AD7396_15 [ADI]
3 V, Parallel Input Dual 12-Bit /10-Bit DACs;型号: | AD7396_15 |
厂家: | ADI |
描述: | 3 V, Parallel Input Dual 12-Bit /10-Bit DACs |
文件: | 总12页 (文件大小:229K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
3 V, Parallel Input
Dual 12-Bit/10-Bit DACs
a
AD7396/AD7397
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Micropower: 100 A/DAC
0.1 A Typical Power Shutdown
Single Supply +2.7 V to +5.5 V Operation
Compact 1.1 mm Height TSSOP 24-Lead Package
AD7396: 12-Bit Resolution
AD7397: 10-Bit Resolution
0.9 LSB Differential Nonlinearity Error
V
V
DD
AD7396
12
DACA
REGISTER
12-BIT
DACA
LDA
OUTA
CS
INPUTA
REGISTER
A/B
12
1
V
DATA
REF
APPLICATIONS
INPUTB
REGISTER
Automotive Output Span Voltage
Portable Communications
Digitally Controlled Calibration
PC Peripherals
12
DACB
REGISTER
12-BIT
DACB
LDB
V
OUTB
AGND
DGND
RS
SHDN
GENERAL DESCRIPTION
Both parts are offered in the same pinout, allowing users to
The AD7396/AD7397 series of dual, 12-bit and 10-bit voltage-
output digital-to-analog converters are designed to operate from
a single +3 V supply. Built using a CBCMOS process, these
monolithic DACs offer the user low cost and ease of use in
single supply +3 V systems. Operation is guaranteed over the
supply voltage range of +2.7 V to +5.5 V, making this device
ideal for battery operated applications.
select the amount of resolution appropriate for their applications
without circuit card changes.
The AD7396/AD7397 are specified for operation over the ex-
tended industrial (–40°C to +85°C) temperature range. The
AD7397AR is specified for the –40°C to +125°C automotive
temperature range. AD7396/AD7397s are available in plastic
DIP, and 24-lead SOIC packages. The AD7397ARU is avail-
able for ultracompact applications in a thin 1.1 mm height
TSSOP 24-lead package.
A 12-bit wide data latch loads with a 45 ns write time allowing
interface to fast processors without wait states. The double
buffered input structure allows the user to load the input
registers one at a time, then a single load strobe tied to both
LDA+LDB inputs will simultaneously update both DAC out-
puts. LDA and LDB can also be independently activated to
immediately update their respective DAC registers. An address
input (A/B) decodes DACA or DACB when the chip select CS
input is strobed. Additionally, an asynchronous RS input sets
the output to zero-scale at power on or upon user demand.
Power shutdown to submicroamp levels is directly controlled by
the active low SHDN pin. While in the power shutdown state
register data can still be changed even though the output buffer
is in an open circuit state. Upon return to the normal operating
state the latest data loaded in the DAC register will establish the
output voltage.
1.0
V
V
= +3V
DD
0.8
0.6
0.4
= +2.5V
REF
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–1.0
T
= +25؇C, +85؇C, –55؇C
SUPERIMPOSED
A
0
512
1024 1536
2048
2560 3072
3584 4096
CODE – Decimal
Figure 1. DNL vs. Digital Code at Temperature
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
World Wide Web Site: http://www.analog.com
© Analog Devices, Inc., 1998
AD7396/AD7397–SPECIFICATIONS
AD7396 12-BIT
(@ VREF IN = +2.5 V, –40؇C < TA < +85؇C, unless otherwise noted)
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Conditions
+3 V ؎ 10% +5 V ؎ 10% Units
STATIC PERFORMANCE
Resolution1
N
12
12
Bits
Relative Accuracy2
INL
INL
DNL
DNL
VZSE
VZSE
VFSE
VFSE
TCVFS
TA = +25°C
±1.75
±2.0
±0.9
±1
4.0
8.0
±1.75
±2.0
±0.9
±1
4.0
8.0
±8
±20
–45
LSB max
LSB max
LSB max
LSB max
mV max
mV max
mV max
mV max
ppm/°C typ
Relative Accuracy2
TA = –40°C, +85°C
TA = +25°C, Monotonic
Monotonic
Data = 000H, TA = +25°C, +85°C
Data = 000H, TA = –40°C
Differential Nonlinearity2
Differential Nonlinearity2
Zero-Scale Error
Zero-Scale Error
Full-Scale Voltage Error
Full-Scale Voltage Error
Full-Scale Tempco3
TA = +25°C, +85°C, Data = FFFH ±8
TA = –40°C, Data = FFFH
±20
–45
REFERENCE INPUT
V
REF Range
VREF
RREF
CREF
0/VDD
2.5
5
0/VDD
2.5
5
V min/max
MΩ typ4
pF typ
Input Resistance
Input Capacitance3
ANALOG OUTPUT
Output Current (Source)
Output Current (Sink)
Capacitive Load3
IOUT
IOUT
CL
Data = 800H, ∆VOUT = 5 LSB
Data = 800H, ∆VOUT = 5 LSB
No Oscillation
1
3
100
1
3
100
mA typ
mA typ
pF typ
LOGIC INPUTS
Logic Input Low Voltage
Logic Input High Voltage
Input Leakage Current
Input Capacitance3
VIL
VIH
IIL
0.5
VDD – 0.6
10
10
0.8
4.0
10
V max
V min
µA max
CIL
10
pF max
INTERFACE TIMING3, 5
Chip Select Write Width
DAC Select Setup
DAC Select Hold
Data Setup
Data Hold
Load Setup
Load Hold
Load Pulsewidth
tCS
tAS
tAH
tDS
tDH
45
30
0
30
20
20
10
30
40
35
15
0
15
10
20
10
30
30
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
tLS
tLH
tLDW
tRSW
Reset Pulsewidth
AC CHARACTERISTICS
Output Slew Rate
Settling Time6
SR
tS
Data = 000H to FFFH to 000H
To ±0.1% of Full Scale
0.05
70
0.05
60
V/µs typ
µs typ
Shutdown Recovery Time
DAC Glitch
Digital Feedthrough
Feedthrough
tSDR
Q
Q
90
65
15
80
65
15
µs typ
nV/s typ
nV/s typ
Code 7FFH to 800H to 7FFH
VOUT/VREF
VREF = 1.5 VDC +1 V p-p,
Data = 000H, f = 100 kHz
–63
–63
dB typ
SUPPLY CHARACTERISTICS
Power Supply Range
Positive Supply Current
Shutdown Supply Current
Power Dissipation
VDD RANGE
IDD
IDD_SD
PDISS
DNL < ±1 LSB
2.7/5.5
125/200
0.1/1.5
600
2.7/5.5
125/200
0.1/1.5
1000
V min/max
µA typ/max
µA typ/max
µW max
VIL = 0 V, No Load
SHDN = 0, VIL = 0 V, No Load
VIL = 0 V, No Load
∆VDD = ±5%
Power Supply Sensitivity
PSS
0.006
0.006
%/% max
NOTES
1One LSB = VREF/4096 V for the 12-bit AD7396.
2The first two codes (000H, 001H) are excluded from the linearity error measurement.
3These parameters are guaranteed by design and not subject to production testing.
4Typicals represent average readings measured at +25°C.
5All input control signals are specified with tR = tF = 2 ns (10% to 90% of +3 V) and timed from a voltage level of +1.6 V.
6The settling time specification does not apply for negative going transitions within the last 3 LSBs of ground.
Specifications subject to change without notice.
–2–
REV. 0
AD7396/AD7397
AD7397 10-BIT
(@ VREF IN = +2.5 V, –40؇C < TA < +85؇C, unless otherwise noted)
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Conditions
+3 V ؎ 10% +5 V ؎ 10% Units
STATIC PERFORMANCE
Resolution1
N
10
10
Bits
Relative Accuracy2
INL
INL
DNL
VZSE
VFSE
VFSE
TCVFS
TA = +25°C
TA = –40°C, +85°C, +125°C
Monotonic
Data = 000H
±1.75
±2.0
±1
±1.75
±2.0
±1
LSB max
LSB max
LSB max
mV max
mV max
mV max
ppm/°C typ
Relative Accuracy2
Differential Nonlinearity2
Zero-Scale Error
9.0
9.0
Full-Scale Voltage Error
Full-Scale Voltage Error
Full-Scale Tempco3
TA = +25°C, +85°C, +125°C, Data = 3FFH ±42
±42
±48
–45
TA = –40°C, Data = 3FFH
±48
–45
REFERENCE INPUT
V
REF Range
VREF
RREF
CREF
0/VDD
2.5
5
0/VDD
2.5
5
V min/max
MΩ typ4
pF typ
Input Resistance
Input Capacitance3
ANALOG OUTPUT
Output Current (Source)
Output Current (Sink)
Capacitive Load3
IOUT
IOUT
CL
Data = 200H, ∆VOUT = 5 LSB
Data = 200H, ∆VOUT = 5 LSB
No Oscillation
1
3
100
1
3
100
mA typ
mA typ
pF typ
LOGIC INPUTS
Logic Input Low Voltage
Logic Input High Voltage
Input Leakage Current
Input Capacitance3
VIL
VIH
IIL
0.5
VDD – 0.6
10
10
0.8
4.0
10
V max
V min
µA max
CIL
10
pF max
INTERFACE TIMING3, 5
Chip Select Write Width
DAC Select Setup
DAC Select Hold
Data Setup
Data Hold
Load Setup
Load Hold
Load Pulsewidth
tCS
tAS
tAH
tDS
tDH
45
30
0
30
20
20
10
30
40
35
15
0
15
10
20
10
30
30
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
tLS
tLH
tLDW
tRSW
Reset Pulsewidth
AC CHARACTERISTICS
Output Slew Rate
Settling Time6
SR
tS
Data = 000H to 3FFH to 000H
To ±0.1% of Full Scale
0.05
70
0.05
60
V/µs typ
µs typ
Shutdown Recovery Time
DAC Glitch
Digital Feedthrough
Feedthrough
tSDR
Q
Q
90
65
15
80
65
15
µs typ
nV/s typ
nV/s typ
Code 7FFH to 800H to 7FFH
VOUT/VREF VREF = 1.5 VDC +1 V p-p,
Data = 000H, f = 100 kHz
–63
–63
dB typ
SUPPLY CHARACTERISTICS
Power Supply Range
Positive Supply Current
Shutdown Supply Current
Power Dissipation
VDD RANGE DNL < ±1 LSB
2.7/5.5
125/200
0.1/1.5
600
2.7/5.5
125/200
0.1/1.5
1000
V min/max
µA typ/max
µA typ/max
µW max
IDD
VIL = 0 V, No Load
SHDN = 0, VIL = 0 V, No Load
VIL = 0 V, No Load
∆VDD = ±5%
IDD_SD
PDISS
PSS
Power Supply Sensitivity
0.006
0.006
%/% max
NOTES
1One LSB = VREF/4096 V for the 10-bit AD7397.
2The first two codes (000H, 001H) are excluded from the linearity error measurement.
3These parameters are guaranteed by design and not subject to production testing.
4Typicals represent average readings measured at +25°C.
5All input control signals are specified with tR = tF = 2 ns (10% to 90% of +3 V) and timed from a voltage level of +1.6 V.
6The settling time specification does not apply for negative going transitions within the last 3 LSBs of ground.
Specifications subject to change without notice.
REV. 0
–3–
AD7396/AD7397
tCSW
CS
tAS
tAH
1 OF 12
LATCHES
B REGISTER
A/B
OF THE 2 INPUT
REGISTERS
tDS
tDH
D0–D11
DBx
CS
TO DAC
REGISTERS
tLS
tLDW
tLH
LDA, LDB
tRSW
A/B
RS
RS
tS
tS
1 LSB
ERROR BAND
V
OUT
Figure 2. Timing Diagram
Figure 3. Digital Control Logic
Table I. Control Logic Truth
CS
A/B
LDA
LDB
RS
SHDN
Input Register
DAC Register
L
L
L
L
H
H
X
H
L
H
L
H
X
X
X
X
H
H
H
L
L
^
H
H
L
H
L
^
H
H
H
H
H
H
L
X
X
X
X
X
X
X
X
Write to B
Write to A
Write to B
Write to A
Latched
Latched
Reset to Zero Scale
Latched to Zero
Latched with Previous Data
Latched with Previous Data
B Transparent
A Transparent
A and B Transparent
Latched with New Data from Input REG
Reset to Zero Scale
Latched to Zero
X
X
X
X
^
^Denotes positive edge. The SHDN pin has no effect on the digital interface data loading; however, while in the SHDN state (SHDN = 0) the output amplifiers VOUTA
and VOUTB exhibit an open circuit condition. Note, the LDx inputs are level-sensitive, the respective DAC registers are in a transparent state when LDx = “0.”
–4–
REV. 0
AD7396/AD7397
ABSOLUTE MAXIMUM RATINGS*
Maximum Junction Temperature (TJ max) . . . . . . . . .+150°C
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
AD7397AN, AD7397AR Only . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
V
OUT to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +2 V
IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . +50 mA
Package Power Dissipation . . . . . . . . . . . . . (TJ max – TA)/θJA
Thermal Resistance θJA
24-Lead Plastic DIP Package (N-24) . . . . . . . . . . +63°C/W
24-Lead SOIC Package (R-24) . . . . . . . . . . . . . . . +70°C/W
24-Lead Thin Shrink Surface Mount (RU-24) . . +143°C/W
N-24 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . .+300°C
R-24 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . . .+215°C
RU-24 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . .+224°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Res
(LSB)
Temperature
Ranges
Package
Descriptions
Package
Options
Model
AD7396AN
AD7396AR
12
12
–40°C to +85°C
–40°C to +85°C
24-Lead P-DIP
24-Lead SOIC
N-24
R-24
AD7397AN
AD7397AR
AD7397ARU
10
10
10
–40°C to +125°C
–40°C to +125°C
–40°C to +85°C
24-Lead P-DIP
24-Lead SOIC
24-Lead Thin Shrink Small Outline Package (TSSOP)
N-24
R-24
RU-24
The AD7396/AD7397 contains 1365 transistors. The die size measures 89 mil × 106 mil = 9434 sq mil.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7396/AD7397 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. 0
–5–
AD7396/AD7397
PIN FUNCTION DESCRIPTIONS
Pin No.
Name
1
2
3
4
VOUTA
AGND
DGND
LDA
DAC A Voltage Output.
Analog Ground.
Digital Ground.
Load DAC A Register Strobe. Transfers input register data to the DAC A register. Active
low inputs, Level sensitive latch. May be connected together with LDB to double-buffer load
both DAC registers simultaneously.
5
SHDN
Power Shutdown Active Low Input. DAC register contents are saved as long as power stays
on the VDD pin.
6
RS
Resets Input and DAC Register to Zero Condition. Asynchronous active low input.
Twelve Parallel Input Data Bits. D11 = MSB Pin 18, D0 = LSB Pin 7, AD7396.
No Connect Pins 7 and 8 On the AD7397 Only.
Ten Parallel Input Data Bits. D9 = MSB Pin 18, D0 = LSB Pin 9, AD7397 Only.
Chip Select Latch Enable, Active Low.
7–18
7, 8
9–18
19
D0–D11
NC
D0–D9
CS
20
A/B
DAC Input Register Address Select DACA = 1 or DACB = 0.
21
LDB
Load DAC B Register Strobe. Transfers input register data to the DAC B register. Active low
inputs, Level sensitive latch. May be connected together with LDA to double-buffer load
both DAC registers simultaneously.
22
23
24
VDD
VREF
VOUTB
Positive Power Supply Input. Specified range of operation +2.7 V to +5.5 V.
DAC Reference Input Pin. Establishes DAC full-scale voltage.
DAC B Voltage Output.
PIN CONFIGURATIONS
V
1
2
24
23
22
21
20
19
18
17
V
V
V
V
1
2
24
23
22
21
20
19
18
17
16
15
14
13
V
V
V
OUTA
OUTB
REF
DD
OUTA
OUTB
REF
DD
AGND
DGND
AGND
DGND
3
3
4
4
LDA
SHDN
RS
LDB
A/B
CS
LDA
SHDN
RS
LDB
A/B
CS
5
5
AD7397
TOP VIEW
(Not to Scale)
AD7396
TOP VIEW
(Not to Scale)
6
6
7
7
NC
D9
D0
D11
D10
D9
8
8
NC
D8
D1
D0
9
16 D7
9
D2
10
11
15
14
10
11
12
D1
D6
D5
D3
D8
D2
D4
D7
D3 12
13 D4
D5
D6
NC = NO CONNECT
–6–
REV. 0
Typical Performance Characteristics–AD7396/AD7397
30
1.0
1.5
1.0
V
V
= +3V
SS = 200 UNITS
DD
AD7396
V
V
= +2.7V
AD7397
DD
AD7397
0.8
T
= +25؇C
= +2.5V
A
REF
= +2.5V
REF
T
= –55؇C
V
V
= +2.7V
A
DD
0.6
0.4
0.2
= +2.5V
REF
20
0.5
0.0
T
= –55؇C
A
0.0
–0.2
–0.4
–0.6
–0.5
–1.0
10
0
T
= +25؇C, +85؇C
A
T
A
= +25؇C, +85؇C
–0.8
–1.0
–1.5
0
0
–5
5
10
128 256 384 512 640 768 896 1024
CODE – Decimal
0
512 1024 1536 2048 2560 3072 3584 4096
CODE – Decimal
TOTAL UNADJUSTED ERROR
HISTOGRAM – LSB
Figure 4. AD7396 INL vs. Code and
Temperature
Figure 5. AD7397 INL vs. Code and
Temperature
Figure 6. AD7397 TUE Histogram
100
1.0
60
SS = 200 UNITS
AD7396
AD7397
SS = 200 UNITS
V
V
= +2.7V
DD
AD7397
V
V
= +2.7V
0.8
DD
V
V
T
= +2.7V
DD
= +2.5V
REF
= +2.5V
REF
= +2.5V
REF
80
60
40
20
0
0.6
0.4
T
= –40؇C TO +85؇C
A
= –40؇C TO +85؇C
A
40
20
0
0.2
0.0
–0.2
–0.4
–0.6
–0.8
T
= +25؇C, +85؇C, –55؇C
SUPERIMPOSED
A
–1.0
0
–70
–60
–50
–40
–30
128 256 384 512 640 768 896 1024
CODE – Decimal
–55
–50
–45
–40
–35
–30
FULL-SCALE TEMPCO – ppm/؇C
FULL-SCALE OUTPUT TEMPCO
HISTOGRAM – ppm/؇C
Figure 7. AD7397 DNL vs. Code and
Temperature
Figure 8. AD7396 Full-Scale Tempco
Histogram
Figure 9. AD7397 Full-Scale Tempco
Histogram
1.5
1.0
0.5
0
40
20
40
20
0
10
V
V
= +5V
DD
AD7396
= +2.5V
REF
T
= +25؇C
A
8
6
4
2
0
0
V
= +5V
DD
= +25؇C
T
A
–0.5
–1.0
–1.5
CODE = HALF SCALE
–20
–40
–20
–40
V
= +5V
= +25؇C
DD
T
A
FSE (LSB) = FSE (V)
؋
4096/V (V)
REF
0
1
2
3
4
5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1
10
100
1k
10k
100k
V – V
REF
V
– Volts
FREQUENCY – Hz
REF
Figure 10. INL Error vs. Reference
Voltage
Figure 11. Full-Scale Error vs. Refer-
ence Voltage
Figure 12. Output Noise Voltage
Density vs. Frequency
REV. 0
–7–
AD7396/AD7397
0
1.262
1.257
145
140
V
V
T
= +5V
V
T
= +3V
= +25؇C
DD
DD
–5
= +2.5V
REF
A
= +25 C
V
= 0V TO +3V
–10
A
IN
135
130
CODE = 800 TO 7FF
H
5mV/DIV
V
= +3V
H
DD
CODE = FULL SCALE
–15
–20
–25
–30
–35
–40
–45
–50
V
= +3V TO 0V
IN
1.252
1.247
1.242
1.237
125
120
115
110
105
100
100
1k
10k
100k
1M
0
0.5
1
1.5
2
2.5
3
TIME – 2s/DIV
LOGIC INPUT – V (Volts)
FREQUENCY – Hz
IN
Figure 13. Reference Multiplying
Gain vs. Frequency
Figure 14. Midscale Transition
Performance
Figure 15. IDD vs. Logic Input Voltage
35
45
5.0
4.5
T
= +25؇C
V
= +2.5V
REF
= +25؇C
V
T
= +2.5V
= +25؇C
A
REF
40
35
30
25
20
T
A
A
30
25
20
15
10
V
= +5V
DD
4.0
3.5
V
= +5V
DD
V
= +3V
DD
V
FROM
LOGIC
LOW TO HIGH
3.0
2.5
V
= +3V
DD
15
10
5
2.0
1.5
1.0
V
FROM
LOGIC
5
0
HIGH TO LOW
0
0
2
3
4
5
6
7
–120 –100 –80
–60
–40
–20
0
2
4
6
8
10
12
V
– V
⌬V
– mV
⌬V
– mV
DD
OUT
OUT
Figure 16. Logic Threshold Voltage
vs. VDD
Figure 17. IOUT Source Current vs.
∆ VOUT
Figure 18. IOUT Sink Current vs.
∆ VOUT
1000
170
200
V
V
= +2.5V
= +5V
V
= +2.5V
T
= +25؇C
REF
REF
A
180
160
140
120
100
80
160
150
140
130
120
DD
V
= +3.6V, V
= +2.4V
SHDN = 0V
DD
LOGIC
V
= +5V
100
10
1
DD
V
= +5V, V
= +5V
DD
LOGIC
V
= +3V
DD
110
100
90
60
V
= +3V, V
= +3V
DD
LOGIC
40
20
80
0
0
–40 –20
20 40 60 80 100 120 140
–40 –20
0
20 40 60 80 100 120 140
0
1
2
3
4
5
TEMPERATURE – ؇C
TEMPERATURE – ؇C
V
– Volts
REF
Figure 21. Shutdown Current vs.
Temperature
Figure 19. IDD vs. Temperature
Figure 20. IDD vs. Reference Voltage
–8–
REV. 0
AD7396/AD7397
1400
1200
1000
800
600
400
200
0
80
70
60
50
1.0
0.9
AD7396
AD7396
V
= +5V, ؎5%
DD
SAMPLE SIZE = 77
= +2.5V
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
A: V = +2.7V, CODE = 555
DD
V
H
REF
B: V = +2.7V, CODE = 3FF
DD
H
H
C: V = +5.5V, CODE = 155
DD
D: V = +5.5V, CODE = 3FF
DD
H
40
30
20
10
0
V
= +3V, ؎5%
CODE = FFF
DD
H
D
C
CODE = 000
H
A
B
0
100
200
300
400
500
600
1k
10k
100k
1M
10M
1
10
100
1k
10k
HOURS OF OPERATION AT +150؇C
DIGITAL INPUT FREQUENCY – Hz
FREQUENCY – Hz
Figure 22. IDD vs. Digital Input
Frequency
Figure 23. PSRR vs. Frequency
Figure 24. Long-Term Drift Acceler-
ated by Burn-In
V
OUT = VREF × D/2N
(1)
OPERATION
The AD7396 and AD7397 are a set of pin compatible, 12-bit
and 10-bit digital-to-analog converters. These single-supply
operation devices consume less than 200 µA of current while
operating from power supplies in the +2.7 V to +5.5 V range,
making them ideal for battery operated applications. They
contain a voltage-switched, 12-bit/10-bit, digital-to-analog
converter, rail-to-rail output op amps, and a parallel-input
DAC register. The external reference input has constant
2.5 MΩ input resistance independent of the digital code
setting of the DAC. In addition, the reference input can be tied
to the same supply voltage as VDD resulting in a maximum
output voltage span of 0 to VDD. The parallel data interface
consists of 12 data bits, DB0–DB11, for the AD7396, 10 data
bits, DB0–DB9, for the AD7397, and a CS write strobe. An RS
pin is available to reset the DAC register to zero scale. This
function is useful for power-on reset or system failure recovery
to a known state. Additional power savings are accomplished by
activating the SHDN pin resulting in a 1.5 µA maximum con-
sumption sleep mode. As long as the supply voltage, remains
data will be retained in the DAC and input register to supply
the DAC output when the part is taken out of shutdown.
where D is the decimal data word loaded into the DAC register,
and N is the number of bits of DAC resolution. In the case of
the 10-bit AD7397 using a 2.5 V reference, Equation 1 simpli-
fies to:
V
OUT = 2.5 × D/1024
(2)
Using Equation 2, the nominal midscale voltage at VOUT is
1.25 V for D = 512; full-scale voltage is 2.497 V. The LSB step
size is = 2.5 × 1/1024 = 0.0024 V.
For the 12-bit AD7396 operating from a 5.0 V reference equa-
tion [1] becomes:
V
OUT = 5.0 × D/4096
(3)
Using Equation 3, the AD7396 provides a nominal midscale
voltage of 2.50 V for D = 2048, and a full-scale output of
4.998 V. The LSB step size is = 5.0 × 1/4096 = 0.0012 V.
AMPLIFIER SECTION
The internal DAC’s output is buffered by a low power con-
sumption precision amplifier. The op amp has a 60 µs typical
settling time to 0.1% of full scale. There are slight differences in
settling time for negative slewing signals versus positive. Also,
negative transition settling time to within the last 6 LSBs of zero
volts has an extended settling time. The rail-to-rail output stage
of this amplifier has been designed to provide precision perfor-
mance while operating near either power supply. Figure 26
shows an equivalent output schematic of the rail-to-rail-ampli-
fier with its N-channel pull-down FETs that will pull an output
load directly to GND. The output sourcing current is provided
by a P-channel pull-up device that can source current to GND
terminated loads.
V
V
DD
AD7396
12
DACA
REGISTER
12-BIT
DACA
LDA
OUTA
CS
INPUTA
REGISTER
A/B
12
1
V
DATA
REF
INPUTB
REGISTER
V
12
DD
DACB
REGISTER
12-BIT
DACB
LDB
V
OUTB
AGND
P-ch
DGND
RS
SHDN
V
OUT
Figure 25. Functional Block Diagram
N-ch
D/A CONVERTER SECTION
The voltage switched R-2R DAC generates an output voltage
dependent on the external reference voltage connected to the
REF pin according to the following equation:
AGND
Figure 26. Equivalent Analog Output Circuit
REV. 0
–9–
AD7396/AD7397
+2.7V TO +5.5V
The rail-to-rail output stage provides ±1 mA of output current.
The N-channel output pull-down MOSFET shown in Figure 26
has a 35 Ω ON resistance, which sets the sink current capability
near ground. In addition to resistive load driving capability, the
amplifier has also been carefully designed and characterized for
up to 100 pF capacitive load driving capability.
+
C
*
0.1F
10F
REF
V
DD
CS
AD7396
OR
AD7397
A/B
V
V
OUTA
LDA
LDB
OUTB
DATA
REFERENCE INPUT
DGND AGND
The reference input terminal has a constant input resistance
independent of digital code, which results in reduced glitches on
the external reference voltage source. The high 2.5 MΩ input
resistance minimizes power dissipation within the AD7396/
AD7397 D/A converters. The VREF input accepts input voltages
ranging from ground to the positive-supply voltage VDD. One of
the simplest applications, which saves an external reference voltage
source, is connection of the VREF terminal to the positive VDD
supply. This connection results in a rail-to-rail voltage output
span maximizing the programmed range. The reference input
will accept AC signals as long as they are kept within the supply
voltage range, 0 < VREF IN < VDD. The reference bandwidth
and integral nonlinearity error performance are plotted in the
Typical Performance Characteristics section, see Figures 10 and
13. The ratiometric reference feature makes the AD7396/AD7397
an ideal companion to ratiometric analog-to-digital converters
such as the AD7896.
*
OPTIONAL EXTERNAL
REFERENCE BYPASS
Figure 27. Recommended Supply Bypassing
INPUT LOGIC LEVELS
All digital inputs are protected with a Zener-type ESD protec-
tion structure (Figure 28) that allows logic input voltages to
exceed the VDD supply voltage. This feature can be useful if the
user is driving one or more of the digital inputs with a 5 V CMOS
logic input-voltage level while operating the AD7396/AD7397
on a +3 V power supply. If this mode of interface is used, make
sure that the VOL of the 5 V CMOS meets the VIL input require-
ment of the AD7396/AD7397 operating at 3 V. See Figure 16
for a graph for digital logic input threshold versus operating VDD
supply voltage.
V
DD
LOGIC
IN
POWER SUPPLY
The very low power consumption of the AD7396/AD7397 is a
direct result of a circuit design optimizing the use of a CBCMOS
process. By using the low power characteristics of CMOS for
the logic, and the low noise, tight matching of the complemen-
tary bipolar transistors, excellent analog accuracy is achieved.
One advantage of the rail-to-rail output amplifiers used in the
AD7396/AD7397 is the wide range of usable supply voltage.
The part is fully specified and tested for operation from +2.7 V
to +5.5 V.
GND
Figure 28. Equivalent Digital Input ESD Protection
In order to minimize power dissipation from input-logic levels
that are near the VIH and VIL logic input voltage specifications, a
Schmitt trigger design was used that minimizes the input-buffer
current consumption compared to traditional CMOS input
stages. Figure 15 shows a plot of incremental input voltage
versus supply current showing that negligible current consump-
tion takes place when logic levels are in their quiescent state.
The normal crossover current still occurs during logic transi-
tions. A secondary advantage of this Schmitt trigger is the pre-
vention of false triggers that would occur with slow moving logic
transitions when a standard CMOS logic interface or opto-
isolators are used. The logic inputs DB11–DB0, A/B CS, RS,
SHDN all contain Schmitt trigger circuits.
POWER SUPPLY BYPASSING AND GROUNDING
Precision analog products such as the AD7396/AD7397 require
a well filtered power source. Since the AD7396/AD7397 oper-
ates from a single +3 V to +5 V supply, it seems convenient to
simply tap into the digital logic power supply. Unfortunately,
the logic supply is often a switch-mode design, which generates
noise in the 20 kHz to 1 MHz range. In addition, fast logic gates
can generate glitches, hundred of millivolts in amplitude, due to
wiring resistance and inductance. The power supply noise gen-
erated thereby means that special care must be taken to assure
that the inherent precision of the DAC is maintained. Good
engineering judgment should be exercised when addressing the
power supply grounding and bypassing of the 12-bit AD7396.
DIGITAL INTERFACE
The AD7396/AD7397 has a double-buffered, parallel-data
input. A functional block diagram of the digital section is shown
in Figure 25, while Table I contains the truth table for the logic
control inputs. The chip select (CS) and A/B pins control load-
ing of data from the data inputs on pins DB11–DB0 into the
internal Input Register. The CS active low input places data
into the decoded A/B input register. When CS returns to logic
high within the data setup-and-hold time specifications the new
value of data in the input register will be latched. See Truth
Table for complete set of conditions. New data can only be
transferred to the corresponding DAC register when its LDx pin
is strobed active low. The LDx inputs are level-sensitive (DAC
Registers are transparent latches) and can be tied active low
The AD7396 should be powered directly from the system power
supply. Whether or not a separate power supply trace is avail-
able generous supply bypassing will reduce supply line-induced
errors. Local supply bypassing consisting of a 10 µF tantalum
electrolytic in parallel with a 0.1 µF ceramic capacitor is recom-
mended in all applications (Figure 27).
–10–
REV. 0
AD7396/AD7397
allowing any new Input Register data updates to directly control
the DAC output voltages for single-buffered applications. For
doubled-buffered applications where both DAC outputs, VOUTA
and VOUTB, need to be changed simultaneously to a new value,
the two inputs, LDA and LDB, can be tied together and pulsed
active low in a synchronous manner.
Table II. Unipolar Code Table
Hexadecimal
Number
Decimal
Output
Voltage (V)
(VREF = 2.5 V)
Number
In DAC Register
In DAC Register
FFF
801
800
7FF
000
4095
2049
2048
2047
0
2.4994
1.2506
1.2500
1.2494
0
RESET (RS) PIN
Forcing the asynchronous RS pin low will set the Input and
DAC registers to all zeros and the DAC output voltage will be
zero volts. The reset function is useful for setting the DAC
outputs to zero at power-up or after a power supply interrup-
tion. Test systems and motor controllers are two of many appli-
cations that benefit from powering up to a known state. The
external reset pulse can be generated by the microprocessor’s
power-on RESET signal, from the microprocessor, or by an
external resistor and capacitor. RESET has a Schmitt trigger
input which results in a clean reset function when using external
resistor/capacitor generated pulses. See Table I, Control-Logic
Truth.
The circuit can be configured with an external reference plus
power supply, or powered from a single dedicated regulator or
reference, depending on the application performance requirements.
BIPOLAR OUTPUT OPERATION
Although the AD7397 has been designed for single supply op-
eration, the output can easily be configured for bipolar opera-
tion. A typical circuit is shown in Figure 30. This circuit uses a
clean regulated +5 V supply for power, which also provides
the circuit’s reference voltage. Since the AD7397 output span
swings from ground to very near +5 V, it is necessary to choose
an external amplifier with a common-mode input voltage range
that extends to its positive supply rail. The micropower con-
sumption OP196 has been designed just for this purpose and
results in only 50 µA of maximum current consumption. Con-
nection of the equal-value 470 kΩ resistors results in a differen-
tial amplifier mode of operation with a voltage gain of two,
which produces a circuit output span of ten volts, that is,
–5 V to +5 V. As the AD7397 DAC is programmed from zero-
code 000H to midscale 200H to full-scale 3FFH, the circuit out-
put voltage VO is set at –5 V, 0 V and +5 V (–1 LSB). The
output voltage VO is coded in offset binary according to
Equation 3.
POWER SHUTDOWN (SHDN)
Maximum power savings can be achieved by using the power
shutdown control function. This hardware-activated feature is
controlled by the active low input SHDN pin. This pin has a
Schmitt trigger input which helps to desensitize it to slowly
changing inputs. By placing a logic low on this pin the internal
consumption of the AD7397 or AD7397 is reduced to nanoamp
levels, guaranteed to 1.5 µA maximum over the operating tem-
perature range. If power is present at all times on the VDD pin
while in the shutdown mode, the internal DAC register will
retain the last programmed data value. This data will be used
when the part is returned to the normal active state by placing
the DAC back to its programmed voltage setting. Shutdown
recovery time measures 80 µs. In the shutdown state the DAC
output amplifier exhibits an open-circuit high-resistance state.
Any load connected will stabilize at its termination voltage. If
the power shutdown feature is not needed then the user should
tie the SHDN pin to the VDD voltage thereby disabling this
function.
V
OUT = [(D/512)–1] × 5
(4)
where D is the decimal code loaded in the AD7397 DAC regis-
ter. Note that the LSB step size is 10/1024 = 10 mV. This
circuit has been optimized for micropower consumption includ-
ing the 470 kΩ gain setting resistors, which should have low
temperature coefficients to maintain accuracy and matching
(preferably the same resistor material, such as metal film). If
better stability is required, the power supply could be substi-
tuted with a precision reference voltage such as the low dropout
REF195, which can easily supply the circuit’s 262 µA of current
and still provide additional power for the load connected to VO.
The micropower REF195 is guaranteed to source 10 mA output
drive current, but consumes only 50 µA internally. If higher
resolution is required, the AD7396 can be used with the addi-
tion of two more bits of data inserted into the software coding,
which would result in a 2.5 mV LSB step size. Table III shows
examples of nominal output voltages, VO, provided by the bipo-
lar operation circuit application.
UNIPOLAR OUTPUT OPERATION
This is the basic mode of operation for the AD7396. As shown
in Figure 29, the AD7396 has been designed to drive loads as
low as 5 kΩ in parallel with 100 pF. The code table for this
operation is shown in Table II.
+2.7V TO +5.5V
R
0.01F
0.1F
10F
V
DD
AD7396
V
REF
V
DAC A
OUTA
EXT
REF
75k⍀
75k⍀
100pF
100pF
V
DAC B
AGND
OUTB
16/14
DIGITAL
DGND
C
DIGITAL INTERFACE
CIRCUITRY OMITTED
FOR CLARITY.
Figure 29. Unipolar Output Operation
REV. 0
–11–
AD7396/AD7397
I
< 262A
SY
Table III. Bipolar Code Table
+5V
470k⍀
200A
470k⍀
Hexadecimal Number Decimal Number Analog Output
In DAC Register
In DAC Register
Voltage (V)
< 50A
+5V
V
REF
V
DD
BIPOLAR
OUTPUT
SWING
3FF
201
200
1FF
000
1023
513
512
511
0
4.9902
0.0097
0.0000
–0.0097
–5.0000
O
OP196
V
OUTA
AD7397
C
–5V
GND
–5V
ONLY ONE CHANNEL SHOWN.
DIGITAL INTERFACE CIRCUITRY
OMITTED FOR CLARITY.
Figure 30. Bipolar Output Operation
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Lead SOIC Package
(R-24)
24-Lead Narrow Body Plastic DIP Package
(N-24)
1.275 (32.30)
1.125 (28.60)
0.6141 (15.60)
0.5985 (15.20)
24
1
13
12
0.280 (7.11)
0.240 (6.10)
24
1
13
12
0.325 (8.25)
0.300 (7.62)
0.195 (4.95)
0.115 (2.93)
PIN 1
0.060 (1.52)
0.015 (0.38)
0.210
(5.33)
MAX
0.150
(3.81)
MIN
0.200 (5.05)
0.125 (3.18)
PIN 1
0.1043 (2.65)
0.0926 (2.35)
0.015 (0.381)
0.008 (0.204)
0.0291 (0.74)
0.0098 (0.25)
؋
45؇ 0.022 (0.558) 0.100 (2.54)
0.014 (0.356)
0.070 (1.77)
0.045 (1.15)
SEATING
PLANE
BSC
0.0500 (1.27)
0.0157 (0.40)
8؇
0؇
0.0500
(1.27)
BSC
0.0192 (0.49)
0.0138 (0.35)
0.0118 (0.30)
0.0040 (0.10)
SEATING
PLANE
0.0125 (0.32)
0.0091 (0.23)
24-Lead Thin Surface Mount TSSOP Package
(RU-24)
0.311 (7.90)
0.303 (7.70)
24
13
12
1
0.006 (0.15)
PIN 1
0.002 (0.05)
0.0433
(1.10)
MAX
0.028 (0.70)
0.020 (0.50)
8؇
0؇
0.0256 (0.65) 0.0118 (0.30)
SEATING
PLANE
0.0079 (0.20)
0.0035 (0.090)
BSC
0.0075 (0.19)
–12–
REV. 0
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