ADM8830ARUZ [ADI]
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型号: | ADM8830ARUZ |
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Charge Pump Regulator
for Color TFT Panel
ADM8830
FEATURES
FUNCTIONAL BLOCK DIAGRAM
3 OutputVoltages (+5.1V, +15.3V, –10.2V) from
One 3V Input Supply
Power Efficiency Optimized for Use withTFT in
Mobile Phones
C5
2.2F
V
CC
C1+
VOLTAGE
DOUBLER
C1
2.2F
Low Quiescent Current
Low Shutdown Current (<1 A)
FastTransient Response
C1–
ADM8830
VOUT
LDO IN
OSCILLATOR
CLKIN
C6
2.2F
Shutdown Function
LDO
VOLTAGE
Power Saving during Blanking Period
Option to Use External LDO
REGULAT
SCAN/BLANK
LDO_ON/OFF
+5VOUT
+5VIN
CONT
L
+5.1V
C7
2.2F
APPLICATIONS
C2+
DOUBLE
TRIPLE
C2
Handheld Instruments
TFT LCD Panels
Cellular Phones
C2–
C3+
C3–
1F
TIMING
GERATOR
C3
1F
+15VOUT
+15.3V
C8
1F
VLTAGE
IPLER
C4+
C4
VOLTAGE
INVERTER
C4–
1F
OWN
NTROL
DISCHARGE
SHDN
–10VOUT
GENERAL DESCRIPTION
–10.2V
C9
The ADM8830 is a charge pump regulator used for color thin
film transistor (TFT) liquid crystal displays (LCDs). Usi
charge pump technology, the device can be used to gen
output voltages (+5.1V ± 2%, +15.3V, –10.2V) from
3V input supply.These outputs are then used to provi
supplies for the LCD controller (5.1V) and thte driv
the transistors in the panel (+15.3V and –.2V). Only a few
external capacitors are needed for the chapumfficient
low dropout voltage regulator also ensures the powe
efficiency is high and provides a lople 5.1V outpuThis
LDO can be shut down and an LDO usregulate
the 5V doubler output and dhe charge pump
section, which generates the +V outputs if so
required by the user.
GND
1F
seamlessly maintained when switching from scanning mode to
blanking mode or vice versa.
The ADM8830 has a number of power saving features, including
low power shutdown and reduced quiescent current consumption
during the blanking periods mentioned above.The 5.1V output
consumes the most power, so power efficiency is also maximized
on this output with an oscillator enabling scheme (Green Idle™).
This effectively senses the load current that is flowing and turns
on the charge pump only when charge needs to be delivered to
the 5V pump doubler output.
The ADM8830 ha100 kscillator for use in
scanning mode, bbe clocked by an external clock
source in blankinode.The internal oscillator is
used to clock the curing scanning mode where the
current is highest. Durking periods, the ADM8830
switches to use an external, lower frequency clock.This allows the
user to vary the frequency and maximize power efficiency during
blanking periods.The tolerances on the output voltages are
The ADM8830 is fabricated using CMOS technology for minimal
power consumption.The part is packaged in 20-lead LFCSP
andTSSOP packages.
REV.B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed byAnalog Devices for its
use, nor for any infringements of patents or other rights of third parties
that may result from its use. No license is granted by implication or oth-
erwise under any patent or patent rights of Analog Devices.Trademarks
and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
www.analog.com
© 2003 Analog Devices, Inc. All rights reserved.
(VCC = 2.6 V to 3.6 V, TA = –40C to +85C, unless otherwise noted, C1, C5, C6,
C7 = 2.2 F, C2, C3, C4, C8, C9 = 1 F, CLKIN = 1 kHz in blanking mode.)
ADM8830–SPECIFICATIONS
Parameter
Min
Typ
Max
Unit
Test Conditions
INPUTVOLTAGE,VCC
SUPPLY CURRENT, ICC
2.6
3.6
V
150
70
400
140
1
µA
µA
µA
Unloaded, Scanning Period
Unloaded, Blanking Period
Shutdown Mode,TA = 25°C
+5.1V OUTPUT
OutputVoltage
Output Current
5.0
5.1
4
5
50
80
70
10
5
5.2
5
8
V
IL = 10 µA to 8 mA
Scanning Period
Scanning Period,VCC > 2.7V
Blanking Period
VCC = 3V, IL = 5 mA (canning)
VCC = 3V, IL = 200 (Blanking)
8 mA Load
mA
mA
µA
%
%
mV p-p
µs
200
Power Efficiency
Output Ripple
Transient Response
IL Stepped from µA t8 mA
+15.3V OUTPUT
OutputVoltage
Output Current
14.4
15.3
50
1
15.6
100
10
V
µA
µA
mV p-p
IL = 1 µ100 µA
Scanng Pod
Blanking Peri
L = 100 µA
Output Ripple
50
–10.2V OUTPUT
OutputVoltage
Output Current
–10.4
–100
–10
–10.2
–50
–1
–9.6
V
µA
µA
mV p-p
I–1 µA to –100 µA
anning riod
BkiPeriod
IL = 100 µA
Output Ripple
50
POWER EFFICIENCY
(+15.3V and –10.2V Outputs)
90
80
%
elative to 5.1V Output, IL = 100 µA (Scanning)
Relative to 5.1V Output, IL =10 µA (Blanking)
CHARGE PUMP FREQUENCY
60
100
kHz
Scanning Period
CONTROL PINS
SHDN
InputVoltage,VSHDN
V
V
SHDN Low = Shutdown Mode
SHDN High = Normal Mode
0.7VC
Digital Input Current
Digital Input Capacitance*
SCAN/BLANK
±1
0
µA
pF
InputVoltage
0.3VCC
V
Low = BLANK Period
0.7VCC
V
µA
pF
High = SCAN Period
Digital Input Current
Digital Input Capacita
LDO_ON/OFF
±1
10
InputVoltage
0.3VCC
V
V
µA
pF
Low = External LDO
High = Internal LDO
Digital Input Curr
Digital Input Capacita
CLKIN
±1
10
Minimum Frequency
0.9
1
kHz
Duty Cycle = 50%, Rise/FallTimes = 20 ns
InputVoltage
VIL
0.3VCC
V
VIH
0.7VCC
V
µA
pF
Digital Input Current
Digital Input Capacitance*
±1
10
*Guaranteed by design. Not 100% production tested.
Specifications are subject to change without notice.
–2–
REV. B
ADM8830
(VCC = 2.6 V to 3.6 V, TA = –40C to +85C, unless otherwise noted, C1, C5, C6,
C7 = 2.2 F, C2, C3, C4, C8, C9 = 1 F, CLKIN = 1 kHz in blanking mode.)
TIMING SPECIFICATIONS
Parameter
Min
Typ
Max
Unit
Test Conditions
POWER-UP SEQUENCE
+5V RiseTime, tR5V
+15V RiseTime, tR15V
–10V FallTime, tF10V
Delay between –10V Fall
and +15V, tDELAY
300
8
12
µs
ms
ms
10% to 90%, Figure 2
10% to 90%, Figure 2
90% to 10%, Figure 2
3
ms
Figure 2
POWER-DOWN SEQUENCE
+5V FallTime, tF5V
+15V FallTime, tF15V
–10V RiseTime, tR10V
75
40
40
ms
ms
ms
90% to 10%, Fige 2
90% to 10%, gure 2
10% to 90Figure
Specifications are subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
THERMAL CARAERISTICS
(TA = 25°C, unless otherwise noted.)
20-LeadTSSOP Packag
SupplyVoltage . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +4.0V
InputVoltage to Digital Inputs . . . . . . . . . . . . . –0.3V to +4.0V
Output Short Circuit Duration to GND . . . . . . . . . . . . . 10 sec
OutputVoltage
A = 7C/W
20-LeLFCSPackage:
A 31°C
J
J
+5.1V Output . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +6V
–10.2V Output . . . . . . . . . . . . . . . . . . . . . . . .–12V to +0.3V
+15.3V Output . . . . . . . . . . . . . . . . . . . . . . . –0.3V to +17V
OperatingTemperature Range . . . . . . . . . . . . –40°C to +85°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(Derate 33 mW/°C above 25°C)
StorageTemperature Range . . . . . . . . . . . . . –65°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
*This is a stress rating only; functional operation of the dt these o
conditions above those indicated in the operational sions of this specificatiis
not implied. Exposure to absolute maximum rating cditions ed periods
of time may affect reliability.
ORDERING GUIDE
Model
ture Range Package Description
Package Option
ADM8830ACP
ADM883L7
ADM88
ADM88
ADM883
EVAL-ADM
to +85ºC
C to +85ºC
–40ºC to +85ºC
–40ºC to +85ºC
–40ºC to +85ºC
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Evaluation Board
CP-20-1
CP-20-1
RU-20
RU-20
RU-20
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate
on the human body and test equipment and can discharge without detection. Although the ADM8830
features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high
energy electrostatic discharges.Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
REV. B
–3–
ADM8830
PIN CONFIGURATIONS
TSSOP
LFCSP
1
2
20
19
18
17
16
15
14
13
12
11
C1–
C1+
GND
–10VOUT
C4+
3
V
CC
VOUT
LDO_IN
+5VOUT
+5VIN
4
C4–
PIN 1
15 C4–
14 C2+
13 C2–
12 C3+
11 C3–
V
1
CC
INDICATOR
5
C2+
ADM8830
TOP VIEW
(Not to Scale)
VOUT 2
LDO_IN 3
+5VOUT 4
+5VIN 5
ADM8830
TOPVIEW
6
C2–
7
C3+
8
C3–
LDO_ON/OFF
SHDN
9
+15VOUT
CLKIN
10
SCAN/BLANK
PIN FUNCTION DESCRIPTIONS
Pin Number
TSSOP LFCSP Mnemonic
Function
1, 2
3
19, 20
C1–, C1+
VCC
External capacitor C1 is connected betweeese piA 2.2 µF capacitor is recommended.
Positive SupplyVoltage Input. Connect this pin tsupply with a 2.2 µF decoupling capacitor.
1
2
4
VOUT
Voltage Doubler Output.This derived by doubling the 3V supply. A 2.2 µF capacitor to
ground is required on this pin.
5
6
7
8
3
4
5
6
LDO_IN
Voltage Regulator ser hoption to bypass this circuit using the
LDO_ON/OFF
+5VOUT
+5VIN
+5.1V Output Pd by doubling and regulating the 3V supply. A 2.2 µF ca-
pacitor to ground this pin to stabilize the regulator.
+5.1Input Pin.This is he input to the voltage tripler and doubler inverter charge pump
circs.
LDO_ON/OFF
Control Logic Inp3V CMOS logic. A logic high selects the internal LDO for regulation of
e 5V voltage dbler output. A logic low isolates the internal LDO from the rest of the charge
mp circuits.This allows the use of an external LDO to regulate the 5V voltage doubler
he output of this LDO is then fed back into the voltage tripler and doubler/inverter
f the ADM8830.
9
7
8
SH
l Input. 3V CMOS logic. Active low shutdown control.This shuts down the timing
erator and enables the discharge circuit to dissipate the charge on the voltage outputs,
thus driving them to 0V.
10
Drive Mode Input. 3V CMOS logic. A logic high places the part in scan (high current) mode
and the charge pump is driven by the internal oscillator. A logic low places the part in blanking
(low current) mode and the charge pump is driven by the (slower) external oscillator.This is
a power saving feature on the ADM8830.
11
12
9
CLKIN
External CLOCK Input. During a blanking period, the oscillator circuit selects this pin to drive
the charge pump circuit.This is at a lower frequency than the internal oscillator, resulting in
lower quiescent current consumption, thus saving power.
10
+15VOUT
+15.3V Output Pin.This is derived by tripling the +5.1V regulated output. A 1 µF capacitor
is required on this pin.
13, 14
15, 16
17, 18
19
11, 12
13, 14
15, 16
17
C3–, C3+
C2–, C2+
C4–, C4+
–10VOUT
External capacitor C3 is connected between these pins. A 1 µF capacitor is recommended.
External capacitor C2 is connected between these pins. A 1 µF capacitor is recommended.
External capacitor C4 is connected between these pins. A 1 µF capacitor is recommended.
–10.2V Output Pin.This is derived by doubling and inverting the +5.1V regulated output.
A 1 µF capacitor is required on this pin.
20
18
GND
Device Ground Pin.
–4–
REV. B
Typical Performance Characteristics–ADM8830
80
70
60
50
40
30
20
10
5.104
5.0752
5.0750
5.0748
5.0746
5.0744
5.0742
5.0740
5.0738
5.0736
5.0734
5.102
5.100
5.098
5.096
5.094
5.092
5.090
0
2
3
I
4
5
6
7
8
10 30 50 70 90 110 130 150 170 190
100
1000
10000
– mA
OUTPUT CURRENT – A
BLANKING FREQUENCY – Hz
LOAD
TPC 1. LDO Efficiency in Blanking
Mode with VCC = 3 V
TPC 2. LDO OutputVoltage (Unloaded)
vs. Blanking Mode Frequency
TP. LDO/P Voltage vs. Load
CurreScanniMode, VCC = 3.3V
85
84
83
82
100
90
100
9
80
70
60
50
40
80
81
80
79
78
70
60
0
1
2
3
4
5
6
7
8
8
10
0
20
40
60
80
100
OUTPUT CURRENT – mA
RRENT – A
OUTPUT CURRENT – A
TPC 4. LDO Efficiency in Scanning
Mode with VCC = 3 V
TPC 5. +15VV Efficiency vs. Output
Cun Blanking Mode, VCC = 3 V
TPC 6. +15V/–10V Efficiency vs. Output
Current in Scanning Mode,VCC = 3V
5.30
5.25
250
200
V
OUT
5.20
E 1 @ +
5.15
I
(SCAN)
CC
DEVICE 1 @ +
5V OUTPUT RIPPLE
5.10
150
100
50
5.05
V
RIPPLE
CC
@ –40C
I
(BLANK)
CC
5.00
4.95
4.90
0
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
V
–V
CC
V
–V
CC
TPC 9. Output Ripple on LDO
(5 V Output)
TPC 7. LDO Variation over Supply
andTemperature
TPC 8. Supply Current vs. Voltage
REV. B
–5–
ADM8830
+15V OUTPUT
LOAD DISABLE
5V OUTPUT
LOAD ENABLE
5V OUTPUT
–10V OUTPUT
5VOUT
TPC 11. 5V OutputTransient Response,
Load Disconnected
TPC 12. +1and –10 V Outputs at
Power-U
TPC 10. 5 V OutputTransient
Response for Maximum Load
Current
20.1
20.0
19.9
19.8
19.7
19.6
+15V OUTPUT
–10V OUTPUT
5VOUT
19.5
19.4
40
– C
80
–40
–20
TPC 13. +15 V and –10 V Outputs at
Power-Down (Unloaded)
TPC 14. Pon overTem-
perature, VCC nning Mode
th All O/Ps at mum Load
–6–
REV. B
ADM8830
SCANNING AND BLANKING
V
ATFT LCD panel is essentially made up of a bank of capacitors,
each representing a pixel in the display.These capacitors store
different levels of charge, depending on the amount of lumines-
cence required for a given pixel.When a picture is being displayed
on the panel, a scan of all the pixel capacitors is performed, placing
different levels of charge on each in order to create the image.The
process of updating the display like this is called “scanning.” Once
scanned, an image will be held by pixel capacitance and the con-
troller and source line drivers can be put into a low power mode.
This low power mode is referred to as the blanking mode on the
ADM8830. Over a finite period of time, this pixel charge will leak
and the capacitors will have to be refreshed in order to maintain
the image.
CC
SHDN
tR5V
90%
10%
tF5V
+5V
tR15V
tF15V
+15V
–10V
tDELAY
–3V
90%
10%
tR10V
tF10V
LOAD
The ADM8830 caters to the two modes of operation described
above as follows.When theTFT LCD panel is in scanning mode,
a logic high on the SCAN/BLANK input places the device in high
current power mode, providing extra power (extra current) to the
LCD controller and the source line drivers. If the panel continues
to be updated (as when a moving picture is being displayed), then
the ADM8830 can be continually operated in scanning mode. If
the same image is kept on the panel, a logic low is applied to the
SCAN/BLANK input and the ADM8830 enters blanking (low
current) mode. Depending on how often the image is being updated,
the ADM8830 can be operated with a variable SCAN/BLANK
duty cycle.This helps to maximize power efficiency and therefore
extends the battery life.
SCAN/BLANK
EXTERNAL CLOCK
Figu. Power Sequence
TRANSNT RESPONSE
The M883eatures extremely fast transient response, making
it very safor fast mage updates onTFT LCD panels.This
means thaen unr changing load conditions there is still very
effective reguof the 5V output.TPCs 10 and 11 show how
the 5.1V output responds when a maximum load is dynamically
onnected d disconnected. Note that the output settles within
5 to lthan 1% of the output level.
EXTERNAL CLOCK
The ADM8830 has an internal 100 kHz oscillator, but an external
clock source can also be used to clock the part.This clock source
must be applied to the CLKIN pin. Power is saved during blank-
ing periods by disabling the internal oscillator and switching to
the lower frequency external clock source.To achieve optimum
performance of the charge pump circuitry, it is important that the
duty cycle of the external clock source be 50% and that the rise
and fall times be less than 20 ns.
tR
tF
tRE
tF: FALLTIME
tH
tH
tT
@ 100CYCLE
tT
Figure 1. Duty CyClock
0.28
0.4
3.10
0.75
POWER SEQUEN
0.9
The gate drive suequenced such that the –10V
supply is up befoply for theTFT panel to power
up correctly.The Arols this sequence.When the
device is turned on (a on SHDN), the ADM8830 allows
the –10V output to ramp immediately but holds off the +15V
output. It continues to do this until the negative output has reached
–3V. At this point, the positive output is enabled and allowed to
ramp up to +15V.This sequence is highlighted in Figure 2.
0.25
0.5
1.95
2.10
SOLDER MASK
BOARD METALLIZATION
0.25
0.2
DIMENSIONS IN
MILLIMETERS
Figure 3. Suggested LFCSP 4 mm 4 mm 20-Lead
Land Pattern
REV. B
–7–
ADM8830
OUTLINE DIMENSIONS
20-LeadThin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
6.60
6.50
6.40
20
11
10
4.50
4.40
4.30
6.40 BSC
1
PIN 1
0.65
BSC
1.20
MAX
0.15
0.05
0.20
0.09
.75
60
8
0
0.30
0.19
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153
20-Lead Lead Frame Chip Scale Packa[LCSP]
4 mm 4 mm Body
(CP-20-1)
Dimensions shown illimeters
0.60
MAX
4.0
BSC SQ
0.60
MAX
16
15
20
1
5
PIN 1
2.25
2.10 S
1.95
INDICATOR
TOP
BOTTOM
VIEW
VIEW
11
10
0.75
0.55
0.35
6
0.25 MI
0 MAX
0.65 TYP
0.30
0.23
0.18
12 MAX
1.00
0.05 MAX
0.02 NOM
0.20
REF
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Revision History
Location
Page
10/03—Data Sheet chV. A to REV. B.
Changes to GENERAL ION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3/03—Data Sheet changed from REV. SpA to REV. A.
Edits to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Edits toTPC 12 andTPC 13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11/02—Data Sheet changed from REV. 0 to REV. SpA.
Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Changes to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Changes toTHERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Edits to captions ofTPCs 2, 3, and 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Edits to caption ofTPC 13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
AddedTPC 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
–8–
REV. B
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