AD9629BCPZRL7-40 [ADI]
12-Bit, 20 MSPS/40 MSPS/65 MSPS/80 MSPS, 1.8 V Analog-to-Digital Converter; 12位, 20 MSPS / 40 MSPS / 65 MSPS / 80 MSPS , 1.8 V模拟数字转换器型号: | AD9629BCPZRL7-40 |
厂家: | ADI |
描述: | 12-Bit, 20 MSPS/40 MSPS/65 MSPS/80 MSPS, 1.8 V Analog-to-Digital Converter |
文件: | 总32页 (文件大小:984K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
12-Bit, 20 MSPS/40 MSPS/65 MSPS/80 MSPS,
1.8 V Analog-to-Digital Converter
AD9629
FEATURES
FUNCTIONAL BLOCK DIAGRAM
AVDD
GND
SDIO SCLK CSB
DRVDD
1.8 V analog supply operation
1.8 V to 3.3 V output supply
SNR
RBIAS
VCM
SPI
71.3 dBFS at 9.7 MHz input
OR
PROGRAMMING DATA
69.0 dBFS at 200 MHz input
SFDR
95 dBc at 9.7 MHz input
83 dBc at 200 MHz input
Low power
D11 (MSB)
VIN+
VIN–
ADC
CORE
D0 (LSB)
DCO
VREF
SENSE
45 mW at 20 MSPS
85 mW at 80 MSPS
AD9629
REF
SELECT
Differential input with 700 MHz bandwidth
On-chip voltage reference and sample-and-hold circuit
2 V p-p differential analog input
DNL = 0.16 LSB
MODE
DIVIDE BY
1, 2, 4
CONTROLS
CLK+ CLK–
PDWN DFS MODE
Serial port control options
Figure 1.
Offset binary, gray code, or twos complement data format
Integer 1, 2, or 4 input clock divider
Built-in selectable digital test pattern generation
Energy-saving power-down modes
Data clock out with programmable clock and data alignment
PRODUCT HIGHLIGHTS
1. The AD9629 operates from a single 1.8 V analog power
supply and features a separate digital output driver supply
to accommodate 1.8 V to 3.3 V logic families.
2. The patented sample-and-hold circuit maintains excellent
performance for input frequencies up to 200 MHz and is
designed for low cost, low power, and ease of use.
3. A standard serial port interface (SPI) supports various
product features and functions, such as data output format-
ting, internal clock divider, power-down, DCO and data
output (D11 to D0) timing and offset adjustments, and
voltage reference modes.
4. The AD9629 is packaged in a 32-lead RoHS compliant LFCSP
that is pin compatible with the AD9609 10-bit ADC and
the AD9649 14-bit ADC, enabling a simple migration path
between 10-bit and 14-bit converters sampling from 20 MSPS
to 80 MSPS.
APPLICATIONS
Communications
Diversity radio systems
Multimode digital receivers
GSM, EDGE, W-CDMA, LTE, CDMA2000, WiMAX, TD-SCDMA
Smart antenna systems
Battery-powered instruments
Hand held scope meters
Portable medical imaging
Ultrasound
Radar/LIDAR
PET/SPECT imaging
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2009 Analog Devices, Inc. All rights reserved.
AD9629
TABLE OF CONTENTS
Features .............................................................................................. 1
Voltage Reference ....................................................................... 19
Clock Input Considerations...................................................... 20
Power Dissipation and Standby Mode .................................... 21
Digital Outputs ........................................................................... 22
Timing ......................................................................................... 22
Built-In Self-Test (BIST) and Output Test .................................. 23
Built-In Self-Test (BIST)............................................................ 23
Output Test Modes..................................................................... 23
Serial Port Interface (SPI).............................................................. 24
Configuration Using the SPI..................................................... 24
Hardware Interface..................................................................... 25
Configuration Without the SPI ................................................ 25
SPI Accessible Features.............................................................. 25
Memory Map .................................................................................. 26
Reading the Memory Map Register Table............................... 26
Open Locations .......................................................................... 26
Default Values............................................................................. 26
Memory Map Register Table..................................................... 27
Memory Map Register Descriptions........................................ 29
Applications Information.............................................................. 30
Design Guidelines ...................................................................... 30
Outline Dimensions....................................................................... 31
Ordering Guide .......................................................................... 31
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
General Description......................................................................... 3
Specifications..................................................................................... 4
DC Specifications ......................................................................... 4
AC Specifications.......................................................................... 5
Digital Specifications ................................................................... 6
Switching Specifications .............................................................. 7
Timing Specifications .................................................................. 8
Absolute Maximum Ratings............................................................ 9
Thermal Characteristics .............................................................. 9
ESD Caution.................................................................................. 9
Pin Configuration and Function Descriptions........................... 10
Typical Performance Characteristics ........................................... 11
AD9629-80 .................................................................................. 11
AD9629-65 .................................................................................. 13
AD9629-40 .................................................................................. 14
AD9629-20 .................................................................................. 15
Equivalent Circuits......................................................................... 16
Theory of Operation ...................................................................... 17
Analog Input Considerations.................................................... 17
REVISION HISTORY
10/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 32
AD9629
GENERAL DESCRIPTION
deterministic and pseudorandom patterns, along with custom
user-defined test patterns entered via the serial port interface (SPI).
The AD9629 is a monolithic, single channel 1.8 V supply, 12-bit,
20 MSPS/40 MSPS/65 MSPS/80 MSPS analog-to-digital conver-
ter (ADC). It features a high performance sample-and-hold
circuit and on-chip voltage reference.
A differential clock input with optional 1, 2, or 4 divide ratios
controls all internal conversion cycles.
The product uses multistage differential pipeline architecture
with output error correction logic to provide 12-bit accuracy at
80 MSPS data rates and to guarantee no missing codes over the
full operating temperature range.
The digital output data is presented in offset binary, gray code,
or twos complement format. A data output clock (DCO) is
provided to ensure proper latch timing with receiving logic. Both
1.8 V and 3.3 V CMOS levels are supported.
The ADC contains several features designed to maximize
flexibility and minimize system cost, such as programmable
clock and data alignment and programmable digital test pattern
generation. The available digital test patterns include built-in
The AD9629 is available in a 32-lead RoHS compliant LFCSP
and is specified over the industrial temperature range (−40°C
to +85°C).
Rev. 0 | Page 3 of 32
AD9629
SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
Table 1.
AD9629-20/AD9629-40
Temp Min Typ Max
AD9629-65
AD9629-80
Parameter
Min
Typ
Max
Min
Typ
Max
Unit
RESOLUTION
Full
12
12
12
Bits
ACCURACY
No Missing Codes
Offset Error
Full
Full
Full
Full
25°C
Full
25°C
Guaranteed
Guaranteed
Guaranteed
−0.40 +0.05
−1.5
+0.50
−0.40 +0.05 +0.50 −0.40 +0.05 +0.50 % FSR
−1.5 −1.5 % FSR
0.30 LSB
Gain Error1
Differential Nonlinearity (DNL)2
0.25
0.25
0.30
0.11
0.11
2
0.11
0.1ꢀ
LSB
0.35 LSB
LSB
Integral Nonlinearity (INL)2
0.40
0.13
2
0.1ꢀ
2
TEMPERATURE DRIFT
Offset Error
Full
ppm/°C
INTERNAL VOLTAGE REFERENCE
Output Voltage (1 V Mode)
Load Regulation Error at 1.0 mA
INPUT-REFERRED NOISE
VREF = 1.0 V
Full
Full
0.984 0.99ꢀ
2
1.008
0.984 0.99ꢀ 1.008 0.984 0.99ꢀ 1.008
V
mV
2
2
25°C
0.25
0.25
0.25
LSB rms
ANALOG INPUT
Input Span, VREF = 1.0 V
Input Capacitance3
Input Common-Mode Voltage
Input Common-Mode Range
REFERENCE INPUT RESISTANCE
POWER SUPPLIES
Supply Voltage
AVDD
DRVDD
Full
Full
Full
Full
Full
2
ꢀ
0.9
2
ꢀ
0.9
2
ꢀ
0.9
V p-p
pF
V
0.5
1.3
0.5
1.3
0.5
1.3
V
7.5
7.5
1.8
7.5
1.8
kΩ
Full
Full
1.7
1.7
1.8
1.9
3.ꢀ
1.7
1.7
1.9
3.ꢀ
1.7
1.7
1.9
3.ꢀ
V
V
Supply Current
IAVDD2
Full
Full
Full
24.9/31.1 2ꢀ.7/33.2
1.5/2.5
2.7/4.7
41.2
4.2
7.5
4ꢀ.0
4ꢀ.8
5.0
9.0
50.0
mA
mA
mA
IDRVDD2 (1.8 V)
IDRVDD2 (3.3 V)
POWER CONSUMPTION
DC Input
Sine Wave Input2 (DRVDD = 1.8 V)
Sine Wave Input2 (DRVDD = 3.3 V)
Standby Power4
Full
Full
Full
Full
Full
45.0/5ꢀ.7
47.5/ꢀ0.5 50.7/ꢀ5.0
53.7/71.7
34
0.5
75
85.2
93
114
34
mW
mW
mW
mW
mW
81.7
98.9
34
8ꢀ.0
100
Power-Down Power
0.5
0.5
1 Measured with 1.0 V external reference.
2 Measured with a 10 MHz input frequency at rated sample rate, full-scale sine wave, with approximately 5 pF loading on each output bit.
3 Input capacitance refers to the effective capacitance between one differential input pin and AGND.
4 Standby power is measured with a dc input and the clock active.
Rev. 0 | Page 4 of 32
AD9629
AC SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
Table 2.
AD9629-20/AD9629-40
AD9629-65
AD9629-80
Parameter1
Temp Min
Typ
Max
Min Typ Max Min Typ
Max Unit
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 9.7 MHz
fIN = 30.5 MHz
25°C
25°C
Full
25°C
Full
25°C
71.4
71.2
71.3
71.2
71.3
71.2
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
70.5/70.7
70.ꢀ
70.5
fIN = 70 MHz
70.5/71.0
71.0
ꢀ9.0
70.9
ꢀ9.0
70.3
70.2
fIN = 200 MHz
SIGNAL-TO-NOISE-AND-DISTORTION (SINAD)
fIN = 9.7 MHz
fIN = 30.5 MHz
25°C
25°C
Full
25°C
Full
71.4
71.2
71.3
71.2
71.2
71.1
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
70.5/70.ꢀ
fIN = 70 MHz
70.4/70.9
ꢀ8
70.9
ꢀ8
70.8
ꢀ8
fIN = 200 MHz
25°C
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 200 MHz
25°C
25°C
25°C
25°C
11.4/11.ꢀ
11.4/11.5
11.4/11.5
11.0
11.ꢀ
11.5
11.5
11.0
11.5
11.5
11.5
11.0
Bits
Bits
Bits
Bits
WORST SECOND OR THIRD HARMONIC
fIN = 9.7 MHz
fIN = 30.5 MHz
25°C
25°C
Full
25°C
Full
−97
−95
−97
−95
−95
−94
dBc
dBc
dBc
dBc
dBc
dBc
−83
−83
fIN = 70 MHz
−9ꢀ/−94
−83
−95
−83
−95
−83
−81
fIN = 200 MHz
25°C
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 9.7 MHz
fIN = 30.5 MHz
25°C
25°C
Full
25°C
Full
97
9ꢀ/95
97
95
95
93
dBc
dBc
dBc
dBc
dBc
dBc
83
83
fIN = 70 MHz
9ꢀ/94
83
95
83
95
83
81
fIN = 200 MHz
25°C
WORST OTHER (HARMONIC OR SPUR)
fIN = 9.7 MHz
fIN = 30.5 MHz
25°C
25°C
Full
25°C
Full
−100
−100
−100
−100
−100
−100
dBc
dBc
dBc
dBc
dBc
dBc
−92/−91
−93
fIN = 70 MHz
−97/−100
−92
−100
−92
−100
−92
−89
fIN = 200 MHz
25°C
TWO-TONE SFDR
fIN = 30.5 MHz (−7 dBFS), 32.5 MHz (−7 dBFS)
ANALOG INPUT BANDWIDTH
25°C
25°C
90
90
90
dBc
700
700
700
MHz
1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
Rev. 0 | Page 5 of 32
AD9629
DIGITAL SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
Table 3.
AD9629-20/AD9629-40/AD9629-65/AD9629-80
Parameter
Temp
Min
Typ
Max
Unit
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
Internal Common-Mode Bias
Differential Input Voltage
Input Voltage Range
High Level Input Current
Low Level Input Current
Input Resistance
CMOS/LVDS/LVPECL
0.9
Full
Full
Full
Full
Full
Full
Full
V
0.2
GND − 0.3
−10
−10
8
3.ꢀ
AVDD + 0.2
+10
+10
12
V p-p
V
μA
μA
kΩ
pF
10
4
Input Capacitance
LOGIC INPUTS (SCLK/DFS, MODE, SDIO/PDWN)1
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Full
Full
Full
Full
Full
Full
1.2
0
−50
−10
DRVDD + 0.3
0.8
−75
+10
V
V
μA
μA
kΩ
pF
30
2
Input Capacitance
LOGIC INPUTS (CSB)2
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Full
Full
Full
Full
Full
Full
1.2
0
−10
40
DRVDD + 0.3
0.8
+10
135
V
V
μA
μA
kΩ
pF
2ꢀ
2
Input Capacitance
DIGITAL OUTPUTS
DRVDD = 3.3 V
High Level Output Voltage, IOH = 50 μA
High Level Output Voltage, IOH = 0.5 mA
Low Level Output Voltage, IOL = 1.ꢀ mA
Low Level Output Voltage, IOL = 50 μA
DRVDD = 1.8 V
Full
Full
Full
Full
3.29
3.25
V
V
V
V
0.2
0.05
High Level Output Voltage, IOH = 50 μA
High Level Output Voltage, IOH = 0.5 mA
Low Level Output Voltage, IOL = 1.ꢀ mA
Low Level Output Voltage, IOL = 50 μA
Full
Full
Full
Full
1.79
1.75
V
V
V
V
0.2
0.05
1 Internal 30 kΩ pull-down.
2 Internal 30 kΩ pull-up.
Rev. 0 | Page ꢀ of 32
AD9629
SWITCHING SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
Table 4.
AD9629-20/AD9629-40
AD9629-65
AD9629-80
Max Min Typ Max Unit
Parameter
Temp Min
Typ
Max
Min
Typ
CLOCK INPUT PARAMETERS
Input Clock Rate1
Conversion Rate2
CLK Period, Divide-by-1 Mode (tCLK
CLK Pulse Width High (tCH)
Aperture Delay (tA)
Aperture Uncertainty (Jitter, tJ)
DATA OUTPUT PARAMETERS
Data Propagation Delay (tPD)
Full
Full
Full
80/1ꢀ0
20/40
2ꢀ0
ꢀ5
320
80
MHz
MSPS
ns
ns
ns
3
3
3
12.5
50/25
)
15.38
25.0/12.5
1.0
0.1
7.ꢀ9
1.0
0.1
ꢀ.25
1.0
0.1
Full
Full
ps rms
Full
Full
Full
Full
Full
Full
Full
3
3
0.1
8
350
ꢀ00/400
2
3
3
3
3
ns
ns
ns
Cycles
μs
DCO Propagation Delay (tDCO
)
DCO to Data Skew (tSKEW
)
0.1
8
350
300
2
0.1
8
350
2ꢀ0
2
Pipeline Delay (Latency)
Wake-Up Time3
Standby
ns
OUT-OF-RANGE RECOVERY TIME
Cycles
1 Input clock rate is the clock rate before the internal CLK divider.
2 Conversion rate is the clock rate after the CLK divider.
3 Wake-up time is dependent on the value of the decoupling capacitors.
N – 1
N + 4
tA
N + 5
N
N + 3
VIN
N + 1
N + 2
tCH
tCLK
CLK+
CLK–
tDCO
DCO
tSKEW
N – 8
DATA
N – 7
N – 6
N – 5
N – 4
tPD
Figure 2. CMOS Output Data Timing
Rev. 0 | Page 7 of 32
AD9629
TIMING SPECIFICATIONS
Table 5.
Parameter
Conditions
Min
Typ
Max
Unit
SPI TIMING REQUIREMENTS
tDS
tDH
tCLK
tS
tH
tHIGH
tLOW
tEN_SDIO
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the SCLK
Setup time between CSB and SCLK
Hold time between CSB and SCLK
SCLK pulse width high
SCLK pulse width low
Time required for the SDIO pin to switch from an input to an
output relative to the SCLK falling edge
2
2
40
2
2
10
10
10
ns
ns
ns
ns
ns
ns
ns
ns
tDIS_SDIO
Time required for the SDIO pin to switch from an output to an
input relative to the SCLK rising edge
10
ns
Rev. 0 | Page 8 of 32
AD9629
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 6.
Parameter
Rating
The exposed paddle is the only ground connection for the chip.
The exposed paddle must be soldered to the AGND plane of the
user’s circuit board. Soldering the exposed paddle to the user’s
board also increases the reliability of the solder joints and
maximizes the thermal capability of the package.
AVDD to AGND
DRVDD to AGND
VIN+, VIN− to AGND
CLK+, CLK− to AGND
VREF to AGND
SENSE to AGND
VCM to AGND
RBIAS to AGND
CSB to AGND
SCLK/DFS to AGND
SDIO/PDWN to AGND
MODE/OR to AGND
D0 through D11 to AGND
DCO to AGND
Operating Temperature Range (Ambient)
Maximum Junction Temperature Under Bias
Storage Temperature Range (Ambient)
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−40°C to +85°C
Table 7. Thermal Resistance
Airflow
Package Velocity
1, 2
1, 3
1, 4
1, 2
Type
(m/sec)
θJA
θJC
θJB
20.7
ΨJT
0.3
0.5
0.8
Unit
°C/W
°C/W
°C/W
32-Lead
LFCSP
5 mm ×
5 mm
0
1.0
2.5
37.1
32.4
29.1
3.1
1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-ꢀ (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
150°C
−ꢀ5°C to +150°C
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces the θJA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. 0 | Page 9 of 32
AD9629
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
CLK+
CLK–
AVDD
1
2
3
4
5
6
7
8
24 AVDD
23 MODE/OR
22 DCO
21 D11 (MSB)
20 D10
19 D9
18 D8
17 D7
PIN 1
INDICATOR
CSB
AD9629
TOP VIEW
SCLK/DFS
SDIO/PDWN
NC
(Not to Scale)
NC
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PADDLE MUST BE SOLDERED TO
THE PCB GROUND TO ENSURE PROPER HEAT DISSIPATION,
NOISE, AND MECHANICAL STRENGTH BENEFITS.
Figure 3. Pin Configuration
Table 8. Pin Function Description
Pin No.
Mnemonic
Description
0 (EPAD)
GND
Exposed Paddle. The exposed paddle is the only ground connection. It must be soldered to the analog
ground of the customer’s PCB to ensure proper functionality and maximize heat dissipation, noise, and
mechanical strength benefits.
1, 2
3, 24, 29, 32
CLK+, CLK−
AVDD
Differential Encode Clock. PECL, LVDS, or 1.8 V CMOS inputs.
1.8 V Supply Pin for ADC Core Domain.
4
5
CSB
SCLK/DFS
SPI Chip Select. Active low enable. 30 kΩ internal pull-up.
SPI Clock Input in SPI Mode (SCLK). 30 kΩ internal pull-down.
Data Format Select in Non-SPI Mode (DFS). Static control of data output format. 30 kΩ internal pull-down.
DFS high = twos complement output; DFS low = offset binary output.
ꢀ
SDIO/PDWN
SPI Data Input/Output (SDIO). Bidirectional SPI data I/O in SPI mode. 30 kΩ internal pull-down.
Non-SPI Mode Power-Down (PDWN). Static control of power-down with 30 kΩ internal pull-down. See
Table 14 for details.
7, 8
NC
Do Not Connect.
9 to 12, 14 to 21 D0 (LSB) to
D11 (MSB)
ADC Digital Outputs.
13
22
23
DRVDD
DCO
MODE/OR
1.8 V to 3.3 V Supply Pin for Output Driver Domain.
Data Clock Digital Output.
Chip Mode Select Input or Out-of-Range (OR) Digital Output in SPI Mode.
Default = out-of-range (OR) digital output (SPI Register 0x2A[0] = 1).
Option = chip mode select input (SPI Register 0x2A[0] = 0).
Chip power down (SPI Register 0x08[7:5] = 100b).
Chip standby (SPI Register 0x08[7:5] = 101b).
Normal operation, output disabled (SPI Register 0x08[7:5] = 110b).
Normal operation, output enabled (SPI Register 0x08[7:5] = 111b).
Out-of-Range (OR) digital output only in non-SPI mode.
25
2ꢀ
27
28
VREF
SENSE
VCM
RBIAS
VIN−, VIN+
1.0 V Voltage Reference Input/Output. See Table 10.
Reference Mode Selection. See Table 10.
Analog Output Voltage at Mid AVDD Supply. Sets common mode of the analog inputs.
Sets Analog Current Bias. Connect to 10 kΩ (1% tolerance) resistor to ground.
ADC Analog Inputs.
30, 31
Rev. 0 | Page 10 of 32
AD9629
TYPICAL PERFORMANCE CHARACTERISTICS
AD9629-80
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
0
0
80MSPS
–15
–30
80MSPS
–15
–30
30.6MHz @ –1dBFS
SNR = 70.1dB (71.1dBFS)
SFDR = 94.4dBc
9.7MHz @ –1dBFS
SNR = 70.2dB (71.2dBFS)
SFDR = 93.6dBc
–45
–45
–60
–60
–75
–75
–90
+
–90
3
+
2
6
2
4
3
5
5
4
–105
–120
–135
6
–105
–120
–135
0
4
8
12
16
20
24
28
32
36
40
0
4
8
12
16
20
24
28
32
36
40
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 7. AD9629-80 Single-Tone FFT with fIN = 30.6 MHz
Figure 4. AD9629-80 Single-Tone FFT with fIN = 9.7 MHz
0
–15
0
80MSPS
80MSPS
–15
–30
69MHz @ –1dBFS
SNR = 69.9dB (70.9dBFS)
SFDR = 94.3dBc
210.3MHz @ –1dBFS
SNR = 67.9dB (68.9dBFS)
SFDR = 83.2dBc
–30
–45
–45
–60
–60
–75
–75
2
3
–90
+
–90
+
6
4
2
6
3
5
5
4
–105
–120
–135
–105
–120
–135
0
4
8
12
16
20
24
28
32
36
40
0
4
8
12
16
20
24
28
32
36
40
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 5. AD9629-80 Single-Tone FFT with fIN = 69 MHz
Figure 8. AD9629-80 Single-Tone FFT with fIN = 210.3 MHz
0
–15
0
80MSPS
28.3 @ –7dBFS
30.6 @ –7dBFS
SFDR = 90dBc
–30
–20
SFDR (dBc)
IMD3 (dBc)
–45
–40
–60
–60
–75
–90
F1 + F2
F2 – F1 2F2 – F1
2F2 – F1
2F1 – F2
2F1 + F2
–80
–105
–120
–135
SFDR (dBFS)
–100
–120
IMD3 (dBFS)
–60
0
4
8
12
16
20
24
28
32
36
40
FREQUENCY (MHz)
–70
–50
–40
–30
–20
–10
INPUT AMPLITUDE (dBFS)
Figure 6. AD9629-80 Two-Tone FFT with fIN1 = 28.3 MHz and fIN2 = 30.6 MHz
Figure 9. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 30.5 MHz
and fIN2 = 32.5 MHz
Rev. 0 | Page 11 of 32
AD9629
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
100
90
80
70
60
50
40
30
20
10
0
0.3
SFDR
0.2
SNR
0.1
0
–0.1
–0.2
–0.3
0
500
1000 1500 2000 2500 3000
OUTPUT CODE
3500 4000
0
50
100
INPUT FREQUENCY (MHz)
150
200
Figure 13. DNL Error with fIN = 9.7 MHz
Figure 10. AD9629-80 SNR/SFDR vs. Input Frequency (AIN) with 2 V p-p Full Scale
100
0.4
0.2
0
90
80
70
60
50
40
30
20
10
0
SFDR
SNRFS
–0.2
0.4
0
500
1000 1500 2000 2500 3000 3500 4000
OUTPUT CODE
10
20
30
40
50
60
70
80
SAMPLE RATE (MHz)
Figure 11. AD9629-80 SNR/SFDR vs. Sample Rate with AIN = 9.7 MHz
Figure 14. INL with fIN = 9.7 MHz
100
90
SFDRFS
80
SNRFS
70
60
SFDR
50
SNR
40
30
20
10
0
–70
–60
–50
–40
–30
–20
–10
0
INPUT AMPLITUDE (dBc)
Figure 12. AD9629-80 SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
Rev. 0 | Page 12 of 32
AD9629
AD9629-65
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
0
120
100
80
60
40
20
0
65MSPS
–15
9.7MHz @ –1dBFS
SNR =70.3 (71.3dBFS)
SFDR = 94.2dBc
SFDRFS
–30
–45
SNRFS
SFDR
–60
–75
–90
+
2
3
5
6
4
SNR
–105
–120
–135
0
3
6
9
12
15
18
21
24
27
30
33
33
33
–70
–60
–50
–40
–30
–20
–10
0
FREQUENCY (MHz)
INPUT AMPLITUDE (dBc)
Figure 15. AD9629-65 Single-Tone FFT with fIN = 9.7 MHz
Figure 18. AD9629-65 SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
0
100
65MSPS
90
–15
–30
SFDR
69MHz @ –1dBFS
SNR = 69.9dB (70.9dBFS)
SFDR = 92.0dBc
80
SNR
70
–45
60
50
40
30
20
10
0
–60
–75
–90
+
2
5
4
3
6
–105
–120
–135
0
3
6
9
12
15
18
21
24
27
30
0
50
100
150
200
FREQUENCY (MHz)
INPUT FREQUENCY (MHz)
Figure 16. AD9629-65 Single-Tone FFT with fIN = 69 MHz
Figure 19. AD9629-65 SNR/SFDR vs. Input Frequency (AIN) with
2 V p-p Full Scale
0
65MSPS
–15
–30
30.6MHz @ –1dBFS
SNR = 70.2dB (71.2dBFS)
SFDR = 94.1dBc
–45
–60
–75
–90
+
3
2
5
6
4
–105
–120
–135
0
3
6
9
12
15
18
21
24
27
30
FREQUENCY (MHz)
Figure 17. AD9629-65 Single-Tone FFT with fIN = 30.6 MHz
Rev. 0 | Page 13 of 32
AD9629
AD9629-40
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
0
120
100
80
60
40
20
0
40MSPS
–15
9.7MHz @ –1dBFS
SNR = 70.3dB (71.3dBFS)
SFDR = 93.8dBc
SFDRFS
SNRFS
–30
–45
–60
–75
SFDR
SNR
–90
+
2
3
5
4
6
–105
–120
–135
0
2
4
6
8
10
12
14
16
18
20
–70
–60
–50
–40
–30
–20
–10
0
FREQUENCY (MHz)
INPUT AMPLITUDE (dBc)
Figure 20. AD9629-40 Single-Tone FFT with fIN = 9.7 MHz
Figure 22. AD9629-40 SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
0
40MSPS
–15
–30
30.6MHz @ –1dBFS
SNR = 70.2dB (71.2dBFS)
SFDR = 95.4dBc
–45
–60
–75
–90
+
5
3
6
2
4
–105
–120
–135
0
2
4
6
8
10
12
14
16
18
20
FREQUENCY (MHz)
Figure 21. AD9629-40 Single-Tone FFT with fIN = 30.6 MHz
Rev. 0 | Page 14 of 32
AD9629
AD9629-20
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
0
120
100
80
60
40
20
0
20MSPS
–15
SFDRFS
9.7MHz @ –1dBFS
SNR = 70.3dB (71.3dBFS)
SFDR = 94.1dBc
–30
–45
SNRFS
SFDR
–60
–75
–90
+
2
5
3
SNR
4
6
–105
–120
–135
0
0.95 1.90 2.85 3.80 4.75 5.70 6.65 7.60 8.55 9.50
FREQUENCY (MHz)
–70
–60
–50
–40
–30
–20
–10
0
INPUT AMPLITUDE (dBc)
Figure 23. AD9629-20 Single-Tone FFT with fIN = 9.7 MHz
Figure 25. AD9629-20 SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
0
20MSPS
–15
30.6MHz @ –1dBFS
SNR = 70.2dB (71.2dBFS)
SFDR = 94.6dBc
–30
–45
–60
–75
–90
+
5
4
2
3
6
–105
–120
–135
0
0.95 1.90 2.85 3.80 4.75 5.70 6.65 7.60 8.55 9.50
FREQUENCY (MHz)
Figure 24. AD9629-20 Single-Tone FFT with fIN = 30.6 MHz
Rev. 0 | Page 15 of 32
AD9629
EQUIVALENT CIRCUITS
DRVDD
AVDD
VIN±
Figure 26. Equivalent Analog Input Circuit
Figure 30. Equivalent D0 to D11 and OR Digital Output Circuit
DRVDD
AVDD
350Ω
SCLK/DFS, MODE,
375Ω
SDIO/PDWN
VREF
30kΩ
7.5kΩ
Figure 27. Equivalent VREF Circuit
Figure 31. Equivalent SCLK/DFS, MODE, and SDIO/PDWN Input Circuit
AVDD
DRVDD
AVDD
30kΩ
375Ω
350Ω
SENSE
CSB
Figure 28. Equivalent SENSE Circuit
Figure 32. Equivalent CSB Input Circuit
5Ω
CLK+
15kΩ
0.9V
AVDD
15kΩ
5Ω
CLK–
375Ω
RBIAS
AND VCM
Figure 29. Equivalent Clock Input Circuit
Figure 33. Equivalent RBIAS and VCM Circuit
Rev. 0 | Page 1ꢀ of 32
AD9629
THEORY OF OPERATION
high IF frequencies. Either a shunt capacitor or two single-ended
capacitors can be placed on the inputs to provide a matching
passive network. This ultimately creates a low-pass filter at the
input to limit unwanted broadband noise. See the AN-742
Application Note, the AN-827 Application Note, and the Analog
Dialogue article “Transformer-Coupled Front-End for Wideband
A/D Converters” (Volume 39, April 2005) for more information.
In general, the precise values depend on the application.
The AD9629 architecture consists of a multistage, pipelined ADC.
Each stage provides sufficient overlap to correct for flash errors in
the preceding stage. The quantized outputs from each stage are
combined into a final 12-bit result in the digital correction logic.
The pipelined architecture permits the first stage to operate with a
new input sample while the remaining stages operate with pre-
ceding samples. Sampling occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched-capacitor DAC
and an interstage residue amplifier (for example, a multiplying
digital-to-analog converter (MDAC)). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage consists of a flash ADC.
Input Common Mode
The analog inputs of the AD9629 are not internally dc-biased.
Therefore, in ac-coupled applications, the user must provide a
dc bias externally. Setting the device so that VCM = AVDD/2
is recommended for optimum performance, but the device can
function over a wider range with reasonable performance, as
shown in Figure 35 and Figure 36.
An on-board, common-mode voltage reference is included in
the design and is available from the VCM pin. The VCM pin
must be decoupled to ground by a 0.1 μF capacitor, as described
in the Applications Information section.
The output staging block aligns the data, corrects errors, and
passes the data to the CMOS output buffers. The output buffers
are powered from a separate (DRVDD) supply, allowing adjust-
ment of the output voltage swing. During power-down, the output
buffers go into a high impedance state.
100
SFDR (dBc)
ANALOG INPUT CONSIDERATIONS
90
80
The analog input to the AD9629 is a differential switched-
capacitor circuit designed for processing differential input
signals. This circuit can support a wide common-mode range
while maintaining excellent performance. By using an input
common-mode voltage of midsupply, users can minimize
signal-dependent errors and achieve optimum performance.
SNR (dBFS)
70
60
50
H
CPAR
H
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
VIN+
INPUT COMMON-MODE VOLTAGE (V)
CSAMPLE
S
S
S
S
Figure 35. SNR/SFDR vs. Input Common-Mode Voltage,
f
IN = 32.1 MHz, fS = 80 MSPS
CSAMPLE
100
90
VIN–
H
CPAR
SFDR (dBc)
H
Figure 34. Switched-Capacitor Input Circuit
80
The clock signal alternately switches the input circuit between
sample-and-hold mode (see Figure 34). When the input circuit
is switched to sample mode, the signal source must be capable
of charging the sample capacitors and settling within one-half
of a clock cycle. A small resistor in series with each input can
help reduce the peak transient current injected from the output
stage of the driving source. In addition, low Q inductors or ferrite
beads can be placed on each leg of the input to reduce high dif-
ferential capacitance at the analog inputs and, therefore, achieve
the maximum bandwidth of the ADC. Such use of low Q inductors
or ferrite beads is required when driving the converter front end at
SNR (dBFS)
70
60
50
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
INPUT COMMON-MODE VOLTAGE (V)
Figure 36. SNR/SFDR vs. Input Common-Mode Voltage,
fIN = 10.3 MHz, fS = 20 MSPS
Rev. 0 | Page 17 of 32
AD9629
Differential Input Configurations
~10 MHz where SNR is a key parameter, differential double balun
coupling is the recommended input configuration (see Figure 40).
Optimum performance is achieved while driving the AD9629 in a
differential input configuration. For baseband applications, the
AD8138, ADA4937-2, and ADA4938-2 differential drivers provide
excellent performance and a flexible interface to the ADC.
An alternative to using a transformer-coupled input at frequencies
in the second Nyquist zone is to use the AD8352 differential driver.
An example is shown in Figure 41. See the AD8352 data sheet
for more information.
The output common-mode voltage of the ADA4938-2 is easily
set with the VCM pin of the AD9629 (see Figure 37), and the
driver can be configured in a Sallen-Key filter topology to
provide band limiting of the input signal.
In any configuration, the value of Shunt Capacitor C is dependent
on the input frequency and source impedance and may need to
be reduced or removed. Table 9 displays the suggested values to set
the RC network. However, these values are dependent on the
input signal and should be used only as a starting guide.
200Ω
33Ω
VIN–
VIN
76.8Ω
AVDD
90Ω
10pF
ADC
ADA4938
Table 9. Example RC Network
0.1µF
120Ω
33Ω
VCM
VIN+
R Series
200Ω
Frequency Range (MHz)
0 to 70
(Ω Each)
C Differential (pF)
Figure 37. Differential Input Configuration Using the ADA4938-2
33
22
70 to 200
125
Open
For baseband applications below ~10 MHz where SNR is a key
parameter, differential transformer-coupling is the recommended
input configuration. An example is shown in Figure 38. To bias
the analog input, the VCM voltage can be connected to the
center tap of the secondary winding of the transformer.
Single-Ended Input Configuration
A single-ended input can provide adequate performance in
cost-sensitive applications. In this configuration, SFDR and
distortion performance degrade due to the large input common-
mode swing. If the source impedances on each input are matched,
there should be little effect on SNR performance. Figure 39
shows a typical single-ended input configuration.
VIN+
R
2V p-p
49.9Ω
C
ADC
R
VCM
VIN–
10µF
AVDD
0.1µF
1kΩ
R
Figure 38. Differential Transformer-Coupled Configuration
VIN+
1V p-p
0.1µF
49.9Ω
1kΩ
The signal characteristics must be considered when selecting
a transformer. Most RF transformers saturate at frequencies
below a few megahertz (MHz). Excessive signal power can
also cause core saturation, which leads to distortion.
AVDD
ADC
C
1kΩ
R
VIN–
10µF
0.1µF
1kΩ
At input frequencies in the second Nyquist zone and above, the
noise performance of most amplifiers is not adequate to achieve
the true SNR performance of the AD9629. For applications above
Figure 39. Single-Ended Input Configuration
0.1µF
R
R
0.1µF
VIN+
2V p-p
25Ω
25Ω
P
A
S
S
P
C
ADC
0.1µF
0.1µF
VCM
VIN–
Figure 40. Differential Double Balun Input Configuration
V
CC
0.1µF
0Ω
0.1µF
16
1
8, 13
11
0.1µF
0.1µF
ANALOG INPUT
R
R
VIN+
VIN–
2
200Ω
C
ADC
AD8352
10
R
R
G
C
D
D
3
4
5
200Ω
VCM
14
0.1µF
ANALOG INPUT
0Ω
0.1µF
0.1µF
Figure 41. Differential Input Configuration Using the AD8352
Rev. 0 | Page 18 of 32
AD9629
External Reference Operation
VOLTAGE REFERENCE
The use of an external reference may be necessary to enhance
the gain accuracy of the ADC or improve thermal drift charac-
teristics. Figure 44 shows the typical drift characteristics of the
internal reference in 1.0 V mode.
A stable and accurate 1.0 V voltage reference is built into the
AD9629. The VREF can be configured using either the internal
1.0 V reference or an externally applied 1.0 V reference voltage.
The various reference modes are summarized in the sections
that follow. The Reference Decoupling section describes the
best practices PCB layout of the reference.
4
3
Internal Reference Connection
2
VREF ERROR (mV)
1
0
A comparator within the AD9629 detects the potential at the
SENSE pin and configures the reference into two possible modes,
which are summarized in Table 10. If SENSE is grounded, the
reference amplifier switch is connected to the internal resistor
divider (see Figure 42), setting VREF to 1.0 V.
–1
–2
–3
–4
–5
–6
VIN+
VIN–
ADC
CORE
–40
–20
0
20
40
60
80
TEMPERATURE (°C)
Figure 44. Typical VREF Drift
VREF
When the SENSE pin is tied to AVDD, the internal reference is
disabled, allowing the use of an external reference. An internal
reference buffer loads the external reference with an equivalent
7.5 kΩ load (see Figure 27). The internal buffer generates the
positive and negative full-scale references for the ADC core.
Therefore, the external reference must be limited to a maximum
of 1.0 V.
1.0µF
0.1µF
SELECT
LOGIC
SENSE
0.5V
ADC
Figure 42. Internal Reference Configuration
If the internal reference of the AD9629 is used to drive multiple
converters to improve gain matching, the loading of the reference
by the other converters must be considered. Figure 43 shows
how the internal reference voltage is affected by loading.
0
–0.5
–1.0
INTERNAL VREF = 0.996V
–1.5
–2.0
–2.5
–3.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
LOAD CURRENT (mA)
Figure 43. VREF Accuracy vs. Load Current
Table 10. Reference Configuration Summary
Selected Mode
SENSE Voltage (V) Resulting VREF (V)
Resulting Differential Span (V p-p)
Fixed Internal Reference
Fixed External Reference
AGND to 0.2
AVDD
1.0 internal
1.0 applied to external VREF pin
2.0
2.0
Rev. 0 | Page 19 of 32
AD9629
This limit helps prevent the large voltage swings of the clock
from feeding through to other portions of the AD9629 while
preserving the fast rise and fall times of the signal that are critical
to a low jitter performance.
CLOCK INPUT CONSIDERATIONS
For optimum performance, clock the AD9629 sample clock inputs,
CLK+ and CLK−, with a differential signal. The signal is typi-
cally ac-coupled into the CLK+ and CLK− pins via a transformer
or capacitors. These pins are biased internally (see Figure 45)
and require no external bias.
If a low jitter clock source is not available, another option is to
ac couple a differential PECL signal to the sample clock input
pins, as shown in Figure 48. The AD9510/AD9511/AD9512/
AD9513/AD9514/AD9515/AD9516/AD9517 clock drivers
offer excellent jitter performance.
AVDD
0.9V
CLK+
CLK–
0.1µF
0.1µF
CLOCK
INPUT
CLK+
2pF
2pF
AD951x
PECL DRIVER
100Ω
ADC
0.1µF
0.1µF
CLOCK
INPUT
CLK–
240Ω
240Ω
50kΩ
50kΩ
Figure 45. Equivalent Clock Input Circuit
Clock Input Options
Figure 48. Differential PECL Sample Clock (Up to 4× Rated Sample Rate)
The AD9629 has a very flexible clock input structure. The clock
input can be a CMOS, LVDS, LVPECL, or sine wave signal.
Regardless of the type of signal being used, clock source jitter is
of great concern, as described in the Jitter Considerations section.
A third option is to ac couple a differential LVDS signal to the
sample clock input pins, as shown in Figure 49. The AD9510/
AD9511/AD9512/AD9513/AD9514/AD9515/AD9516/AD9517
clock drivers offer excellent jitter performance.
Figure 46 and Figure 47 show two preferred methods for clock-
ing the AD9629. The CLK inputs support up to 4× the rated
sample rate when using the internal clock divider feature. A low
jitter clock source is converted from a single-ended signal to a
differential signal using either an RF transformer or an RF balun.
0.1µF
0.1µF
CLOCK
INPUT
CLK+
AD951x
LVDS DRIVER
100Ω
ADC
0.1µF
0.1µF
CLOCK
INPUT
CLK–
®
50kΩ
50kΩ
Mini-Circuits
ADT1-1WT, 1:1 Z
0.1µF
0.1µF
XFMR
Figure 49. Differential LVDS Sample Clock (Up to 4× Rated Sample Rate)
CLOCK
INPUT
CLK+
100Ω
50Ω
In some applications, it may be acceptable to drive the sample
clock inputs with a single-ended 1.8 V CMOS signal. In such
applications, drive the CLK+ pin directly from a CMOS gate, and
bypass the CLK− pin to ground with a 0.1 ꢀF capacitor (see
Figure 50).
ADC
0.1µF
CLK–
SCHOTTKY
DIODES:
HSMS2822
0.1µF
Figure 46. Transformer-Coupled Differential Clock (3 MHz to 200 MHz)
V
CC
OPTIONAL
100Ω
0.1µF
1
0.1µF
1kΩ
1kΩ
AD951x
CMOS DRIVER
1nF
50Ω
1nF
0.1µF
0.1µF
CLOCK
INPUT
CLK+
CLOCK
INPUT
CLK+
50Ω
ADC
ADC
CLK–
CLK–
SCHOTTKY
DIODES:
0.1µF
HSMS2822
1
50Ω RESISTOR IS OPTIONAL.
Figure 47. Balun-Coupled Differential Clock (Up to 4× Rated Sample Rate)
Figure 50. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz)
The RF balun configuration is recommended for clock frequencies
between 80 MHz and 320 MHz, and the RF transformer is recom-
mended for clock frequencies from 3 MHz to 200 MHz. The
back-to-back Schottky diodes across the transformer/balun
secondary limit clock excursions into the AD9629 to ~0.8 V p-p
differential.
Input Clock Divider
The AD9629 contains an input clock divider with the ability
to divide the input clock by integer values of 1, 2, or 4.
Rev. 0 | Page 20 of 32
AD9629
Clock Duty Cycle
The clock input should be treated as an analog signal in cases in
which aperture jitter may affect the dynamic range of the AD9629.
To avoid modulating the clock signal with digital noise, keep
power supplies for clock drivers separate from the ADC output
driver supplies. Low jitter, crystal-controlled oscillators make
the best clock sources. If the clock is generated from another type
of source (by gating, dividing, or another method), it should be
retimed by the original clock at the last step.
Typical high speed ADCs use both clock edges to generate
a variety of internal timing signals and, as a result, may be
sensitive to clock duty cycle. Commonly, a 50% duty cycle clock
with 5% tolerance is required to maintain optimum dynamic
performance as shown in Figure 51.
Jitter on the rising edge of the clock input can also impact dynamic
performance and should be minimized as discussed in the Jitter
Considerations section.
For more information, see the AN-501 Application Note and the
AN-756 Application Note available on www.analog.com.
80
POWER DISSIPATION AND STANDBY MODE
75
70
65
60
55
50
45
40
As shown in Figure 53, the analog core power dissipated by
the AD9629 is proportional to its sample rate. The digital
power dissipation of the CMOS outputs are determined
primarily by the strength of the digital drivers and the load
on each output bit.
The maximum DRVDD current (IDRVDD) can be calculated as
IDRVDD = VDRVDD × CLOAD × fCLK × N
where N is the number of output bits (13, in the case of the
AD9629).
10
20
30
40
50
60
70
80
This maximum current occurs when every output bit switches
on every clock cycle, that is, a full-scale square wave at the Nyquist
frequency of fCLK/2. In practice, the DRVDD current is estab-
lished by the average number of output bits switching, which
is determined by the sample rate and the characteristics of the
analog input signal.
POSITIVE DUTY CYCLE (%)
Figure 51. SNR vs. Clock Duty Cycle
Jitter Considerations
High speed, high resolution ADCs are sensitive to the quality
of the clock input. The degradation in SNR from the low fre-
quency SNR (SNRLF) at a given input frequency (fINPUT) due to
jitter (tJRMS) can be calculated by
Reducing the capacitive load presented to the output drivers
can minimize digital power consumption. The data in Figure 53
was taken using the same operating conditions as those used for
the Typical Performance Characteristics, with a 5 pF load on
each output driver.
SNRHF = −10 log[(2π × fINPUT × tJRMS)2 + 10 (−SNR /10)
]
LF
In the previous equation, the rms aperture jitter represents the
clock input jitter specification. IF undersampling applications
are particularly sensitive to jitter, as illustrated in Figure 52.
85
80
80
AD9231-80
75
75
70
65
0.05ps
0.2ps
70
65
60
55
50
45
40
35
AD9231-65
60
55
50
0.5ps
AD9231-40
1.0ps
1.5ps
AD9231-20
20
2.0ps
2.5ps
10
30
40
50
60
70
80
3.0ps
CLOCK RATE (MSPS)
45
1
10
100
1k
Figure 53. Analog Core Power vs. Clock Rate
FREQUENCY (MHz)
Figure 52. SNR vs. Input Frequency and Jitter
Rev. 0 | Page 21 of 32
AD9629
In SPI mode, the AD9629 can be placed in power-down mode
directly via the SPI port, or by using the programmable external
MODE pin. In non-SPI mode, power-down is achieved by
asserting the PDWN pin high. In this state, the ADC typically
dissipates 500 μW. During power-down, the output drivers are
placed in a high impedance state. Asserting PDWN low (or the
MODE pin in SPI mode) returns the AD9629 to its normal
operating mode. Note that PDWN is referenced to the digital
output driver supply (DRVDD) and should not exceed that
supply voltage.
As detailed in the AN-877 Application Note, Interfacing to High
Speed ADCs via SPI, the data format can be selected for offset
binary, twos complement, or gray code when using the SPI control.
Table 11. SCLK/DFS and SDIO/PDWN Mode Selection
(External Pin Mode)
Voltage at Pin SCLK/DFS
SDIO/PDWN
AGND
Offset binary (default) Normal operation
(default)
DRVDD
Twos complement
Outputs disabled
Low power dissipation in power-down mode is achieved by
shutting down the reference, reference buffer, biasing networks,
and clock. Internal capacitors are discharged when entering power-
down mode and then must be recharged when returning to normal
operation. As a result, wake-up time is related to the time spent
in power-down mode, and shorter power-down cycles result in
proportionally shorter wake-up times.
Digital Output Enable Function (OEB)
When using the SPI interface, the data outputs and DCO can be
independently three-stated by using the programmable external
MODE pin. The MODE pin (OEB) function is enabled via
Bits[6:5] of Register 0x08.
If the MODE pin is configured to operate in traditional OEB
mode and the OEB pin is low, the output data drivers and
DCOs are enabled. If the OEB pin is high, the output data
drivers and DCOs are placed in a high impedance state. This
OEB function is not intended for rapid access to the data bus.
Note that OEB is referenced to the digital output driver supply
(DRVDD) and should not exceed that supply voltage.
When using the SPI port interface, the user can place the ADC
in power-down mode or standby mode. Standby mode allows
the user to keep the internal reference circuitry powered when
faster wake-up times are required. See the Memory Map section
for more details.
DIGITAL OUTPUTS
TIMING
The AD9629 output drivers can be configured to interface with
1.8 V to 3.3 V CMOS logic families. Output data can also be
multiplexed onto a single output bus to reduce the total number
of traces required.
The AD9629 provides latched data with a pipeline delay of
9 clock cycles. Data outputs are available one propagation
delay (tPD) after the rising edge of the clock signal.
Minimize the length of the output data lines and loads placed
on them to reduce transients within the AD9629. These
transients can degrade converter dynamic performance.
The CMOS output drivers are sized to provide sufficient output
current to drive a wide variety of logic families. However, large
drive currents tend to cause current glitches on the supplies and
may affect converter performance.
The lowest typical conversion rate of the AD9629 is 3 MSPS. At
clock rates below 3 MSPS, dynamic performance can degrade.
Applications requiring the ADC to drive large capacitive loads
or large fanouts may require external buffers or latches.
Data Clock Output (DCO)
The AD9629 provides a data clock output (DCO) signal
intended for capturing the data in an external register. The CMOS
data outputs are valid on the rising edge of DCO, unless the DCO
clock polarity has been changed via the SPI. See Figure 2 for a
graphical timing description.
The output data format can be selected to be either offset binary
or twos complement by setting the SCLK/DFS pin when operating
in the external pin mode (see Table 11).
Table 12. Output Data Format
Input (V)
Condition (V)
< −VREF − 0.5 LSB
= −VREF
Offset Binary Output Mode
0000 0000 0000
0000 0000 0000
1000 0000 0000
1111 1111 1111
Twos Complement Mode
1000 0000 0000
1000 0000 0000
0000 0000 0000
0111 1111 1111
OR
1
0
0
0
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
= 0
= +VREF − 1.0 LSB
> +VREF − 0.5 LSB
1111 1111 1111
0111 1111 1111
1
Rev. 0 | Page 22 of 32
AD9629
BUILT-IN SELF-TEST (BIST) AND OUTPUT TEST
generator, Bit 2 (BIST INIT) of Register 0x0E. At the completion
The AD9629 includes a built-in self-test feature designed to
enable verification of the integrity of each channel as well as to
facilitate board level debugging. A built-in self-test (BIST) feature
that verifies the integrity of the digital datapath of the AD9629
is included. Various output test options are also provided to place
predictable values on the outputs of the AD9629.
of the BIST, Bit 0 of Register 0x24 is automatically cleared. The PN
sequence can be continued from its last value by writing a 0 in
Bit 2 of Register 0x0E. However, if the PN sequence is not reset,
the signature calculation does not equal the predetermined
value at the end of the test. At that point, the user needs to rely
on verifying the output data.
BUILT-IN SELF-TEST (BIST)
OUTPUT TEST MODES
The BIST is a thorough test of the digital portion of the selected
AD9629 signal path. Perform the BIST test after a reset to ensure
the part is in a known state. During BIST, data from an internal
pseudorandom noise (PN) source is driven through the digital
datapath of both channels, starting at the ADC block output.
At the datapath output, CRC logic calculates a signature from
the data. The BIST sequence runs for 512 cycles and then stops.
Once completed, the BIST compares the signature results with a
predetermined value. If the signatures match, the BIST sets Bit 0
of Register 0x24, signifying the test passed. If the BIST test failed,
Bit 0 of Register 0x24 is cleared. The outputs are connected
during this test, so the PN sequence can be observed as it runs.
Writing 0x05 to Register 0x0E runs the BIST. This enables the Bit 0
(BIST enable) of Register 0x0E and resets the PN sequence
The output test options are described in Table 16 at Address
0x0D. When an output test mode is enabled, the analog section
of the ADC is disconnected from the digital back-end blocks
and the test pattern is run through the output formatting block.
Some of the test patterns are subject to output formatting, and
some are not. The PN generators from the PN sequence tests
can be reset by setting Bit 4 or Bit 5 of Register 0x0D. These
tests can be performed with or without an analog signal (if
present, the analog signal is ignored), but they do require an
encode clock. For more information, see the AN-877
Application Note, Interfacing to High Speed ADCs via SPI.
Rev. 0 | Page 23 of 32
AD9629
SERIAL PORT INTERFACE (SPI)
The falling edge of CSB, in conjunction with the rising edge of
SCLK, determines the start of the framing. An example of the
serial timing and its definitions can be found in Figure 54 and
Table 5.
The AD9629 serial port interface (SPI) allows the user to configure
the converter for specific functions or operations through a
structured register space provided inside the ADC. The SPI
gives the user added flexibility and customization, depending
on the application. Addresses are accessed via the serial port
and can be written to or read from via the port. Memory is
organized into bytes that can be further divided into fields,
which are documented in the Memory Map section. For
detailed operational information, see the AN-877 Application
Note, Interfacing to High Speed ADCs via SPI.
Other modes involving the CSB are available. The CSB can be
held low indefinitely, which permanently enables the device;
this is called streaming. The CSB can stall high between bytes to
allow for additional external timing. When CSB is tied high, SPI
functions are placed in high impedance mode. This mode turns
on any SPI pin secondary functions.
During an instruction phase, a 16-bit instruction is transmitted.
Data follows the instruction phase, and its length is determined
by the W0 and W1 bits as shown in Figure 54.
CONFIGURATION USING THE SPI
Three pins define the SPI of this ADC: the SCLK, the SDIO,
and the CSB (see Table 13). The SCLK (a serial clock) is used
to synchronize the read and write data presented from and to
the ADC. The SDIO (serial data input/output) is a dual-purpose
pin that allows data to be sent and read from the internal ADC
memory map registers. The CSB (chip select bar) is an active-
low control that enables or disables the read and write cycles.
All data is composed of 8-bit words. The first bit of the first byte in
a multibyte serial data transfer frame indicates whether a read
command or a write command is issued. This allows the serial
data input/output (SDIO) pin to change direction from an input
to an output at the appropriate point in the serial frame.
In addition to word length, the instruction phase determines
whether the serial frame is a read or write operation, allowing
the serial port to be used both to program the chip and to read
the contents of the on-chip memory. If the instruction is a readback
operation, performing a readback causes the serial data input/
output (SDIO) pin to change direction from an input to an output
at the appropriate point in the serial frame.
Table 13. Serial Port Interface Pins
Pin
Function
SCLK Serial clock. The serial shift clock input, which is used to
synchronize serial interface reads and writes.
SDIO Serial data input/output. A dual-purpose pin that
typically serves as an input or an output, depending on
the instruction being sent and the relative position in the
timing frame.
Data can be sent in MSB-first mode or in LSB-first mode. MSB
first is the default on power-up and can be changed via the SPI
port configuration register. For more information about this
and other features, see the AN-877 Application Note, Interfacing
to High Speed ADCs via SPI.
CSB
Chip select bar. An active-low control that gates the read
and write cycles.
tHIGH
tDS
tCLK
tH
tS
tDH
tLOW
CSB
SCLK DON’T CARE
SDIO DON’T CARE
DON’T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
D4
D3
D2
D1
D0
DON’T CARE
Figure 54. Serial Port Interface Timing Diagram
Rev. 0 | Page 24 of 32
AD9629
HARDWARE INTERFACE
CONFIGURATION WITHOUT THE SPI
The pins described in Table 13 constitute the physical interface
between the programming device of the user and the serial
port of the AD9629. The SCLK pin and the CSB pin function
as inputs when using the SPI interface. The SDIO pin is
bidirectional, functioning as an input during write phases
and as an output during readback.
In applications that do not interface to the SPI control registers,
the SDIO/PDWN pin, the SCLK/DFS pin serve as standalone
CMOS-compatible control pins. When the device is powered up, it
is assumed that the user intends to use the pins as static control
lines for the power-down and output data format feature control.
In this mode, connect the CSB chip select to DRVDD, which
disables the serial port interface.
The SPI interface is flexible enough to be controlled by
either FPGAs or microcontrollers. One method for SPI
configuration is described in detail in the AN-812 Appli-
cation Note, Microcontroller-Based Serial Port Interface
(SPI) Boot Circuit.
Table 14. Mode Selection
External
Pin
SDIO/PDWN DRVDD
AGND (default)
DRVDD
AGND (default)
Voltage
Configuration
Chip power-down mode
Normal operation(default)
Twos complement enabled
Offset binary enabled
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK signal, the CSB signal, and the SDIO signal are typically
asynchronous to the ADC clock, noise from these signals can
degrade converter performance. If the on-board SPI bus is used for
other devices, it may be necessary to provide buffers between
this bus and the AD9629 to prevent these signals from transi-
tioning at the converter inputs during critical sampling periods.
SCLK/DFS
SPI ACCESSIBLE FEATURES
Table 15 provides a brief description of the general features that
are accessible via the SPI. These features are described in detail
in the AN-877 Application Note, Interfacing to High Speed ADCs
via SPI. The AD9629 part-specific features are described in
detail in Table 16.
SDIO/PDWN and SCLK/DFS serve a dual function when the
SPI interface is not being used. When the pins are strapped to
DRVDD or ground during device power-on, they are associated
with a specific function. The Digital Outputs section describes
the strappable functions supported on the AD9629.
Table 15. Features Accessible Using the SPI
Feature
Description
Modes
Allows the user to set either power-down mode or
standby mode
Offset Adjust Allows the user to digitally adjust the converter
offset
Test Mode
Allows the user to set test modes to have known
data on output bits
Output Mode Allows the user to set up outputs
Output Phase Allows the user to set the output clock polarity
Output Delay Allows the user to vary the DCO delay
Rev. 0 | Page 25 of 32
AD9629
MEMORY MAP
READING THE MEMORY MAP REGISTER TABLE
DEFAULT VALUES
Each row in the memory map register table (see Table 16)
contains eight bit locations. The memory map is roughly
divided into four sections: the chip configuration registers
(Address 0x00 to Address 0x02); the device transfer register
(Address 0xFF); the program registers, including setup, control,
and test (Address 0x08 to Address 0x2A); and the AD9629
specific customer SPI control register (Address 0x101).
After the AD9629 is reset, critical registers are loaded with default
values. The default values for the registers are given in the memory
map register table (see Table 16).
Logic Levels
An explanation of logic level terminology follows:
•
“Bit is set” is synonymous with “bit is set to Logic 1” or
“writing Logic 1 for the bit.”
Table 16 documents the default hexadecimal value for each
•
“Clear a bit” is synonymous with “bit is set to Logic 0” or
“writing Logic 0 for the bit.”
hexadecimal address shown. The column with the heading Bit 7
(MSB) is the start of the default hexadecimal value given. For
example, Address 0x2A, the OR/MODE select register, has a hexa-
decimal default value of 0x01. This means that in Address 0x2A,
Bits[7:1] = 0, and Bit 0 = 1. This setting is the default OR/MODE
setting. The default value results in the programmable external
MODE/OR pin (Pin 23) functioning as an out-of-range digital
output. For more information on this function and others, see the
AN-877 Application Note, Interfacing to High Speed ADCs via SPI.
This application note details the functions controlled by Register
0x00 to Register 0xFF. The remaining register, Register 0x101, is
documented in the Memory Map section that follows Table 16.
Transfer Register Map
Address 0x08 to Address 0x18 are shadowed. Writes to these
addresses do not affect part operation until a transfer command
is issued by writing 0x01 to Address 0xFF, setting the transfer bit.
This allows these registers to be updated internally and simulta-
neously when the transfer bit is set. The internal update takes
place when the transfer bit is set, and then the bit autoclears.
OPEN LOCATIONS
All address and bit locations that are not included in the SPI map
are not currently supported for this device. Unused bits of a valid
address location should be written with 0s. Writing to these loca-
tions is required only when part of an address location is open
(for example, Address 0x2A). If the entire address location is
open, it is omitted from the SPI map (for example, Address 0x13)
and should not be written.
Rev. 0 | Page 2ꢀ of 32
AD9629
MEMORY MAP REGISTER TABLE
All address and bit locations that are not included in Table 16 are not currently supported for this device.
Table 16.
Default
Value
(Hex)
Addr
Bit 7
(MSB)
Bit 0
(LSB)
(Hex) Register Name
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Comments
Chip Configuration Registers
0x00
SPI port
configuration
0
LSB
first
Soft
reset
1
1
Soft reset
LSB
first
0
0x18
The nibbles are
mirrored so that LSB
or MSB first mode
registers correctly,
regardless of shift
mode
0x01
0x02
Chip ID
8-bit chip ID, Bits[7:0]
AD9ꢀ29 = 0x70
Read
only
Unique chip ID used
to differentiate
devices; read only
Chip grade
Open
Speed grade ID, Bits[ꢀ:4]
(identify device variants of
chip ID)
Open
Read
only
Unique speed grade
ID used to
differentiate devices;
Read only
20 MSPS = 000
40 MSPS = 001
ꢀ5 MSPS = 010
80 MSPS = 011
Device Index and Transfer Register
0xFF Transfer Open
Open
Open
Open
Open
Open
Open
Open
Open
Open Transfer
0x00
0x00
Synchronously
transfers data from
the master shift
register to the slave
Program Registers
0x08
Modes
External External Pin 23
00 = chip run
01 = full power down
10 = standby
11 = chip wide digital
reset
Determines various
generic modes of
chip operation
Pin 23
mode
input
function when high
00 = full power
down
01 = standby
10 = normal
mode: output
disabled
enable
11 = normal
mode: output
enabled
0x0B
0x0D
Clock divide
Test mode
Open
Clock divider, Bits[2:0]
0x00
0x00
The divide ratio is
the value plus 1
Clock divide ratio
000 = divide-by-1
001 = divide-by-2
011 = divide-by-4
User test mode
00 = single
01 = alternate
10 = single once
11 = alternate
once
Reset PN Reset
long gen PN
short
Output test mode, Bits[3:0] (local)
0000 = off (default)
0001 = midscale short
0010 = positive FS
When set, the test
data is placed on the
output pins in place
of normal data
gen
0011 = negative FS
0100 = alternating checkerboard
0101 = PN 23 sequence
0110 = PN 9 sequence
0111 = 1/0 word toggle
1000 = user input
1001 = one/zero bit toggle
1010 = 1× sync
1011 = one bit high
1100 = mixed bit frequency
0x0E
0x10
BIST enable
Offset adjust
Open
Open
Open
Open
Open
BIST INIT
Open BIST enable
0x00
0x00
When Bit 0 is set, the
built-in self-test
function is initiated
8-bit device offset adjustment [7:0] (local)
Device offset trim
Offset adjust in LSBs from +127 to −128 (twos complement format)
Rev. 0 | Page 27 of 32
AD9629
Default
Value
(Hex)
Addr
Bit 7
(MSB)
Bit 0
(LSB)
(Hex) Register Name
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Comments
0x14
Output mode
00 = 3.3 V CMOS
10 = 1.8 V CMOS
Open
Output Open
disable
Output
invert
00 = offset binary
01 = twos
complement
0x00
Configures the
outputs and the
format of the data
10 = gray code
11 = offset binary
0x15
Output adjust
3.3 V DCO
1.8 V DCO
3.3 V data
1.8 V data
0x22
Determines CMOS
output drive
strength properties
drive strength
00 = 1 stripe
(default)
01 = 2 stripes
10 = 3 stripes
11 = 4 stripes
drive strength
00 = 1 stripe
01 = 2 stripes
10 = 3 stripes
(default)
drive strength
00 = 1 stripe
(default)
01 = 2 stripes
10 = 3 stripes
11 = 4 stripes
drive strength
00 = 1 stripe
01 = 2 stripes
10 = 3 stripes
(default)
11 = 4 stripes
11 = 4 stripes
0x1ꢀ
Output phase
DCO
Open
Open
Open
Open
Input clock phase adjust, Bits[2:0]
(Value is number of input clock
cycles of phase delay)
0x00
On devices that
utilize global clock
divide, determines
which phase of the
divider output is
used to supply the
output clock;
Output
polarity
0 =
normal
1 =
000 = no delay
001 = 1 input clock cycle
010 = 2 input clock cycles
011 = 3 input clock cycles
100 = 4 input clock cycles
101 = 5 input clock cycles
110 = ꢀ input clock cycles
111 = 7 input clock cycles
inverted
internal latching is
unaffected
0x17
Output delay
Enable
DCO
delay
Open
Enable
data
delay
Open
DCO/data delay, Bits[2:0]
000 = 0.5ꢀ ns
001 = 1.12 ns
010 = 1.ꢀ8 ns
011 = 2.24 ns
100 = 2.80 ns
101 = 3.3ꢀ ns
110 = 3.92 ns
111 = 4.48 ns
0x00
Sets the fine output
delay of the output
clock, but does not
change internal
timing
0x19
0x1A
0x1B
0x1C
0x24
USER_PATT1_LSB
B7
Bꢀ
B5
B4
B3
B2
B1
B9
B1
B9
B0
B8
B0
B8
0x00
0x00
0x00
0x00
0x00
User-defined
pattern, 1 LSB
USER_PATT1_MSB B15
USER_PATT2_LSB B7
B14
Bꢀ
B13
B5
B12
B4
B11
B3
B10
B2
User-defined
pattern, 1 MSB
User-defined
pattern, 2 LSB
USER_PATT2_MSB B15
BIST signature LSB
B14
B13
B12
B11
B10
User-defined
pattern, 2 MSB
BIST signature, Bits[7:0]
Least significant byte
of BIST signature,
read only
0x2A
OR/MODE select
Open
Open
Open
Open
Open
Open
Open
Open
Open
Open
Open
0 =
0x01
Selects I/O
MODE
1 = OR
(default)
functionality in
conjunction w/
Address 0x08 for
MODE (input) or OR
(output) on external
Pin 23
1.1. AD9ꢀ29 Specific Customer SPI Control
0x101 USR2
1
Enable
GCLK
detect
Run GCLK
Disable
SDIO
pull-
0x88
Enables internal
oscillator for clock
rates of <5 MHz
down
Rev. 0 | Page 28 of 32
AD9629
Bit 2—Run GCLK
MEMORY MAP REGISTER DESCRIPTIONS
This bit enables the GCLK oscillator. For some applications
with encode rates below 10 MSPS, it may be preferable to set
this bit high to supersede the GCLK detector.
For additional information about functions controlled in
Register 0x00 to Register 0xFF, see the AN-877 Application
Note, Interfacing to High Speed ADCs via SPI.
Bit 0—Disable SDIO Pull-Down
USR2 (Register 0x101)
This bit can be set high to disable the internal 30 kꢁ pull-down
on the SDIO pin, which can be used to limit the loading when
many devices are connected to the SPI bus.
Bit 3—Enable GCLK Detect
Normally set high, this bit enables a circuit that detects encode
rates below about 5 MSPS. When a low encode rate is detected,
an internal oscillator, GCLK, is enabled ensuring the proper
operation of several circuits. If set low the detector is disabled.
Rev. 0 | Page 29 of 32
AD9629
APPLICATIONS INFORMATION
To maximize the coverage and adhesion between the ADC and
the PCB, a silkscreen should be overlaid to partition the continuous
plane on the PCB into several uniform sections. This provides
several tie points between the ADC and the PCB during the reflow
process. Using one continuous plane with no partitions guarantees
only one tie point between the ADC and the PCB. For detailed
information about packaging and PCB layout of chip scale
packages, see the AN-772 Application Note, A Design and
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP), at www.analog.com.
DESIGN GUIDELINES
Before starting design and layout of the AD9629 as a system,
it is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements needed for certain pins.
Power and Ground Recommendations
When connecting power to the AD9629, it is strongly recom-
mended that two separate supplies be used. Use one 1.8 V supply
for analog (AVDD); use a separate 1.8 V to 3.3 V supply for the
digital output supply (DRVDD). If a common 1.8 V AVDD and
DRVDD supply must be used, the AVDD and DRVDD domains
must be isolated with a ferrite bead or filter choke and separate
decoupling capacitors. Several different decoupling capacitors
can be used to cover both high and low frequencies. Locate
these capacitors close to the point of entry at the PCB level
and close to the pins of the part, with minimal trace length.
Encode Clock
For optimum dynamic performance a low jitter encode clock
source with a 50% duty cycle 5% should be used to clock the
AD9629.
VCM
The VCM pin should be decoupled to ground with a 0.1 ꢀF
capacitor, as shown in Figure 38.
A single PCB ground plane should be sufficient when using the
AD9629. With proper decoupling and smart partitioning of the
PCB analog, digital, and clock sections, optimum performance
is easily achieved.
RBIAS
The AD9629 requires that a 10 kΩ resistor be placed between
the RBIAS pin and ground. This resistor sets the master current
reference of the ADC core and should have at least a 1% tolerance.
Exposed Paddle Thermal Heat Sink Recommendations
The exposed paddle (Pin 0) is the only ground connection for
the AD9629; therefore, it must be connected to analog ground
(AGND) on the customer’s PCB. To achieve the best electrical
and thermal performance, mate an exposed (no solder mask)
continuous copper plane on the PCB to the AD9629 exposed
paddle, Pin 0.
Reference Decoupling
Externally decouple the VREF pin to ground with a low ESR,
1.0 ꢀF capacitor in parallel with a low ESR, 0.1 ꢀF ceramic
capacitor.
SPI Port
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK, CSB, and SDIO signals are typically asynchronous to the
ADC clock, noise from these signals can degrade converter
performance. If the on-board SPI bus is used for other devices,
it may be necessary to provide buffers between this bus and the
AD9629 to keep these signals from transitioning at the converter
inputs during critical sampling periods.
The copper plane should have several vias to achieve the
lowest possible resistive thermal path for heat dissipation to
flow through the bottom of the PCB. Fill or plug these vias
with nonconductive epoxy.
Rev. 0 | Page 30 of 32
AD9629
OUTLINE DIMENSIONS
5.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
25
24
32
1
PIN 1
INDICATOR
0.50
BSC
EXPOSED
PAD
(BOTTOM VIEW)
3.65
3.50 SQ
3.35
TOP
VIEW
4.75
BSC SQ
0.50
0.40
0.30
17
16
8
9
0.25 MIN
0.80 MAX
0.65 TYP
3.50 REF
12° MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
1.00
0.85
0.80
0.30
0.23
0.18
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 55. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad (CP-32-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Package Option
CP-32-4
CP-32-4
CP-32-4
CP-32-4
CP-32-4
CP-32-4
CP-32-4
CP-32-4
AD9ꢀ29BCPZ-801, 2
AD9ꢀ29BCPZRL7-801, 2
AD9ꢀ29BCPZ-ꢀ51, 2
AD9ꢀ29BCPZRL7-ꢀ51, 2
AD9ꢀ29BCPZ-401, 2
AD9ꢀ29BCPZRL7-401, 2
AD9ꢀ29BCPZ-201, 2
AD9ꢀ29BCPZRL7-201, 2
AD9ꢀ29-80EBZ1
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
AD9ꢀ29-ꢀ5EBZ1
Evaluation Board
Evaluation Board
Evaluation Board
AD9ꢀ29-40EBZ1
AD9ꢀ29-20EBZ1
1 Z = RoHS Compliant Part.
2 The exposed paddle (Pin 0) is the only GND connection on the chip and must be connected to the PCB AGND.
Rev. 0 | Page 31 of 32
AD9629
NOTES
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08540-0-10/09(0)
Rev. 0 | Page 32 of 32
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