ADF7010BRUZ-REEL [ADI]
IC SPECIALTY TELECOM CIRCUIT, PDSO24, MO-153AD, TSSOP-24, Telecom IC:Other;
| 型号： | ADF7010BRUZ-REEL |
| 厂家： | 
ADI |
| 描述： | IC SPECIALTY TELECOM CIRCUIT, PDSO24, MO-153AD, TSSOP-24, Telecom IC:Other ISM频段 |
| 文件： | 总20页 (文件大小：564K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Performance ISM Band
ASK/FSK/GFSK Transmitter IC
a
ADF7010
FEATURES
GENERAL DESCRIPTION
Single Chip Low Power UHF Transmitter
902 MHz–928 MHz Frequency Band
On-Chip VCO and Fractional-N PLL
2.3 V–3.6 V Supply Voltage
Programmable Output Power
–16 dBm to +12 dBm, 0.3 dB Steps
Data Rates up to 76.8 kbps
Low Current Consumption
28 mA at 8 dBm Output
The ADF7010 is a low power OOK/ASK/FSK/GFSK UHF
transmitter designed for use in ISM band systems. It contains
an integrated VCO and sigma-delta fractional-N PLL. The
output power, channel spacing, and output frequency are pro-
grammable with four 24-bit registers. The fractional-N PLL
enables the user to select any channel frequency within the U.S.
902 MHz–928 MHz band, allowing the use of the ADF7010 in
frequency hopping systems.
It is possible to choose from the four different modulation
schemes: Binary or Gaussian Frequency Shift Keying (FSK/
GFSK), Amplitude Shift Keying (ASK), or On/Off Keying
(OOK). The device also features a crystal compensation register
that can provide ꢀ1 ppm resolution in the output frequency.
Indirect temperature compensation of the crystal can be accom-
plished inexpensively using this register.
Power-Down Mode (<1 ꢀA)
24-Lead TSSOP Package
APPLICATIONS
Low Cost Wireless Data Transfer
Wireless Metering
Remote Control/Security Systems
Keyless Entry
Control of the four on-chip registers is via a simple 3-wire inter-
face. The devices operate with a power supply ranging from
2.3 V to 3.6 V and can be powered down when not in use.
FUNCTIONAL BLOCK DIAGRAM
C
REG
VCO
CLK
CPV
CP
GND
GND
OUT
DD
C
VCO
OSC1
OSC2
V
DD
OOK/ASK
PA
ꢁ CLK
RF
OUT
VCO
RF
GND
DV
DD
ꢁ R
PFD/
CHARGE
PUMP
D
GND
C
REG
LDO
REGULATOR
OOK/ASK
FSK/GFSK
TxCLK
ꢁ FRACTIONAL N
SIGMA-DELTA
TxDATA
LOCK DETECT
MUXOUT
LE
DATA
CLK
MUXOUT
FREQUENCY
COMPENSATION
SERIAL
INTERFACE
R
SET
CENTER
FREQUENCY
CE
TEST
A
GND
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
www.analog.com
© Analog Devices, Inc., 2002
(VDD = 2.3 V to 3.6 V, GND = 0 V, TA = TMIN to TMAX, unless otherwise noted. Typical
ADF7010–SPECIFICATIONS1 specifications are at VDD = 3 V, TA = 25ꢂC.)
Parameter
Min
Typ
Max
Unit
RF CHARACTERISTICS
Output Frequency Ranges
U.S. ISM Band
902
3.625
928
20
MHz
MHz @ 928 MHz
Phase Frequency Detector Frequency
TRANSMISSION PARAMETERS
Transmit Rate
FSK
ASK
0.3
0.3
0.3
76.8
9.6
76.8
kbps
kbps
kbps
GFSK
Frequency Shift Keying
FSK Separation2, 3
1
4.88
110
620
kHz, Using 3.625 MHz PFD
kHz, Using 20 MHz PFD
Gaussian Filter ꢁt
Amplitude Shift Keying Depth
On/Off Keying
0.5
30
40
dB, Max Output Power 2 dBm
dB
Output Power
Output Power Variation
Max Power Setting
9
12
11
9.5
dBm, VDD = 3.6 V
dBm, VDD = 3.0 V
dBm, VDD = 2.3 V
Programmable Step Size
–16 dBm to +12 dBm
0.3125
dB
LOGIC INPUTS
VINH, Input High Voltage
VINL, Input Low Voltage
0.7 ꢂ VDD
DVDD – 0.4
2.3
V
V
mA
pF
MHz
0.2 ꢂ VDD
I
INH/IINL, Input Current
ꢀ1
10
50
CIN, Input Capacitance
Control Clock Input
LOGIC OUTPUTS
VOH, Output High Voltage
VOL, Output Low Voltage
CLKOUT Rise/Fall Time
CLKOUT Mark: Space Ratio
V, IOH = 500 mA
0.4
3.6
V, IOL = 500 mA
16
50:50
ns, FCLK = 4.8 MHz into 10 pF
POWER SUPPLIES
Voltage Supply
DVDD
V
Transmit Current Consumption
–20 dBm (0.01 mW)
–10 dBm (0.1 mW)
0 dBm (1 mW)
12
15
20
28
40
mA
mA
mA
mA
mA
+8 dBm (6.3 mW)
+12 dBm (16 mW)
Crystal Oscillator Block Current
Consumption
Regulator Current Consumption
Power-Down Mode
Low Power Sleep Mode
190
380
mA
mA
0.2
1
mA
–2–
REV. 0
ADF7010
Parameter
Min
Typ
Max
Unit
PHASE-LOCKED LOOP
VCO Gain
80
–80
–100
MHz/V @ 915 MHz
dBc/Hz @ 5 kHz Offset
dBc/Hz @ 1 MHz Offset
100 kHz Loop BW
Phase Noise (In-Band)4
Phase Noise (Out of Band)5
Spurious
Integer Boundary6
Reference
–55
–50
dBc, 50 kHz Loop
dBc
dBc
dBc
dBc
dBc
Harmonics7
–14
–18
–18
–35
Second Harmonic VDD = 3.0 V
Third Harmonic VDD = 3.0 V
All Other Harmonics
–27
–21
REFERENCE INPUT
Crystal Reference
External Oscillator
3.625
3.625
0.7 ꢂ VDD
20
40
MHz
MHz
V
Input Level, High Voltage
Input Level, Low Voltage
0.2 ꢂ VDD
V
FREQUENCY COMPENSATION
Pull In Range of Register
1
100
ppm
PA CHARACTERISTICS
RF Output Impedance
High Range Amplifier
16 – j33
W, ZREF = 50 W
TIMING INFORMATION
Chip Enabled to Regulator Ready7
Crystal Oscillator to CLKOUT OK
50
2
200
+85
ms
ms, 19.2 MHz Xtal
TEMPERATURE RANGE, TA
–40
ꢃC
NOTES
1Operating temperature range is as follows: –40∞C to +85∞C.
2 Frequency Deviation = (PFD Frequency ꢂ Mod Deviation )/212
.
3 GFSK Frequency Deviation = (PFD Frequency ꢂ 2m )/212 where m = Mod Control.
4 VDD = 3 V, PFD = 19.2 MHz, PA = 8 dBm
5 VDD = 3 V, Loop Filter BW = 100 kHz
6 Measured >1 MHz away from integer channel. See Successful Design with ADF7010 Transmitter application note.
7 Not production tested. Based on characterization.
Specifications subject to change without notice.
REV. 0
–3–
ADF7010
(V = 3 V ꢃ10%, VGND = 0 V, T = 25ꢂC, unless otherwise noted.)
TIMING CHARACTERISTICS
DD
A
Limit at
TMIN to TMAX
(B Version)
Parameter
Unit
Test Conditions/Comments
t1
t2
t3
t4
t5
t6
10
10
25
25
10
20
ns min
ns min
ns min
ns min
ns min
ns min
DATA to CLOCK Setup Time
DATA to CLOCK Hold Time
CLOCK High Duration
CLOCK Low Duration
CLOCK to LE Setup Time
LE Pulsewidth
Guaranteed by design but not production tested.
t3
t4
CLOCK
t1
t2
DB0 (LSB)
(CONTROL BIT C1)
DB1
DATA
DB23 (MSB)
DB22
DB2
(CONTROL BIT C2)
t6
LE
t5
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS1, 2
(TA = 25∞C, unless otherwise noted.)
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
VDD to GND3 . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.0 V
VCOVDD, RFVDD, CPVDD to GND . . . . . –0.3 V to +7 V
Digital I/O Voltage to GND . . . . . . –0.3 V to DVDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40∞C to +85∞C
Storage Temperature Range . . . . . . . . . . . . –65∞C to +125∞C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 125∞C
TSSOP ꢄJA Thermal Impedance . . . . . . . . . . . . . . 150.4∞C/W
CSP ꢄJA (Paddle Soldered) . . . . . . . . . . . . . . . . . . . . 122∞C/W
CSP ꢄJA (Paddle Not Soldered) . . . . . . . . . . . . . . . . . 216∞C/W
Lead Temperature, Soldering
2This device is a high performance RF integrated circuit with an ESD rating of
<1 kV and it is ESD sensitive. Proper precautions should be taken for handling and
assembly.
3GND = CPGND = RFGND = DGND = AGND = 0 V.
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 235∞C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240∞C
ORDERING GUIDE
Temperature Range
Model
Package Option
ADF7010BRU –40ºC to +85ºC
RU-24 (TSSOP)
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADF7010 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
–4–
REV. 0
ADF7010
PIN CONFIGURATION
1
2
24
23
22
21
20
19
18
17
R
C
REG
SET
CPV
C
VCO
DD
3
CP
VCO
GND
IN
TSSOP
4
CP
A
GND
OUT
5
CE
RF
RF
DV
OUT
GND
DD
ADF7010
6
DATA
CLK
TOP VIEW
(Not to Scale)
7
8
LE
TEST
TxDATA
TxCLK
MUXOUT
9
16 VCO
GND
10
11
12
15
14
13
OSC1
OSC2
CLK
D
GND
OUT
PIN FUNCTION DESCRIPTIONS
Pin No.
Mnemonic
Function
1
RSET
External Resistor to Set Charge Pump Current and Some Internal Bias Currents. Use 4.7 kW as default:
9.5
RSET
ICP MAX
=
So, with RSET = 4.7 kW, ICPMAX = 2.02 mA.
2
CPVDD
Charge Pump Supply. This should be biased at the same level as RFVDD and DVDD. The pin should be
decoupled with a 0.1 mF capacitor as close to the pin as possible.
3
4
CPGND
CPOUT
Charge Pump Ground
Charge Pump Output. This output generates current pulses that are integrated in the loop filter. The
integrated current changes the control voltage on the input to the VCO.
5
6
7
8
CE
Chip Enable. A logic low applied to this pin powers down the part. This must be high for the part to
function. This is the only way to power down the regulator circuit.
DATA
CLK
LE
Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits.
This is a high impedance CMOS input.
Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched
into the 24-bit shift register on the CLK rising edge. This is a high impedance CMOS input.
Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one
of the four latches, the latch being selected using the control bits.
9
TxDATA
TxCLK
Digital data to be transmitted is input on this pin.
10
GFSK Only. This clock output is used to synchronize microcontroller data to the TxDATA pin of the
ADF7010. The clock is provided at the same frequency as the data rate.
11
MUXOUT
This multiplexer output allows either the digital lock detect (most common), the scaled RF, or the scaled
reference frequency to be accessed externally. Used commonly for system debug. See Function Register Map.
12
13
DGND
Ground Pin for the RF Digital Circuitry
CLKOUT
The Divided Down Crystal Reference with 50:50 Mark-Space Ratio. May be used to drive the clock input
of a microcontroller. To reduce spurious components in the output spectrum, the sharp edges can be
reduced with a series RC. For 4.8 MHz output clock, a series 50 W into 10 pF will reduce spurs to
< –50 dBc. Defaults on power-up to divide by 16.
14
OSC2
Oscillator Pin. If a single-ended reference is used (such as a TCXO), it should be applied to this pin.
When using an external signal generator, a 51 W resistor should be tied from this pin to ground. The
XOE bit in the R Register should set high when using an external reference.
REV. 0
–5–
ADF7010
PIN FUNCTION DESCRIPTIONS (continued)
Pin No.
Mnemonic
Function
15
OSC1
Oscillator Pin. For use with crystal reference only. This is three-stated when an external reference oscillator
is used.
16
17
VCOGND
TEST
Voltage Controlled Oscillator Ground
Input to the RF fractional-N divider. This pin allows the user to connect an external VCO to the part.
Disabling the internal VCO activates this pin. If the internal VCO is used, this pin should be grounded.
18
DVDD
Positive Supply for the Digital Circuitry. This must be between 2.3 V and 3.6 V. Decoupling capacitors
to the analog ground plane should be placed as close as possible to this pin.
19
20
RFGND
RFOUT
Ground for Output Stage of Transmitter
The modulated signal is available at this pin. Output power levels are from –16 dBm to +12 dBm. The
output should be impedance matched to the desired load using suitable components. See the Output RF
Stage section.
21
22
AGND
Ground Pin for the RF Analog Circuitry
VCOIN
The tuning voltage on this pin determines the output frequency of the Voltage Controlled Oscillator
(VCO). The higher the tuning voltage the higher the output frequency.
23
24
CVCO
CREG
A 0.22 mF capacitor should be added to reduce noise on VCO bias lines. Tied to CREG pin.
A 2.2 mF capacitor should be added at CREG to reduce regulator noise and improve stability. A reduced
capacitor will improve regulator power-on time but may cause higher spurious components.
–6–
REV. 0
Typical Performance Characteristics–ADF7010
RL = 10.0dBm
935.000MHz
918.000MHz
V
= 3V
DD
PFD FREQUENCY = 19.2MHz
LOOP BW = 100kHz
V
= 3V
DD
PFD FREQUENCY = 19.2MHz
LOOP BW = 100kHz
RBW = 1kHz
901.000MHz
915.7MHz
SPAN 5.000MHz
–20.00ꢀs
5.00ꢀs
5.00ꢀs/DIV
30.00ꢀs
TPC 1. FSK Modulated Signal, FDEVIATION = 58 kHz,
Data Rate = 19.2 kbps/s, 10 dBm
TPC 4. PLL Settling Time, 902 MHz to 928 MHz,
23 ꢅs (±400 kHz)
RL = 10.0dBm
+10dBm
V
= 3V
DD
2dBm
PFD FREQUENCY = 19.2MHz
LOOP BW = 1MHz
RBW = 3kHz
V
= 3V
DD
PFD FREQUENCY = 19.2MHz
LOOP BW = 100kHz
RBW = 100kHz
–36dBm
@ 200kHz
+19.2MHz
–61dBc
915.7MHz
SPAN 500kHz
RBW 100kHz
915.7MHz
SPAN 50.00MHz
TPC 2. OOK Modulated Signal, Data Rate = 4.8 kbps/s, 4 dBm
TPC 5. PFD Spurious/Fractional Spurious
+10dBm
+10dBm
SECOND HARMONIC
–22dBc
V
= 3V
DD
PFD FREQUENCY = 19.2MHz
LOOP BW = 100kHz
RBW = 30Hz
THIRD HARMONIC
–34dBc
PN @ 4kHz
80dBc/Hz
START 800MHz
RBW 1.0MHz
STOP 7.750GHz
915.7MHz
SPAN 10.00kHz
TPC 3. Harmonic Levels at 10 dBm Output Power.
See Figure 15.
TPC 6. In-Band Phase Noise
REV. 0
–7–
ADF7010
110
100
90
V
= 3V
C1 FREQ
1.6MHz
DD
C1 RISE
144.8ns
C1 FALL
145.6ns
C1 +DUTY
49.385
T
= 25ꢂC
A
80
70
60
50
40
Ch1 500mV
M 200ns
885
895
905
915
925
935
945
FREQUENCY
TPC 7. 1.6 MHz CLOCKOUT Waveform
TPC 10. Typical VCO Gain
20
15
+10dBm
V
= 2.2V
DD
V
= 3.0V
= 3.6V
DD
V
= 3V
DD
V
DD
PFD FREQUENCY = 19.2MHz
LOOP BW = 100kHz
RBW = 10Hz
10
LOW RANGE
MID RANGE
5
0
+1.6MHz
–53dBc
HIGH RANGE
–5
–10
–15
–20
–25
–30
915.7MHz
SPAN 5.00MHz
40
60
80
100
120
PA SETTING – MODULATION REGISTER
TPC 8. Spurious Signal Generated by CLOCKOUT
TPC 11. PA Output Programmability, TA = 25∞C
0
–5
44
42
40
38
–10
–15
–20
–25
36
34
32
30
0.8
0.9
1.0
1.1
1.2
1.3
1.4
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
FREQUENCY – GHz
SUPPLYVOLTAGE –V
TPC 9. N-Divider Input Sensitivity
TPC 12. IDD vs. VDD @ 10 dBm
–8–
REV. 0
ADF7010
REGISTER MAPS
RF R REGISTER
CONTROL
BITS
CLK
11-BIT FREQUENCY ERROR CORRECTION
4-BIT R-VALUE
RESERVED
OUT
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1
DB0
C1 (0)
F1 C2 (0)
R2
R1
CL4 CL3 CL2 CL1
X1
R4
R3
R2
R1
F11 F10 F9
F8
F7
F6
F5
F4
F3
F2
RF N REGISTER
CONTROL
BITS
8-BIT INTEGER-N
12-BIT FRACTIONAL-N
DB19
DB14 DB13
DB3
M2
DB22 DB21 DB20
DB17
N4
DB8
M7
DB6 DB5
M5 M4
DB4
M3
DB2 DB1
M1
DB23
DB18
N5
DB16 DB15
N3 N2
DB12 DB11 DB10 DB9
M11 M10 M9 M8
DB7
M6
DB0
LDP V1
N8
N7
N6
N1
C1 (1)
M12
C2 (0)
MODULATION REGISTER
INDEX
COUNTER
GFSK MOD
CONTROL
MODULATION
SCHEME
CONTROL
BITS
MODULATION DEVIATION
POWER AMPLIFIER
DB13
DB22
IC2
DB21 DB20
DB18 DB17 DB16 DB15
DB12
D2
DB11 DB10
DB8 DB7 DB6 DB5 DB4 DB3
DB1
DB23
P1
DB19
DB14
D4
DB9
P6
DB2
S1
DB0
C1 (0)
C2 (1)
IC1
MC3 MC2 MC1
D7
D6
D5
D3
D1
P7
P5
P4
P3
P2
P1
S2
FUNCTION REGISTER
CHARGE
PUMP
CONTROL
BITS
FAST LOCK
TEST MODES
MUXOUT
DB19
T5
DB14
DB10
DB9
DB23 DB22 DB21 DB20
T9 T8 T7 T6
DB15
T1
DB2
PD1
DB1
DB0
DB17 DB16
DB13 DB12 DB11
DB8 DB7 DB6 DB5
I1
DB3
PD2
DB18
T4
DB4
PD3
M1
T3
T2
M4
M3
VP1 CP4 CP3 CP2 CP1
C1 (1)
C2 (1)
M2
REV. 0
–9–
ADF7010
RF R REGISTER
CONTROL
BITS
CLK
4-BIT R-VALUE
11-BIT FREQUENCY ERROR CORRECTION
RESERVED
OUT
DB23 DB22
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1
DB21
DB0
C1 (0)
F1 C2 (0)
R2
R1
CL4 CL3 CL2 CL1
X1
R4
R3
R2
R1
F11
F10
F9
F8
F7
F6
F5
F4
F3
F2
X1
XOE
F-COUNTER
F11
F3
F2
F1
OFFSET
0
1
XTAL OSCILLATOR ON
XTAL OSCILLATOR OFF
0
0
0
0
0
...........
...........
...........
...........
...........
1
1
.
0
0
1
1
.
0
0
1
0
.
1
0
ꢄ1023
ꢄ1022
.
ꢄ1
ꢄ0
.........................................................................................................................................................
1
1
...........
...........
...........
...........
...........
1
1
.
0
0
1
1
.
0
0
1
0
.
1
0
ꢅ1
ꢅ2
.
ꢅ1023
ꢅ1024
1
1
e.g., F-COUNTER OFFSET = ꢅ1, FRACTIONAL OFFSET = ꢅ1/215
RF R COUNTER
DIVIDE RATIO
R1
R4
R3
R2
0
0
0
0
.
0
0
0
1
.
0
1
1
0
.
1
0
1
0
.
1
2
3
4
.
CLK
DIVIDE RATIO
OUT
CL3
CL2
CL4
CL1
0
0
0
0
.
.
.
1
0
0
0
1
.
.
.
1
0
1
1
0
.
.
.
0
1
0
1
0
.
.
.
0
2
4
6
8
.
.
.
24
.
.
1
.
.
1
.
.
0
.
.
0
.
.
12
1
1
1
1
1
1
0
1
1
1
0
1
13
14
15
1
1
1
1
1
1
0
1
1
1
0
1
26
28
30
–10–
REV. 0
ADF7010
RF N REGISTER
CONTROL
BITS
12-BIT FRACTIONAL-N
8-BIT INTEGER-N
DB19
DB14 DB13
DB3
M2
DB22 DB21 DB20
DB17
N4
DB8
M7
DB6 DB5 DB4
M5 M4 M3
DB2 DB1
M1
DB23
DB18
N5
DB16 DB15
DB12 DB11 DB10 DB9
DB7
M6
DB0
LDP V1
N8 N7
N6
N3
N2
N1
M11 M10 M9
M8
C1 (1)
M12
C2 (0)
e.g., SETTING F = 0 IN FSK MODE TURNS ON THE
SIGMA-DELTA WHILE THE PLL IS AN INTEGER VALUE
MODULUS
DIVIDE RATIO
M12
M11
M10
M3
M2
M1
0
0
0
.
.
.
0
0
0
.
.
.
0
0
0
.
.
.
..........
..........
..........
..........
..........
..........
..........
1
1
1
.
.
.
0
0
1
.
.
.
0
1
0
.
.
.
4
5
6
.
.
.
1
1
1
1
0
0
4092
1
1
1
1
1
1
1
1
1
..........
..........
..........
1
1
1
0
1
1
1
0
1
4093
4094
4095
e.g., MODULUS DIVIDE RATIO = 2048 –> FRACTION 1/2
N COUNTER
N8
N7
N6
N5
N4
N3
N2
N1
DIVIDE RATIO
0
0
0
0
.
0
0
0
0
.
0
1
1
1
.
1
0
0
0
.
1
0
0
0
.
1
0
0
0
.
1
0
0
1
.
1
0
1
0
.
31
32
33
34
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
0
1
253
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
254
255
VCO BAND
MHZ
V1
0
1
902–928
451–464
THE N-VALUE CHOSEN IS A MINIMUM OF
+ 3P + 3. FOR PRESCALER = 8/9 THIS
P
2
MEANS A MINIMUM N DIVIDE OF 91.
LOCK DETECT
PRECISION
LDP
0
1
3 CYCLES <15ns
5 CYCLES <15ns
REV. 0
–11–
ADF7010
MODULATION REGISTER
MODULATION CONTROL
SCHEM
INDEX
COUNTER
GFSK MOD
CONTROL
MODULATION DEVIATION
POWER AMPLIFIER
E
BITS
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
P1 IC2 IC1 MC3 MC2 MC1 D7 D6 D5 D4 D3 D2 D1 P7 P6 P5 P4 P3 P2 P1 S2 S1 C2 (1) C1 (0)
MODULATION
SCHEME
S2
S1
0
0
1
1
0
1
0
1
FSK
GFSK
ASK
OOK
POWER AMPLIFIER OUTPUT LEVEL
IF AMPLITUDE SHIFT KEYING SELECTED, TxDATA = 0
P7
P6
.
P2
P1
D7
D6
.
D2
D1
0
0
0
.
0
1
1
.
1
1
1
1
1
0
1
1
.
1
0
0
.
0
1
1
1
1
.
X
0
0
.
1
0
0
.
1
0
0
.
X
0
1
.
1
0
1
.
1
0
1
.
PA OFF
ꢅ16.0dBm
ꢅ16ꢄ1ꢆ(10/32)
0
0
0
.
0
1
1
.
1
1
1
1
1
0
1
1
.
1
0
0
.
0
1
1
1
1
.
X
0
0
.
1
0
0
.
1
0
0
.
X
0
1
.
1
0
1
.
1
0
1
.
PA OFF
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
ꢅ16.0dBm
ꢅ16ꢄ1ꢆ(10/32)
.
ꢅ16ꢄ31ꢆ(10/32)
ꢅ6dBm
ꢅ6ꢄ1ꢆ(10/32)
.
ꢅ6ꢄ1ꢆ(10/32)
2dBm
.
ꢅ16ꢄ31ꢆ(10/32)
ꢅ6dBm
ꢅ6ꢄ1ꢆ(10/32)
.
ꢅ6ꢄ1ꢆ(10/32)
2dBm
2ꢄ1ꢆ(10/32)
.
12dBm
2ꢄ1ꢆ(10/32)
.
12dBm
P1
RF PRESCALER
1
1
1
1
0
1
4/5
8/9
IF FREQUENCY SHIFT KEYING SELECTED
12
/2
F
= F
PFD
STEP
D7.
.
.
.
D3
D2
D1
0
F DEVIATION
PLL MODE
11 ꢆ F
02 ꢆ F
13 ꢆ F
0 .
0 .
.
.
.
.
.
.
.
0
0
0
0
0
0
1
1
.
.
.
STEP
STEP
STEP
0 .
0 .
.
.
.
1 .
.
1
.
.
...............
127 ꢆ F
.
.
.
1
STEP
IF GAUSSIAN FREQUENCY SHIFT KEYING SELECTED
D7
D3
D2
D1
DIVIDER FACTOR
INDEX
COUNTER
IC2
IC1
0
0
0
0
.
0
0
0
0
.
0
0
1
1
.
0
1
0
1
.
0
1
2
3
......
127
0
0
1
1
0
1
0
1
16
32
64
128
1
1
1
1
GFSK MOD
CONTROL
MC3
MC2
MC1
0
0
.
0
0
.
0
1
.
0
1
.
1
1
1
7
–12–
REV. 0
ADF7010
FUNCTION REGISTER
CONTROL
BITS
CHARGE
PUMP
FAST LOCK
TEST MODES
MUXOUT
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8
DB7 DB6
DB5
I1
DB4
PD3
DB3
PD2
DB2
PD1
DB1
DB0
T9
T8
T7
T6
T5
T4
T3
T2
T1
M4
M3
M2
M1
VP1
CP4
CP3
C2
C1
C2 (1) C1 (1)
I1
0
DATA INVERT
DATA
VP1
0
VCO DISABLE
VCO ON
1
DATA
1
VCO OFF
CP4
CP FLOCK DOWN
PD1
PLL ENABLE
0
1
BLEED OFF
BLEED ON
0
1
PLL OFF
PLL ON
CP3
CP FLOCK UP
PD2
PA ENABLE
PA OFF
0
1
BLEED OFF
BLEED ON
0
1
PA ON
CP2
CP1
I
(mA)
CP
R
SET
2.7kꢇ
4.7kꢇ
10kꢇ
0
0
1
1
0
1
0
1
0.50
1.50
2.51
3.51
0.29
0.87
1.44
2.02
0.14
0.41
0.68
0.95
PD3
CLK
OUT
0
1
CLK
OFF
OUT
CLK
ON
OUT
M4
M3
M2
M1
MUXOUT
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
LOGIC LOW
LOGIC HIGH
THREE-STATE
REGULATOR READY (DEFAULT)
DIGITAL LOCK DETECT
ANALOG LOCK DETECT
R DIVIDER / 2 OUTPUT
N DIVIDER / 2 OUTPUT
RF R DIVIDER OUTPUT
RF N DIVIDER OUTPUT
DATA RATE
LOGIC LOW
LOGIC LOW
LOGIC LOW
NORMAL TEST MODES
SIGMA-DELTA TEST MODES
REV. 0
–13–
ADF7010
DEFAULT VALUES FOR REGISTERS
R REGISTER
CONTROL
BITS
11-BIT FREQUENCY ERROR CORRECTION
4-BIT R-VALUE
RESERVED
DB23 DB22
CLK
OUT
DB20 DB19
DB21
1
DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1
1
DB0
C1 (0)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C2 (0)
N REGISTER
CONTROL
BITS
8-BIT INTEGER-N
12-BIT FRACTIONAL-N
DB23
0
DB18
0
DB16 DB15
DB12 DB11 DB10 DB9
DB7
0
DB0
DB19
0
DB14 DB13
DB3
0
DB22 DB21 DB20
DB17
0
DB8
0
DB6 DB5 DB4
DB2 DB1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
C1 (1)
1
C2 (0)
MODULATION REGISTER
INDEX
COUNTER
CONTROL
BITS
GFSK MOD
CONTROL
MODULATION
SCHEME
MODULATION DEVIATION
POWER AMPLIFIER
DB13
DB22
0
DB21 DB20
DB18 DB17 DB16 DB15
DB12
0
DB11 DB10
DB8 DB7 DB6 DB5 DB4
DB3
DB2
DB1
DB23
DB19
0
DB14
0
DB9
1
DB0
C1 (0)
0
0
0
0
0
0
0
0
1
C2 (1)
0
0
0
0
0
0
0
1
FUNCTION REGISTER
CONTROL
BITS
CHARGE
PUMP
FAST LOCK
TEST MODES
MUXOUT
DB19
0
DB14
DB10
0
DB9
0
DB23 DB22 DB21 DB20
DB15
0
DB2
0
DB1
DB0
DB17 DB16
DB13 DB12 DB11
DB8 DB7 DB6 DB5
DB3
DB18
0
DB4
1
0
0
0
0
0
0
0
0
0
1
1
0
1
0
C1 (1)
C2 (1)
1
–14–
REV. 0
ADF7010
CIRCUIT DESCRIPTION
REFERENCE INPUT SECTION
PRESCALER, PHASE FREQUENCY DETECTOR (PFD),
AND CHARGE PUMP
The on-board crystal oscillator circuitry (Figure 2), allows the
use of an inexpensive quartz crystal as the PLL reference. The
oscillator circuit is enabled by setting XOE low. It is enabled
by default on power-up and is disabled by bringing CE low.
Two parallel resonant capacitors are required for oscillation at
the correct frequency; the value of these is dependent on the
crystal specification. Errors in the crystal can be corrected using
the Error Correction register within the R Register. A single-
ended reference (TCXO, CXO) may be used. The CMOS
levels should be applied to OSC2, with XOE set high.
The dual-modulus prescaler (P/P + 1) divides the RF signal
from the VCO to a lower frequency that is manageable by the
CMOS counters.
The PFD takes inputs from the R Counter and the N Counter
(N = Int + Fraction) and produces an output proportional to the
phase and frequency difference between them. Figure 4 is a
simplified schematic.
V
P
CHARGE
PUMP
UP
HI
D1 Q1
U1
OSC2
10pF
R DIVIDER
CLR1
100kꢇ
10pF
100kꢇ
NC
OSC1 500kꢇ
BUFFER
CP
U3
SW1
XTAL OSCILLATOR
DISABLED
TO R COUNTER, AND
CLOCK OUT DIVIDE
CLR2
Figure 2. Oscillator Circuit on the ADF7010
DOWN
HI
D2 Q2
U2
CLKOUT DIVIDER AND BUFFER
N DIVIDER
The CLKOUT circuit takes the reference clock signal from the
oscillator section above and supplies a divided down 50:50
mark-space signal to the CLKOUT pin. An even divide from 2 to 30
is available. This divide is set by the 4 MSBs in the R register.
On power-up, the CLKOUT defaults to divide by 16.
CPGND
R DIVIDER
DV
DD
N DIVIDER
CLK
ENABLE BIT
OUT
CP OUTPUT
Figure 4. PFD Stage
DIVIDER
1 TO 15
DIVIDE
BY 2
CLK
OUT
OSC1
The PFD includes a delay element that sets the width of the
antibacklash pulse. The typical value for this in the ADF7010 is
3 ns. This pulse ensures that there is no dead zone in the PFD
transfer function and minimizes phase noise and reference spurs.
Figure 3. CLKOUT Stage
The output buffer to CLKOUT is enabled by setting Bit DB4 in
the function register high. On power-up, this bit is set high. The
output buffer can drive up to a 20 pF load with a 10% rise time at
4.8 MHz. Faster edges can result in some spurious feedthrough
to the output. A small series resistor (50 W) can be used to slow
MUXOUT AND LOCK DETECT
The MUXOUT pin allows the user to access various internal
points in the ADF7010. The state of MUXOUT is controlled by
Bits M1 to M4 in the function register.
the clock edges to reduce these spurs at FCLK
.
REGULATOR READY
This is the default setting on MUXOUT after the transmitter has
been powered up. The power-up time of the regulator is typically
50 ms. Since the serial interface is powered from the regulator,
it is necessary for the regulator to be at its nominal voltage
before the ADF7010 can be programmed. The status of the regu-
lator can be monitored at MUXOUT. Once the REGULATOR
READY signal on MUXOUT is high, programming of the
ADF7010 may begin.
R COUNTER
The 4-bit R Counter divides the reference input frequency by an
integer from 1 to 15. The divided down signal is presented as the
reference clock to the phase frequency detector (PFD). The divide
ratio is set in the R register. Maximizing the PFD frequency
reduces the N-value. This reduces the noise multiplied at a rate
of 20 log(N) to the output, as well as reducing occurrences of
spurious components. The R register defaults to R = 1 on power-up.
REV. 0
–15–
ADF7010
DV
DD
REGULATOR READY
DIGITAL LOCK DETECT
ANALOG LOCK DETECT
R COUNTER/2 OUTPUT
N COUNTER/2 OUTPUT
R COUNTER OUTPUT
N COUNTER OUTPUT
MUX
CONTROL
MUXOUT
DGND
Figure 5. MUXOUT Stage
Digital Lock Detect
Digital lock detect is active high. The lock detect circuit is
contained at the PFD. When the phase error on five consecutive
cycles is less than 15 ns, lock detect is set high. Lock detect
remains high until 25 ns phase error is detected at the PFD. Since
no external components are needed for digital lock detect, it is
more widely used than analog lock detect.
CHARGE
PUMP OUT
VCO
Analog Lock Detect
Figure 6. Typical Loop Filter Configuration––
Third Order Integrator
This N-channel open-drain lock detect should be operated with
an external pull-up resistor of 10 kW nominal. When lock has been
detected, this output will be high with narrow low going pulses.
In FSK, the loop should be designed so that the loop bandwidth
(LBW) is approximately 5 times the data rate. Widening the LBW
excessively reduces the time spent jumping between frequencies
but may cause insufficient spurious attenuation.
VOLTAGE REGULATOR
The ADF7010 requires a stable voltage source for the VCO and
modulation blocks. The on-board regulator provides 2.2 V using
a band gap reference. A 2.2 mF capacitor from CREG to ground
is used to improve stability of the regulator over a supply from 2.3 V
to 3.6 V. The regulator consumes less than 400 mA and can only
be powered down using the chip enable (CE) pin. Bringing
the chip enable pin low disables the regulator and also erases all
values held in the registers. The serial interface operates off the
regulator supply; therefore, to write to the part, the user must
have CE high. Regulator status can be monitored using the
Regulator Ready signal from MUXOUT.
For ASK systems, the wider the loop BW the better. The sudden
large transition between two power levels will result in VCO
pulling and can cause a wider output spectrum than is desired. By
widening the loop BW to >10 times the data rate, the amount
of the VCO pulling is reduced, since the loop will settle quickly
back to the correct frequency. The wider LBW may restrict the
output power and data rate of ASK based systems, compared
with FSK based systems.
Narrow loop bandwidths may result in the loop taking long
periods of time to attain lock. Careful design of the loop filter is
critical in obtaining accurate FSK/GFSK modulation.
LOOP FILTER
The loop filter integrates the current pulses from the charge
pump to form a voltage that tunes the output of the VCO to the
desired frequency. It also attenuates spurious levels generated
by the PLL. A typical loop filter design is shown in Figure 6.
For GFSK, it is recommended that an LBW of 2.0 to 2.5 times
the data rate be used to ensure sufficient samples are taken of the
input data while filtering system noise.
–16–
REV. 0
ADF7010
VOLTAGE CONTROLLED OSCILLATOR (VCO)
An on-chip VCO is included on the transmitter. The VCO
converts the control voltage generated by the loop filter into an
output frequency that is sent to the antenna via the power
amplifier (PA). The VCO has a typical gain of 80 MHz/V and
operates from 900 MHz–940 MHz. The PD1 bit in the function
register is the active high bit that turns on the VCO. A frequency
divide by 2 is included to allow operation in the lower 450 MHz
band. To enable operation in the lower band, the V1 bit in the
N Register should be set to 1.
LOW
MED
HIGH
The VCO needs an external 220 nF between the VCO and the
regulator to reduce internal noise.
P5
P1
P7, P6
Figure 8. Output Stage
VCO CONTROL BIT
SERIAL INTERFACE
The serial interface allows the user to program the four 24-bit
registers using a 3-wire interface. (CLK, Data, and Load Enable).
TO PA AND
N DIVIDER
MUX
VCO
The serial interface consists of a level shifter, 24-bit shift register,
and four latches. Signals should be CMOS compatible. The serial
interface is powered by the regulator, and therefore is inactive
when CE is low.
DIVIDE
BY 2
LOOP FILTER
220nF
C
PIN
Table I. C2, C1 Truth Table
REG
C2
C1 Data Latch
VCO SELECT BIT
0
0
1
1
0
1
0
1
R Register
N Register
Modulation Register
Function Register
Figure 7. Voltage Controlled Oscillator
RF OUTPUT STAGE
The RF output stage consists of a DAC with a number of current
sources to adjust the output power level. To set up the power level:
Data is clocked into the shift register, MSB first, on the rising edge
of each clock (CLK). Data is transferred to one of four latches on
the rising edge of LE. The destination latch is determined by the
value of the two control bits (C2 and C1). These are the two
LSBs, DB1 and DB0, as shown in the timing diagram of Figure 1.
FSK GFSK: The output power is set using the modulation
register by entering a 7-bit number into the bits P1–P7. The two
MSBs set the range of the output stage, while the five LSBs set
the output power in the selected range.
V
DD
ASK: The output power as set up for FSK is the output power
for a TxDATA of 1. The output power for a zero data bit is set
up the same way but using the bits D1–D7.
L1
PA
The output stage is powered down by setting bit PD2 in the
Function register to zero.
L2
C1
RF
50ꢇ
OUT
Figure 9. Output Stage Matching
REV. 0
–17–
ADF7010
M12 M11 M10 M9 M8 M7 M6 M5 M4 M3 M2 M1
12-BIT NVALUE
0.00
0.0
0.20
0.50
1.00
2.00
5.00
L(SERIES) = 6.8nH
ꢄ
F10 F9
F8
F7
F6
F5
F4
F3
N2
F2
N1
F1
N0
ꢀ5.00
10-BIT (ꢅ SIGN) ERROR CORRECTION
ꢀ0.20
ꢀ150
ꢀ140
ꢀ130
L(SHUNT) = 12nH
ꢀ30
ꢀ40
16 – j33
N14 N13 N12 N11 N10 N9
N8 N7
N6 N5
N4 N3
ꢀ2.00
ꢀ0.50
15-BIT FRACTIONAL N REGISTER
ꢀ50
ꢀ120
ꢀ1.00
ꢀ100
ꢀ60
Figure 12. Fractional Components
ꢀ110
ꢀ70
ꢀ80
ꢀ90
The resolution of each register is the smallest amount that the
output frequency can be changed by changing the LSB of the
register.
Figure 10. Output Impedance on Smith Chart
FRACTIONAL-N
N COUNTER AND ERROR CORRECTION
The ADF7010 consists of a 15-bit sigma-delta fractional N
divider. The N Counter divides the output frequency to the output
stage back to the PFD frequency. It consists of a prescaler, integer,
and fractional part.
Changing the Output Frequency
The fractional part of the N Register changes the output fre-
quency by:
-
(FPFD )(N RegisterValue)
212
The prescaler can be 4/5 or 8/9. The spurious performance is
better with a 4/5 prescaler, and the N-value can be lower since
N
The frequency error correction contained in the R Register
changes the output frequency by:
MIN is P 2 + 3P + 3.
(FPFD )(Frequency Error Correction Value)
The output frequency of the PLL is:
215
Int +(23 ¥ Fractional ) + Error
By default, this will be set to 0. The user can calibrate the system
and set this by writing a twos complement number to Bits F1–F11
in the R Register. This can be used to compensate for initial error,
temperature drift, and aging effects in the crystal reference.
PFD Frequency ¥
215
REFERENCE IN
PFD/
CHARGE
PUMP
Integer N Register
ꢁR
VCO
The integer part of the N-Counter contains the prescaler and A and
B counters. It is eight bits wide and offers a divide of P 2 + 3P + 3
to 255.
ꢁN
The combination of the integer (255) and the fractional (31767/
31768) give a maximum N Divider of 256. The minimum PFD
usable is:
THIRD ORDER
ꢂ-ꢃ MODULATOR
MaximumOutput Frequency Required
FPFD (min) =
(255 +1)
FRACTIONAL N
INTEGER N
For use in the U.S. 902 MHz–928 MHz band, there is a restriction
to using a minimum PFD of 3.625 MHz to allow the user to have
a center frequency of 928 MHz.
Figure 11. Fractional-N PLL
Fractional-N Registers
The fractional part is made up of a 15-bit divide, made up of
a 12-bit N value in the N Register summed with a 10-bit (plus
sign bit) in the R-Register that is used for error correction, as
shown in Figure 12.
PFD Frequency
The PFD frequency is the number of times a comparison is
made between the reference frequency and the feedback signal
from the output.
The higher the PFD frequency, the more often a comparison is
made at the PFD. This also allows a wider loop bandwidth
without compromising stability. This means that the frequency
lock time will be reduced when jumping from one frequency to
another by increasing the PFD.
–18–
REV. 0
ADF7010
The N divide in the integer part is also reduced. This results in
less noise being multiplied from the PFD to the output, resulting
in better phase noise for higher PFDs.
Setting up the ADF7010 for GFSK
To set up the frequency deviation, set the PFD and the mod
control Bits MC1 to MC3:
2m ¥ FPFD
Increasing the PFD reduces your resolution at the output.
GFSKDEVIATION (Hz) =
212
MODULATION SCHEMES
Frequency Shift Keying (FSK)
where m is mod control.
Frequency shift keying is implemented by setting the N value
for the center frequency and then toggling this with the TxDATA
line. The deviation from the center frequency is set using Bits
D1–D7 in the Modulation register. The deviation from the center
frequency in Hz is:
To set up the GFSK data rate:
FPFD
Data Rate(bits s) =
Divider Factor ¥ Index Counter
For further information, refer to the Using GFSK on the ADF7010
F
DEVIATION (Hz) = Modulation Number ¥ FPFD
application note.
212
Amplitude Shift Keying (ASK)
Amplitude shift keying is implemented by switching the output
stage between two discrete power levels. This is implemented by
toggling the DAC, which controls the output level between two
7-bit values set up in the Modulation register. A zero TxDATA
bit sends Bits D1–D7 to the DAC. A high TxDATA bit sends
Bits P1–P7 to the DAC. A maximum modulation depth of 30 dB
is possible. ASK is selected by setting Bit S2 = 1 and Bit S1 = 0.
The modulation number is a number from 1 to 127. FSK is selected
by setting Bits S1 and S2 to zero in the modulation register.
CHEAP AT CRYSTAL
INTERNAL VCO USING
SPIRAL INDUCTORS
GAIN 70 MHz/V – 90 MHz/V
PA STAGE
ꢁR
On-Off Keying (OOK)
PFD/
CHARGE
PUMP
VCO
On-off keying is implemented by switching the output stage to a
certain power level for a high TxDATA bit and switching the
output stage off for a zero. Due to feedthrough effects, a maxi-
mum modulation depth of 33 dB is specified. For OOK, the
transmitted power for a high input is programmed using Bits
P1–P7 in the Modulation register. OOK is selected by setting
Bits S1 and S2 to 1 in the modulation register.
FSK DEVIATION
FREQUENCY
–F
DEV
THIRD ORDER
ꢈ-ꢉ
MODULATOR
+F
DEV
TxDATA
CHOOSING CHANNELS FOR BEST SYSTEM
PERFORMANCE
FRACTIONAL N
INTEGER N
Figure 13. FSK Implementation
Gaussian Frequency Shift Keying (GFSK)
Gaussian frequency shift keying reduces the bandwidth occupied
by the transmitted spectrum by digitally prefiltering the TxDATA.
A TxCLK output line is provided from the ADF7010 for syn-
chronization of TxDATA from the microcontroller. The TxCLK
line may be connected to the clock input of an external shift
register that clocks data to the transmitter at the exact data rate.
The fractional-N PLL allows the selection of any channel within
902 MHz to 928 MHz to a resolution of < 100 Hz, as well as
facilitating frequency hopping systems. The use of the ADF7010
in accordance with FCC Part 15.247, allows for improved range
by allowing power levels up to 1 W, and greater interference
avoidance by changing the RF channel on a regular basis.
Careful selection of the RF transmit channels must be made
to achieve best spurious performance. The architecture of
Fractional-N results in some level of the nearest integer channel
moving through the loop to the RF output. These “beat-note”
spurs are not attenuated by the loop if the desired RF channel
and the nearest integer channel are separated by a frequency of
less than the loop BW.
SHIFT
REGISTER
ANTENNA
DATA FROM
MICROCONTROLLER
TxDATA
The occurrence of beat-note spurs is rare, as the integer frequen-
cies are at multiples of the reference, which is typically > 10 MHz.
ADF7010
The beat-note spurs can be significantly reduced in amplitude by
avoiding very small or very large values in the fractional register.
By having a channel 1 MHz away from an integer frequency, a
100 kHz loop filter will reduce the level to < –45 dBc. When using
an external VCO, the Fast Lock (bleed) function will reduce the
spurs to < –60 dBc for the same conditions above.
TxCLK
Figure 14. TxCLK Pin Synchronizing Data for GFSK
REV. 0
–19–
ADF7010
2.2ꢀF
220nF
DV
DD
CPV
DD
C
C
REG
VCO
R
SET
12nH
6.8nH
4.7kꢇ
100pF
6.8nH
6.2pF
ANTENNA
6.2pF
RF
OUT
VCO
CP
OUT
IN
VCO
IN
ADF7010
TxDATA
LE
CLK
DATA
CE
OSC2
OSC1
19.2MHz
10pF 10pF
MUXOUT CLK
TEST
GND
OUT
LOCK DETECT
50ꢇ
DECOUPLING CAPACITORS HAVE
BEEN OMITTED FOR CLARITY.
4.8MHZ CLOCK
Figure 15. Application Diagram
OUTLINE DIMENSIONS
24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
7.90
7.80
7.70
24
13
12
4.50
4.40
4.30
6.40 BSC
1
PIN 1
0.65
BSC
1.20
MAX
0.15
0.05
0.75
0.60
0.45
8ꢂ
0ꢂ
0.30
0.19
0.20
0.09
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AD
–20–
REV. 0
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