUT3, VOUT4  
100 μA < IOUT3 < 300 mA, 100 μA < IOUT4  
300 mA  
<
−3  
+3  
%
Line Regulation  
(ΔVOUT3/VOUT3)/ΔVIN3  
(ΔVOUT4/VOUT4)/ΔVIN4  
(ΔVOUT3/VOUT3)/ΔIOUT3  
,
IOUT3 = IOUT4 = 1 mA  
−0.03  
+0.03 %/V  
0.001 0.003 %/mA  
Load Regulation3  
,
IOUT3 = IOUT4 = 1 mA to 300 mA  
(ΔVOUT4/VOUT4)/ΔIOUT4  
Rev. A | Page 4 of 28  
 
 
Data Sheet  
ADP5034  
Parameter  
Symbol  
VFB3, VFB4  
VDROPOUT  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
V
VOLTAGE FEEDBACK  
DROPOUT VOLTAGE4  
0.485 0.5  
0.515  
VOUT3 = VOUT4 = 5.2 V, IOUT3 = IOUT4 = 300 mA  
VOUT3 = VOUT4 = 3.3 V, IOUT3 = IOUT4 = 300 mA  
VOUT3 = VOUT4 = 2.5 V, IOUT3 = IOUT4 = 300 mA  
VOUT3 = VOUT4 = 1.8 V, IOUT3 = IOUT4 = 300 mA  
50  
75  
100  
180  
mV  
mV  
mV  
mV  
mA  
Ω
140  
CURRENT-LIMIT THRESHOLD5  
ACTIVE PULL-DOWN  
OUTPUT NOISE  
ILIMIT3, ILIMIT4  
RPDWN-L  
335  
600  
600  
Channel disabled  
Regulator LDO1  
Regulator LDO2  
NOISELDO1  
NOISELDO2  
PSRR  
10 Hz to 100 kHz, VIN3 = 5 V, VOUT3 = 2.8 V  
10 Hz to 100 kHz, VIN4 = 5 V, VOUT4 = 1.2 V  
100  
60  
μV rms  
μV rms  
POWER SUPPLY REJECTION  
RATIO  
Regulator LDO1  
Regulator LDO2  
10 kHz, VIN3 = 3.3 V, VOUT3 = 2.8 V, IOUT3 = 1 mA  
100 kHz, VIN3 = 3.3 V, VOUT3 = 2.8 V, IOUT3 = 1 mA  
1 MHz, VIN3 = 3.3 V, VOUT3 = 2.8 V, IOUT3 = 1 mA  
10 kHz, VIN4 = 1.8 V, VOUT4 = 1.2 V, IOUT4 = 1 mA  
100 kHz, VIN4 = 1.8 V, VOUT4 = 1.2 V, IOUT4 = 1 mA  
1 MHz, VIN4 = 1.8 V, VOUT4 = 1.2 V, IOUT4 = 1 mA  
60  
62  
63  
54  
57  
64  
dB  
dB  
dB  
dB  
dB  
dB  
1 All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC).  
2 This is the input current into VIN3/VIN4, which is not delivered to the output load.  
3 Based on an endpoint calculation using 1 mA and 300 mA loads.  
4 Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only to output voltages  
above 1.7 V.  
5 Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V  
output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V, or 2.7 V.  
INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS  
TA = −40°C to +125°C, unless otherwise specified.  
Table 4.  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
SUGGESTED INPUT AND OUTPUT CAPACITANCE  
BUCK1, BUCK2 Input Capacitor  
BUCK1, BUCK2 Output Capacitor  
LDO1, LDO21 Input and Output Capacitor  
CAPACITOR ESR  
CMIN1, CMIN2  
CMIN1, CMIN2  
CMIN3, CMIN4  
RESR  
4.7  
7
0.70  
0.001  
40  
40  
μF  
μF  
μF  
Ω
1
1 The minimum input and output capacitance should be greater than 0.70 μF over the full range of operating conditions. The full range of operating conditions in the  
application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R- and X5R-type capacitors are  
recommended; Y5V and Z5U capacitors are not recommended for use because of their poor temperature and dc bias characteristics.  
Rev. A | Page 5 of 28  
 
 
 
ADP5034  
Data Sheet  
ABSOLUTE MAXIMUM RATINGS  
THERMAL RESISTANCE  
Table 5.  
θJA is specified for the worst-case conditions, that is, a device  
soldered in a circuit board for surface-mount packages.  
Parameter  
Rating  
AVIN to AGND  
VIN1, VIN2 to AVIN  
PGND1, PGND2 to AGND  
VIN3, VIN4, VOUT1, VOUT2, FB1, FB2,  
FB3, FB4, EN1, EN2, EN3, EN4, MODE  
to AGND  
−0.3 V to +6 V  
−0.3 V to +0.3 V  
−0.3 V to +0.3 V  
−0.3 V to (AVIN + 0.3 V)  
Table 6. Thermal Resistance  
Package Type  
θJA  
θJC  
Unit  
24-Lead, 0.5 mm pitch LFCSP  
35  
3
°C/W  
VOUT3 to AGND  
VOUT4 to AGND  
SW1 to PGND1  
SW2 to PGND2  
−0.3 V to (VIN3 + 0.3 V)  
−0.3 V to (VIN4 + 0.3 V)  
−0.3 V to (VIN1 + 0.3 V)  
−0.3 V to (VIN2 + 0.3 V)  
−65°C to +150°C  
ESD CAUTION  
Storage Temperature Range  
Operating Junction Temperature  
Range  
−40°C to +125°C  
Soldering Conditions  
JEDEC J-STD-020  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
For detailed information on power dissipation, see the Power  
Dissipation and Thermal Considerations section.  
Rev. A | Page 6 of 28  
 
 
Data Sheet  
ADP5034  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
PIN 1  
INDICATOR  
FB4  
EN4  
VIN2  
SW2  
PGND2  
NC  
1
2
3
4
5
6
18 AGND  
AVIN  
16 VIN1  
15 SW1  
14 PGND1  
13 MODE  
17  
ADP5034  
TOP VIEW  
(Not to Scale)  
NOTES  
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.  
2. IT IS RECOMMENDED THAT THE EXPOSED PAD  
BE SOLDERED TO THE GROUND PLANE.  
Figure 2. Pin Configuration—View from the Top of the Die  
Table 7. Pin Function Descriptions  
Pin No. Mnemonic Description  
1
FB4  
LDO2 Feedback Input. For device models with a adjustable output voltage, connect this pin to the middle of the  
LDO2 resistor divider. For device models with a factory programmed output voltage, connect FB4 to the top of the  
capacitor on VOUT4.  
2
3
4
5
6
7
8
EN4  
LDO2 Enable Pin. High level turns on this regulator, and low level turns it off.  
BUCK2 Input Supply (2.3 V to 5.5 V). Connect VIN2 to VIN1 and AVIN.  
BUCK2 Switching Node.  
Dedicated Power Ground for BUCK2.  
No Connect. Leave this pin unconnected.  
BUCK2 Enable Pin. High level turns on this regulator, and low level turns it off.  
BUCK2 Feedback Input. For device models with an adjustable output voltage, connect this pin to the middle of the  
BUCK2 resistor divider. For device models with a fixed output voltage, leave this pin unconnected.  
VIN2  
SW2  
PGND2  
NC  
EN2  
FB2  
9
10  
11  
VOUT2  
VOUT1  
FB1  
BUCK2 Output Voltage Sensing Input. Connect VOUT2 to the top of the capacitor on VOUT2.  
BUCK1 Output Voltage Sensing Input. Connect VOUT1 to the top of the capacitor on VOUT1.  
BUCK1 Feedback Input. For device models with an adjustable output voltage, connect this pin to the middle of the  
BUCK1 resistor divider. For device models with a fixed output voltage, leave this pin unconnected.  
12  
13  
14  
15  
16  
17  
18  
19  
EN1  
BUCK1 Enable Pin. High level turns on this regulator, and low level turns it off.  
BUCK1/BUCK2 Operating Mode. MODE = high: forced PWM operation. MODE = low: auto PWM/PSM operation.  
Dedicated Power Ground for BUCK1.  
MODE  
PGND1  
SW1  
VIN1  
AVIN  
AGND  
FB3  
BUCK1 Switching Node.  
BUCK1 Input Supply (2.3 V to 5.5 V). Connect VIN1 to VIN2 and AVIN.  
Analog Input Supply (2.3 V to 5.5 V). Connect AVIN to VIN1 and VIN2.  
Analog Ground.  
LDO1 Feedback Input. For device models with an adjustable output voltage, connect this pin to the middle of the  
LDO1 resistor divider. For device models with a factory programmed output voltage, connect FB3 to the top of the  
capacitor on VOUT3.  
20  
21  
22  
23  
24  
EPAD  
VOUT3  
VIN3  
EN3  
VIN4  
VOUT4  
EP  
LDO1 Output Voltage.  
LDO1 Input Supply (1.7 V to 5.5 V).  
LDO1 Enable Pin. High level turns on this regulator, and low level turns it off.  
LDO2 Input Supply (1.7 V to 5.5 V).  
LDO2 Output Voltage.  
Exposed Pad. It is recommended that the exposed pad be soldered to the ground plane.  
Rev. A | Page 7 of 28  
 
ADP5034  
Data Sheet  
TYPICAL PERFORMANCE CHARACTERISTICS  
VIN1 = VIN2 = VIN3= VIN4 = 3.6 V, TA = 25°C, unless otherwise noted.  
3.35  
3.33  
3.31  
3.29  
3.27  
3.25  
140  
120  
100  
80  
V
= 4.2V, +25°C  
IN  
V
= 4.2V, +85°C  
= 4.2V, –40°C  
IN  
60  
V
IN  
40  
20  
0
0
0.2  
0.4  
0.6  
(A)  
0.8  
1.0  
1.2  
2.3  
2.8  
3.3  
3.8  
4.3  
4.8  
5.3  
I
INPUT VOLTAGE (V)  
OUT  
Figure 3. System Quiescent Current vs. Input Voltage, VOUT1 = 3.3 V,  
VOUT2 = 1.8 V, VOUT3 = 1.2 V, VOUT4 = 3.3 V, All Channels Unloaded  
Figure 6. BUCK1 Load Regulation Across Temperature, VOUT1 = 3.3 V,  
Auto Mode  
1.864  
T
1.844  
SW  
4
V
= 3.6V, +25°C  
IN  
IOUT  
2
1.824  
1.804  
1.784  
1.764  
V
= 3.6V, +85°C  
IN  
VOUT  
1
V
= 3.6V, –40°C  
IN  
EN  
3
B
B
B
B
CH1 2.00V  
CH3 5.00V  
CH2 50.0mA Ω  
CH4 5.00V  
M 40.0µs  
T 11.20%  
A CH3  
2.2V  
0
0.2  
0.4  
0.6  
(A)  
0.8  
1.0  
1.2  
W
W
W
W
I
OUT  
Figure 4. BUCK1 Startup, VOUT1 = 1.8 V, IOUT1 = 5 mA  
Figure 7. BUCK2 Load Regulation Across Temperature, VOUT2 = 1.8 V,  
Auto Mode  
0.799  
0.798  
T
V
= 3.6V, +85°C  
= 3.6V, +25°C  
IN  
0.797  
0.796  
0.795  
0.794  
0.793  
0.792  
0.791  
0.790  
0.789  
SW  
4
2
V
IN  
IOUT  
VOUT  
EN  
1
3
V
= 3.6V, –40°C  
0.4  
IN  
B
B
B
B
0
0.2  
0.6  
(A)  
0.8  
1.0  
1.2  
CH1 2.00V  
CH3 5.00V  
CH2 50.0mA Ω  
CH4 5.00V  
M 40.0µs  
A CH3  
2.2V  
W
W
W
W
I
OUT  
T
11.20%  
Figure 8. BUCK1 Load Regulation Across Input Voltage, VOUT1 = 0.8 V,  
PWM Mode  
Figure 5. BUCK2 Startup, VOUT2 = 3.3 V, IOUT2 = 10 mA  
Rev. A | Page 8 of 28  
 
Data Sheet  
ADP5034  
100  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
V
V
= 3.9V  
= 4.2V  
= 5.5V  
IN  
IN  
IN  
V
= 3.6V  
IN  
90  
80  
70  
60  
50  
40  
30  
20  
10  
V
= 2.3V  
IN  
V
= 5.5V  
IN  
V
= 4.2V  
IN  
0
0.0001  
0.001  
0.01  
(A)  
0.1  
1
0.001  
0.01  
0.1  
1
I
I
(A)  
OUT  
OUT  
Figure 9. BUCK1 Efficiency vs. Load Current, Across Input Voltage,  
VOUT1 = 3.3 V, Auto Mode  
Figure 12. BUCK2 Efficiency vs. Load Current, Across Input Voltage,  
VOUT2 = 1.8 V, PWM Mode  
100  
90  
100  
90  
80  
70  
60  
80  
V
= 5.5V  
IN  
70  
60  
50  
40  
30  
20  
10  
0
V
= 3.9V  
IN  
V
= 2.3V  
IN  
V
= 5.5V  
IN  
V
= 4.2V  
IN  
50  
40  
30  
20  
10  
0
V
= 3.6V  
IN  
V
= 4.2V  
IN  
0.001  
0.01  
0.1  
1
0.001  
0.01  
0.1  
1
I
(A)  
I
(A)  
OUT  
OUT  
Figure 10. BUCK1 Efficiency vs. Load Current, Across Input Voltage,  
VOUT1 = 3.3 V, PWM Mode  
Figure 13. BUCK1 Efficiency vs. Load Current, Across Input Voltage,  
VOUT1 = 0.8 V, Auto Mode  
100  
90  
100  
90  
V
= 3.6V  
IN  
80  
70  
60  
50  
40  
30  
20  
10  
0
80  
V
= 2.3V  
IN  
V
= 2.3V  
70  
60  
50  
40  
30  
20  
10  
0
IN  
V
= 5.5V  
IN  
V
= 4.2V  
IN  
V
= 5.5V  
V
= 3.6V  
IN  
IN  
V
= 4.2V  
IN  
0.001  
0.01  
0.1  
1
0.001  
0.01  
0.1  
1
I
(A)  
I
(A)  
OUT  
OUT  
Figure 11. BUCK2 Efficiency vs. Load Current, Across Input Voltage,  
OUT2 = 1.8 V, Auto Mode  
Figure 14. BUCK1 Efficiency vs. Load Current, Across Input Voltage,  
VOUT1 = 0.8 V, PWM Mode  
V
Rev. A | Page 9 of 28  
ADP5034  
Data Sheet  
100  
90  
80  
70  
60  
50  
40  
30  
20  
3.3  
3.2  
3.1  
3.0  
2.9  
2.8  
2.7  
2.6  
2.5  
–40°C  
+25°C  
+85°C  
+25°C  
+85°C  
–40°C  
10  
0
0.001  
0.01  
0.1  
1
0
0.2  
0.4  
0.6  
(A)  
0.8  
1.0  
1.2  
I
(A)  
I
OUT  
OUT  
Figure 18. BUCK2 Switching Frequency vs. Output Current, Across  
Temperature, VOUT2 = 1.8 V, PWM Mode  
Figure 15. BUCK1 Efficiency vs. Load Current, Across Temperature,  
VIN = 3.9 V, VOUT1 = 3.3 V, Auto Mode  
100  
T
+85°C  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
+25°C  
VOUT  
1
–40°C  
I
SW  
2
SW  
4
0.001  
0.01  
0.1  
1
CH1 50.0mV  
CH2 500mA Ω  
M 4.00µs A CH2  
28.40%  
240mA  
CH4 2.00V  
I
(A)  
OUT  
T
Figure 16. BUCK2 Efficiency vs. Load Current, Across Temperature,  
OUT2 = 1.8 V, Auto Mode  
Figure 19. Typical Waveforms, VOUT1 = 3.3 V, IOUT1 = 30 mA, Auto Mode  
V
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
T
+25°C  
VOUT  
1
+85°C  
–40°C  
I
SW  
2
SW  
4
B
CH1 50.0mV  
W CH2 500mA Ω  
CH4 2.00V  
M 4.00µs A CH2  
220mA  
0.001  
0.01  
0.1  
1
B
W
I
(A)  
OUT  
T 28.40%  
Figure 20. Typical Waveforms, VOUT2 = 1.8 V, IOUT2 = 30 mA, Auto Mode  
Figure 17. BUCK2 Efficiency vs. Load Current, Across Temperature,  
VOUT1 = 0.8 V, Auto Mode  
Rev. A | Page 10 of 28  
Data Sheet  
ADP5034  
T
T
VOUT  
1
2
VIN  
I
SW  
VOUT  
SW  
1
SW  
4
3
4
B
B
CH1 50mV  
CH2 500mA  
CH4 2.00V  
M 400ns A CH2  
T 28.40%  
220mA  
CH1 50.0mV  
CH3 1.00V  
M 1.00ms  
T 30.40%  
A CH3  
4.80V  
W
W
W
B
B
B
W
CH4 2.00V  
W
Figure 21. Typical Waveforms, VOUT1 = 3.3 V, IOUT1 = 30 mA, PWM Mode  
Figure 24. BUCK2 Response to Line Transient, VIN2 = 4.5 V to 5.0 V,  
VOUT2 = 1.8 V, PWM Mode  
T
T
SW  
VOUT  
1
4
I
SW  
2
VOUT  
1
SW  
I
OUT  
4
2
B
CH1 50mV  
CH2 500mA Ω  
CH4 2.00V  
M 400ns A CH2  
T 28.40%  
220mA  
W
B
B
B
B
W
CH1 50.0mV  
W CH2 50.0mA Ω  
CH4 5.00V  
M 20.0µs A CH2  
T 60.000µs  
356mA  
W
W
Figure 22. Typical Waveforms, VOUT2 = 1.8 V, IOUT2 = 30 mA, PWM Mode  
Figure 25. BUCK1 Response to Load Transient, IOUT1 from 1 mA to 50 mA,  
VOUT1 = 3.3 V, Auto Mode  
T
T
SW  
4
VIN  
VOUT  
1
VOUT  
1
SW  
I
OUT  
3
2
B
B
B
B
CH1 50.0mV  
CH3 1.00V  
M 1.00ms  
T 30.40%  
A CH3  
4.80V  
CH1 50.0mV  
W CH2 50.0mA Ω  
CH4 5.00V  
M 20.0µs A CH2  
379mA  
W
W
W
W
B
B
CH4 2.00V  
W
T
22.20%  
Figure 26. BUCK2 Response to Load Transient, IOUT2 from 1 mA to 50 mA,  
VOUT2 = 1.8 V, Auto Mode  
Figure 23. BUCK1 Response to Line Transient, Input Voltage from 4.5 V to  
5.0 V, VOUT1 = 3.3 V, PWM Mode  
Rev. A | Page 11 of 28  
ADP5034  
Data Sheet  
T
T
SW  
4
1
I
IN  
2
1
3
VOUT  
VOUT  
EN  
I
OUT  
2
B
B
B
B
B
B
CH1 2.00V  
CH3 5.00V  
CH2 50.0mA Ω  
M 40.0µs  
A CH3  
2.2V  
CH1 50.0mV  
W CH2 200mA Ω  
CH4 5.00V  
M 20.0µs A CH2  
408mA  
W
W
W
W
W
W
B
T
11.20%  
T
20.40%  
Figure 27. BUCK1 Response to Load Transient, IOUT1 from 20 mA to 180 mA,  
VOUT1 = 3.3 V, Auto Mode  
Figure 30. LDO Startup, VOUT3 = 3.0 V, IOUT3 = 5 mA  
2.820  
2.815  
2.810  
2.805  
2.800  
2.795  
2.790  
2.785  
2.780  
T
SW  
4
VOUT  
1
V
= 4.5V  
V
= 3.3V  
IN  
IN  
I
OUT  
V
= 5.5V  
IN  
2
V
= 5.0V  
IN  
B
B
B
CH1 100mV  
CH2 200mA  
CH4 5.00V  
M 20.0µs A CH2  
88.0mA  
0
0.05  
0.10  
0.15  
0.20  
0.25  
0.30  
W
W
W
I
(A)  
T
19.20%  
OUT  
Figure 28. BUCK2 Response to Load Transient, IOUT2 from 20 mA to 180 mA,  
Figure 31. LDO Load Regulation Across Input Voltage, VOUT3 = 2.8 V  
VOUT2 = 1.8 V, Auto Mode  
400  
350  
T
VOUT2  
SW1  
2
3
300  
+125°C  
250  
200  
150  
100  
50  
+25°C  
–40°C  
VOUT1  
SW2  
1
4
0
B
B
CH1 5.00V  
CH3 5.00V  
CH2 5.00V  
CH4 5.00V  
M 400ns A CH4  
50.00%  
1.90V  
W
W
W
W
2.3  
2.8  
3.3  
3.8  
4.3  
4.8  
5.3  
B
B
T
INPUT VOLTAGE (V)  
Figure 29. VOUT and SW Waveforms for BUCK1 and BUCK2 in PWM Mode  
Showing Out-of-Phase Operation  
Figure 32. NMOS RDSON vs. Input Voltage Across Temperature  
Rev. A | Page 12 of 28  
Data Sheet  
ADP5034  
250  
200  
150  
100  
50  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
+125°C  
+25°C  
–40°C  
0
2.3  
0
2.8  
3.3  
3.8  
4.3  
4.8  
5.3  
0
0.05  
0.10  
0.15  
0.20  
0.25  
INPUT VOLTAGE (V)  
LOAD CURRENT (A)  
Figure 33. PMOS RDSON vs. Input Voltage Across Temperature  
Figure 36. LDO Ground Current vs. Output Load, VIN3 = 3.3 V, VOUT3 = 2.8 V  
3.45  
T
3.40  
3.35  
3.30  
3.25  
3.20  
3.15  
I
OUT  
2
1
V
V
= 4.2V, +85°C  
IN  
V
= 4.2V, +25°C  
IN  
VOUT  
= 4.2V, –40°C  
IN  
B
B
W
CH1 100mV  
CH2 100mA Ω  
M 40.0µs A CH2  
52.0mA  
0
0.05  
0.10  
0.15  
(A)  
0.20  
0.25  
0.30  
W
I
T
19.20%  
OUT  
Figure 34. LDO Load Regulation Across Temperature, VIN3 = 3.3 V, VOUT3 = 2.8 V  
Figure 37. LDO Response to Load Transient, IOUT3 from 1 mA to 80 mA,  
VOUT3 = 2.8 V  
3.0  
I
= 10mA  
I
= 100µA  
OUT  
T
OUT  
I
= 1mA  
OUT  
= 100mA  
= 150mA  
2.5  
2.0  
1.5  
1.0  
0.5  
0
I
OUT  
I
VIN  
OUT  
= 300mA  
I
OUT  
VOUT  
1
3
CH1 20.0mV  
CH3 1.00V  
M 100µs  
28.40%  
A
CH3  
4.80V  
2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4  
V
(V)  
T
IN  
Figure 35. LDO Line Regulation Across Output Load, VOUT3 = 2.8 V  
Figure 38. LDO Response to Line Transient, Input Voltage from 4.5 V to 5.5 V,  
VOUT3 = 2.8 V  
Rev. A | Page 13 of 28  
ADP5034  
Data Sheet  
60  
55  
50  
45  
0
V
= 5V  
IN  
–20  
–40  
–60  
–80  
V
= 3.3V  
IN  
40  
35  
30  
100µA  
1mA  
10mA  
50mA  
100mA  
150mA  
–100  
–120  
25  
0.001  
0.01  
0.1  
1
10  
100  
10  
100  
1k  
10k  
100k  
1M  
10M  
I
(mA)  
FREQUENCY (Hz)  
LOAD  
Figure 39. LDO Output Noise vs. Load Current, Across Input Voltage,  
VOUT3 = 2.8 V  
Figure 42. LDO PSRR Across Output Load, VIN3 = 3.3 V, VOUT3 = 3.0 V  
0
65  
100µA  
1mA  
10mA  
50mA  
100mA  
150mA  
V
= 5V  
IN  
60  
–20  
V
= 3.3V  
IN  
55  
50  
45  
40  
35  
30  
–40  
–60  
–80  
–100  
–120  
25  
0.001  
0.01  
0.1  
1
10  
100  
10  
100  
1k  
10k  
100k  
1M  
10M  
I
(mA)  
FREQUENCY (Hz)  
LOAD  
Figure 40. LDO Output Noise vs. Load Current, Across Input Voltage,  
VOUT3 = 3.0 V  
Figure 43. LDO PSRR Across Output Load, VIN3 = 5.0 V, VOUT3 = 2.8 V  
0
0
100µA  
100µA  
1mA  
–10  
1mA  
10mA  
50mA  
100mA  
–10  
10mA  
50mA  
100mA  
150mA  
–20  
–20  
150mA  
–30  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
10  
100  
1k  
10k  
100k  
1M  
10M  
10  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
Figure 41. LDO PSRR Across Output Load, VIN3 = 3.3 V, VOUT3 = 2.8 V  
Figure 44. LDO PSRR Across Output Load, VIN3 = 5.0 V, VOUT3 = 3.0 V  
Rev. A | Page 14 of 28  
Data Sheet  
ADP5034  
THEORY OF OPERATION  
VOUT1 FB1 FB2 VOUT2  
GM ERROR  
AMP  
GM ERROR  
AMP  
ENBK1  
ENBK2  
75  
75ꢀ  
AVIN  
PWM  
COMP  
PWM  
COMP  
SOFT START  
SOFT START  
VIN2  
VIN1  
I
I
LIMIT  
LIMIT  
PSM  
PSM  
COMP  
COMP  
PWM/  
PSM  
CONTROL  
BUCK1  
PWM/  
PSM  
CONTROL  
BUCK2  
LOW  
CURRENT  
LOW  
CURRENT  
SW2  
SW1  
OSCILLATOR  
DRIVER  
DRIVER  
AND  
ANTISHOOT  
THROUGH  
AND  
SYSTEM  
UNDERVOLTAGE  
LOCKOUT  
OP  
MODE  
ANTISHOOT  
THROUGH  
SEL  
PGND2  
MODE2  
THERMAL  
SHUTDOWN  
B
A
PGND1  
ENLDO2  
Y
600ꢀ  
MODE  
EN1  
EN2  
EN3  
EN4  
ENBK1  
ENABLE  
AND  
ENBK2  
LDO  
UNDERVOLTAGE  
LOCKOUT  
LDO  
UNDERVOLTAGE  
LOCKOUT  
MODE  
ENLDO1  
ENLDO2  
CONTROL  
R1  
R2  
R3  
R4  
LDO  
CONTROL  
LDO  
AVIN  
AVIN  
CONTROL  
ENLDO1  
600ꢀ  
ADP5034  
VIN3  
AGND FB3 VOUT3 VIN4  
FB4  
VOUT4  
Figure 45. Functional Block Diagram  
This operating mode reduces the switching and quiescent  
current losses. The auto PWM/PSM mode transition is  
controlled independently for each buck regulator. The two  
bucks operate synchronized to each other.  
POWER MANAGEMENT UNIT  
The ADP5034 is a micropower management units (micro  
PMU) combining two step-down (buck) dc-to-dc convertors  
and two low dropout linear regulators (LDOs). The high  
switching frequency and tiny 24-lead LFCSP package allow for  
a small power management solution.  
The ADP5034 has individual enable pins (EN1 to EN4) control-  
ling the activation of each regulator. The regulators are activated  
by a logic level high applied to the respective EN pin. EN1 controls  
BUCK1, EN2 controls BUCK2, EN3 controls LDO1, and EN4  
controls LDO2.  
To combine these high performance regulators into the micro  
PMU, there is a system controller allowing them to operate  
together.  
Regulator output voltages are set through external resistor  
dividers or can be optionally factory programmed to default  
values (see the Ordering Guide section).  
The buck regulators can operate in forced PWM mode if the  
MODE pin is at a logic high level. In forced PWM mode, the  
buck switching frequency is always constant and does not  
change with the load current. If the MODE pin is at logic low  
level, the switching regulators operate in auto PWM/PSM  
mode. In this mode, the regulators operate at fixed PWM  
frequency when the load current is above the PSM current  
threshold. When the load current falls below the PSM current  
threshold, the regulator in question enters PSM, where the  
switching occurs in bursts. The burst repetition rate is a  
function of the current load and the output capacitor value.  
When a regulator is turned on, the output voltage ramp rate is  
controlled though a soft start circuit to avoid a large inrush  
current due to the charging of the output capacitors.  
Rev. A | Page 15 of 28  
 
ADP5034  
Data Sheet  
Thermal Protection  
Alternatively, the user can select device models with a UVLO  
set at a higher level, suitable for USB applications. For these  
models, the device reaches the turn-off threshold when the  
input supply drops to 3.65 V typical.  
In the event that the junction temperature rises above 150°C,  
the thermal shutdown circuit turns off all the regulators. Extreme  
junction temperatures can be the result of high current opera-  
tion, poor circuit board design, or high ambient temperature.  
A 20°C hysteresis is included so that when thermal shutdown  
occurs, the regulators do not return to operation until the on-chip  
temperature drops below 130°C. When coming out of thermal  
shutdown, all regulators restart with soft start control.  
In case of a thermal or UVLO event, the active pull-downs (if  
factory enabled) are enabled to discharge the output capacitors  
quickly. The pull-down resistors remain engaged until the  
thermal fault event is no longer present or the input supply  
voltage falls below the VPOR voltage level. The typical value of  
VPOR is approximately 1 V.  
Undervoltage Lockout  
Enable/Shutdown  
To protect against battery discharge, undervoltage lockout  
(UVLO) circuitry is integrated into the system. If the input  
voltage on VIN1 drops below a typical 2.15 V UVLO threshold,  
all channels shut down. In the buck channels, both the power  
switch and the synchronous rectifier turn off. When the voltage  
on VIN1 rises above the UVLO threshold, the part is enabled  
once more.  
The ADP5034 has an individual control pin for each regulator.  
A logic level high applied to the ENx pin activates a regulator,  
whereas a logic level low turns off a regulator.  
Figure 46 shows the regulator activation timings for the  
ADP5034 when all enable pins are connected to AVIN. Also  
shown is the active pull-down activation.  
V
UVLO  
AVIN  
V
POR  
VOUT1  
VOUT3  
VOUT4  
30µs  
(MIN)  
30µs  
(MIN)  
50µs (MIN)  
VOUT2  
50µs (MIN)  
BUCK1,  
LDO1,  
LDO2  
PULL-DOWNS  
BUCK2  
PULL-DOWN  
Figure 46. Regulator Sequencing on the ADP5034 (EN1 = EN2 = EN3 = EN4 = VAVIN  
)
Rev. A | Page 16 of 28  
 
Data Sheet  
ADP5034  
drives the inductor to make the output voltage rise again to the  
upper threshold. This process is repeated while the load current  
is below the PSM current threshold.  
BUCK1 AND BUCK2  
The buck uses a fixed frequency and high speed current mode  
architecture. The buck operates with an input voltage of 2.3 V  
to 5.5 V.  
The ADP5034 has a dedicated MODE pin controlling the PSM  
and PWM operation. A high logic level applied to the MODE  
pin forces both bucks to operate in PWM mode. A logic level  
low sets the bucks to operate in auto PSM/PWM.  
The buck output voltage is set through external resistor  
dividers, shown in Figure 47 for BUCK1. The output voltage  
can optionally be factory programmed to default values as  
indicated in the Ordering Guide section. In this event, R1 and  
R2 are not needed, and FB1 can be left unconnected. In all  
cases, VOUT1 must be connected to the output capacitor. FB1  
is 0.5 V.  
PSM Current Threshold  
The PSM current threshold is set to100 mA. The bucks employ  
a scheme that enables this current to remain accurately  
controlled, independent of input and output voltage levels. This  
scheme also ensures that there is very little hysteresis between  
the PSM current threshold for entry to and exit from the PSM.  
The PSM current threshold is optimized for excellent efficiency  
over all load currents.  
VOUT1  
VIN1  
L1  
1µH  
SW1  
VOUT1  
BUCK  
R1  
R2  
C5  
10µF  
FB1  
Oscillator/Phasing of Inductor Switching  
AGND  
The ADP5034 ensures that both bucks operate at the same  
switching frequency when both bucks are in PWM mode.  
R1  
R2  
V
= V  
FB1  
+ 1  
OUT1  
Additionally, the ADP5034 ensures that when both bucks are in  
PWM mode, they operate out of phase, whereby the Buck2  
pFET starts conducting exactly half a clock period after the  
BUCK1 pFET starts conducting.  
Figure 47. BUCK1 External Output Voltage Setting  
Control Scheme  
The bucks operate with a fixed frequency, current mode PWM  
control architecture at medium to high loads for high efficiency  
but shift to a power save mode (PSM) control scheme at light  
loads to lower the regulation power losses. When operating in  
fixed frequency PWM mode, the duty cycle of the integrated  
switches is adjusted and regulates the output voltage. When  
operating in PSM at light loads, the output voltage is controlled  
in a hysteretic manner, with higher output voltage ripple. During  
part of this time, the converter is able to stop switching and  
enters an idle mode, which improves conversion efficiency.  
Short-Circuit Protection  
The bucks include frequency foldback to prevent output current  
runaway on a hard short. When the voltage at the feedback pin  
falls below half the target output voltage, indicating the possi-  
bility of a hard short at the output, the switching frequency is  
reduced to half the internal oscillator frequency. The reduction  
in the switching frequency allows more time for the inductor to  
discharge, preventing a runaway of output current.  
Soft Start  
PWM Mode  
The bucks have an internal soft start function that ramps the  
output voltage in a controlled manner upon startup, thereby  
limiting the inrush current. This prevents possible input voltage  
drops when a battery or a high impedance power source is  
connected to the input of the converter.  
In PWM mode, the bucks operate at a fixed frequency of 3 MHz  
set by an internal oscillator. At the start of each oscillator cycle,  
the pFET switch is turned on, sending a positive voltage across  
the inductor. Current in the inductor increases until the current  
sense signal crosses the peak inductor current threshold that  
turns off the pFET switch and turns on the nFET synchronous  
rectifier. This sends a negative voltage across the inductor,  
causing the inductor current to decrease. The synchronous  
rectifier stays on for the rest of the cycle. The buck regulates the  
output voltage by adjusting the peak inductor current threshold.  
Current Limit  
Each buck has protection circuitry to limit the amount of  
positive current flowing through the pFET switch and the  
amount of negative current flowing through the synchronous  
rectifier. The positive current limit on the power switch limits  
the amount of current that can flow from the input to the  
output. The negative current limit prevents the inductor  
current from reversing direction and flowing out of the load.  
Power Save Mode (PSM)  
The bucks smoothly transition to PSM operation when the load  
current decreases below the PSM current threshold. When  
either of the bucks enters PSM, an offset is induced in the PWM  
regulation level, which makes the output voltage rise. When the  
output voltage reaches a level approximately 1.5% above the  
PWM regulation level, PWM operation is turned off. At this  
point, both power switches are off, and the buck enters an idle  
mode. The output capacitor discharges until the output voltage  
falls to the PWM regulation voltage, at which point the device  
100% Duty Operation  
With a drop in input voltage, or with an increase in load  
current, the buck may reach a limit where, even with the pFET  
switch on 100% of the time, the output voltage drops below the  
desired output voltage. At this limit, the buck transitions to a  
mode where the pFET switch stays on 100% of the time. When  
Rev. A | Page 17 of 28  
 
 
ADP5034  
Data Sheet  
the input conditions change again and the required duty cycle  
falls, the buck immediately restarts PWM regulation without  
allowing overshoot on the output voltage.  
Each LDO output voltage is set through external resistor dividers  
as shown in Figure 48 for LDO1. The output voltage can option-  
ally be factory programmed to default values as indicated in the  
Ordering Guide section. In this event, Ra and Rb are not needed,  
and FB3 must be connected to the top of the capacitor on VOUT3.  
Active Pull-Downs  
All regulators have optional, factory programmable, active pull-  
down resistors discharging the respective output capacitors  
when the regulators are disabled. The pull-down resistors are  
connected between VOUTx and AGND. Active pull-downs are  
disabled when the regulators are turned on. The typical value of  
the pull-down resistor is 600 Ω for the LDOs and 75 Ω for the  
bucks. Figure 46 shows the activation timings for the active  
pull-downs during regulator activation and deactivation.  
VOUT3  
VOUT3  
VIN3  
C7  
1µF  
Ra  
FB3  
LDO1  
Rb  
Ra  
V
= V  
+ 1  
OUT3  
FB3  
Rb  
LDO1 AND LDO2  
Figure 48. LDO1 External Output Voltage Setting  
The ADP5034 contains two LDOs with low quiescent current  
and low dropout linear regulators, and provides up to 300 mA  
of output current. Drawing a low 10 ꢀA quiescent current  
(typical) at no load makes the LDO ideal for battery-operated  
portable equipment.  
The LDOs also provide high power supply rejection ratio  
(PSRR), low output noise, and excellent line and load transient  
response with only a small 1 μF ceramic input and output  
capacitor.  
Each LDO operates with an input voltage of 1.7 V to 5.5 V. The  
wide operating range makes these LDOs suitable for cascading  
configurations where the LDO supply voltage is provided from  
one of the buck regulators.  
LDO1 is optimized to supply analog circuits because it offers  
better noise performance compared to LDO2. LDO1 should be  
used in applications where noise performance is critical.  
Rev. A | Page 18 of 28  
 
 
Data Sheet  
ADP5034  
APPLICATIONS INFORMATION  
Ceramic capacitors are manufactured with a variety of dielec-  
trics, each with a different behavior over temperature and  
applied voltage. Capacitors must have a dielectric adequate  
to ensure the minimum capacitance over the necessary  
temperature range and dc bias conditions. X5R or X7R  
dielectrics with a voltage rating of 6.3 V or 10 V are recom-  
mended for best performance. Y5V and Z5U dielectrics are  
not recommended for use with any dc-to-dc converter because  
of their poor temperature and dc bias characteristics.  
BUCK EXTERNAL COMPONENT SELECTION  
Trade-offs between performance parameters such as efficiency  
and transient response can be made by varying the choice of  
external components in the applications circuit, as shown in  
Figure 1.  
Feedback Resistors  
For the adjustable model, referring to Figure 49 the total  
combined resistance for R1 and R2 is not to exceed 400 kꢁ.  
Inductor  
The worst-case capacitance accounting for capacitor variation  
over temperature, component tolerance, and voltage is calcu-  
lated using the following equation:  
The high switching frequency of the ADP5034 bucks allows for  
the selection of small chip inductors. For best performance, use  
inductor values between 0.7 ꢀH and 3 ꢀH. Suggested inductors  
are shown in Table 8.  
CEFF = COUT × (1 − TEMPCO) × (1 − TOL)  
where:  
The peak-to-peak inductor current ripple is calculated using  
the following equation:  
C
EFF is the effective capacitance at the operating voltage.  
TEMPCO is the worst-case capacitor temperature coefficient.  
TOL is the worst-case component tolerance.  
VOUT ×(VIN VOUT  
)
IRIPPLE  
=
In this example, the worst-case temperature coefficient  
(TEMPCO) over −40°C to +85°C is assumed to be 15% for an  
X5R dielectric. The tolerance of the capacitor (TOL) is assumed  
to be 10%, and COUT is 9.2 ꢀF at 1.8 V, as shown in Figure 49.  
V
IN × fSW ×L  
where:  
SW is the switching frequency.  
L is the inductor value.  
f
Substituting these values in the equation yields  
The minimum dc current rating of the inductor must be greater  
than the inductor peak current. The inductor peak current is  
calculated using the following equation:  
CEFF = 9.2 ꢀF × (1 − 0.15) × (1 − 0.1) ≈ 7.0 ꢀF  
To guarantee the performance of the bucks, it is imperative  
that the effects of dc bias, temperature, and tolerances on the  
behavior of the capacitors be evaluated for each application.  
12  
IRIPPLE  
2
IPEAK = ILOAD(MAX)  
+
Inductor conduction losses are caused by the flow of current  
through the inductor, which has an associated internal dc  
resistance (DCR). Larger sized inductors have smaller DCR,  
which may decrease inductor conduction losses. Inductor core  
losses are related to the magnetic permeability of the core material.  
Because the bucks are high switching frequency dc-to-dc  
converters, shielded ferrite core material is recommended for  
its low core losses and low EMI.  
10  
8
6
4
Output Capacitor  
2
Higher output capacitor values reduce the output voltage ripple  
and improve load transient response. When choosing this value,  
it is also important to account for the loss of capacitance due to  
output voltage dc bias.  
0
0
1
2
3
4
5
6
DC BIAS VOLTAGE (V)  
Figure 49. Capacitance vs. Voltage Characteristic  
Table 8. Suggested 1.0 μH Inductors  
Vendor  
Model  
Dimensions (mm)  
2.0 × 1.6 × 0.9  
3.2 × 2.5 × 1.6  
3.2 × 2.5 × 2.5  
4.0 × 4.0 × 2.1  
1.9 × 2.0 × 1.0  
2.5 × 2.0 × 1.2  
ISAT (mA)  
1400  
2300  
2000  
5400  
DCR (mΩ)  
Murata  
Murata  
Taiyo Yuden  
Coilcraft®  
Coilcraft  
Toko  
LQM2MPN1R0NG0B  
LQH32PN1R0NN0  
CBC3225T1R0MR  
XFL4020-102ME  
XPL2010-102ML  
MDT2520-CN  
85  
45  
71  
11  
89  
85  
1800  
1350  
Rev. A | Page 19 of 28  
 
 
 
ADP5034  
Data Sheet  
The peak-to-peak output voltage ripple for the selected output  
capacitor and inductor values is calculated using the following  
equation:  
To minimize supply noise, place the input capacitor as close as  
possible to the VINx pin of the buck. As with the output  
capacitor, a low ESR capacitor is recommended.  
IRIPPLE  
8× fSW ×COUT  
VIN  
2 ×L×COUT  
The effective capacitance needed for stability, which includes  
temperature and dc bias effects, is a minimum of 3 μF and a  
maximum of 10 μF. A list of suggested capacitors is shown in  
Table 9 and Table 10.  
VRIPPLE  
=
(
2π× fSW  
)
Capacitors with lower effective series resistance (ESR) are  
preferred to guarantee low output voltage ripple, as shown in  
the following equation:  
Table 9. Suggested 10 μF Capacitors  
Voltage  
Rating  
(V)  
VRIPPLE  
IRIPPLE  
ESRCOUT  
Case  
Size  
Vendor  
Murata  
TDK  
Type Model  
X5R  
X5R  
X5R  
GRM188R60J106  
C1608JB0J106K  
ECJ1VB0J106M  
0603 6.3  
0603 6.3  
0603 6.3  
The effective capacitance needed for stability, which includes  
temperature and dc bias effects, is a minimum of 7 μF and a  
maximum of 40 μF.  
Panasonic  
The buck regulators require 10 μF output capacitors to guaran-  
tee stability and response to rapid load variations and to transition  
into and out of the PWM/PSM modes. A list of suggested capaci-  
tors is shown in Table 9. In certain applications where one or  
both buck regulator powers a processor, the operating state is  
known because it is controlled by software. In this condition,  
the processor can drive the MODE pin according to the operating  
state; consequently, it is possible to reduce the output capacitor  
from 10 μF to 4.7 μF because the regulator does not expect a  
large load variation when working in PSM mode (see Figure 50).  
Table 10. Suggested 4.7 μF Capacitors  
Voltage  
Case Rating  
Size (V)  
GRM188R60J475ME19D 0402 6.3  
Vendor  
Type Model  
X5R  
Murata  
Taiyo Yuden X5R  
Panasonic X5R  
JMK107BJ475  
ECJ-0EB0J475M  
0402 6.3  
0402 6.3  
Table 11. Suggested 1.0 μF Capacitors  
Case  
Size  
Voltage  
Rating (V)  
Vendor  
Murata  
TDK  
Panasonic  
Taiyo  
Type Model  
X5R  
X5R  
X5R  
X5R  
GRM155B30J105K  
C1005JB0J105KT  
ECJ0EB0J105K  
0402  
0402  
0402  
0402  
6.3  
6.3  
6.3  
10.0  
Input Capacitor  
Higher value input capacitors help to reduce the input voltage  
ripple and improve transient response. Maximum input  
capacitor current is calculated using the following equation:  
LMK105BJ105MV-F  
Yuden  
VOUT (VIN VOUT  
)
ICIN ILOAD(MAX)  
VIN  
AVIN  
VIN1  
HOUSEKEEPING  
BUCK1  
CAVIN  
0.1µF  
VOUT1  
L1 1µH  
2.3V TO  
5.5V  
SW1  
FB1  
VOUT1  
1200mA  
@
C1  
4.7µF  
R1  
R2  
C5  
10µF  
ON  
PGND1  
EN1  
EN1  
OFF  
MODE  
PWM  
MODE  
VOUT2  
PSM/PWM  
VIN2  
EN2  
MODE  
L2 1µH  
R3  
SW2  
FB2  
VOUT2  
1200mA  
@
C2  
4.7µF  
BUCK2  
EN2  
C6  
10µF  
R4  
PGND2  
ON  
OFF  
OFF  
VOUT3  
FB3  
EN3  
VOUT3  
300mA  
@
EN3  
LDO1  
R5  
R6  
VIN3  
1.7V TO  
5.5V  
(ANALOG)  
C7  
1µF  
C3  
1µF  
ON  
EN4  
VOUT4  
FB4  
VOUT4  
300mA  
@
EN4  
LDO2  
(DIGITAL)  
R7  
R8  
VIN4  
C8  
1µF  
C4  
1µF  
ADP5034  
AGND  
Figure 50. Processor System Power Management with PSM/PWM Control  
Rev. A | Page 20 of 28  
 
 
 
Data Sheet  
ADP5034  
1.2  
1.0  
0.8  
0.6  
LDO EXTERNAL COMPONENT SELECTION  
Feedback Resistors  
For the adjustable model, the maximum value of Rb is not to  
exceed 200 kꢁ (see Figure 48).  
Output Capacitor  
The ADP5034 LDOs are designed for operation with small, space-  
saving ceramic capacitors, but function with most commonly  
used capacitors as long as care is taken with the ESR value. The  
ESR of the output capacitor affects stability of the LDO control  
loop. A minimum of 0.70 μF capacitance with an ESR of 1 ꢁ  
or less is recommended to ensure that stability of the ADP5034.  
Transient response to changes in load current is also affected by  
output capacitance. Using a larger value of output capacitance  
improves the transient response of the ADP5034 to large  
changes in load current.  
0.4  
0.2  
0
0
1
2
3
4
5
6
DC BIAS VOLTAGE (V)  
Figure 51. Capacitance vs. Voltage Characteristic  
Use the following equation to determine the worst-case capa-  
citance accounting for capacitor variation over temperature,  
component tolerance, and voltage:  
Input Bypass Capacitor  
Connecting a 1 μF capacitor from VIN3 and VIN4 to ground  
reduces the circuit sensitivity to printed circuit board (PCB)  
layout, especially when long input traces or high source imped-  
ance is encountered. If greater than 1 μF of output capacitance  
is required, increase the input capacitor to match it.  
CEFF = CBIAS × (1 − TEMPCO) × (1 − TOL)  
where:  
CBIAS is the effective capacitance at the operating voltage.  
TEMPCO is the worst-case capacitor temperature coefficient.  
TOL is the worst-case component tolerance.  
Input and Output Capacitor Properties  
Use any good quality ceramic capacitors with the ADP5034 as  
long as they meet the minimum capacitance and maximum ESR  
requirements. Ceramic capacitors are manufactured with a variety  
of dielectrics, each with a different behavior over temperature  
and applied voltage. Capacitors must have a dielectric adequate  
to ensure the minimum capacitance over the necessary tempera-  
ture range and dc bias conditions. X5R or X7R dielectrics with a  
voltage rating of 6.3 V or 10 V are recommended for best perfor-  
mance. Y5V and Z5U dielectrics are not recommended for use  
with any LDO because of their poor temperature and dc bias  
characteristics.  
In this example, the worst-case temperature coefficient  
(TEMPCO) over −40°C to +85°C is assumed to be 15% for an  
X5R dielectric. The tolerance of the capacitor (TOL) is assumed  
to be 10%, and CBIAS is 0.85 ꢀF at 1.8 V as shown in Figure 51.  
Substituting these values into the following equation,  
CEFF = 0.85 ꢀF × (1 − 0.15) × (1 − 0.1) = 0.65 ꢀF  
Therefore, the capacitor chosen in this example meets the  
minimum capacitance requirement of the LDO over  
temperature and tolerance at the chosen output voltage.  
To guarantee the performance of the ADP5034, it is imperative  
that the effects of dc bias, temperature, and tolerances on the  
behavior of the capacitors be evaluated for each application.  
Figure 51 depicts the capacitance vs. voltage bias characteristic  
of a 0402 1 μF, 10 V, X5R capacitor. The voltage stability of a capa-  
citor is strongly influenced by the capacitor size and voltage rating.  
In general, a capacitor in a larger package or with higher voltage  
rating exhibits better stability. The temperature variation of the  
X5R dielectric is about 15% over the −40°C to +85°C tempera-  
ture range and is not a function of package or voltage rating.  
Rev. A | Page 21 of 28  
 
 
ADP5034  
Data Sheet  
POWER DISSIPATION AND THERMAL CONSIDERATIONS  
The ADP5034 is a highly efficient μPMU, and, in most cases,  
the power dissipated in the device is not a concern. However,  
if the device operates at high ambient temperatures and maxi-  
mum loading condition, the junction temperature can reach  
the maximum allowable operating limit (125°C).  
BUCK REGULATOR POWER DISSIPATION  
The power loss of the buck regulator is approximated by  
LOSS = PDBUCK + PL  
where:  
DBUCK is the power dissipation on one of the ADP5034 buck  
P
(3)  
P
When the temperature exceeds 150°C, the ADP5034 turns off  
all the regulators, allowing the device to cool down. When the  
die temperature falls below 130°C, the ADP5034 resumes  
normal operation.  
regulators.  
PL is the inductor power losses.  
The inductor losses are external to the device, and they do not  
have any effect on the die temperature.  
This section provides guidelines to calculate the power dissi-  
pated in the device and ensure that the ADP5034 operates  
below the maximum allowable junction temperature.  
The inductor losses are estimated (without core losses) by  
PL IOUT1(RMS)2 × DCRL  
where:  
DCRL is the inductor series resistance.  
(4)  
The efficiency for each regulator on the ADP5034 is given by  
POUT  
PIN  
η =  
×100%  
(1)  
IOUT1(RMS) is the rms load current of the buck regulator.  
where:  
η is the efficiency.  
PIN is the input power.  
r
IOUT1(RMS) = IOUT1 × 1+  
12  
(5)  
(6)  
where r is the normalized inductor ripple current.  
r = VOUT1 × (1 − D)/(IOUT1 × L × fSW)  
P
OUT is the output power.  
Power loss is given by  
where:  
L is the inductance.  
SW is the switching frequency.  
D is the duty cycle.  
P
P
LOSS = PIN POUT  
(2a)  
(2b)  
or  
f
LOSS = POUT (1− η)/η  
D = VOUT1/VIN1  
(7)  
Power dissipation can be calculated in several ways. The most  
intuitive and practical is to measure the power dissipated at the  
input and all the outputs. Perform the measurements at the  
worst-case conditions (voltages, currents, and temperature).  
The difference between input and output power is dissipated in  
the device and the inductor. Use Equation 4 to derive the power  
lost in the inductor and, from this, use Equation 3 to calculate  
the power dissipation in the ADP5034 buck converter.  
ADP5034 buck regulator power dissipation, PDBUCK, includes the  
power switch conductive losses, the switch losses, and the transi-  
tion losses of each channel. There are other sources of loss, but  
these are generally less significant at high output load currents,  
where the thermal limit of the application is. Equation 8  
captures the calculation that must be made to estimate the  
power dissipation in the buck regulator.  
A second method to estimate the power dissipation uses the  
efficiency curves provided for the buck regulator, and the power  
lost on each LDO can be calculated using Equation 12. When  
the buck efficiency is known, use Equation 2b to derive the total  
power lost in the buck regulator and inductor, use Equation 4 to  
derive the power lost in the inductor, and then calculate the  
power dissipation in the buck converter using Equation 3. Add  
the power dissipated in the buck and in the two LDOs to find  
the total dissipated power.  
P
DBUCK = PCOND + PSW + PTRAN  
(8)  
The power switch conductive losses are due to the output current,  
IOUT1, flowing through the P-MOSFET and the N-MOSFET  
power switches that have internal resistance, RDSON-P and  
RDSON-N. The amount of conductive power loss is found by  
2
P
COND = [RDSON-P × D + RDSON-N × (1 − D)] × IOUT1  
(9)  
where RDSON-P is approximately 0.2 ꢁ, and RDSON-N is approxi-  
mately 0.16 ꢁ at 125°C junction temperature and VIN1 = VIN2 =  
3.6 V. At VIN1 = VIN2 = 2.3 V, these values change to 0.31 ꢁ and  
0.21 ꢁ, respectively, and at VIN1 = VIN2 = 5.5 V, the values are  
0.16 ꢁ and 0.14 ꢁ, respectively.  
Note that the buck efficiency curves are typical values and may  
not be provided for all possible combinations of VIN, VOUT, and  
IOUT. To account for these variations, it is necessary to include a  
safety margin when calculating the power dissipated in the buck.  
A third way to estimate the power dissipation is analytical and  
involves modeling the losses in the buck circuit provided by  
Equation 8 to Equation 11 and the losses in the LDO provided  
by Equation 12.  
Rev. A | Page 22 of 28  
 
 
 
 
 
 
Data Sheet  
ADP5034  
Switching losses are associated with the current drawn by the  
driver to turn on and turn off the power devices at the switching  
frequency. The amount of switching power loss is given by  
JUNCTION TEMPERATURE  
In cases where the board temperature, TA, is known, the  
thermal resistance parameter, θJA, can be used to estimate the  
junction temperature rise. TJ is calculated from TA and PD using  
the formula  
P
SW = (CGATE-P + CGATE-N) × VIN12 × fSW  
(10)  
where:  
C
C
GATE-P is the P-MOSFET gate capacitance.  
GATE-N is the N-MOSFET gate capacitance.  
TJ = TA + (PD × θJA)  
(14)  
The typical θJA value for the 24-lead, 4 mm × 4 mm LFCSP is  
35°C/W (see Table 6). A very important factor to consider is  
that θJA is based on a 4-layer 4 in × 3 in, 2.5 oz copper, as per  
JEDEC standard, and real applications may use different sizes  
and layers. It is important to maximize the copper used to remove  
the heat from the device. Copper exposed to air dissipates heat  
better than copper used in the inner layers. The exposed pad  
should be connected to the ground plane with several vias.  
For the ADP5034, the total of (CGATE-P + CGATE-N) is  
approximately 150 pF.  
The transition losses occur because the P-channel power  
MOSFET cannot be turned on or off instantaneously, and the  
SW node takes some time to slew from near ground to near  
VOUT1 (and from VOUT1 to ground). The amount of transition  
loss is calculated by  
If the case temperature can be measured, the junction  
temperature is calculated by  
P
TRAN = VIN1 × IOUT1 × (tRISE + tFALL) × fSW  
(11)  
where tRISE and tFALL are the rise time and the fall time of the  
switching node, SW. For the ADP5034, the rise and fall times of  
SW are in the order of 5 ns.  
TJ = TC + (PD × θJC)  
(15)  
where TC is the case temperature and θJC is the junction-to-case  
thermal resistance provided in Table 6.  
If the preceding equations and parameters are used for estimat-  
ing the converter efficiency, it must be noted that the equations  
do not describe all of the converter losses, and the parameter  
values given are typical numbers. The converter performance  
also depends on the choice of passive components and board  
layout; therefore, a sufficient safety margin should be included  
in the estimate.  
When designing an application for a particular ambient  
temperature range, calculate the expected ADP5034 power  
dissipation (PD) due to the losses of all channels by using the  
Equation 8 to Equation 13. From this power calculation, the  
junction temperature, TJ, can be estimated using Equation 14.  
The reliable operation of the converter and the two LDO regulators  
can be achieved only if the estimated die junction temperature of  
the ADP5034 (Equation 14) is less than 125°C. Reliability and  
mean time between failures (MTBF) are highly affected by increas-  
ing the junction temperature. Additional information about  
product reliability can be found from the ADI Reliability Handbook,  
which can be found at www.analog.com/reliability_handbook.  
LDO Regulator Power Dissipation  
The power loss of a LDO regulator is given by  
P
DLDO = [(VIN VOUT) × ILOAD] + (VIN × IGND  
where:  
LOAD is the load current of the LDO regulator.  
)
(12)  
I
VIN and VOUT are input and output voltages of the LDO,  
respectively.  
IGND is the ground current of the LDO regulator.  
Power dissipation due to the ground current is small and it  
can be ignored.  
The total power dissipation in the ADP5034 simplifies to  
PD = PDBUCK1 + PDBUCK2 + PDLDO1 + PDLDO2  
(13)  
Rev. A | Page 23 of 28  
 
 
 
 
 
ADP5034  
Data Sheet  
PCB LAYOUT GUIDELINES  
Poor layout can affect ADP5034 performance, causing electro-  
magnetic interference (EMI) and electromagnetic compatibility  
(EMC) problems, ground bounce, and voltage losses. Poor  
layout can also affect regulation and stability. A good layout is  
implemented using the following guidelines. Also, refer to the  
UG-271 user guide.  
Maximize the size of ground metal on the component side  
to help with thermal dissipation.  
Use a ground plane with several vias connecting to the  
component side ground to further reduce noise  
interference on sensitive circuit nodes.  
Connect VIN1, VIN2, and AVIN together close to the IC  
using short tracks.  
Place the inductor, input capacitor, and output capacitor  
close to the IC using short tracks. These components carry  
high switching frequencies, and large tracks act as antennas.  
Route the output voltage path away from the inductor and  
SW node to minimize noise and magnetic interference.  
Rev. A | Page 24 of 28  
 
Data Sheet  
ADP5034  
TYPICAL APPLICATION SCHEMATICS  
AVIN  
HOUSEKEEPING  
BUCK1  
CAVIN  
0.1µF  
VOUT1  
L1 1µH  
VIN1  
EN1  
2.3V TO  
5.5V  
SW1  
FB1  
VOUT1  
1200mA  
@
C1  
4.7µF  
C5  
ON  
PGND1  
10µF  
EN1  
OFF  
MODE  
PWM  
MODE  
VOUT2  
PSM/PWM  
VIN2  
EN2  
MODE  
L2 1µH  
R3  
SW2  
FB2  
VOUT2  
1200mA  
@
C2  
4.7µF  
BUCK2  
EN2  
C6  
10µF  
PGND2  
ON  
OFF  
OFF  
EN3  
VOUT3  
FB3  
VOUT3  
300mA  
@
EN3  
LDO1  
VIN3  
1.7V TO  
5.5V  
(ANALOG)  
C7  
C3  
1µF  
1µF  
EN4  
ON  
VOUT4  
FB4  
VOUT4  
300mA  
@
EN4  
LDO2  
(DIGITAL)  
VIN4  
C8  
1µF  
C4  
1µF  
ADP5034  
AGND  
Figure 52. ADP5034 Fixed Output Voltages with Enable Pins  
AVIN  
HOUSEKEEPING  
CAVIN  
VOUT1  
0.1µF  
L1 1µH  
VIN1  
2.3V TO  
5.5V  
SW1  
FB1  
VOUT1  
1200mA  
@
C1  
R1  
R2  
BUCK1  
MODE  
4.7µF  
C5  
ON  
PGND1  
10µF  
EN1  
EN1  
OFF  
PWM  
MODE  
VOUT2  
PSM/PWM  
VIN2  
EN2  
MODE  
L2 1µH  
R3  
SW2  
FB2  
VOUT2  
1200mA  
@
C2  
4.7µF  
BUCK2  
C6  
10µF  
R4  
EN2  
EN3  
PGND2  
ON  
OFF  
OFF  
VOUT3  
FB3  
EN3  
VOUT3  
300mA  
@
LDO1  
(ANALOG)  
R5  
R6  
VIN3  
1.7V TO  
5.5V  
C7  
1µF  
C3  
1µF  
ON  
EN4  
VOUT4  
FB4  
VOUT4  
300mA  
@
EN4  
LDO2  
(DIGITAL)  
R7  
R8  
VIN4  
C8  
1µF  
C4  
1µF  
ADP5034  
AGND  
Figure 53. ADP5034 Adjustable Output Voltages with Enable Pins  
BILL OF MATERIALS  
Table 12.  
Reference  
Value  
Part Number  
Vendor  
Package or Dimension (mm)  
CAVIN  
C3, C4, C7, C8  
C1, C2  
C5, C6  
L1, L2  
0.1 μF, X5R, 6.3 V  
1 μF, X5R, 6.3 V  
4.7 μF, X5R, 6.3 V  
10 μF, X5R, 6.3 V  
1 μH, 0.18 Ω, 850 mA  
1 μH, 0.085 Ω, 1400 mA  
1 μH, 0.059 Ω, 900 mA  
1 μH, 0.086 Ω, 1350 mA  
Four-regulator micro PMU  
JMK105BJ104MV-F  
LMK105BJ105MV-F  
ECJ-0EB0J475M  
JMK107BJ106MA-T  
BRC1608T1R0M  
LQM2MPN1R0NG0B  
EPL2014-102ML  
MDT2520-CN  
Taiyo-Yuden  
Taiyo-Yuden  
Panasonic-ECG  
Taiyo-Yuden  
Taiyo-Yuden  
Murata  
Coilcraft  
Toko  
Analog Devices  
0402  
0402  
0402  
0603  
0603  
2.0 × 1.6 × 0.9  
2.0 × 2.0 × 1.4  
2.5 × 2.0 × 1.2  
24-lead LFCSP  
IC1  
ADP5034  
Rev. A | Page 25 of 28  
 
ADP5034  
Data Sheet  
OUTLINE DIMENSIONS  
4.10  
4.00 SQ  
3.90  
0.30  
0.25  
0.20  
PIN 1  
INDICATOR  
PIN 1  
INDICATOR  
19  
24  
0.50  
BSC  
18  
1
6
EXPOSED  
PAD  
2.20  
2.10 SQ  
2.00  
13  
12  
7
0.50  
0.40  
0.30  
0.25 MIN  
TOP VIEW  
BOTTOM VIEW  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.80  
0.75  
0.70  
0.05 MAX  
0.02 NOM  
SECTION OF THIS DATA SHEET.  
COPLANARITY  
0.08  
SEATING  
PLANE  
0.20 REF  
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-8.  
Figure 54. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
4 mm × 4 mm Body, Very Very Thin Quad  
(CP-24-10)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Temperature  
Range  
Output  
Voltage (V)2  
Active Pull-  
UVLO3 Down4  
Package  
Option  
Model1  
Package Description  
ADP5034ACPZ-R7  
−40°C to +125°C Adjustable  
Low  
Enabled on buck  
channels only  
24-Lead Lead Frame Chip Scale Package  
[LFCSP_WQ]  
CP-24-10  
ADP5034ACPZ-1-R7  
−40°C to +125°C VOUT1 = 1.2 V  
VOUT2 = 3.3 V  
Low  
Enabled on buck  
channels only  
24-Lead Lead Frame Chip Scale Package  
[LFCSP_WQ]  
CP-24-10  
VOUT3 = 2.8 V  
VOUT4 = 1.8 V  
ADP5034ACPZ-2-R7  
−40°C to +125°C Adjustable  
High  
Enabled on buck  
channels only  
24-Lead Lead Frame Chip Scale Package  
[LFCSP_WQ]  
CP-24-10  
ADP5034-1-EVALZ  
ADP5034-2-EVALZ  
Evaluation Board for ADP5034ACPZ-R7  
Evaluation Board for ADP5034ACPZ-2-R7  
1 Z = RoHS Compliant Part.  
2 For additional options, contact a local sales or distribution representative. Additional options available are:  
BUCK1 and BUCK2: 3.3 V, 3.0 V, 2.8 V, 2.5 V, 2.3 V, 2.0 V, 1.8 V, 1.6 V, 1.5 V, 1.4 V, 1.3 V, 1.2 V, 1.1 V, 1.0 V, 0.9 V, or adjustable.  
LDO1 and LDO2: 3.3 V, 3.0 V, 2.8 V, 2.5 V, 2.25 V, 2.0 V, 1.8 V, 1.7 V, 1.6 V, 1.5 V, 1.2 V, 1.1 V, 1.0 V, 0.9 V, 0.8 V, or adjustable.  
3 UVLO: low or high.  
4 BUCK1, BUCK2, both LDO1 and LDO2: Active pull-down resistor is programmable to be either enabled or disabled.  
Rev. A | Page 26 of 28  
 
 
 
Data Sheet  
NOTES  
ADP5034  
Rev. A | Page 27 of 28  
ADP5034  
NOTES  
Data Sheet  
©2011 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D09703-0-10/11(A)  
Rev. A | Page 28 of 28  

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